Datasheet
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RCD051N20 Nch 200V 5.0A Power MOSFET
Outline
VDSS 200V CPT3(SC-63)<SOT-428>
RDS(on) (Max.) 760mID 5.0A
PD 29W
Features Inner circuit
1) Low on-resistance.
2) Fast switching speed.
3) Drive circuits can be simple.
4) Parallel use is easy.
5) Pb-free lead plating ; RoHS compliant
6) 100% Avalanche tested Packaging specifications
Type
Packaging Taping
Application Reel size (mm) 330
Switching Power Supply Tape width (mm) 16
Automotive Motor Drive Basic ordering unit (pcs) 2,500
Drain - Source voltage VDSS 200 V
Automotive Solenoid Drive Taping code TL
Marking C51N20
Absolute maximum ratings(Ta = 25°C)
Parameter Symbol Value Unit
Pulsed drain current ID,pulse *2 20 A
Tc = 25°C
Tc = 100°CContinuous drain current
ID *1 A5.0
ID *1 2.7 A
PD 0.85 W
Avalanche energy, single pulse
Avalanche current
Tc = 25°C
Ta = 25°C *4Power dissipation
Gate - Source voltage VGSS 30 V
PD 29 W
mJ
A
EAS *3
IAR *3
1.83
2.5
Junction temperature Tj 150 °C
Range of storage temperature Tstg 55 to 150 °C
(1)
(2)
(3)
∗1
(1) (2) (3)
1 BODY DIODE
(1) Gate(2) Drain(3) Source
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Data SheetRCD051N20
Thermal resistance, junction - case
1100RDS(on)
*5
Electrical characteristics(Ta = 25°C)
Parameter
Drain - Source breakdown voltage
Zero gate voltage drain current
V(BR)DSS
IDSS
-
-
- 10
- 100
ValuesUnit
gfs
VDS = 200V, VGS = 0V
Tj = 25°C
VDS = 200V, VGS = 0V
Thermal resistance
Parameter Symbol
Symbol Conditions
VGS = 0V, ID = 1mA
Tsold
Thermal resistance, junction - ambient *4
Soldering temperature, wavesoldering for 10s
RthJA
RthJC
ValuesUnit
Min. Typ. Max.
- 4.3 °C/W
- - °C/W147
-
Min. Typ. Max.
°C
V200 - -
- - 265
100 nA
Tj = 125°C
VGate threshold voltage VGS (th) VDS = 10V, ID = 1mA 3.25 - 5.25
Gate - Source leakage current IGSS VGS = 30V, VDS = 0V - -
A
mVGS = 10V, ID = 2.5A
Tj = 125°C
Forward transfer admittance VDS = 10V, ID = 2.5A 1.3 2.6 - S
Static drain - sourceon - state resistance
VGS = 10V, ID = 2.5A - 540 760
- 785
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Data SheetRCD051N20
*1 Limited only by maximum temperature allowed.
*2 Pw 10s, Duty cycle 1%
*3 L ⋍ 500H, VDD = 50V, Rg = 25, starting Tj = 25°C
*4 Mounted on a epoxy PCB FR4 (20mm × 20mm × 0.8mm)
*5 Pulsed
-
Continuous source current
8.3 -
IS = 2.5A
di/dt = 100A/sReverse recovery charge Qrr *5 - 150 -
Body diode electrical characteristics (Source-Drain)(Ta = 25°C)
Parameter Symbol ConditionsValues
UnitMin. Typ. Max.
Gate plateau voltage V(plateau) VDD ⋍ 100V, ID = 5.0A - 7.4
nC
20 A
Forward voltage VSD *5 VGS = 0V, IS = 5.0A - - 1.5 V
75 - ns
Tc = 25°C
Reverse recovery time trr *5
IS *1 - - 5.0 A
Pulsed source current ISM *2 -
Electrical characteristics(Ta = 25°C)
Parameter Symbol ConditionsValues
UnitMin. Typ. Max.
pFOutput capacitance Coss VDS = 25V - 33 -
Reverse transfer capacitance Crss f = 1MHz
Input capacitance Ciss VGS = 0V - 330 -
- 15 -
Turn - on delay time td(on) *5 VDD ⋍ 100V, VGS = 10V - 13 -
nsRise time tr
*5 ID = 2.5A - 15 -
Turn - off delay time td(off) *5 RL = 40.2 - 18 -
Fall time tf *5 RG = 10 - 8 -
Gate Charge characteristics(Ta = 25°C)
Parameter Symbol ConditionsValues
UnitMin. Typ. Max.
-
- V
ID = 5.0A
VGS = 10V
- 3.3 -
Gate - Drain charge Qgd *5 - 3.2 -
nCGate - Source charge Qgs *5
Total gate charge Qg *5 VDD ⋍ 100V -
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Data SheetRCD051N20
Electrical characteristic curves
0
20
40
60
80
100
120
0 25 50 75 100 125 150 175
0.01
0.1
1
10
0.0001 0.01 1 100
Ta=25ºCSingle PulseRth(j-c)(t) = r(t)×Rth(ch-c)
Rth(j-c) = 147ºC/W
top D = 1D = 0.5D = 0.1D = 0.05D = 0.01D = Single
0.01
0.1
1
10
100
0.1 1 10 100 1000
Ta=25ºCSingle Pulse
PW = 100s
PW = 1ms
PW = 10ms
Operation in thisarea is limitedby RDS(on)
Fig.1 Power Dissipation Derating Curve Fig.2 Maximum Safe Operating Area
Pow
er D
issi
patio
n :
PD/P
Dm
ax. [
%]
Dra
in C
urre
nt :
ID
[A]
Fig.3 Normalized Transient Thermal Resistance vs. Pulse Width
Nor
mal
ized
Tra
nsie
nt T
herm
al R
esis
tanc
e : r
(t)
Pulse Width : PW [s]
Junction Temperature : Tj [°C] Drain - Source Voltage : VDS [V]
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Data SheetRCD051N20
Electrical characteristic curves
0
0.2
0.4
0.6
0.8
1
0 0.2 0.4 0.6 0.8 1
VGS=5.0V
VGS=6.0V
Ta=25ºCPulsed
VGS=10.0V
VGS=7.0V
VGS=8.0V
0
1
2
3
4
5
0 2 4 6 8 10
VGS=5.0V
VGS=10.0V
VGS=8.0V
VGS=6.0V
VGS=7.0V
Ta=25ºCPulsed
0.1
1
10
100
0.01 0.1 1 10 100
VDD=50V,RG=25VGF=10V,VGR=0VStarting Tch=25ºC
0
20
40
60
80
100
120
0 25 50 75 100 125 150 175
Fig.6 Typical Output Characteristics(I)
Dra
in C
urre
nt :
ID
[A]
Drain - Source Voltage : VDS [V]
Fig.7 Typical Output Characteristics(II)
Dra
in C
urre
nt :
ID
[A]
Drain - Source Voltage : VDS [V]
Fig.4 Avalanche Current vs Inductive Load
Ava
lanc
he C
urre
nt :
IA
S[A
]
Coil Inductance : L [mH]
Fig.5 Avalanche Energy Derating Curvevs Junction Temperature
Ava
lanc
he E
nerg
y :
EA
S/ E
AS
max
. [%
]
Junction Temperature : Tj [°C]
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Data SheetRCD051N20
Electrical characteristic curves
180
190
200
210
220
230
240
250
260
270
280
-50 0 50 100 150
VGS = 0VID = 1mA
0.001
0.01
0.1
1
10
0 2 4 6 8 10
VDS= 10V
Ta= 125ºCTa= 75ºCTa= 25ºCTa= 25ºC
2.5
3.0
3.5
4.0
4.5
5.0
5.5
-50 -25 0 25 50 75 100 125 150
VDS = 10VID = 1mA
0.01
0.1
1
10
0.01 0.1 1 10
VDS= 10V
Ta= 25ºCTa=25ºCTa=75ºCTa=125ºC
Fig.10 Gate Threshold Voltagevs. Junction Temperature
Gat
e T
hres
hold
Vol
tage
: V
GS
(th)
[V]
Junction Temperature : Tj [°C]
Fig.11 Transconductance vs. Drain Current
Tra
nsco
nduc
tanc
e : g
fs[S
]
Drain Current : ID [A]
Fig.8 Breakdown Voltage vs. Junction Temperature
Junction Temperature : Tj [°C]
Fig.9 Typical Transfer Characteristics
Gate - Source Voltage : VGS [V]
Dra
in C
urre
nt :
ID
[A]
Nor
mar
ize
Dra
in -
Sou
rce
Bre
akdo
wn
Vol
tage
: V(B
R)D
SS
[V]
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Data SheetRCD051N20
Electrical characteristic curves
0
200
400
600
800
1000
1200
1400
0 5 10 15 20
Ta=25ºC
ID = 5A
ID = 2.5A
100
1000
10000
0.01 0.1 1 10
Ta=25ºC
VGS= 10V
0
100
200
300
400
500
600
700
800
900
1000
1100
1200
-50 0 50 100 150
VGS = 10VID = 2.5A
Fig.13 Static Drain - Source On - StateResistance vs. Drain Current(I)
Sta
tic D
rain
-S
ourc
e O
n-S
tate
Res
ista
nce
: RD
S(o
n)[m
]
Junction Temperature : Tj [ºC]
Fig.14 Static Drain - Source On - StateResistance vs. Junction Temperature
Sta
tic D
rain
-S
ourc
e O
n-S
tate
Res
ista
nce
: RD
S(o
n)[m
]
Drain Current : ID [A]
Fig.12 Static Drain - Source On - StateResistance vs. Gate Source Voltage
Sta
tic D
rain
-S
ourc
e O
n-S
tate
Res
ista
nce
: RD
S(o
n)[m
]
Gate - Source Voltage : VGS [V]
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Data SheetRCD051N20
Electrical characteristic curves
0
20
40
60
80
100
120
0 25 50 75 100 125 150 175100
1000
10000
0.01 0.1 1 10
Ta=125ºCTa=75ºCTa=25ºCTa= 25ºC
VGS= 10V
Fig.15 Static Drain - Source On - StateResistance vs. Drain Current(II)
Sta
tic D
rain
-S
ourc
e O
n-S
tate
Res
ista
nce
: RD
S(o
n)[m
]
Drain Current : ID [A]
Fig.16 Drain Current Derating Curve
Dra
in C
urre
nt D
issi
patio
n : I
D/I D
max
.(%
)
Junction Temperature : Tj [°C]
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Data SheetRCD051N20
Electrical characteristic curves
1
10
100
1000
10000
0.01 0.1 1 10 100 1000
Coss
Crss
Ciss
Ta = 25ºCf = 1MHzVGS = 0V
1
10
100
1000
10000
0.01 0.1 1 10
tr
tf
td(on)
td(off)
Ta=25ºCVDD= 100VVGS= 10VRG=10
0
5
10
15
20
0 2 4 6 8 10 12 14 16
Ta=25ºCVDD= 100VID= 5.0ARG=10
Fig.17 Typical Capacitancevs. Drain - Source Voltage
Cap
acita
nce
: C
[pF
]
Drain - Source Voltage : VDS [V]
Fig.19 Dynamic Input Characteristics
Gat
e -
Sou
rce
Vol
tage
: V
GS
[V]
Total Gate Charge : Qg [nC]
Fig.18 Switching Characteristics
Sw
itchi
ng T
ime
: t [
ns]
Drain Current : ID [A]
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Data SheetRCD051N20
Electrical characteristic curves
10
100
1000
0.1 1 10
Ta=25ºCdi / dt = 100A / sVGS = 0V
0.01
0.1
1
10
0.0 0.5 1.0 1.5
Ta=125ºCTa=75ºCTa=25ºC
Ta= 25ºC
VGS=0V
Fig.20 Source Currentvs. Source - Drain Voltage
Sou
rce
Cur
rent
: I S
[A]
Source-Drain Voltage : VSD [V]
Fig21 Reverse Recovery Timevs.Source Current
Rev
erse
Rec
over
y T
ime
: tr
r [n
s]
Source Current : IS [A]
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Data SheetRCD051N20
Measurement circuits
Fig.1-1 Switching Time Measurement Circuit Fig.1-2 Switching Waveforms
Fig.2-1 Gate Charge Measurement Circuit Fig.2-2 Gate Charge Waveform
Fig.3-1 Avalanche Measurement Circuit Fig.3-2 Avalanche Waveform
VGS
IG(Const.)
VDS
D.U.T.
ID
RL
VDD
90%
90% 90%
10% 10%
50%10%50%
VGS
Pulse width
VDS
ton toff
trtd(on) tftd(off)
VGS
RG
VDS
D.U.T.
ID
RL
VDD
VG
VGS
Charge
Qg
Qgs Qgd
VGS
RG
VDS
D.U.T.
IAS
L
VDD
IAS
VDD
V(BR)DSS
IAS2LEAS =
V(BR)DSS - VDD
V(BR)DSS12
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Data SheetRCD051N20
Dimensions (Unit : mm)
Dimension in mm/inches
CPT3
D
b1
e b
b3
b2
L3
A2
H A1
A3
c
L1 Lp
x B AL
EL2
l3
l2 l1
b6
b5
e
L4
c1
BA
MIN MAX MIN MAXA1 0.00 0.15 0 0.006A2 2.20 2.50 0.087 0.098A3b 0.55 0.75 0.022 0.03b1 5.00 5.30 0.197 0.209b2b3c 0.40 0.60 0.016 0.024c1 0.40 0.60 0.016 0.024D 6.30 6.70 0.248 0.264E 5.40 5.80 0.213 0.228eHE 9.00 10.00 0.354 0.394L 2.20 2.80 0.087 0.11L1 0.80 1.40 0.031 0.055L2 1.20 1.80 0.047 0.071L3L4Lp 1.00 1.60 0.039 0.063x - 0.25 - 0.01
MIN MAX MIN MAXb5 - 1.00 - 0.04b6 - 5.20 - 0.205l1 - 2.50 - 0.098l2 - 5.50 - 0.217l3 - 10.00 - 0.394
0.90 0.035
0.25 0.01
2.30 0.09
5.30 0.209
DIMMILIMETERS INCHES
DIMMILIMETERS INCHES
5.00 0.200.75 0.03
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Notice-PGA-E Rev.003 © 2015 ROHM Co., Ltd. All rights reserved.
Notice Precaution on using ROHM Products
1. Our Products are designed and manufactured for application in ordinary electronic equipments (such as AV equipment, OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you intend to use our Products in devices requiring extremely high reliability (such as medical equipment (Note 1), transport equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance. Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific Applications.
(Note1) Medical Equipment Classification of the Specific Applications JAPAN USA EU CHINA
CLASSⅢ CLASSⅢ
CLASSⅡb CLASSⅢ
CLASSⅣ CLASSⅢ
2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor
products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which a failure or malfunction of our Products may cause. The following are examples of safety measures:
[a] Installation of protection circuits or other protective devices to improve system safety [b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure
3. Our Products are designed and manufactured for use under standard conditions and not under any special or extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any special or extraordinary environments or conditions. If you intend to use our Products under any special or extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of product performance, reliability, etc, prior to use, must be necessary:
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H2S, NH3, SO2, and NO2
[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves [e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items [f] Sealing or coating our Products with resin or other coating materials [g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of
flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning residue after soldering
[h] Use of the Products in places subject to dew condensation
4. The Products are not subject to radiation-proof design. 5. Please verify and confirm characteristics of the final or mounted products in using the Products. 6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied,
confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect product performance and reliability.
7. De-rate Power Dissipation depending on ambient temperature. When used in sealed area, confirm that it is the use in
the range that does not exceed the maximum junction temperature. 8. Confirm that operation temperature is within the specified range described in the product specification. 9. ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in
this document.
Precaution for Mounting / Circuit board design 1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product
performance and reliability.
2. In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products, please consult with the ROHM representative in advance.
For details, please refer to ROHM Mounting specification
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Precautions Regarding Application Examples and External Circuits 1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the
characteristics of the Products and external components, including transient characteristics, as well as static characteristics.
2. You agree that application notes, reference designs, and associated data and information contained in this document
are presented only as guidance for Products use. Therefore, in case you use such information, you are solely responsible for it and you must exercise your own independent verification and judgment in the use of such information contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of such information.
Precaution for Electrostatic This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron, isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).
Precaution for Storage / Transportation 1. Product performance and soldered connections may deteriorate if the Products are stored in the places where:
[a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2 [b] the temperature or humidity exceeds those recommended by ROHM [c] the Products are exposed to direct sunshine or condensation [d] the Products are exposed to high Electrostatic
2. Even under ROHM recommended storage condition, solderability of products out of recommended storage time period may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is exceeding the recommended storage time period.
3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads
may occur due to excessive stress applied when dropping of a carton. 4. Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of
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