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Page 1: Packaging Technology Trends...2016 Data Center Data DC fabrication investment rivals semiconductor fab investment China has 7 of the 10 largest DCs in the world Largest Data Center

© 2017 Amkor Technology, Inc. 1

Packaging Technology TrendsRon Huemoeller l Corporate Vice President l WW R&D and Technology Strategy

Page 2: Packaging Technology Trends...2016 Data Center Data DC fabrication investment rivals semiconductor fab investment China has 7 of the 10 largest DCs in the world Largest Data Center

© 2017 Amkor Technology, Inc. 2

Market Dynamics

Market Trends

Key Package Platforms

Summary

Outline

Page 3: Packaging Technology Trends...2016 Data Center Data DC fabrication investment rivals semiconductor fab investment China has 7 of the 10 largest DCs in the world Largest Data Center

© 2017 Amkor Technology, Inc. 3

Economics of Packaging Today

Page 4: Packaging Technology Trends...2016 Data Center Data DC fabrication investment rivals semiconductor fab investment China has 7 of the 10 largest DCs in the world Largest Data Center

© 2017 Amkor Technology, Inc. 4

Semiconductor Outlook

▪ Continued growth

– Moore’s Law extends

– Mobility

– Automotive

– IoE through a connected world

▪ Greater need for advanced

packages

– Advanced SiP

– Heterogeneous integration

Page 5: Packaging Technology Trends...2016 Data Center Data DC fabrication investment rivals semiconductor fab investment China has 7 of the 10 largest DCs in the world Largest Data Center

© 2017 Amkor Technology, Inc. 5

Advanced Packaging: Must Pay to Play

▪ Developing & manufacturing new

package platforms is expensive

Requires a high degree of

engineering expertise

Requires perpetual funding in

R&D

Requires ability to invest in ‘new’

ideas

Adding new blocks of capacity

expensive – challenging ROI

Page 6: Packaging Technology Trends...2016 Data Center Data DC fabrication investment rivals semiconductor fab investment China has 7 of the 10 largest DCs in the world Largest Data Center

© 2017 Amkor Technology, Inc. 6

Economics of Business Today

▪ Changing competitive environment

– Tier 1 OSATs dominate in

technology

– Entry of foundry

– Suppliers upward ambition

▪ Pace of change accelerating!

– Forcing “all in” mentality

Page 7: Packaging Technology Trends...2016 Data Center Data DC fabrication investment rivals semiconductor fab investment China has 7 of the 10 largest DCs in the world Largest Data Center

© 2017 Amkor Technology, Inc. 7

Market Trends

Page 8: Packaging Technology Trends...2016 Data Center Data DC fabrication investment rivals semiconductor fab investment China has 7 of the 10 largest DCs in the world Largest Data Center

© 2017 Amkor Technology, Inc. 8

Mobility IoT AutomotiveHPC/

Networking

▪ Ultra Thin, Small

▪ Integration, SiP

▪ 5G

▪ Envelope Tracker

▪ AR/Streaming

▪ Miniaturization

▪ Integration

▪ Secure

▪ Power/Connected

▪ Home/Factory/Auto

▪ Reliable, AEC-006

▪ Integration, SiP

▪ 5G

▪ ADAS/Connected

▪ Infotainment/ECU

▪ Performance

▪ Integration

▪ Thermal, Power

▪ AI/AR

▪ Data Center/SiPHO

Major Package Trends

Page 9: Packaging Technology Trends...2016 Data Center Data DC fabrication investment rivals semiconductor fab investment China has 7 of the 10 largest DCs in the world Largest Data Center

© 2017 Amkor Technology, Inc. 9

Mobile▪ Low cost Flip Chip

▪ WLCSP/Fan-Out

▪ MEMS & Sensors

▪ Substrate SiP

▪ Wafer SiP

Consumer/IoT▪ Low cost Flip Chip

▪ WLCSP

▪ MEMS & Sensors

▪ Substrate SiP

HPC▪ Substrate SiP

▪ Wafer SiP

Automotive▪ MEMS & Sensors

▪ Substrate SiP

Choices narrow as product becomes more complicated

Key Market Segments Driving Packaging Technology

~80 packaged die

opportunities

Mobile Automotive~100 packaged die

opportunities

Consumer/IoT HPC

Page 10: Packaging Technology Trends...2016 Data Center Data DC fabrication investment rivals semiconductor fab investment China has 7 of the 10 largest DCs in the world Largest Data Center

© 2017 Amkor Technology, Inc. 10

Mobile Market Growth

Source: GFK May 2017

Page 11: Packaging Technology Trends...2016 Data Center Data DC fabrication investment rivals semiconductor fab investment China has 7 of the 10 largest DCs in the world Largest Data Center

© 2017 Amkor Technology, Inc. 11

Low-end Mid-end High-end

Model Name Lenovo K3 Note OPPO R9S Apple iPhone 7

Release Date Mar. 2015 Oct. 2016 Sep. 2016

Price ~$X ~$2X ~$4X

AP Spec MediaTek MT6752Qualcomm

Snapdragon 625

Apple

A10

# of Pkgs 26 49 69

Source Amkor Teardown Amkor Teardown Amkor Teardown

Smartphone Segments

~80 packaged die opportunities in high end smartphone

Page 12: Packaging Technology Trends...2016 Data Center Data DC fabrication investment rivals semiconductor fab investment China has 7 of the 10 largest DCs in the world Largest Data Center

© 2017 Amkor Technology, Inc. 12

Technology in the Mobile Market Segments

AP/BB,

Standalone

AP or BB

RF Connectivity

Codec

PMIC

Sensor SoCPeripherals

MEP/Fan-In PoP

TMV® PoP

fcCSP

SWIFT®

fcCSP-Hybrid

fcCSP

WLCSP

WLFO

fcCSP

WLCSP

WLFO

SiP

LCCSP (ETS, MSP)

WLCSP 5s WLCSP

WLFO

SiP

Page 13: Packaging Technology Trends...2016 Data Center Data DC fabrication investment rivals semiconductor fab investment China has 7 of the 10 largest DCs in the world Largest Data Center

© 2017 Amkor Technology, Inc. 13

Wafer-Level Packaging

▪ Smartphones driving wafer-

level packaging

▪ Phones getting thinner

▪ Number of WLP per phone

increasing

▪ WLP proliferating into other

applications and markets

Source: TechSearch International, Inc.

77 GHz Radar System

Page 14: Packaging Technology Trends...2016 Data Center Data DC fabrication investment rivals semiconductor fab investment China has 7 of the 10 largest DCs in the world Largest Data Center

© 2017 Amkor Technology, Inc. 14

Number of SiP Packages Increasing

▪ RF related packages: power amplifier, front-end module, antenna switch

and Wi-Fi

2G 3G 4G

Product Nokia 1800 ZTE Z Phone Samsung Galaxy S7

Release Date Nov. 2009 Sept. 2012 Feb. 2016

Total Number of SiPs 1 2 8

Page 15: Packaging Technology Trends...2016 Data Center Data DC fabrication investment rivals semiconductor fab investment China has 7 of the 10 largest DCs in the world Largest Data Center

© 2017 Amkor Technology, Inc. 15

5G Requires Massive Filtering

3G LTE 5G

# of Supported Bands

# of Supported Bands

Page 16: Packaging Technology Trends...2016 Data Center Data DC fabrication investment rivals semiconductor fab investment China has 7 of the 10 largest DCs in the world Largest Data Center

© 2017 Amkor Technology, Inc. 16

Automotive ICsUbiquitous

Camera Modules

1

1

Body Systems

2

Info-Center

3

MEMS & Sensors

4

Safety Systems

5

2

3

4

5

▪ Electronic value added to vehicles estimated at 40% and increasing

with ~100 packaged die opportunities in high end automobiles

Page 17: Packaging Technology Trends...2016 Data Center Data DC fabrication investment rivals semiconductor fab investment China has 7 of the 10 largest DCs in the world Largest Data Center

© 2017 Amkor Technology, Inc. 17

2016 Data Center Data

▪ DC fabrication investment rivals semiconductor fab investment

▪ China has 7 of the 10 largest DCs in the world

Largest Data Center in World = China Telecom ~10M sq.ft. with 150 MW power requirement

Source: Finisar OFC 2016

Page 18: Packaging Technology Trends...2016 Data Center Data DC fabrication investment rivals semiconductor fab investment China has 7 of the 10 largest DCs in the world Largest Data Center

© 2017 Amkor Technology, Inc. 18

Wembley Stadium: 172,000 sq. ft.

Can fit ~63 Wembley stadiums

2016 Largest DC in The World

China Telecom: 10,763,910 sq. ft.

Hohhot (Inner Mongolia)

Page 19: Packaging Technology Trends...2016 Data Center Data DC fabrication investment rivals semiconductor fab investment China has 7 of the 10 largest DCs in the world Largest Data Center

© 2017 Amkor Technology, Inc. 19

High Performance Computing & Networking

400GE Silicon Photonics

10G/40GE Data Centers, Enterprise fcBGA

WLAN WiFi, LTE, Small Cell SiP

Data needs to be accessible always and in real-time

More ApplicationsMore Devices More Data

100GE Hyperscale Data Centers 2.5D TSV

SWIFT®

Page 20: Packaging Technology Trends...2016 Data Center Data DC fabrication investment rivals semiconductor fab investment China has 7 of the 10 largest DCs in the world Largest Data Center

© 2017 Amkor Technology, Inc. 20

Next Level of Package IntegrationMajor Package Platform

Page 21: Packaging Technology Trends...2016 Data Center Data DC fabrication investment rivals semiconductor fab investment China has 7 of the 10 largest DCs in the world Largest Data Center

© 2017 Amkor Technology, Inc. 21

Chip ScalePackaging

Wafer

Flip Chip

Laminate

MEMs

Laminate/Leadframe/

Wafer

System in Package: SiP

Laminate

Next Gen SiP

Wafer

“The Big 5” Packaging Platforms

Page 22: Packaging Technology Trends...2016 Data Center Data DC fabrication investment rivals semiconductor fab investment China has 7 of the 10 largest DCs in the world Largest Data Center

© 2017 Amkor Technology, Inc. 22

Flip Chip Technologies

▪ The best choice for larger single die & big body packages

▪ A mature technology with focus on lowering cost

▪ Enables SiP packaging

Page 23: Packaging Technology Trends...2016 Data Center Data DC fabrication investment rivals semiconductor fab investment China has 7 of the 10 largest DCs in the world Largest Data Center

© 2017 Amkor Technology, Inc. 23

MEMS

▪ IoE, wearables & industrial

– Sensor fusion

– SOIC, QFN & laminate

– Low power, form factor & cost

– A step into SiP

▪ System & functional integration

Page 24: Packaging Technology Trends...2016 Data Center Data DC fabrication investment rivals semiconductor fab investment China has 7 of the 10 largest DCs in the world Largest Data Center

© 2017 Amkor Technology, Inc. 24

Reference Design

SiP Requires State of the Art Technology

Small Form

Factor

Passive comp.

/IPD/Embedded

Embedded &

Conformal

Shielding

Antenna,

Crystal,

SAW/BAW

Filters

Side by Side

Stacked

PoP.

3D-WLFO Benefits

H

Cavity

POSSUM™

F2F

Leadframe2.5D/3D

Page 25: Packaging Technology Trends...2016 Data Center Data DC fabrication investment rivals semiconductor fab investment China has 7 of the 10 largest DCs in the world Largest Data Center

© 2017 Amkor Technology, Inc. 25

Advanced SiP (Wafer-based)

▪ Provides very best in performance

▪ Thinnest form factor

▪ Ultimate in:

– Power

– Electrical

– Thermal

Page 26: Packaging Technology Trends...2016 Data Center Data DC fabrication investment rivals semiconductor fab investment China has 7 of the 10 largest DCs in the world Largest Data Center

© 2017 Amkor Technology, Inc. 26

Fan-Out Package Evolution to Adv Wafer SiP

Low Density FOWLP

▪ Limited scalability & platform extension to MCM, SiP and 3D

Adv Wafer SiP

▪ Logic to Memory or Logic

▪ Fan-out module attach to substrate as alternative to TSV 2.5D

High Density FOWLP

▪ Better scalability, 3D compatible process and extended platform to SiP

Miniaturization

Integration

Performance

Reliability

Cost

Page 27: Packaging Technology Trends...2016 Data Center Data DC fabrication investment rivals semiconductor fab investment China has 7 of the 10 largest DCs in the world Largest Data Center

© 2017 Amkor Technology, Inc. 27

Summary…Technology Pace has Quickened

Page 28: Packaging Technology Trends...2016 Data Center Data DC fabrication investment rivals semiconductor fab investment China has 7 of the 10 largest DCs in the world Largest Data Center

© 2017 Amkor Technology, Inc. 28

Mobility IoT AutomotiveHPC/

Networking

▪ Ultra Thin, Small

▪ Integration, SiP

▪ 5G

▪ Envelope tracker

▪ AR/Streaming

▪ Miniaturization

▪ Integration

▪ Secure

▪ Power/Connected

▪ Home/Factory/Auto

▪ Reliable, AEC-006

▪ Integration, SiP

▪ 5G

▪ ADAS/Connected

▪ Infotainment/ECU

▪ Performance

▪ Integration

▪ Thermal, Power

▪ AI/AR

▪ Data Center/SiPHO

Heterogeneous Integration is the over riding common theme

Page 29: Packaging Technology Trends...2016 Data Center Data DC fabrication investment rivals semiconductor fab investment China has 7 of the 10 largest DCs in the world Largest Data Center

© 2017 Amkor Technology, Inc. 29

Packaging the Future

▪ Economics of packaging

– Requires intelligent growth & investments

▪ Mobility, IoT, Automotive & Networking

– Biggest market drivers for next 5-10 years

▪ Innovative technologies

– Enabling more functionality and offering higher

levels of integration is a clear focus

Best

Solution

Page 30: Packaging Technology Trends...2016 Data Center Data DC fabrication investment rivals semiconductor fab investment China has 7 of the 10 largest DCs in the world Largest Data Center

© 2017 Amkor Technology, Inc. 30

Thank [email protected]


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