©2020 by System Plus Consulting | SP20523 – RF Front-End Module Comparison 2020 - Volume 3 1
22 bd Benoni Goullin44200 NANTES - FRANCE +33 2 40 18 09 16 [email protected] www.systemplus.fr
RF Front-End Module Comparison 2020 – Volume 3Technical and cost overview of the latest Radio Frequency connectivity Front-End technologies, with deep analysis of Wifi 6.0 and Ultra-Wide Band architecture.
SP20523 - RF report by Stéphane ELISABETHLABORATORY ANALYSIS done by Nicolas RADUFE
October 2020 – Sample
REVERSE COSTING® – STRUCTURAL, PROCESS & COST REPORT
©2020 by System Plus Consulting | SP20523 – RF Front-End Module Comparison 2020 - Volume 3 2
Table of Contents
Overview / Introduction 4o Executive Summaryo Key Take Awayo Reverse Costing Methodology
Company Profile 11o Apple, Samsung, Huawei, OnePlus, Google, LG Electronics, Oppoo Smartphones Teardown:
iPhone 11, Galaxy Note 10+, 8 5G, Pixel 4 XL, V60 ThinQ, Reno 3 5G
Physical Analysis Summary 37
o Summary of the analyzed RF components
o Comparative Analysis:Module in Connectivity, Connectivity Area, Design Win, Main Supplier,
Function, OEMs main Supplier
Physical Comparison 47
o Area Distribution per Supplier & Function
o Area Distribution per Supplier & Function for Wifi 6.0
o Die Design Win in Number & Area
o Die Distribution per Function
o Die Distribution per Function for Wifi 6.0
o Filter Distribution per Smartphone: Technology and Substrate
o PA/LNA/Switch Distribution per Smartphone: Technology and Substrate
o Material Substrate Distribution per Smartphone
Cost Comparison 61
o Cost Distribution per Supplier & Function
o Cost Distribution per Supplier & Function for Wifi 6.0
Market Analysis 65
o Wifi Evolution
o Connectivity Market Ecosystem & Forecast
Physical Analysis 71o HiSilicon – Front-End Analysis 72
o Huawei Mate 20 X (5G) vs. Huawei P40 pro – Archi. Wifi 5.0 vs. 6.0
o Hi1105V100 Analysis✓ Package View & Dimensions✓ Package Opening & Cross-Section
✓ Die View And Dimensions✓ Die Delayering & Main Block IDs✓ Die Process
o Hi1105V100 vs. Hi1103V110o Mediatek – Front-End Analysis 89
o HTC desire 19s vs. Oppo Reno3 5Go MT6635 Analysiso MT6635 vs. MT6631N
o Qualcomm – Front-End Analysis 105o Samsung Galaxy M11 & OnePlus 7 pro 5G vs. OnePlus 8 5G –
Archi. Wifi 4.0 to 6.0o Google Pixel 4XL vs. LG V60 ThinQ – Archi. Wifi 6.0 Module
o Murata 1VF & QCA6391 Analysiso QCA6391 vs. WCN2998 vs. WCN3615
o Broadcom – Front-End Analysis 128o Apple iPhone SE (2020) vs. Galaxy Note10+ vs. Apple iPhone 11
Pro Max – Archi. Wifi 6.0 Module from Murata, USI and Samsungo SEMCO 4005C2, USI APPL339S00648, Murata 1VC &
BCM4378 Analysiso BCM4378 vs. BCM4377
o Apple UWB – Front-End Analysis 154o USI U1 and Antenna Analysis
SoC Physical Comparison 177
SoC Manufacturing Process 180o Wafer Die Front-End Process & Fabrication Unit
SoC Cost Analysis 184o Summary of the cost analysis 185o Yields Explanation & Hypotheses 187
o SoC Die 189✓ SoC Die Front-End Cost✓ SoC Die Probe Test, Thinning & Dicing✓ SoC Die Wafer & Die Cost✓ SoC Component Cost
Selling price 193
Feedbacks 197
SystemPlus Consulting services 199
©2020 by System Plus Consulting | SP20523 – RF Front-End Module Comparison 2020 - Volume 3 3
Overview / Introductiono Executive Summaryo Reverse Costing Methodologyo Glossary
Company Profile & Supply Chain
Physical Analysis Summary
Physical Comparison
Cost Comparison
Market Analysis
Physical Analysis
SoC Physical Comparison
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
Feedbacks
Related Reports
About System Plus
Executive Summary
Each year System Plus opens hundreds of Front-End Modules (FEMs) and components to provide an overview of the RadioFrequency (RF) FEM market in selected flagship smartphones. Gathering the information into one report offers anopportunity to keep track of the evolution of this technology market.
This year, System Plus Consulting offers different volumes on technical and cost comparisons of smartphone RFFEMs. Everyreport will focus on a specific subject, either a player’s evolution, a specific technology or a comparison of flagship devices.
This third volume provides insights into technology and cost data for FEMs and several components found in 14 latestsmartphones made by companies from Apple to Xiaomi. It features a comprehensive overview of the connectivityarchitecture on the market, comparing Wifi ac/5.0 to Wifi ax/6.0. As the architecture is centered on the Systems-on-Chips(SoCs), that’s what we’ve done a detailed analysis with cross-section and technology analysis on. Different choices ofarchitecture are revealed between Mediatek, Broadcom, Qualcomm, and Huawei. Additionally, the analysis provides insightinto Apple’s Ultra Wide Band (UWB) technology from the antenna to the SoC.
With teardowns of the smartphones, the main RF modules and components have been extracted and physically analyzed,from the output of the transceiver to the antenna. Packaging, sizes and technologies are studied to provide a large panel oftechnical and economical choices and an overview of the market.
Moreover, the report includes an overview of other flagship smartphones released by the end of 2019 and provides astatistical analysis for most connectivity modules. It also tries to explain the smartphone makers’ choices and suppliertendencies. Analyses of FE modules for LTE and 5G modules are not included in this report.
Note:
Discrete filters and duplexer has been integrated in this report.
Wifi, Bluetooth and UWB Module analysed are included in this report.
RF Front-End Module for LTE/5G connectivity are not included in this report.
©2020 by System Plus Consulting | SP20523 – RF Front-End Module Comparison 2020 - Volume 3 4
Overview / Introductiono Executive Summaryo Reverse Costing Methodologyo Glossary
Company Profile & Supply Chain
Physical Analysis Summary
Physical Comparison
Cost Comparison
Market Analysis
Physical Analysis
SoC Physical Comparison
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
Feedbacks
Related Reports
About System Plus
Executive Summary
RF Front-End Module Comparison 2020 – Vol. 1Study on smartphones on Q3 2019
RF Front-End Module Comparison 2020 – Vol. 2Study on Huawei smartphones
The report includes the study of at least twenty FEM and severalcomponents found in three smartphones: Apple iPhone 11 Pro,Samsung Galaxy Note10+ and OnePlus 7 Pro 5G. Also, it comesalong with a database including information on 485 componentsin 17 smartphones.
The report includes the study of at least eighty FEM and severalcomponents found in ten smartphones: Mate and P series from2015 to 2019. Also, it came along with a database includinginformation on 483 components in 13 smartphones.
Serie Generation Version # of Components
11 Pro 26
11 - 20
11 Pro Max 27
Note 10 Plus 19
Note 10 - 33
A80 - 22
Fold - 24
Xcover 4 S 21
OnePlus OnePlus 7 Pro 5G 33
Meizu - 16 S 22
Xiaomi Black Shark 2 - 41
Asus ROG Phone II - 33
Motorola One Vision - - 28
Huawei Mate 20 X (5G) 45
Oppo Reno - 5G 24
Royole FlexPai - - 31
LG Electronics V50 ThinQ 5G 36
Total 485
Smartphone List
iPhone
Galaxy Samsung
AppleSerie Generation Version Addon # of Components
30 Pro 5G 60
20 X 5G 45
20 - - 22
10 Lite - 34
10 - - 28
9 - - 40
8 - - 42
30 Pro - 41
30 - - 31
20 Pro - 37
10 - - 45
9 - - 30
9 Lite - 28
Total 483
Smartphone List
Mate
PHuawei
Huawei
©2020 by System Plus Consulting | SP20523 – RF Front-End Module Comparison 2020 - Volume 3 5
Overview / Introductiono Executive Summaryo Reverse Costing Methodologyo Glossary
Company Profile & Supply Chain
Physical Analysis Summary
Physical Comparison
Cost Comparison
Market Analysis
Physical Analysis
SoC Physical Comparison
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
Feedbacks
Related Reports
About System Plus
Executive Summary
RF Front-End Module Comparison 2020 – Vol. 3Wifi & Connectivity
The report includes the study of several FEMs and componentsfound in 14 smartphones: From Apple to Xiaomi. Also, it camealong with a database including information on 281 componentsin 44 smartphones.
Serie Generation Version Addon # of Components
11 - - 5
11 Pro - 4
11 Pro Max 3
SE (2020) - - 3
Asus Rog Phone II - - 8
Google Pixel 4 XL - 6
HTC Desire 19s - - 4
20 X 5G 8
30 Pro 5G 9
Xs - - 8
P 40 Pro - 10
LG V60 ThinQ - - 8
Edge + - - 7
Moto G8 Plus - 5
Hyper - - 6
Macro - - 4
Razr 2019 - - 5
7 Pro - 5G 9
8 - - 5G 10
Find X2 - - 10
3 - 5G 6
3 Pro 5G 6
Ace - - 7
A10 s - 4
A50 - - 7
A51 - - 6
Fold - - 5
M11 - - 4
M31 - - 7
Note10 - - 7
Note10 + - 8
S20 Ultra 5G 8
S20 + 5G 8
Xcover 4S - 5
Z Flip - - 5
Sharp Aquos R - 5G 5
Nex 3s - - 8
Nex S - - 5
X30 Pro - - 7
Mi 10 Pro 5G 8
Mi Note 10 - 5
K30 - 5G 6
Note 8 Pro 5
ZTE Nubia Red Magic - 5G 7
Total 281
Redmi
One
Reno
Vivo
Xiaomi
GalaxySamsung
Smartphone List
HuaweiMate
Apple iPhone
Motorola
OnePlus
Oppo
©2020 by System Plus Consulting | SP20523 – RF Front-End Module Comparison 2020 - Volume 3 6
Overview / Introduction
Company Profile & Supply Chain o Apple & iPhone 11 Teardowno Huawei & P40 Pro Teardowno Samsung & Galaxy Note 10+
Teardowno OnePlus & 8 5G Teardowno Google & Pixel 4 XL Teardowno LG & V60 ThinQ Teardowno Oppo & Reno 3 5G Teardown
Physical Analysis Summary
Physical Comparison
Cost Comparison
Market Analysis
Physical Analysis
SoC Physical Comparison
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
FeedbacksRelated ReportsAbout System Plus
Samsung Smartphone Teardown – Samsung Galaxy Note 10 plus
Connectivity Board Area : 346 mm²
RF Components(Marking)
Manufacturer Type Area(mm²)
Quantity RF Board Proportion
Cost
4005C2 SEMCO Wifi FEM 76.97 1 XX% $ XX BCM4775 Broadcom GPS SoC 9.83 1 XX% $ XX
B8920 (8PR) Epcos (TDK) SAW Diplexer 3.00 1 XX% $ XX B8893 (8NX) Epcos (TDK) BAW Filter 0.99 2 XX% $ XX
yEx Wisol SAW Filter 0.99 1 XX% $ XX 7Hx Wisolm SAW Filter 0.99 1 XX% $ XX
BGA855N6 Infineon LNA 0.78 1 XX% $ XX Sx Infineon LNA 0.99 1 XX% $ XX
Total 94.54 9 XX% $ XX
©2020 by System Plus Consulting | SP20523 – RF Front-End Module Comparison 2020 - Volume 3 7
Overview / Introduction
Company Profile & Supply Chain
Physical Analysis Summaryo Summary of the analyzed RF
componentso Comparative Analysis
Physical Comparison
Cost Comparison
Market Analysis
Physical Analysis
SoC Physical Comparison
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
Feedbacks
Related Reports
About System Plus
Components Summary
Manufacturer Model Packaging Manufacturer IC Main IC Function Wifi Norme MIMO BT Rev.
HiSiliconHi1103V110 WLCSP - - Wifi, BT, GPS a/b/g/n/ac - 5.0
Hi1105V100 WLCSP - - Wifi, BT, GPS a/b/g/n/ac/ax 2x2 5.1
MediatekMT6631N WLCSP - - Wifi, BT, GPS, FM a/b/g/n/ac - 5.0
MT6635 WLCSP - - Wifi, BT, GPS, FM a/b/g/n/ac/ax 2x2 5.0
Murata
1RH Double Side Molding Broadcom BCM4377 Wifi, BT, FM a/b/g/n/ac/ax 2x2 5.0
1TR MCM Qualcomm WCN3990 Wifi, BT, FM a/b/g/n/ac 2x2 5.0
1VF Double Side Molding Qualcomm QCA6390 Wifi, BT a/b/g/n/ac/ax 2x2 5.1
1VC MCM Broadcom BCM4378 Wifi, BT, FM a/b/g/n/ac/ax 2x2 5.0
Qualcomm
QCA6391 FCBGA - - Wifi, BT a/b/g/n/ac/ax 2x2 5.1
WCN3615 WLCSP - - Wifi, BT b/g/n - 4.2
WCN3950 WLCSP - - Wifi, BT, FM a/b/g/n/ac 2x2 5.0
WCN3980 WLCSP - - Wifi, BT, FM a/b/g/n/ac 2x2 5.0
WCN3990 WLCSP - - Wifi, BT, FM a/b/g/n/ac 2x2 5.0
WCN3998 WLCSP - - Wifi, BT, FM a/b/g/n/ac 2x2 5.0
SamsungS5N5C12 WLCSP - - Wifi, BT, FM a/b/g/n/ac - 4.2
S5N5C20 WLCSP - - Wif, BT, FM a/b/g/n/ac - 5.0
4005C2 MCM Double Sided Broadcom BCM4377 Wifi, BT, FM a/b/g/n/ac/ax 2x2 5.0
USIAPPL339S00648 MCM Broadcom BCM4378 Wifi, BT, FM a/b/g/n/ac/ax 2x2 5.0
U1 MCM Apple (Est.) TMKA75 UWB - - -
• The components using Wifi 6 and UWB will be opened, and the die pictures will be presented in this report.
©2020 by System Plus Consulting | SP20523 – RF Front-End Module Comparison 2020 - Volume 3 8
Overview / Introduction
Company Profile & Supply Chain
Physical Analysis Summaryo Summary of the analyzed RF
componentso Comparative Analysis
Physical Comparison
Cost Comparison
Market Analysis
Physical Analysis
SoC Physical Comparison
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
Feedbacks
Related Reports
About System Plus
Module in connectivity
0% 10% 20% 30% 40% 50% 60% 70% 80% 90% 100%
iPhone 11 Pro Max
iPhone SE (2020)
P40 Pro
8 5G
Reno 3 5G
Galaxy Note10+
Ap
ple
Hu
awei
On
ePlu
sO
pp
oSa
msu
ng
Percentage of module in connectivty area
Module in Connectivity Area proportion
Sum of Total Module Area
Sum of Blank Space & Discrete
XX,XXX mm²
XX,XXX mm²
XX,XXX mm²
XX,XXX mm²
XX,XXX mm²
XX,XXX mm²
©2020 by System Plus Consulting | SP20523 – RF Front-End Module Comparison 2020 - Volume 3 9
Overview / Introduction
Company Profile & Supply Chain
Physical Analysis Summaryo Summary of the analyzed RF
componentso Comparative Analysis
Physical Comparison
Cost Comparison
Market Analysis
Physical Analysis
SoC Physical Comparison
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
Feedbacks
Related Reports
About System Plus
46%
18%
14%
8%
8%
4%
2% 0%
Component Distribution per Funtion
Filter
LNA
FEM
SoC
Switch
LNA/Switch
Multiplexer
RFIC
Components Summary
26%
17%
14%
10%
7%
6%
6%
3%
2%
2%
1%
1%
1%1%
1%1% 0% 0%
Component Distribution per Supplier
MURATA
QUALCOMM
NXP
QORVO
SKYWORKS
UNIDENTIFIED
WISOL
TAIYO YUDEN
INFINEON TECHNOLOGIES
SAMSUNG
MEDIATEK
USI
HISILICON
MAXSCEND
AWINIC
BROADCOM
WILLSEMI
TST
Share in design win©2020 by System Plus Consulting
Smartphone List Serie Generation Version Addon # of Components
11 - - 5
11 Pro - 4
11 Pro Max 3
SE (2020) - - 3
Asus Rog Phone II - - 8
Google Pixel 4 XL - 6
HTC Desire 19s - - 4
20 X 5G 8
30 Pro 5G 9
Xs - - 8
P 40 Pro - 10
LG V60 ThinQ - - 8
Edge + - - 7
Moto G8 Plus - 5
Hyper - - 6
Macro - - 4
Razr 2019 - - 5
7 Pro - 5G 9
8 - - 5G 10
Find X2 - - 10
3 - 5G 6
3 Pro 5G 6
Ace - - 7
A10 s - 4
A50 - - 7
A51 - - 6
Fold - - 5
M11 - - 4
M31 - - 7
Note10 - - 7
Note10 + - 8
S20 Ultra 5G 8
S20 + 5G 8
Xcover 4S - 5
Z Flip - - 5
Sharp Aquos R - 5G 5
Nex 3s - - 8
Nex S - - 5
X30 Pro - - 7
Mi 10 Pro 5G 8
Mi Note 10 - 5
K30 - 5G 6
Note 8 Pro 5
ZTE Nubia Red Magic - 5G 7
Total 281
Redmi
One
Reno
Vivo
Xiaomi
GalaxySamsung
Motorola
OnePlus
Oppo
HuaweiMate
Apple iPhone
Share in implemented function©2020 by System Plus Consulting
44 Smartphones; From 2019 to 2020; 281 Components
281 Components
281 Components
©2020 by System Plus Consulting | SP20523 – RF Front-End Module Comparison 2020 - Volume 3 10
Overview / Introduction
Company Profile & Supply Chain
Physical Analysis Summary
Physical Comparisono Area Distribution per Supplier &
Functiono Die Design Win in Number &
Areao Die Distribution per Functiono Filter Distributiono PA/LNA/Switch Distributiono Material Substrate Distribution
Cost Comparison
Market Analysis
Physical Analysis
SoC Physical Comparison
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
FeedbacksRelated ReportsAbout System Plus
Filter Distribution
3%
10%
13%
70%
4%
Filter Distribution per technology
Filter BAW FBAR
Filter BAW SMR
Filter IPD -
Filter SAW -
Filter SAW IHP
67%
3%
30%
Filter substrate Area
LT/LN
Sapphire
Silicon
Filter die type distribution©2020 by System Plus Consulting
Filter die substrate distribution©2020 by System Plus Consulting
©2020 by System Plus Consulting | SP20523 – RF Front-End Module Comparison 2020 - Volume 3 11
Overview / Introduction
Company Profile & Supply Chain
Physical Analysis Summary
Physical Comparisono Area Distribution per Supplier &
Functiono Die Design Win in Number &
Areao Die Distribution per Functiono Filter Distributiono PA/LNA/Switch Distributiono Material Substrate Distribution
Cost Comparison
Market Analysis
Physical Analysis
SoC Physical Comparison
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
FeedbacksRelated ReportsAbout System Plus
PA/LNA/Switch Die Distribution
©2020 by System Plus Consulting | SP20523 – RF Front-End Module Comparison 2020 - Volume 3 12
Overview / Introduction
Company Profile & Supply Chain
Physical Analysis Summary
Physical Comparisono Area Distribution per Supplier &
Functiono Die Design Win in Number &
Areao Die Distribution per Functiono Filter Distributiono PA/LNA/Switch Distributiono Material Substrate Distribution
Cost Comparison
Market Analysis
Physical Analysis
SoC Physical Comparison
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
FeedbacksRelated ReportsAbout System Plus
Material Distribution
©2020 by System Plus Consulting | SP20523 – RF Front-End Module Comparison 2020 - Volume 3 13
Overview / Introduction
Company Profile & Supply Chain
Physical Analysis Summary
Physical Comparison
Cost Comparisono Cost Distribution per Supplier &
Function
Market Analysis
Physical Analysis
SoC Physical Comparison
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
Feedbacks
Related Reports
About System Plus
Cost Distribution – Wifi 6.0
©2020 by System Plus Consulting | SP20523 – RF Front-End Module Comparison 2020 - Volume 3 14
Overview / Introduction
Company Profile & Supply Chain
Physical Analysis Summary
Physical Comparison
Cost Comparison
Market Analysis
Physical Analysis o HiSilicon – Front-End Analysiso Mediatek – Front-End Analysiso Qualcomm – Front-End Analysiso Broadcom – Front-End Analysiso Apple UWB – Front-End Analysis
SoC Physical Comparison
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
Feedbacks
Related Reports
About System Plus
RF Components Summary
Manufacturer Model Packaging Manufacturer IC Main IC Function Wifi Norme MIMO BT Rev. Cost
HiSiliconHi1103V110 WLCSP - - Wifi, BT, GPS a/b/g/n/ac - 5.0 $XX
Hi1105V100 WLCSP - - Wifi, BT, GPS a/b/g/n/ac/ax 2x2 5.1 $XX
Manufacturer Model Type Series Module Cost
HiSiliconHi1103V110 RFIC Mate 20 X (5G); Mate 30 Pro 5G; Mate Xs $XX
Hi1105V100 RFIC P40 Pro $XX
Mate 20 X (5G)
Manufacturer Model Type Quantity Module Cost
HiSilicon Hi1103V110 RFIC 1 $XX
NXP BGF8458 LNA/Switch 2 $XX
NXP BGS8324 LNA/Switch 2 $XX
Triquint A7C BAW Filter 2 $XX
Mate 30 Pro 5G
Manufacturer Model Type Quantity Module Cost
HiSilicon Hi1103V110 RFIC 1 $XX
NXP BGF8458 LNA/Switch 2 $XX
NXP BGS8324 LNA/Switch 2 $XX
Murata SADEN2G45MC0F0A SAW Filter 1 $XX
Epcos B8921 (8PS) SAW Filter 1 $XX
Mate Xs
Manufacturer Model Type Quantity Module Cost
HiSilicon Hi1103V110 RFIC 1 $XX
NXP BGF8458 LNA/Switch 2 $XX
NXP BGS8324 LNA/Switch 2 $XX
Murata SADEN2G45MC0F0A SAW Filter 2 $XX
Epcos B8857 (8MS) BAW Filter 2 $XX
P40 Pro
Manufacturer Model Type Quantity Module Cost
HiSilicon Hi1105V100 RFIC 1 $XX
NXP 102# FEM 2 $XX
NXP BGS8324 LNA/Switch 2 $XX
Taiyo Yuden 166# BAW Filter 1 $XX
Murata SADEN2G45MC0F0A SAW Filter 1 $XX
Solution Cost: $XX
Solution Cost: $XX
Solution Cost: $XX
Solution Cost: $XX
©2020 by System Plus Consulting | SP20523 – RF Front-End Module Comparison 2020 - Volume 3 15
Overview / Introduction
Company Profile & Supply Chain
Physical Analysis Summary
Physical Comparison
Cost Comparison
Market Analysis
Physical Analysis o HiSilicon – Front-End Analysiso Mediatek – Front-End Analysiso Qualcomm – Front-End Analysiso Broadcom – Front-End Analysiso Apple UWB – Front-End Analysis
SoC Physical Comparison
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
Feedbacks
Related Reports
About System Plus
Oppo Reno3 5G – Architecture Wifi 6.0
Oppo Reno3 5G
Manufacturer Model Type Quantity Module Cost
Mediatek MT6635 RFIC 1 $XX
Murata SAFQA2G45MA0G0A IHP SAW Filter 2 $XX
Solution Cost: $XX
©2020 by System Plus Consulting | SP20523 – RF Front-End Module Comparison 2020 - Volume 3 16
Overview / Introduction
Company Profile & Supply Chain
Physical Analysis Summary
Physical Comparison
Cost Comparison
Market Analysis
Physical Analysis o HiSilicon – Front-End Analysiso Mediatek – Front-End Analysiso Qualcomm – Front-End Analysiso Broadcom – Front-End Analysiso Apple UWB – Front-End Analysis
SoC Physical Comparison
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
Feedbacks
Related Reports
About System Plus
Murata 1VF & Qualcomm QCA6391 – Package View & Dimensions
Package Top View – Optical View©2020 by System Plus Consulting
• Package Type : XX XX BGA
• Dimensions : XX mm² x XX mm(XX x XX x XX mm)
• Pin Pitch : XX mm
• Marking : <Logo Murata>1VF
Package Bottom View – Optical View©2020 by System Plus Consulting
Package Side View – Optical View©2020 by System Plus Consulting
XX
mm
XX mm
XX
mm
Package Bottom View – Optical View©2020 by System Plus Consulting
Package Top View – Optical View©2020 by System Plus Consulting
Package Side View – Optical View©2020 by System Plus Consulting
XX
mm
• Package Type : XX XX BGA
• Dimensions : XX mm² x XX mm(XX x XX x XX mm)
• Pin Pitch : XX mm
• Marking : <Logo Qualcomm>QCA6391002JE004F96
XX mm
XX
mm
©2020 by System Plus Consulting | SP20523 – RF Front-End Module Comparison 2020 - Volume 3 17
Overview / Introduction
Company Profile & Supply Chain
Physical Analysis Summary
Physical Comparison
Cost Comparison
Market Analysis
Physical Analysis o HiSilicon – Front-End Analysiso Mediatek – Front-End Analysiso Qualcomm – Front-End Analysiso Broadcom – Front-End Analysiso Apple UWB – Front-End Analysis
SoC Physical Comparison
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
Feedbacks
Related Reports
About System Plus
Murata 1VC – Package Cross-Section
Package Cross-Section Plan©2020 by System Plus Consulting
Package Cross-Section – Optical View©2020 by System Plus Consulting
Package Cross-Section – SEM View©2020 by System Plus Consulting
XX µm
XX µm
Package Molding
Conformal Shielding
Silicon SubstrateCopper Notch
8-Layer PCB Substrate
©2020 by System Plus Consulting | SP20523 – RF Front-End Module Comparison 2020 - Volume 3 18
Overview / Introduction
Company Profile & Supply Chain
Physical Analysis Summary
Physical Comparison
Cost Comparison
Market Analysis
Physical Analysis o HiSilicon – Front-End Analysiso Mediatek – Front-End Analysiso Qualcomm – Front-End Analysiso Broadcom – Front-End Analysiso Apple UWB – Front-End Analysis
SoC Physical Comparison
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
Feedbacks
Related Reports
About System Plus
Broadcom BCM4378 – Die Main Block IDs
Die Delayering – Optical View©2020 by System Plus Consulting
XX
XX
XX
XX
XX
©2020 by System Plus Consulting | SP20523 – RF Front-End Module Comparison 2020 - Volume 3 19
Overview / Introduction
Company Profile & Supply Chain
Physical Analysis Summary
Physical Comparison
Cost Comparison
Market Analysis
Physical Analysis o HiSilicon – Front-End Analysiso Mediatek – Front-End Analysiso Qualcomm – Front-End Analysiso Broadcom – Front-End Analysiso Apple UWB – Front-End Analysis
SoC Physical Comparison
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
Feedbacks
Related Reports
About System Plus
Broadcom BCM4377 vs. BCM4378 – Die View & Dimensions
+xx %
TSMC XX nm TSMC XX nm
Norme Die Size RF/LF Ratio
BCM4377 ax XX mm² XX %
BCM4378 ax XX mm² XX %
©2020 by System Plus Consulting | SP20523 – RF Front-End Module Comparison 2020 - Volume 3 20
Overview / Introduction
Company Profile & Supply Chain
Physical Analysis Summary
Physical Comparison
Cost Comparison
Market Analysis
Physical Analysis o HiSilicon – Front-End Analysiso Mediatek – Front-End Analysiso Qualcomm – Front-End Analysiso Broadcom – Front-End Analysiso Apple UWB – Front-End Analysis
SoC Physical Comparison
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
Feedbacks
Related Reports
About System Plus
Antenna Overview
©2020 by System Plus Consulting | SP20523 – RF Front-End Module Comparison 2020 - Volume 3 21
Overview / Introduction
Company Profile & Supply Chain
Physical Analysis Summary
Physical Comparison
Cost Comparison
Market Analysis
Physical Analysis o HiSilicon – Front-End Analysiso Mediatek – Front-End Analysiso Qualcomm – Front-End Analysiso Broadcom – Front-End Analysiso Apple UWB – Front-End Analysis
SoC Physical Comparison
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
Feedbacks
Related Reports
About System Plus
Apple U1 – Die Overview
©2020 by System Plus Consulting | SP20523 – RF Front-End Module Comparison 2020 - Volume 3 22
Overview / Introduction
Company Profile & Supply Chain
Physical Analysis Summary
Physical Comparison
Cost Comparison
Market Analysis
Physical Analysis o HiSilicon – Front-End Analysiso Mediatek – Front-End Analysiso Qualcomm – Front-End Analysiso Broadcom – Front-End Analysiso Apple UWB – Front-End Analysis
SoC Physical Comparison
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
Feedbacks
Related Reports
About System Plus
Apple U1 – Die Cross-Section
XX µm
Silicon Die
Polyimide
Metal Layers
Solder Ball
Package Molding
UBM
RDL
• Die substrate thickness:
XX µm
Die Cross-Section – SEM View©2020 by System Plus Consulting
©2020 by System Plus Consulting | SP20523 – RF Front-End Module Comparison 2020 - Volume 3 23
Overview / Introduction
Company Profile & Supply Chain
Physical Analysis Summary
Physical Comparison
Cost Comparison
Market Analysis
Physical Analysis
SoC Physical Comparison
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
Feedbacks
Related Reports
About System Plus
SoC Die Comparison – Wifi 6.0
©2020 by System Plus Consulting | SP20523 – RF Front-End Module Comparison 2020 - Volume 3 24
Overview / Introduction
Company Profile & Supply Chain
Physical Analysis Summary
Physical Comparison
Cost Comparison
Market Analysis
Physical Analysis
SoC Physical Comparison
Manufacturing Process Flow
Cost Analysiso Cost Analysis Summaryo Yields Explanation &
Hypotheseso SoC Wafer Costo SoC Component Cost
Selling Price Analysis
Feedbacks
Related Reports
About System Plus
Synthesis of the cost analysis
©2020 by System Plus Consulting | SP20523 – RF Front-End Module Comparison 2020 - Volume 3 25
Overview / Introduction
Company Profile & Supply Chain
Physical Analysis Summary
Physical Comparison
Cost Comparison
Market Analysis
Physical Analysis
SoC Physical Comparison
Manufacturing Process Flow
Cost Analysiso Cost Analysis Summaryo Yields Explanation &
Hypotheseso SoC Wafer Costo SoC Component Cost
Selling Price Analysis
Feedbacks
Related Reports
About System Plus
Wafer Front-End Cost
©2020 by System Plus Consulting | SP20523 – RF Front-End Module Comparison 2020 - Volume 3 26
Overview / Introduction
Company Profile & Supply Chain
Physical Analysis Summary
Physical Comparison
Cost Comparison
Market Analysis
Physical Analysis
SoC Physical Comparison
Manufacturing Process Flow
Cost Analysis
Selling Price Analysiso Definition of Priceso Manufacturer Financialso Component Price
Feedbacks
Related Reports
About System Plus
Component Selling Price
©2020 by System Plus Consulting | SP20523 – RF Front-End Module Comparison 2020 - Volume 3 27
Overview / Introduction
Company Profile & Supply Chain
Physical Analysis Summary
Physical Comparison
Cost Comparison
Market Analysis
Physical Analysis
SoC Physical Comparison
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
Feedbacks
Related Reports
About System Plus
Related Reports
MARKET AND TECHNOLOGY REPORTS - YOLE DÉVELOPPEMENT
ADVANCED PACKAGING• 5G’s Impact on RF Front-End and Connectivity for Cellphones
2020
REVERSE COSTING ANALYSES - SYSTEM PLUS CONSULTING
PACKAGING• RF Front-End Module Comparison 2020 – Volume 2• RF Front-End Module Comparison 2020 – Volume 1• SAW Filter Comparison 2020• Skyworks’ FBAR-BAW Filter Technology in 2G/UHB PAMiD
SKY78221• Qualcomm’s Second Generation 5G mmWave Chipset,
from Modem to Antenna
©2020 by System Plus Consulting | SP20523 – RF Front-End Module Comparison 2020 - Volume 3 28
COMPANYSERVICES
©2020 by System Plus Consulting | SP20523 – RF Front-End Module Comparison 2020 - Volume 3 29
Overview / Introduction
Company Profile & Supply Chain
Physical Analysis Summary
Physical Comparison
Cost Comparison
Market Analysis
Physical Analysis
SoC Physical Comparison
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
Feedbacks
Related Reports
About System Pluso Company serviceso Contact
Business Models Fields of Expertise
Custom Analyses(>130 analyses per year)
Reports(>60 reports per year)
Costing Tools
Trainings
©2020 by System Plus Consulting | SP20523 – RF Front-End Module Comparison 2020 - Volume 3 30
Overview / Introduction
Company Profile & Supply Chain
Physical Analysis Summary
Physical Comparison
Cost Comparison
Market Analysis
Physical Analysis
SoC Physical Comparison
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
Feedbacks
Related Reports
About System Pluso Company serviceso Contact
Contact
Headquarters22 bd Benoni Goullin44200 NantesFRANCE+33 2 40 18 09 [email protected]
Europe Sales OfficeLizzie LEVENEZFrankfurt am MainGERMANY+49 151 23 54 41 [email protected]
www.systemplus.fr
NANTESHeadquarter
FRANKFURT/MAINEuropa Sales Office
LYONYOLE HQ
TOKYOYOLE KK
GREATER CHINAYOLE
KOREAYOLE
CORNELIUSYOLE Inc.
Asia Sales OfficeTakashi ONOZAWATokyoJAPANT : +81 804 371 [email protected]
Mavis WANGTAIWANT :+886 979 336 809CN: [email protected]
America Sales OfficeSteve LAFERRIEREWESTERN UST : +1 310 600 [email protected]
Chris YOUMANEASTERN US & CANADAT : +1 919 607 9839 [email protected]