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Page 1: Process for pickling steel

nitrate solution and the reducing substantial electroless gold plat- solution. ing solution.

US. Patent 6,398,855. June 4,2002 R. Palmans and Y Lantasov, assig- nors t IMEC VZW, Kapeldreef; Belgium An aqueous solution for electroless deposition of copper on a substrate comprising a source of copper ions; a reducing agent; an additive to adjust the pH to a value between 11 and 13.5; and a compound for complexing the copper ions.

SOLUTRON l_%S. Patent 6,398,856. June 4,2002 M. Nakazawa, assignor to Shinko Electric Industries Co., Ltd., Japan A sunbstantial electroless gold plating solution for applying gold to a surface of nickel or a nickel alloy, in which a straight chain alkylamine, a nickel or nickel alloy reducing agent selected from the group consisting of hypophosphite and a hydrazine compound and gold cyanide as a gold source are blended into the

US. Patent 6,398,870. June 4,2002 T. Kaya and M. Fuchiwaki, assignors to Chuo Electronic Measurement Co., Ltd., Hiroshima-ken, Japan A system for detecting a spot to mend on an outer surface of a coated body and marking the spot to mend, the system com- prising an image pickup device moved relative the coated body for detecting a spot to mend on the coated body; a marking unit moved relative the coated body having a marking solution applicator for making the spot mend using a marking solution; a relocating mechanism for moving the marking solution applicator to apply the marking solution at the spot to mend; and a controller for controlling the marking unit and the relo- cating mechanism to apply the marking solution at the spot to mend based on output from the image pickup device.

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U.S. 6,398,871. June 4,2002 J Hun assignor to Hyundai Motor Co., Seoul, Rep. of Korea An apparatus for painting the door of a vehicle comprising a painting robot having a door open/close jig, including a supporting bar elasti- cally supported by a spring and a permanent magnet; and a holding unit for a door panel having a height control cylinder for control- ling the height thereof, a moving cylinder for holding or releasing the door opened, a rotor connected with the moving cylinder, and guide shaft mounted on an end of the rotor and having a holder pro- vided with a plurality of recesses for holding the door panel on its surface.

~~0~~~~ I. US. Paten 002 J Starvcevic and D. Gamsriegler, assignors to Andritz-Patentverwaltungs GmbH, Graz, Austria A process of pickling a stainless steel metal substrate comprising combininag a spent neutral salt electrolyte pickling solution

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142 Metal Finishing

Page 2: Process for pickling steel

obtained from a neutral salt elec- trochemical pickling process with an acid solution thereby forming an acid pickling solution; and con- tacting a stainless steel metal substrate with the acid pickling solution for a time sufficient to pickle the stainless steel metal substrate.

US. Patent 6,398,877. June 4,2002 C. T Magliocca, Tacoma, Wash. A method of cleaning parts with a solvent while maintaining a rela- tively high degree of purity of the solvent the method comprising placing the parts to be washed in a wash basin; causing the parts to be washed with solvent in the basin; directing the solvent to flow by the force of gravity from the wash basins to a centrifugal filter and operating the centrifu- gal filter to separate from the sol- vent impurities in the solvent; collecting the solvent separated from the centrifugal filter in a reservoir; and recirculating the solvent from the reservoir back to

the wash basin for further use in washing the parts in the basin.

QlOf DWPEB EL Pl.&rlE VS. Patent 6,398,884. June 4,2002 K. Kyono, et al., assignors to Kawasaki Steel Corp., Kobe, Japan Methods of producing steel plate, hot-dipped steel plate, and alloy hot dipped steel plate.

ELElCTRGPLATING A~~A~~GG

US. Patent 6,398,926. June 4, 2002 L.F! Mahneke, assignors to Techpoint Pacific Singapore Pte Ltd., Singapore An electroplating apparatus com- prising a substantially planar chuck having an upper surface for the substrate to be disposed there- on; means located on the upper surface for securing the substrate thereon; and a barrier element extending from the upper surface for securing the substrate thereon; and a barrier element extending from the upper surface and adapt- ed to abut the bottom surface of the substrate, the barrier element for inhibiting fluid from flowing beyond the periphery of the bottom surface of the substrate.

US. Patent 6,398,934. June 4,2002 K. Klein, et al., assignors to E. I. du Pont de Nemours and Co., Wilmington, Del. A 2-component concentrate suit- able for the preparation of cathod- ic electrodeposition coating com- positions comprising in combination a binder component comprising an aqueous dispersion of a cathodic electrodeposition binder having groups of active hydrogen being cross-linkable with a blocked polyisocyante; and a cross-linking component of an anhydrous, organic solution of an oxime-blocked isocyanate-func- tional adductof an aromatic poly- isocyanate.

APPARATUS FOR PLATING COPPER

QAI PAR‘I’I~ULATE GRAPHITE

US. Patent 6,398,936. June 4,2002 C-B. Lin and J-l? Lin, Taiwan A process for plating copper on particulate graphite comprising cleaning and drying graphite par- ticles; wetting the graphite parti- cles with a plating solution con- taining copper ions; dripping the

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