0
Industry Collaboration
1
MissionMission
Assure Leadership of the Global Electronics Manufacturing Supply Chain for the benefit of members and the industry
Software Solutions
Marketing Design Manufacturing OrderFulfillment
Supply Chain ManagementInformation Technology
LogisticsCommunications
Business Practices
Build toOrder
Materials
Components
Customer
Equipment
MaterialsTransformation
Collaborative Design Life Cycle
SolutionsSoftware Solutions
2
MethodologyMethodology
Product Needs
Technology Evolution
GAP AnalysisResearch
Projects
Competitive Solutions
RoadmapProject
Completion
Industry Solution Needed
Academia
Government
iNEMIUsers & Suppliers
Regional Collaboration
No Work Required
Available to Market
Place
GlobalParticipation
Disruptive Technology
RoadmapRoadmap
ImplementationImplementation
3
What Does iNEMI Do For the Industry?What Does iNEMI Do For the Industry?
Leverage the combined power of Member Companies to provide industry leadership
• iNEMI roadmaps the global needs of the electronics industry– Evolution of existing technologies– Predictions on emerging/innovative technologies
• iNEMI identifies gaps (both business & technical) in the electronics infrastructure
• iNEMI identifies and prioritizes research needs.• iNEMI stimulates worldwide standards to speed the
introduction of new technology & business practices.
4
What Does iNEMI Do For its Members?What Does iNEMI Do For its Members?
Leverage the combined power of member companies to provide industry leadership
• iNEMI stimulates research/innovation to fill gaps• iNEMI sponsors workshops and forums on emerging technology
and issues• iNEMI works with other organizations to ensure that government
policy recommendations are aligned with our mission.• iNEMI establishes implementation projects to eliminate gaps
– Develop processes– Evaluate alternative technologies– Identify equipment needs– Determine component requirements– Develop standards proposals– Communicate results to members
5
Value PropositionValue Proposition
“Connect with and Strengthen Your Supply Chain”
• iNEMI offers the opportunity to collaborate with the entire supply chain in an efficient manner
– To understand and accelerate strategic directions– To define future needs and opportunities– To jointly create industry standard solutions.
• Today’s increasingly distributed supply chain makes this more important than ever.
• iNEMI is a member driven organization that adapts to industry changes quickly and provides timely leadership.
• iNEMI provides important deliverables:– Technology roadmaps– Five year technology plans (for members)– Forums on key industry issues– Deployment projects (for members)– Webinars (for members).
6
Industry Leaders belong Industry Leaders belong –– OEM/EMSOEM/EMS
7
Industry Leaders belong Industry Leaders belong –– SuppliersSuppliers
8
Industry Leaders belongIndustry Leaders belong
Consultants, Government, Organizations & UniversitiesConsultants, Government, Organizations & Universities
9
OrganizationOrganization
ImplementationImplementation
8 iNEMITIGs
Technical Committee
EMS, OEM, Supplier & Academia/Government
Representatives
Technical CommitteeTechnical Committee
EMS, OEM, Supplier & Academia/Government
Representatives
TechnologyTechnologyRoadmappingRoadmapping
19 IndustryTWGs
iNEMI Staff
Secretary to BoDCommunications
Membership DevelopmentTechnical Facilitation
iNEMI StaffiNEMI Staff
Secretary to BoDCommunications
Membership DevelopmentTechnical Facilitation
iNEMI Boardof Directors
Elected by iNEMI CouncilRepresentativesEMS DirectorsOEM Directors
Supplier DirectorsStrategic Objectives
Operational Responsibility
iNEMI BoardiNEMI Boardof Directorsof Directors
Elected by iNEMI CouncilRepresentativesEMS DirectorsOEM Directors
Supplier DirectorsStrategic Objectives
Operational Responsibility
SubstratesTIG
OptoelectronicsTIG
(Technology Integration Group)
TechnologyWorkingGroup
•••
TechnologyWorkingGroup Medical
ElectronicsTIG
TechnologyWorkingGroup
Board AssemblyTIG
Environmentally Conscious Electronics
TIG
Product Life Cycle Information
ManagementTIG
TechnologyWorkingGroup
Research Committee
EMS, OEM, Supplier & Academia/Government
Representatives
Research CommitteeResearch Committee
EMS, OEM, Supplier & Academia/Government
RepresentativesProduct Emulator
Group
Product Emulator
Group
Product NeedProduct NeedRoadmappingRoadmapping
7 IndustryPEGs
Business Leadership
Team
EMS & OEM Representatives
Business Business Leadership Leadership
TeamTeam
EMS & OEM Representatives
System in PackageTIG
Heat TransferTechnology
TIG
10
Roadmap2004 => 2007
11
Attributes of iNEMI RoadmapsAttributes of iNEMI Roadmaps
• iNEMI Roadmap is customer need driven, not technology driven.
• OEM driven Product Emulator Groups (PEGs) start roadmapping process by presenting what they need to remain competitive in the world market.
• Focus of Roadmaps is on process and technology rather than end products.
• Technology Working Groups (TWGs) respond and identify gaps and showstoppers. They do not provide solutions.
• iNEMI Technical Committee prioritizes gaps and forms Technology Integration Groups (TIGs) to close them.
12
Statistics for the 2004 RoadmapStatistics for the 2004 Roadmap
• > 470 Participants• > 220 Companies/organizations• 11 Countries from 3 Continents• 19 Technology Working Groups
(TWGs) (added Sensors)• 7 Product Emulator Groups (PEGs)• Over 1200 Pages of Information• Roadmaps the needs for 2005-2015
13
7 Product Emulator Groups (PEGs)7 Product Emulator Groups (PEGs)
Emulators Characteristics
Portable / Consumer High volume Consumer Products for which cost is the primary driver including Hand held, battery-powered products driven by size and weight reduction
System in a Package Complete function provided in a package to system manufacturer
Office Systems / Large Business Systems
Products which seek maximum performance from a few thousand dollar cost limit to literally no cost limit
Network / Datacom / Telecom Products
Products that serve the networking, datacom and telecom markets and cover a wide range of cost and performance targets
Medical Products Products which must operate within a highly reliable environment
Automotive Products which must operate in an automotive environment
Defense and Aerospace Products which must operate in extreme environments
Yellow = Completely new Emulator Green = Broadened focus
14
19 TWG’s Focused on Technology & Mfg. 19 TWG’s Focused on Technology & Mfg.
Organic Substrates BoardAssembly Customer
RF Components & Subsystems
Optoelectronics
Displays
Energy Storage Systems
Modeling, Simulation, and Design
Modeling, Simulation, and Design
PackagingSemiconductorTechnology
Final Assembly
Mass Storage (Magnetic & Optical)
Passive Components
Product Lifecycle Information
Management (PLIM)
Product Lifecycle Information
Management (PLIM)
Test, Inspection & Measurement
Test, Inspection & Measurement
Environmentally Conscious Electronics
Environmentally Conscious Electronics
Ceramic Substrates
Thermal ManagementThermal
Management
Connectors
Sensors
15
8 Contributing Organizations8 Contributing Organizations
16
Major Trends From Roadmap
17
Major Trends Major Trends –– Current & FutureCurrent & Future
• Environmental considerations will expand– RoHS/WEEE is the beginning– Significant impact to supply chain/information needs – Design for Environment/Sustainability – Defensive posture has reduced industry’s influence on
regulations• Manufacturing migration to low cost regions continues
– Some corrections seen due to security/logistics costs– Commodity design is following
• SiP is a major trend in portable products– Infrastructure issues need attention– Could find use in other sectors where mixed IC technologies
are used • Lack of integrated design/simulation tools is:
– Delaying new technology adoption – Impacting product time to market
18
Major Trends Major Trends –– Current & FutureCurrent & Future• The predicted end of semiconductor scaling
could have major implications:– Non classical CMOS– Beyond CMOS– Increased thermal challenges– Significant impact to packaging/interconnect
• Nanotechnology has the potential to dramatically effect electronics:– Materials– Displays– Sensors– Power
19
Example Gap Analysis: ECEExample Gap Analysis: ECE
ECE = Environmentally Conscious ElectronicsECE = Environmentally Conscious ElectronicsBUSINESS & TECHNOLOGY GAPS 2005 20092003 2007Parts, Materials & Processes
Lead-free Soldering TechnologyLead-free Compatible ComponentsTin Whisker Accelerated Test MethodSubstitution of Hazardous Materials in CablesMercury*Cadmium*Hexavalent Chromium*Halogenated Flame Retardants (PBB, PBDE)s*
Engineering/DesignDfE Integrated into Product Development
ToolsMaterials Declaration Design for Environment (DfE)Life Cycle Assessment (LCA)
BusinessRecycling Infrastructure in EUSupply Chain ReadinessMaterials Declaration StandardsNorth American OEM ReadinessKeeping track of e-waste legislation
* Note: Based upon measured results
Development Required Legend: Emerging Technology(or readiness issues)
Sufficiently Ready
20
Example: ECE FiveExample: ECE Five--year Planyear Plan
2003 2005 2007 2009
IMPLEMENTATION NEEDS
ATTRIBUTESEnergy EfficiencyElimination of Materials
of ConcernEnd-of-Life RecyclingInformation ManagementLegislative knowledgeProduct MarkingSubstance BansRecycling TargetsWaste MinimizationRecycled Content
DEPLOYEDTECHNOLOGY
Design tradeoffs for DfE
RESEARCH & DEVELOPMENTLife Cycle Analysis (LCA)Life Cycle Cost Models
ATTRIBUTESEnergy EfficiencyElimination of Materials
of Concern End-of-Life RecyclingInformation ManagementLegislative knowledgeProduct MarkingSubstance Bans
DEPLOYEDTECHNOLOGY
DfELead-freeNon-halogenated flame
retardants (early adopters)Reporting ToolsAlternative Finishes
RESEARCH &DEVELOPMENTDesign tradeoffs for DfE
ATTRIBUTESEnergy EfficiencyElimination of Materials
of ConcernEnd-of-Life RecyclingInformation ManagementLegislative knowledge
DEPLOYEDTECHNOLOGY
Design for EnvironmentApproach (DfE)
Lead-free (early adopters)Environmental Management System (EMS)Product Life-cycle Management (PLM)
RESEARCH & DEVELOPMENTNon-halogenated flame
retardantsReporting ToolsAlternative Finishes
ATTRIBUTESEnergy EfficiencyElimination of Materials
of ConcernEnd-of-Life RecyclingRecycled ContentInformation ManagementLegislative knowledgeProduct MarkingSubstance BansRecycling TargetsWaste MinimizationRecycled ContentLife Cycle Analysis
DEPLOYEDTECHNOLOGY
LCA (early adopters)Life Cycle Cost Models
RESEARCH & DEVELOPMENTDematerializationNew Separation Technologies
DRIVERS - Legislative/regulatory - Sustainable Development- Market Competitiveness - Customer Requirements
WEEE/RoHS Draft EuEELV
21
Summary of Recent Progress
Projects close GapsProjects close Gaps
22
Software Solutions
Life Cycle Solutions
Materials
CollaborativeDesign
Build toOrder
Equipment
MaterialsTransformationComponents
Substrates TIGProjects:
• High Frequency Materials Effects on HDI
• Optoelectronics for Substrates
Board Assembly TIGProjects:
• Pb Free BGA’s in SnPb Assemblies• Substrate Surface Finishes for lead free• SMT Reel Labeling• Pb-free BGAs in SnPb Assemblies• Lead-Free Nano-Solder
Product Life Cycle Information Management TIG Projects:
• PDX Extensions & Updates• Materials Composition Data Exchange• Offspring Industry Adoption (IPC 2581)
Optoelectronics TIGProjects:
• Fiber Optic Splice Loss Measurement • Fiber Connector End-Face Inspection
Environmentally Conscious Electronics TIGProjects:
• Lead-Free Assembly & Rework• Tin Whisker Accelerated Test• Tin Whisker Modeling• Tin Whisker User Group• Lead-Free Wave Soldering Assembly• RoHS Transition Group• Lead-Free Rework Optimization• High Rel RoHS ComplianceSystem in Package TIG:
• Just being defined• Address equipment, process,
& standards
System in Package TIG:• Just being defined• Address equipment, process,
& standards
Heat Transfer TIG:• Just being defined• Address process & standards
Heat Transfer TIG:• Just being defined• Address process & standards
Medical Electronics TIG:• Just being defined• Address standards
Medical Electronics TIG:• Just being defined• Address standards
23
Technology Integration Groups (TIGs)Technology Integration Groups (TIGs)
Co-Directors of Planning: Leslie Guth, Lucent Technologies; Bill Barthel, Plexus
1. Board Assembly– Chair: Tom Pearson, Intel
2. Environmentally Conscious Electronics– Chair: Joe Johnson, Cisco
3. Heat Transfer
– Michael Patterson, Intel
4. Medical Electronics– Chair: Anthony Primavera,
Guidant5. Optoelectronics
– Chair: TBD
6. Product Lifecycle Information Management– Co-Chair: Barbara
Goldstein, NIST– Co-Chair: John Cartwright,
Intel
7. System in Package (SiP) – Chair: Joe Adam, Skyworks
8. Substrates – Chair: Hamid Azimi, Intel
24
How TIGs are DefinedHow TIGs are Defined
• TWG chairs identify potential gaps during roadmap development process, recommend follow-up activities.
• iNEMI Technical Committee (TC) reviews TWG recommendations.
• TC decides on formation of Technical Integration Groups (TIGs) to address gaps.
• TIGs review identified gaps and develop Technical Plan; TC approves.
• TIGs, with TC approval, undertake projects to close gaps.
25
How Projects are DefinedHow Projects are Defined
• Hold project formation meeting• Members develop Statement of Requirements
– User/business case driven– What is needed– Desired outcome of project
• Identify leaders• Members develop Statement of Work
– Project plan with identified tasks, check points and end dates
– Companies expected to participate– Results expected and how documented
• Members sign Project Statement– Formally commit resources as agreed– Specify information sharing process
• Carry out project, report quarterly
26
Board Assembly ProjectsBoard Assembly Projects
Board Assembly TIGChair: Tom Pearson, Intel
Pb-Free BGAs in SnPb Assemblies
Chair: Robert Kinyanjui, Sanmina-SCICo-chair: Charan Gurumurthy, Intel
Pb -Free Assembly Substrate Surface Finishes
Chair: Keith Newman, Sun Microsystems, Co-chair: Charan, Gurumurthy, Intel
SMT Reel Labeling
Chair: Patrick Figueroa, Delphi Electronics & Safety
Pb-free Nano-solder
Chair: Andrew Skipor, Motorola
Pb-free DPMO
Chair: Andrew Dugenske, Georgia Institute of Technology
27
Lead-Free AssemblyChair: Edwin Bradley, PhD Motorola
Co-Chair: Rick Charbonneau
Environmentally Conscious Electronics (ECE) Technology
Integration Group (TIG)
Tin Whisker ModelingChair: George Galyon, IBMCo-Chair: Maureen Williams, NIST
Tin Whisker Users GroupChairs: Joe Smetana, Alcatel
Richard Coyle, Lucent
Pb-Free Assembly & ReworkChairs: Jerry Gleason, HP
Charlie Reynolds, IBM
Pb-Free Assembly & ReworkChairs: Jerry Gleason, HP
Charlie Reynolds, IBM
RoHS Transition Task GroupChair: Dave McCarron, DellProjects: Component Supply Chain Readiness
Chair: John OldendorfComponent and Board Marking
Chair: Vivek Gupta, IntelAssembly Process Specifications
Chair: Frank Grano, -SCIMaterials Declarations
Chair: Nancy Bolinger, IBM
Complete
Pb-free Wave Soldering Chair: Denis Barbini, Vitronics Soltec
Co-chair Paul Wang, Microsoft
Complete
Complete
Pb-free Rework OptimizationChair: Jasbir Bath, Solectron
Halogen-freeChair: Steve Tisdale, Intel
RoHS High RelChair: Mike Davisson, AgilentCo-Chair: Joe Smetana, Alcatel
Tin Whisker Accel. TestsChair: Valeska Schroeder, HPCo-Chairs: Jack McCullen, Intel
Mark Kwoka, Intersil
28
Optoelectronics TIG ProjectsOptoelectronics TIG Projects
Fiber Optic SignalPerformance
Chair: Tatiana Berdinskikh, CelesticaCo-Chair: Heather Tkalec, Alcatel
Fiber Optic SignalPerformance
Chair: Tatiana Berdinskikh, CelesticaCo-Chair: Heather Tkalec, Alcatel
Fiber Optic Splice
Loss Measurement Chair: Peter Arrowsmith, Celestica Com
plete
Complete
Optoelectronics TIGChair: Peter Arrowsmith, Celestica
Co-Chair: Alan Rae, PhD, Cookson Electronics
Fiber End-FaceInspection
Chair: Tatiana Berdinskikh, CelesticaCo-Chair: Heather Tkalec, Alcatel
Fiber Optic Splice Improvement
Chair:Peter Arrowsmith, Celestica Com
plete
29
Fiber Optic Signal PerformanceFiber Optic Signal Performance• Objective:
– Learn the effects that anomalies have on the performance of a fiber optic signal
– Identify the severity of optical signal loss due to the most common hazards found in:
– Supplier – Internal manufacturing processes
Scope:– Develop connector end-face inspection criteria, which provides
feedback on specific cleanliness requirements to: • Incoming Quality• Component Engineering • Cable suppliers
– Provide quantitative evidence to production & test departments to validate their inspection and cleaning strategies.
Status: – Project completed - 2004
30
Substrates TIG ProjectsSubstrates TIG Projects
High FrequencyMaterial Effects on HDI
Chair: Hamid Azimi, PhD, IntelCo-Chair: Jack Fisher, IPC
Optoelectronics for Substrates
Chair: Jack Fisher, iNEMI/IPC
Substrates TIGChair: Hamid Azimi, PhD, Intel
31
Product Life Cycle Information Management (PLIM)Product Life Cycle Information Management (PLIM)
PLIM TIGCo-Chairs:
John Cartwright, IntelBarbara Goldstein, NIST
Materials Composition Data Exchange
Chair: Richard Kubin, E2open, Co-chair: Marissa Yao, Intel
Product Data Exchange (PDX 2.0)
Extensions & Updates
Chair:Barbara Goldstein, NIST CAD Data Exchange
Industry Adoption
32
www.inemi.orgwww.inemi.orgEmail contacts:Email contacts:
Jim McElroy Jim McElroy
[email protected]@inemi.org
Bob PfahlBob Pfahl
[email protected]@inemi.org