CorporateProfile
Corporate Office:15991 Red Hill Ave Suite 102, Tustin, CA 92780Direct: 408-667-3333Office: 714-460-0718 x 115
Home Page:WWW.PALPILOT.COM
Advanced PCBs, Interconnects, and Magnetics
China PCB Production / 2001Taiwan PCB Production / 1999N. & S. California Facility Established / 1993 / 1997
PALWONN Group Established 2010Component Division Established. Strategic Alliance with / 2007
Established FastPrint PalPilot North America / 2013
Magnetic, PalCELL and PalMEMS Divisions / 2012 Strategic Alliance with Sitor / 2011 Suzhou (ZPW) Started Production / 2011
1993 2007 2011 2013 2014
Milestones
GLOBAL REVENUE / 09-13
0 US$ Million
200 US$ Million
400 US$ Million
600 US$ Million
800 US$ Million
1000 US$ Million
1200 US$ Million
PCBConnectorPCB Design
Revenue Totals Based on Global Alliance PartnersGlobal Revenue / 2009-2015
2009 2010 2011 2012 2013 2014 2015*
*Projected
EngineeringDivision
Measurement
High Speed Connectors PCB Manufacturing
Advanced Packaging Supply
Enclosures
Integrated Interconnect Solutions
CrossFunctional
Design
SI/PI ModelingCollaborativeDevelopment
- Component Library- Schematic Symbol Creation- 2D/3D Mechanical Design- Footprint Creation
- Design PCB Layout- Place & Route- 24-Hour PCB Routing Services
- Constraint Rules Driven- 100% Manual Hand Routing- Design Partitioning, Multiple
Designers
- Connector Innovation- USB 3.1 Contributing Member- SFF, MSA Compliant- Customized High Speed Design
- Thermal/Electrical Enhancement
- Signal/Power Integrity (SI/PI) Modeling- Impedance Optimization- Minimize Return Loss- Insertion Loss Reduction- Cross Talk Reduction - Power I/R Drop Characterization
- Agilent Joint Laboratory (System Measurement)- Simulation Vs Measurement- Characterization & Validation
Integrated Interconnect Solutions
PCB Fab&
IC Substrates
PalPilot’s Factories Offer
- Quick Turn Around 5-10 days from Asia- High Mix Low/Medium Volume (HMLV) Production For Low and High technology PCB’s
- High Volume Production (1 -40 layer) - High Layer (Line card/Backplane)- Flex and Ridge Flex- High Density Interconnect (HDI)
- IC Substrate High Density CSP Substrate Next Generation High I/O (<100um FC Package) Metal Core + Flex (High Thermal Substrate) Class10,000 Cleanroom; Class 1,000 Photoprinting
PCB & Substrate Manufacturing Disciplines
PCB DIVISIONCapabilities / Rigid PCB
- Layers 1-40 (layers)- Max Board Size 24” x 40”- Max Board Thickness .315”- Min. Board Thickness 4 layers 16mil, 6 layers 24mil, 8 layers 40mil, 10 layers 48mil, 12~16 layers 63mil- HDI Boards Blind, Buried & Stacked Vias- Min. Line Width / Space 3mil- HDI Line Width / Space <1mil- Min. Mechanical Drill / Pad 6mil/16mil- Min Laser Drill / Pad 4mil/10mil- PTH Dia. Tolerance ±3mil- NPTH Dia. Tolerance ±1mil- Hole Position Deviation ±3mil- Outline Tolerance ±4mil- Solder mask Dams 3mil- Aspect Ratio Mechanical 15:1- Aspect Ratio Laser 1:1- Flammability 94V-0- Impedance Control ≤50 OHMS = ±5OHMS >50 OHMS = ±10%
PCB DIVISIONCapabilities / Flex
- Layers 1-8 (layers)- Max Board Size 8.6” x 13.8”- Max Board Thickness .031” without stiffener- Min. Board Thickness 4mil- Min. Line Width 3mil- Min. Line Space 3mil- Min. Mechanical Drill 6mil- Outline (Laser) Tolerance ±2mil- Cover Layer Dams 8mil- Flammability 94V-0- Impedance Control ≤50 OHMS = ±5OHMS >50 OHMS = ±10%
- Leaded HASL- Lead Free HASL- Immersion Gold (ENIG)- Immersion Gold (ENEPIG)- Immersion Silver- Immersion Tin- Hard Gold (Fingers)- Selective Hard Gold- Wire Bondable Soft Gold- Flash Gold- OSP- Carbon Ink
MATERIALS SURFACEFINISHES
MATERIALSUPPLIERS
- Isola- Sheng Yi- ITEQ- Ventec- Nelco- Megtron- Rogers- Taconic
Materials & Surface Finish
- Standard Tg FR-4- Mid Tg FR-4- High Tg FR-4- High Speed Materials- Mixed Dielectric Constructions- Halogen Free- High CTI- Polyimide (adhesive, adhesiveless)- PET / Polyester- Metal Cores
IC Substrate / Package Product Family
CSP Substrate(WB & FC)
Ceramic on Organic Laminate (COOL)
Metal CoreFlex/COB
High DensityCSP Substrate
ThermalManagement
Ultra High Density “Core Less” Package
IC Substrate Product Family
- IC Package Electronic Test Services:- Impedance & S Parameter…
- Package Design- IC Substrate Design- Substrate Production…
ElectricalPackage / Substrate PackageMeasurement
- Package EM Simulation- Extracting RLC Parameters & S Parameters- Package SI/PI Simulation- PKG & PCB Co-Simulation
Components
- USB 3.1- USB 3.1
Type-C - USB 3.0- USB 2.0- USB Type A- USB Type B- USB Type AB- Mini USB- Micro USB
- SATA- eSATA- Micro SATA
- Type A (1.0 Spec)- Type B (1.0 Spec)- Type C (1.3 Spec)- Type D (1.4 Spec)- Type E (1.4 Spec)- Mini-HDMI- Micro-HDMI
USB, SATA & HDMI Connectors
HDMISATA USB
- 10/100/1000 Base-T- 10GBase-T- RJ45 + USB Combo- PoE/PoE Plus with Internal Diode Bridge
- Single Port- Multiple Port- Stacked Port- Low Profile- Vertical- Custom Configurations- Optional Emi Tabs
- Integrated Magnetics- Tab Up or Tab Down- LED Color Options- Surge Protection- RoHS Compliant
Types Features
RJ45 W/ Magnetics
Packages
LANModules Inductors Filters
CommonMode
ChokesTransformers
- 10/100/1000 Base-T LAN Magnetic Discrete Modules- PoE/PoE+ Modules
- Power- Signal- Energy Storage- Power Supply
- Signal Filtering- Noise Filtering- Power Supply
- Noise Suppression- Power Supply- Telecom
- Flyback- Coupling- Analog- RF - Switching- PoE/PoE+- T1/E1
Discrete Magnetics
- nQSFP+ 100G/112G 25~28Gbps/Channel - nSFP+ 25~28Gbps Data Rate
- QSFP+ 40G~56G- 10~14Gbps/Channel- Press-Fit or Solder Tail- Light Pipe- Heat Sink
- SFP+ 10~14Gbps Data Rate- Press-Fit or Solder Tail- Light Pipe- Heat Sink
- SFP 1~5Gbps Data Rate- Press-Fit or Solder Tail- Light Pipe- Heat Sink
Meet SFF Committee Specification & Fully MSA Compliant
nQSFP+nSFP+ SFPQSFP+ SFP+
High Speed I/O Connector
- 0.4 Pitch. 0.8H/0.9H/ 1.0H/1.5/H2.0H.- 10 Pin~60 Pin- Designed to Prevent Tin Wicking- Narrow Design to Reduce Space for PCB
- 0.3mm, 0.5mm Pitch 1.0H- 6 Pin ~ 67 Pin- Front and Backflip Lock- Designed to Prevent Tin Wicking- Superior Solder Peg
- 1.2H/1.5H/2.5H Plug and Socket Series 0.81/1.00/1.13/1.32 /1.37 Wire- Supports Insert Molding Process for Sealing- Strong Chamber for Better Molding and Mating Guide
- 1.5/1.30H Push Pull Type Micro SD- Locking Feature for the Design- Anti Card Fast Eject Function- Detection Switch Pin Attached- Low Profile Sim Card
- Plastic Cover- Stamping Contact- Insert Molding Mechanical Structure
FPCConnector
RF Connector
Custom Made
ConnectorMemory
CardBTB
Connector
BTB, FPC, RF, Custom Connector, Memory
- Flex-Pin Design with Beryllium Copper material - The best solution for resisting vibration and shock- Small contact size, 50 mil pitch- Ø 0.27” outer housing with 12 contacts - Tail options for pre-wired, solder cup, and solid straight tail
- PSU or PEI plastic housing - Peek insulator for high performance- Autoclave sterilization & disinfection levels- Tough-proof design- Color identification & Keying options - Disposable types
- Robust self-latch mechanism- DIP and Solder cup contacts - Error-proof keying options- Fully EMC protected - 2 to 32 contact options- Water tight IP67 F0K/F1K/ F2K series
- Robust self-latch mechanism- Solder, Crimp and Print Style Contacts - Error-proof keying options- Fully EMC protected - 2 to 32 contact options- IP50
Segment View
Push-Pull Locking Circular Connector
P SeriesPush-Pull
B-Series Push-Pull
K SeriesPush-Pull
MicroCircular
Cable Assembly
AOC HDMI USB LVDSSATA RF
- 56G QSFP + AOC - 40G QSFP+AOC- 10G SFP+AOC- HDMI + AOC- Hot Pluggable- Fiber to 100M- QSFP+MSA Compliant
Form Factor- HDMI Compliant with
version 1.4a
- HMDI 19 Pin Male to Male
- HDMI 19 Pin Male to DVI-D
- Custom Design - Low Noise- High Volume
Manufacturing Capabilities
- USB 2.0 A to B- USB 3.0 to 3.1- USB 3.1 Type-C - Custom Design- USB Committee
Member
- Crimp Terminal LVDS
- Housing LVDS- SATA 7pin/
7+6pin/7+15pin/
- Matches high frequency characteristics
- 1.2H/1.5H/2.5H plug and socket series 0.81/1.00/1.13/1.32/1.37 wire
Injection Molding, Coating, & Metal Die-Casting
- Tooling Design
- Hot Runner
- Double-Shot
- Makino & Charmiles Manufacturing Equipment
- Quality, Ultra-Slim Plastic Injection
- Metal Stamping
- Extrusion Aluminum Die-Casting
- Gate Cut in Mold Technology
- More than 220 High Speed Injection Machines
- Advanced Spray Painting Tech
- Anti-Finger Print Finish
- Soft Touch Finish
- 8 Fully Automatic Lines Up to 5 Chambers/Line
SprayPaintingInjection
ToolingShop
Amazon Kindle Fire HD Tablet Lenovo Yoga Blade Tablet Lenovo S8 Custom Heat Sink
Corporate Offices / Design Center Regional Sales Offices PCB Manufacturing / Design Center
PalPilot Taiwan Magnetic ManufacturingConnector Manufacturing
Global Locations
EMS Customers
OEM Customers
Any Inquiries, Contact:
Randy Yang, Sales ManagerDirect: 408-667-3333
[email protected] Red Hill Ave Suite 102,
Tustin, CA 92780