© 2015 Toshiba Corporation
Toshiba Electronics Asia Ltd.September 16, 2015
Leading Innovation through Diversity
TOSHIBA Semiconductor and Storage products
© 2015 Toshiba Corporation 2
Evolution of mobile devices
Toshiba Electronics Asia, Ltd.
CellularPhone
Computing
Storage
Smartphone
Cloud Computing
StorageSensing Energy Communication
More Info
Car
Camera
Internet of Things
Wearable, Healthcare
FeaturePhone
More Feature
Diversity
More Integration
MOBILEEVOLUTION
Key Technologies;
Key Trend;
1010
Home
Home hub
© 2015 Toshiba Corporation 3Toshiba Electronics Asia, Ltd.
Key Technologies;Contents1. High Speed Communication
・TransferJet™2. Wireless Power Transfer
・Solutions from 1W to 15W3. RF switching
・SOI RF Switch4. Super Low Drop Out regulator
・and other Discrete devices5. CMOS Image Sensors
・8/13/16/20Mpix6. Interface Bridge ICs
・for diversifying applications Storage
Sensing
Energy
Communication
Communication
Energy
Communication
© 2015 Toshiba Corporation 4Toshiba Electronics Asia, Ltd.
Key Technologies;Contents1. High Speed Communication
・TransferJet™2. Wireless Power Transfer
・Solutions from 1W to 15W3. RF switching
・SOI RF Switch4. Super Low Drop Out regulator
・and other Discrete devices5. CMOS Image Sensors
・8/13/16/20Mpix6. Interface Bridge ICs
・for diversifying applications Storage
Sensing
Energy
Communication
Communication
Energy
Communication
© 2015 Toshiba Corporation 5
TransferJetTM
Toshiba Electronics Asia, Ltd.
Click & Go for data transfer Effective 375Mbps max.Short distance minimizes risks
Close Proximity Wireless Transfer Technology
NO congestion, TrasferJet is a device to device communication.
© 2015 Toshiba Corporation 6
TransferJetTM
Toshiba Electronics Asia, Ltd.
© 2015 Toshiba Corporation 7
TransferJetTM
Toshiba Electronics Asia, Ltd.
Street model, 2015ARROWS NX F-04G
MSM8994 MSM8974AC
Bphone
© 2015 Toshiba Corporation 8
TransferJetTM
Toshiba Electronics Asia Ltd.
TransferJetTM
Adapters / SD Memory CardTransferJetTM
Smartphone
Paperless MTG Educational ICT
Digital KIOSK
Contents Delivery at Concert, Event place
Bi-directionalDigital Signage
Contents Sellwhen cashing
Contents Pushwhen thru Gate
Share Photos & Movies
Contents Sellat Vending machine
Specific Place More usual Place New LIFE Style
差し替え予定
Recorder Tablet PCProducts
ApplicationsServices
© 2015 Toshiba Corporation 9Toshiba Electronics Asia, Ltd.
Key Technologies;Contents1. High Speed Communication
・TransferJet™2. Wireless Power Transfer
・Solutions from 1W to 15W3. RF switching
・SOI RF Switch4. Super Low Drop Out regulator
・and other Discrete devices5. CMOS Image Sensors
・8/13/16/20Mpix6. Interface Bridge ICs
・for diversifying applications Storage
Sensing
Energy
Communication
Communication
Energy
Communication
© 2015 Toshiba Corporation 10
Wireless Power Transfer IC’s
Toshiba Electronics Asia, Ltd.
Solutions cover from 1W to 15W
© 2015 Toshiba Corporation 11
Wireless Power Transfer IC’s
Toshiba Electronics Asia, Ltd.
Solutions cover from 1W to 15WPo
wer
(W
)
Low power
High power(Resonance)
Wireless Power Transfer IC´s Roadmap
Mid power
15W
10W
RX:TC7765WBG (MP:OK) TX:TB6865AFG *Enhanced Version (*MP:Q1/2016)
5W
RX: TC7764WBGTX: TB6865AFG *2-device charger
2015~2014 2016 (CY)
RX:TC7766WBG (*MP:Q2/2016)TX:TC7718FTG+M066 (*MP:Q2/2016)
Small form factorfor wearable
1~3W
RX:TC7765WBG (MP:OK) TX:TB6865AFG *Enhanced Version (*MP:Q1/2016)
© 2015 Toshiba Corporation 12
Wireless Power Transfer IC’s
Toshiba Electronics Asia, Ltd.
The top-class System SizeHigh Efficiency;1.0W: ~40% at 1W load 2.5W: ~70% at 2.5W load
Form Factor(coil size) ; 1.0W: TX 24mmΦ, RX 11mmΦ2.5W: TX 28mmΦ, RX 20mmΦ
Applications;1.0W: Active tracker, Wearable, etc.2.5W: Smart watch, Sports camera, etc.
Tx: 30mmΦ
Rx: 11mm x 11mm
Small form factor
1010
© 2015 Toshiba Corporation 13Toshiba Electronics Asia, Ltd.
Key Technologies;Contents1. High Speed Communication
・TransferJet™2. Wireless Power Transfer
・Solutions from 1W to 15W3. RF switching
・SOI RF Switch4. Super Low Drop Out regulator
・and other Discrete devices5. CMOS Image Sensors
・8/13/16/20Mpix6. Interface Bridge ICs
・for diversifying applications Storage
Sensing
Energy
Communication
Communication
Energy
Communication
© 2015 Toshiba Corporation 14
SOI RF Switch
RF bands
GSM wavebands LTE wavebands3G wavebands
Waveband(GHz) 0.7 0.8 0.9 1.0 1.1 1.2 1.3 1.4 1.5 1.6 1.7 1.8 1.9 2.0 2.1 2.2 2.3 2.4 2.5
2G (GSM)
3G
LTE
Ref. : Nikkei Electronics
3.5
2G3GLTE
RF frontend System
High performance RF Selector
• Scattered RF bands• Complex RF frontend system
Toshiba Electronics Asia, Ltd.
© 2015 Toshiba Corporation 15
SOI RF Switch
Toshiba Electronics Asia, Ltd.
• Low insertion loss• Low distortion (THD and IMD)• High production capacity
& cost effective
TarfSOI™ : Toshiba advanced RF SOI
Market Proven TechnologyInsertion Loss improvement of SP12T switch
2014
0.9
0.8
0.7
0.6
0.5
0.4
0.3
20132011
© 2015 Toshiba Corporation 16
SOI RF Switch
WCSP Package
SP4TGPIO
SP6TGPIO
SP8TGPIO
SP10TGPIO
SP10Tmipi
SP8Tmipi
SP12Tmipi
Flip chip with bump
SP16Tmipi
Bump pitch:150umBump pitch:400um
SPDTGPIO
SP3TGPIO
SP4TGPIO
SP6TGPIO
Cutting-edge Product line
Toshiba Electronics Asia, Ltd.
Upcoming product planUnder Mass production* Studying other packages and antenna tuning applications continuously.
© 2015 Toshiba Corporation 17Toshiba Electronics Asia, Ltd.
Key Technologies;Contents1. High Speed Communication
・TransferJet™2. Wireless Power Transfer
・Solutions from 1W to 15W3. RF switching
・SOI RF Switch4. Super Low Drop Out regulator
・and other Discrete devices5. CMOS Image Sensors
・8/13/16/20Mpix6. Interface Bridge ICs
・for diversifying applications Storage
Sensing
Energy
Communication
Communication
Energy
Communication
© 2015 Toshiba Corporation 18
Toshiba Discrete Devices
Toshiba Electronics Asia, Ltd.
Super Low Drop Out regulator
Drop out (Vin-Vout)is only 200mV
Vbatt
Vin=1.3V
Vout=1.1V
for MSM8996 platform
Low Heat
2.5V
1.3V
Vin=1.3V Vout=1.1VPMICPM8996
LDOWi-Fi®
+ Bluetooth®
QCA6174Batt
Direct connection to the 1.3V of PM8996
at 300mA
TCR5AMxx Series
© 2015 Toshiba Corporation 19
Toshiba Discrete Devices
Toshiba Electronics Asia, Ltd.
1. Latest Fine Patterning Technology2. New materials continuously (GaN on Si, SiC, SOI) . 3. Continuous Investment to Frontend-Backend Fab.
Small SignalStandard Logic Power Device Photo Coupler
White LED SiC・GaN
-Digital Consumer-Mobile, Network-PC, PC Peripheral
New Area
-Lighting-LCD Backlight
-Railway-Automobile
-Digital Consumer-Mobile, Network-PC, PC Peripheral
-Digital Consumer-Mobile, Network-PC, PC Peripheral-Infrastructure, Automobile
-Digital Consumer-Mobile, Network-Infrastructure, Automobile
SOI-SW
-Smartphone-RF Module
Product Line ~ from Small signal to High power products
© 2015 Toshiba Corporation 20
Toshiba Discrete Devices
Toshiba Electronics Asia, Ltd.
PF Name Device Toshiba P/N
MSM8916
RF SBD JDH2S02SCSBD CCS15S30SBD CTS05S40 / CUS10S40
P-ch MOSFET SSM6J501NUESD(TVS) DF2B6.8ACT / DF2B7SLESD(TVS) DF2B6.8M1ACT / DF2B7M2SL
MSM8926
Dual P-ch MOSFET SSM6P49NUDual P-ch MOSFET SSM6N57NU
SBD CTS05S40 / CUS10S40P-ch MOSFET SSM6J501NU
ESD(TVS) DF2B6.8ACT / DF2B7SLESD(TVS) DF2B6.8M1ACT / DF2B7M2SL
MSM8939
RF SBD JDH2S02SCSBD CCS15S30SBD CTS05S40 / CUS10S40SBD DSR01S30
P-ch MOSFET SSM6J501NUESD(TVS) DF2B6.8ACT / DF2B7SLESD(TVS) DF2B6.8M1ACT / DF2B7M2SL
All of those have been selected byChinese End Customers and EMSs
Toshiba Discrete Devices for Qualcomm® platformsPF Name Device Toshiba P/N
MSM8928
SBD CTS05S40 / CUS10S40P-chMOSFET SSM6J501NU
ESD(TVS) DF2B6.8ACT / DF2B7SLESD(TVS) DF2B6.8M1ACT / DF2B7M2SL
MSM8956/76 LDO TCR5AM10 LDO TCR5AM11
MSM8996
LDO TCR5AM10LDO TCR5AM11
RF-SBD JDH2S02SCSBD CCS15S30
© 2015 Toshiba Corporation 21Toshiba Electronics Asia, Ltd.
Key Technologies;Contents1. High Speed Communication
・TransferJet™2. Wireless Power Transfer
・Solutions from 1W to 15W3. RF switching
・SOI RF Switch4. Super Low Drop Out regulator
・and other Discrete devices5. CMOS Image Sensors
・8/13/16/20Mpix6. Interface Bridge ICs
・for diversifying applications Storage
Sensing
Energy
Communication
Communication
Energy
Communication
© 2015 Toshiba Corporation 22
CMOS Image SensorsMobile Camera Evolution with Toshiba Image Sensors
HDR: Dynamic Range Improvement
FRC Plus: Super Slow Motion VideoIris Recognition:
Secure Biometrics Recognition
User Experiences
CNR:Noise ReductionRWB CFA:
Sensitivity ImprovementNew Image Processing Architecture:
SNR Improvement, Resolution Enhancement
High Quality
1.12um Pixel:World Smallest 8MP Image Senor
1.0um Pixel: Next Gen Pixel for Low Z-height Camera Module Design
Slim Design
Bright Mode: High Speed Capture
PDAF: Fast Auto Focus
C-PHY: High Speed Camera Interface
High SpeedToshiba Electronics Asia, Ltd.
© 2015 Toshiba Corporation 23Toshiba Electronics Asia, Ltd.
CMOS Image Sensors
Iris biometric Recognition
<Total system solution>- 1080p sensor die and camera module
reference design- Specifically designed lens and IR-BPF- Multi-partnership of IP vendors
High Speed Video
<Bright Mode>- 240 fps for 1080i
by High Speed Video capturing;<FRC Plus>- Up to 2100fps for FWVGA
by x10 digital interpolations
New User Experience with Toshiba Image Sensors
© 2015 Toshiba Corporation 24Toshiba Electronics Asia, Ltd.
CMOS Image Sensors
T4KA71/2.4” 20MP
High resolution
T4KC31/2.78” 16MPHigh resolution
T4KB31/3” 13MPLow power
Small form factor
T4K821/3” 13MPHigh speed
T4K371/3”13MP
T4KA31/4” 8MPLow power
Small form factor
T4K351/4” 8MP
T4K711/7” 1080p
SelfieSmall form factor
MSM8994 ✔ ✔ ✔
MSM8992 ✔ ✔
MSM8974 ✔ ✔ ✔ ✔
MSM8956/76 ✔ ✔ ✔
MSM8939 ✔ ✔
MSM8952 ✔ ✔ ✔
MSM8916 ✔ ✔ ✔ ✔ ✔ ✔
MSM8909 ✔
Toshiba Image Sensor Available on Qualcomm® Platforms
© 2015 Toshiba Corporation 25Toshiba Electronics Asia, Ltd.
Key Technologies;Contents1. High Speed Communication
・TransferJet™2. Wireless Power Transfer
・Solutions from 1W to 15W3. RF switching
・SOI RF Switch4. Super Low Drop Out regulator
・and other Discrete devices5. CMOS Image Sensors
・8/13/16/20Mpix6. Interface Bridge ICs
・for diversifying applications Storage
Sensing
Energy
Communication
Communication
Energy
Communication
© 2015 Toshiba Corporation 26
Interface Bridge ICs
Toshiba Electronics Asia, Ltd.
Display Bridge/HubTC358762XBG (DSI to RGB/MPU) SD2xx/SD4xxTC358774/75XBG (DSI to LVDS ) SD2xx/SD4xxTC358767AXBG (DSI/DPI to DisplayPort) SD4xx/SD6xxTC358770XABG (D4DP: Dual DSI to DisplayPort)
SD6xx/SD8xxTC358860XBG (eDP to Dual DSI )
New! 4k2k support
HDMI® BridgeTC358743XBG (HDMI to CSI) SD4xx/SD6xx/SD8xxTC358749XBG (HDMI to CSI with Scaler) SD4xx/SD6xx/SD8xxTC358840XBG (HDMI to CSI) 4k2k support SD8xx
Flexible IO ExpanderTC35892XBG, 893XBG, 894XBG/FG, 895WBG
Camera BridgeTC358746AXBG/748XBG (Parallel to CSI2)SD2xx/SD4xx
Key PWM GPIO LED
* “SDxxx”; adaptable for “snapdragon xxx”
© 2015 Toshiba Corporation 27
Bridge ICOUTPUT
DPI(RGB)
DBI-B(MPU)
Parallel8bit,16bit MHL® DSI CSI-2 LVDS HDMI®
Display port eDP
INPU
T
DPI(RGB)
DBI-B(MPU-I/F)
Parallel 8bit/16bit
MHL®
DSI
Display PorteDP
CSI-2
HDMI®
ES AvailableMP product
TC358764/65TC358774/75
Under Development
TC358743
TC358746
Parallel 24bit, CSI 4lane
TC358767ADSI 8laneWQXGA
TC358770A
LVDS 1/2linkLow PowerHigher Speed
TC358766
DSI 4lane, wider ball pitch
DSI 3lane
CSI 4lane, Parallel 24bit
DSI 4laneDSI 4lane
CameraBridge
DisplayBridge
DSI 2lane
DSI 4laneTC358771/72Backlight Control
DSI 4lane
TC358777DSI 8lane
WQXGAWider ball pitch
TC358749
TC358xxx
Under Panning
TC358xxx
TC358860
TC358779
TC358xxxeDP Ver. 1.4DSI 8lane 1.5GUp to 4k2k
TC358748CSI 4lane, Parallel 24bit Wider ball Pitch
TC358748 Parallel 24bit, CSI 4laneWider ball pitch
TC358870fHD60fpsScalar de-interlace
4k2k30fps DSI 8lane TC358840 4k2k30fps CSI2 8lane
HD60fps CSI2 4lane Scalar, De-InterlacefHD60fps CSI2 4lane
For Mobile phone Smartphone
For Tablet
For Visual Devices
TC358762TC358766
TC358763
TC358768ATC358778
TC358766TC358767A
TC358746
Toshiba Bridge IC covers diversified sectors
Toshiba Electronics Asia, Ltd.
Interface Bridge ICs
© 2015 Toshiba Corporation 28
Interface Bridge ICs
<Dual Screens>
<Small size Screens>
<High resolution Screens>HostA.P.
eDP, DSI MIPI-DSI 1Gbps*4ane*2link
TC358860XBG
eDP2*DSIDSI 4lane* 2link
Video Mode
• ~2560x1600 MIPI-Panel• ~4k2k DSI-Panel
TC358870XBG
HDMI2*DSIHDMI®
I2S
DSIDSI • Head Mount Display
• Dual ScreensLR
HostA.P.
RGB(DPI)
TC358763XBG
RGBDSI MIPI-DSI 500Mbps*3lane
Stream Mode 60fps
• HVGA(320x480)• FWVGA(480x864)• qHD(540x960)• DVGA(640x960)• XGA(1024x768)• DSI-Panel
Recent Example of Display Bridges
Toshiba Electronics Asia, Ltd.
© 2015 Toshiba Corporation 29
Interface Bridge ICs
Toshiba Electronics Asia, Ltd.
LCD
LCD
GPSCAN
InterfaceBridge
USB
Video Decoder
Sensor fusion
Video Encoder
METER
VideoProcessor
CVBS
Rear SheetEntertainment
VehicleInformation
Ether AVB
HUD
Box Image
BluetoothWi-Fi
Video DecoderBluetooth/ Wi-Fi®
Audio Amps
Rear View CamVideo
Encoder Video Encoder
Image Recognition
Processor
3G/LTE
Center stack
solution
ASIL Certified
InstrumentationMCU
For Car Infotainment,
Cameras
Dash BoardCenter Stack TELEMATICS
Advanced Driver Assistance SystemsADAS:
© 2015 Toshiba Corporation 30Toshiba Electronics Asia, Ltd.
Contents1. High Speed Communication
・TransferJet™2. Wireless Power Transfer
・Solutions from 1W to 15W3. RF switching
・SOI RF Switch4. Super Low Drop Out regulator
・and other Discrete devices5. CMOS Image Sensors
・8/13/16/20Mpix6. Interface Bridge ICs
・for diversifying applications
© 2015 Toshiba Corporation 31Toshiba Electronics Asia, Ltd.
1010
and beyond!!
TransferJet and TransferJet logos are licensed by the TransferJet Consortium.MIPI® is a registered trademark of MIPI Alliance, Inc.
Wi-Fi is a registered trademark of Wi-Fi Alliance. HDMI is a trademark or a registered trademark of HDMI Licensing, LLC.
Bluetooth® word mark is a registered trademark owned by Bluetooth SIG, Inc. and any use of such mark by Toshiba Corporation is under license. Qualcomm and Snapdragon are trademarks or registered trademarks of Qualcomm Incorporated.
Fujitsu and the Fujitsu logo are trademarks or registered trademarks of Fujitsu Limited.Bkav and the Bkav logo are trademarks or registered trademarks of Bkav Corporation.
MHL is a trademark or registered trademark of the MHL, LLC.TarfSOI is a trademark of Toshiba Corporation.