MULTI CHIP MODULE
Contents:IntroductionOverviewTypes of MCM’sApplicationsAdvantagesDisadvantagesConclusion
Introduction:A Multi-Chip Module
is a specialized electronic package where multiple IC’s, semiconductor dies or other modules are packaged in such a way as to facilitate their use as a single IC.
The MCM itself will often be referred to as a "chip" in designs, thus illustrating its integrated nature.
Block Diagram:
Micro controller:Specifications:
a) PIC16F877b)ISM Band Data Transceiverc) Low Power Consumptiond)Sensor Data Collection
Transceiver:Specifications:
a) Multiple I/O interfaceb) Configurable to application requirements, host/master/slavec) Transparent drop-in intelligent RF solutiond) operating frequencies
Transceiver Board
Types of MCM’s:MCM consists of 3 different types.
They are:
MCM-L MCM-CMCM-D
MCM-L: Organic
substrates-based MCM-LBased on laminated PCB technologies that have evolved to accomplish the denser integration requirements of today's demands.
MCM-C:o Ceramic substrate-
based MCM-C
o Substrates based on co-fired ceramic or glass-ceramic technologies.
MCM-D:Silicon substrate-
based MCM-D
MCM-D are formed by Deposited dielectrics and conductors on a base substrate typically made with silicon.
Applications:
Alarm and Security Systems
Automatic Meter Reading (AMR)
Home Automation
Remote Control, Surveillance, Automotive, Telemetry, Industrial Control,
Wireless Communications, Remote Data Logging
Advantages:Size and Weight
Data Speed and Signal Integrity
Reliability/Harsh Environments…
Low Power Consumption
Technology Integration
Cost
Disadvantages:
Electrical drawbacks Thermal drawbacks
Conclusion: Complete redesign in Si
a) Not cost effective at low scale production
b) Not always feasibleAvoiding the Si design
a) Get rid of the packageb) Use smallest possible componentsc) Use a high density multilayer PCB
Solution: MCM Technology
Thank You!
Queries….?