EF_to_NCPsMtg_Challenge3 - 1
Provisional draft
NCPs MeetingBrussels, 19 October 2006
ICT Work Programme 2007-08:ICT Work Programme 2007-08:Activities under Challenge 3Activities under Challenge 3
Erastos FilosDirectorate “Components & Systems”
European Commission, Brussels
EF_to_NCPsMtg_Challenge3 - 2
Provisional draft Presentation outline
• R&D in electronics & its key role for
Europe’s competitiveness
• Challenge 3 rationale
• Foreseen activities under Call 1
• Foreseen activities under Call 2
• Joint Technology Initiatives – a way to
implement ETP Strategic Research
Agendas
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Provisional draft The pervasiveness of electronics …
Electronics underpins everybusiness sector
World GDP
Electronic Equipment
Semiconductors
Investment: Materials & Equipment
Source: Future Horizons, IFS2005, Jan 2005
€ 30,050 bn
€ 1,050 bn
€ 210 bn
€ 38 bn
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Provisional draft
Electronics: Key to intelligent products
By 2010, electronics & software in cars will
account for up to 40% of their value
By 2010, electronics & software in cars will
account for up to 40% of their value
• Smarter products:• Electronic safety
• Driver customisation
• Resource-efficient products:• Fuel efficiency
• Info-mobility & traffic management
• ICT-enabled disposal
• Value-adding services: • Active safety features
• Remote diagnostics & assistance
• Infotainment & travelguidance
EF_to_NCPsMtg_Challenge3 - 5
Provisional draft Europe - losing the game ?
• Europe – a net importer of electronics
• Aggressive global competition: Asia 2/3 of world semiconductor market & 3/4 share in investment
• A typical semiconductor fabrication facility costs € 2.5 billion
0%
10%
20%
30%
40%
50%
60%
EU Japan US Asia
10 %
24 %18 %
Microelectronics investments
€ 27.9 billion in 2005
48 %
0%
10%
20%
30%
40%
50%
60%
EU Japan US Asia
10 %
24 %18 %
Microelectronics investments
€ 27.9 billion in 2005
48 %
Source: European Semiconductor Industry Association, 2005
Source: European Semiconductor Industry Association, 2005
EF_to_NCPsMtg_Challenge3 - 6
Provisional draft European microelectronics achievements
• World top-10 list of semiconductor companies:– 1990: 1 European company– 2004: 3 European companies– 2006: ?
• Equipment:– Wafer processing:
• 5 European SMEs on top 10 list• Europe’s big 2 (ASML and ASM Int’l)
on top 10– Assembly equipment:
• 2 European companies on top 10 list
• Consensus building in nanoelectronics – Strategic public-private partnership
VLSI Research 2003VLSI Research 2003
www.eniac.eu
EF_to_NCPsMtg_Challenge3 - 7
Provisional draft
To enable Europe’s industry to stay at the forefront of electronics developments & applications through chip making, integration &
embedded systems capabilities
To enable Europe’s industry to stay at the forefront of electronics developments & applications through chip making, integration &
embedded systems capabilities
Challenge 3:Components, Systems, Engineering
www.artemis-office.org
www.eniac.eu
www.smart-systems-integration.org
www.photonics21.de
R&D objectives are in line with Strategic Research Agendas of European Technology Platforms & support international co-operation under the Intelligent Manufacturing Systems initiative cordis.europa.eu/ims
EF_to_NCPsMtg_Challenge3 - 8
Provisional draft Foreseen activities under Call 1:
3.3.1.1: Next-Generation Nanoelectronics
Components & Electronics Integration
3.3.1.2: Organic & Large-Area Electronics &
Display Systems
3.3.1.3: Embedded Systems Design
3.3.1.4: Computing Systems
EF_to_NCPsMtg_Challenge3 - 9
Provisional draft
Next-Generation Nanoelectronics Components & Electronics Integration
• Smaller, higher performance, lower cost:
−“More Moore”−Beyond CMOS
• Integration & diversification:
−SoC: Systems-on-Chip−SiP: Systems-in-Package
Technologymaterials, processes, metrology, interconnects, modelling, packaging, architectures
Designincreased complexity, changed performance, heterogeneity in SiP & SoC, productivity & “Design for Manufacturing”
ManufacturingCost-efficient, flexible production for silicon < 45 nm; for SoC & SiP; 450 mm wafer size; small batch/fast cycle time; equipment assessment
Call 1:€ 86 mn
CP, NoE, CSA
EF_to_NCPsMtg_Challenge3 - 10
Provisional draft
Organic & Large-Area Electronics & Display Systems
• Organic & large-area technologies:– Large-area & low-cost manufacturing – Advanced modelling, simulation & circuit design characterisation– Enabling functions:
• logic, memory, e-paper, systems-on-tags, RFIDs, lab-on-chip, lighting, signage, energy scavenging/storage & power management
• Advanced display systems:– Visualisation systems supporting
• Multi-viewer unaided, unrestricted 3D-viewing & natural interaction
– Signal acquisition, processing & representation for 3D-systems – Portable display systems
• Zero-power displays, ruggedised displays• Flexible/transparent devices• Energy-efficient micro-projectors• Lightweight high-resolution vision glasses
Call 1:€ 63 mnCP, NoE,
CSA
EF_to_NCPsMtg_Challenge3 - 11
Provisional draft Embedded Systems Design
• Target outcomes
– Theory & methods for embedded systems design• Key issues: heterogeneity, composability, predictability & adaptivity• International cooperation is encouraged
– Suites of interoperable design tools for rapid design & prototyping• Research will contribute to interoperability of tools from SME vendors;
consolidating tool developers’ joint R&D work; pen tool frameworks
• Expected impact– Increase system development productivity (at least 1 order of
magnitude)– Stimulate growth of European high-tech companies in the field– Reinforce S&T leadership in complex systems engineering
Call 1:€ 40 mn
CP, NoE, CSA
EF_to_NCPsMtg_Challenge3 - 12
Provisional draft Computing systems
• Target outcomes– Novel architectures for multi-core computing systems
• Architectures & system software for scalable & customisable on-chip computing systems incorporating multiple networked, symmetric or heterogeneous, fixed or reconfigurable processing elements
• Key issues: power & performance versatility; reliability & availability– Reference architectures for generic embedded platforms
• Key issues: composability, networking, robustness/security, diagnosis/maintainability, resource management, evolvability & self-organisation
• Expected impact– Inexpensive generic platforms with high European added value enabling
European supplier companies to increase market share– Develop European competences in the use of high-end computing for
the development of new applications– European excellence in computing architectures, system software &
platforms
Call 1:€ 25 mn
CP (STREP), NoE
EF_to_NCPsMtg_Challenge3 - 13
Provisional draft Foreseen activities under Call 2:
3.3.2.1: Photonic components & subsystems
3.3.2.2: Micro/Nanosystems
3.3.2.3: Networked Embedded & Control Systems
EF_to_NCPsMtg_Challenge3 - 14
Provisional draft
Components &Subsystems - Lasers & solid-state
sources- Image sensors- New sensors
Photonic Components & Subsystems
Application specific
- Broadband core networks- Broadband access & LAN- Medical diagnosis & prevention- Sensors for environment, safety
& security applications
Underlyingtechnologies
Complementary measures
Assessment ofprototypes
Core
Integration
Manufacturing
Design methodology & tools
Support measures
Networking, integration & structuring
Access:Expertise centres & foundries
Education:Young people & graduates
Consensus building: R&D strategies,int’ cooperation
Call 2: € 90 mnCP, NoE,
CSA
EF_to_NCPsMtg_Challenge3 - 15
Provisional draft Micro/Nanosystems
• Next generation smart systems Sensor- & actuator-based systems
• Nano-Bio-ICTechnologies convergence Biosensors, lab-on-a-chip, bioMEMS, autonomous implants
• Smart fabrics and interactive textiles Integration of intelligence in textile materials
• From smart systems to viable products Microsystems manufacturing technologies
• Innovative memory systems Emerging technologies for high density mass storage capacity
• Support actionsTechnology access, education and training, coordination & dissemination at EU level
Call 2:€ 83 mn
CP, NoE, CSA
EF_to_NCPsMtg_Challenge3 - 16
Provisional draft Networked Embedded & Control
Systems
• Target outcomes– Middleware platforms for embedded systems
• Key issues: composability, minimum power consumption, openness• Emphasis: programmability, reconfiguration, privacy & trust
– Cooperating objects and Wireless Sensor Networks• Spontaneous cooperation of objects in spatial proximity• Emphasis on new methods & algorithms, hardware/software
platforms for distributed execution & programming & tools for self-organising systems
– Control of large-scale complex distributed systems• Key issues: efficiency, robustness, safety, security• Applications: manufacturing plants, infrastructures
• Expected impact• Enable entirely new services & applications• Make large infrastructures more efficient, flexible & productive• 100% plant availability, reduce maintenance & accidents
Call 2:€ 47 mn
CP, NoE, CSA
EF_to_NCPsMtg_Challenge3 - 17
Provisional draft
A spiral model of innovation capitalising on the multiple
reciprocal relationships between public & private stakeholders at
various knowledge stages
A spiral model of innovation capitalising on the multiple
reciprocal relationships between public & private stakeholders at
various knowledge stages
European Technology Platforms
• Addressing major technological challenges in specific domains• Aiming to leverage public & private investment for R&D &
innovation• Involving key R&D stakeholders
— eg industry, the research community & public authorities
• Bundling fragmented R&D efforts towards agreed goals— Vision 2020 document & Strategic Research Agenda
30+ European Technology Platforms launched so far:
cordis.europa.eu/technology-platformscordis.europa.eu/technology-platforms
POLICY
POLICY
RESEARCH
RESEARCH
BUSINESSBUSINESS
EF_to_NCPsMtg_Challenge3 - 18
Provisional draft
1. Emergence & setting up: – „Bottom-up“ process with key stakeholders in a specific
domain– Key deliverable: Strategic vision document
2. Definition of a Strategic Research Agenda– Co-ordinated by an Advisory Council– Consensus-based– Deployment strategy
3. Implementation of the Strategic Research Agenda‐ Through collaborative research in FP7 & with other
resources, or‐ Through a Joint Technology Initiative (JTI) which integrates
funding sources, eg Framework Programme, transnational & nat’l research programmes, industrial funding, 3rd party private financeCommission Staff Working Paper, SEC(2005)800 of 10 June 2005 &
Status Report 2 of May 2006cordis.europa.eu/technology-platforms/further_en.html
Commission Staff Working Paper, SEC(2005)800 of 10 June 2005 &Status Report 2 of May 2006
cordis.europa.eu/technology-platforms/further_en.html
Joint Technology Initiatives:A way to implement a Strategic Research
Agenda
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Provisional draft For more information
European research on the web:http://cordis.europa.euhttp://cordis.europa.eu/fp7http://ec.europa.eu/comm/research/future/
Information Society and Media:http://ec.europa.eu/information_society/http://cordis.europa.eu/ist
Directorate G:http://cordis.europa.eu/ist/directorate_g
Contact:[email protected]