PROJECT ARA
By: ZIAD IBRAHIM IBN NAZAR1HK11CS121
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HKBK COLLEGE OF ENGINEERINGCOMPUTER SCIENCE AND
ENGINEERING
Under the Guidance ofMr. Neelam Malayadri
Asst. Professor
INTRODUCTION TO PROJECT ARA
Project Ara is the codename for an initiative by Google that aims to develop a free , open hardware platform for creating highly modular smartphones .
It is made up of swappable and replaceable parts. The phone is designed to be a long-term sustainable product tailored to customers’
changing needs .
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Overview of Modular Phone
A modular smartphone is made using different components. Modular phones components can independently be upgraded or replaced. The most important component is the main board, where others are attached. Customization has shown to be attractive to customers in a mobile device and
increases the devices lifespan.
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The MDK defines the Ara platform for module developers and provides reference implementations for various design features.
The Ara platform consists of an on-device packet-switched data network .
It is based on the MIPI UniPro protocol stack, a flexible power bus, and an elegant industrial design that mechanically unites the modules with an endoskeleton.
MDK – MODULE DEVELOPMENT KIT
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SOFTWARE ARCHITECTURE Project ARA runs on a
specialised version of Android
Modules use generic device class drivers that interface with updated Android HALs and services to enable the unique modular features on the Ara platform.
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Project ARA Platform Endo-Skeleton Modules
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Endo-Skeleton The Ara endoskeleton is the frame and backplane of the device, determining
the size and layout of the phone. Ara modules slide in and attach to the endo’s slots, which has a backplane to
electrically and logically connect modules together. There are currently 3 endo size
◦ Mini◦ Medium◦ Large
Endoskeleton Connection◦ Front : Latches◦ Back: Electro Permanent Magnets
Life Span – 5 to 6 YearsDept. . of CSE 7 23/0/2016
Modules
Modules are building blocks of Project Ara. Module is an integrated component which can house a Chip, Wireless component, SD Slot, which are connected to endo. Modules can be of anything like camera, battery, chip etc. Modules are connected by EPM, due to which they are swappable
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New Technologies in ARA
UniPro 1.6
Capacitive M-PHY
Electropermanent Magnet
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UniPro 1.6 UniPro is a high speed internet protocol that project ARA uses
to allow its modules to speak to each other. They share a common low level language for communicating
and building a network. Project ARA is tapping into the latest UniPRO 1.6 SPEC Which offer high-bandwidth, and low power connections
between the modules.
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Capacitive M-PHY
A physical layer spec which is developed by MIPI alliance and made to work with UniPro.
For project ARA, M-PHY is a capacitive interface, which means that the points won’t be worn down over time from swapping modules in and out of the phone.
M-PHY is requiring less pins and providing more bandwidth per pin with improved power efficiency.
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Electropermanent Magnet
Electropermanent magnets are used for affixing the modules in place in the ‘ENDO’
Normal Electromagnets magnetize depending on if current is running through them- that would be battery drain
But Electropermanent magnets only use current to flip magnetization on & off It is able to retain its magnetized state without draining additional power
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Electro permanent Magnet
Advantages Phones are very cheap. You only buy the feature that you want. Your phone can last indefinitely. Repairs are easy and cheaper .
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Goal of Project ARA To reduce production of E-Waste. To Expand life-span of electronic components . To be used by six billion people.
Conclusion…. Modular market
Modular market might not settle so quickly . With the prototype’s receive in the market, new companies or individuals
might get interested in the development of modules The success is tightly connected to the variety of modules and brands that
the user might be able to acquire . The platform that allows the user to manage all its modules should be
intuitive enough for new smartphone users.
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References http://www.projectara.com/ PHONEBLOKS. Phonebloks, a phone worth keeping. 2014.
https://phonebloks.com/en THUNDERCLAP.INC. Thundeclap. 2012 https://www.thunderclap.it/en http://www.modularphonesforum.com/developers/faq/ara-software-stack/ http://
www.theverge.com/2015/1/14/7547495/ara-configurator-app-project-ara-smartphone
https://github.com/projectara http://www.projectara.com/mdk/
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ANY
QUESTION
S ?
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Thank
You
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