Rockwell Collins:WEEE, RoHS and Pbfree
Soldering Processes!
David HillmanAdvanced Process Engineering
May 2006
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WEEE, RoHS & Pbfree Soldering
Agenda:
• Background
• Industry Current Status
• Rockwell Collins Status
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WEEE, RoHS & Pbfree Soldering
Background:
• Waste Electrical and Electronic Equipment (WEEE)
- Prevention of waste
- Reuse, recycling and other forms of recovery
- Implementation August, 2005!
• Restriction of Certain Hazardous Substances (RoHS)- Contribute to environmentally sound recovery and disposal
- Lead, mercury, cadmium, hexavalent chromium,
PBB and PBDEs (brominated flame retardants)
• The Drafts Are Now Directive Requirements
- Implementation July 1, 2006
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WEEE, RoHS & Pbfree Soldering
Background:
• Computer/Communications Segment: 1980’s to 1990’sComputer/Communications Segment: 1980’s to 1990’s
• 49%49% Market Share Market Share 64.7%64.7% Market Share Market Share
• 425425 Million Cell Phones Produced In 2000Million Cell Phones Produced In 2000
““Lead Additives In Gasoline Are Bad”Lead Additives In Gasoline Are Bad”
““Lead Additives In Paint Products Are Bad”Lead Additives In Paint Products Are Bad”
““Can Lead Be Eliminated From Electronics?Can Lead Be Eliminated From Electronics?”
Consumers Have Been Socially Biased That Lead Is Bad!
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WEEE, RoHS & Pbfree Soldering
Industry Status:
Current
Direction
Of
Class 3
OEMs !!!
• Class 2 - Industrial Electronics - Will Make 2006 Deadline
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WEEE, RoHS & Pbfree Soldering
• Rockwell Collins Filed A Request for Exemption on September 21, 2004 with EU TAC – Review Completion Deadline of December 2004
• Request for Further Exemption from the Requirements of Article 4(1) of Directive 2002/95 for Applications of Cadmium, Lead, and Hexavalent Chromium in the Aviation Sector
submitted on behalf of Rockwell Collins, Inc.by Hunton & Williams
Avenue Louise 326 box 6B-1050 BrusselsTel. 02/643 58 00Fax 02/643 58 22
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WEEE, RoHS & Pbfree Soldering
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WEEE, RoHS & Pbfree Soldering
Rockwell Collins Status
• Five Areas Of Focus
– Area #1: Printed Wiring Board Finishes
– Area #2: Component Lead Finishes
– Area #3: Equipment/Manufacturability
– Area #4: Reliability
– Area #5: Legacy Product Issues
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WEEE, RoHS & Pbfree Soldering
Rockwell Collins Status
Area #1: Printed Wiring Board Finishes:• Effort Complete: New Finishes Implemented
• Immersion Silver, Immersion Tin, ENIG (Immersion Gold)
• Rockwell Collins PWB Design Guidelines Revised• Finish Advantages/Disadvantages Comparisons• Decision Tree Charts• Technology/Functionality Charts
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WEEE, RoHS & Pbfree Soldering
Rockwell Collins Status• Area #2: Component Lead Finishes:
* Surface Finish Position Statement Sent to Supply Base
* Lead-Free Component Protocols Implemented
Tin Whiskers Pbfree BGA
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WEEE, RoHS & Pbfree Soldering
Area #3: Equipment/Manufacturability:
* 7 DOE Assembly Process Trials Completed
• Collins is working on characterization of current RC soldering processes, obtaining capable vs. retrofit vs. replace comparisons, and understanding overall impact on current soldering practices
• Rockwell Collins has selected:
• SAC305 for a Pbfree Alloy
Tin (Sn) Silver (Ag) 3% Copper (Cu) 0.5%
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WEEE, RoHS & Pbfree Soldering
Area #3: Equipment/Manufacturability:
***34ºC Increase Over Current Solder Processes !!!
Solder Alloy Melting Temperature (C)42Sn - 58Bi 13868Sn - 32Cd 17663Sn - 37Pb 183
77.2Sn - 2.8 Ag - 20 In 18796.1Sn - 2.6Ag - 0.8Cu - 0.5Sb 210
Sn - 3-4Ag - 0.5-0.9Cu 21795.5Sn - 3.5Ag 221
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WEEE, RoHS & Pbfree Soldering
Rockwell Collins Status:
Area #3: Equipment/Manufacturability:
P3 = 3.3% P1 = 1.1%P2 = 2.2%
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Area #4: Reliability:
JCAA/JGPP No Lead Solder Program:
Test Vehicle & Solder Alloys:•Sn3.9Ag0.6Cu (SAC) for reflow and wave soldering
•Sn3.4Ag1.0Cu3.3Bi (SACB) for reflow soldering
•Sn0.7Cu0.05Ni (SNIC) for wave soldering
•Sn37Pb (SnPb) for reflow and wave soldering
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WEEE, RoHS & Pbfree Soldering
Rockwell Collins Status
Area #5: Legacy Product Issues:
* Effort In Progress: AOE Internal Test on Laminate and Structures
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2003 2004 2005 2006 2007 2008 2009 2010
Calender Year
Implement Lead-Free
Process Line
Product Pathfi nder Trials
Process Compatibility and
Reliability Investigations
Material Investigations
Rockwell Collins Lead-Free Time Line
Material Investigations - Solder Alloy Selection
- Flux Selection
- JCAA/JGPP Test Program (Testing Lead-Free Finishes on Components and Lead-Free Solders)
Process Capability and Reliability Investigations
- Wave Solder Trials
- Reflow Process Trials
- Equipment Analysis
- CALCE Test Program
Product Pathfinder Trials
- Commercial Avionics Product
- Military Avionics
- Additional Product Selections
Implement Lead-Free Process
- Selected Facility Implementation including materials, process and product documentation activities
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Product Pathfinder Trials: Navy Mantech FA-18AB HUD Pbfree Project
WEEE, RoHS & Pbfree Soldering
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WEEE, RoHS & Pbfree Soldering
WEEE,
RoHS,
& Pbfree
Will Impact You!