Semiconductor manufacturing vs. Industry 4.0:
Is the glass half-full or half-empty?
Philippe VialletelleSenior Member of Technical Staff – STMicroelectronics Crolles
The term "Industrie 4.0"
was revived used in 2011
at the Hannover Fair.
In October 2012 the Working Group on
Industry 4.0 presented a set of Industry
4.0 implementation recommendations
to the German federal government.
4th Industrial Revolution– Cyber-Physical Systems
– Internet of things
– Cloud computing
– Big Data
– Virtualization
– Augmented reality
– Additive manufacturing
In the realm of High Volume…
In a Low Mix / High Volume context
– Few products
– Few technologies
– Numerous (identical) tools
Fab Type LMHV HMLV
(Litho) Tools ~160 15
Masks Levels ~40 45
ML per Tool 1 – 4 3 à 20
Tools per ML 4 - 16 1 à 5
Low Mix / High Volume
LMHV
Because size (scale) really matters…
In a High Mix / Low Volume context
– Several hundreds of products
– Typically 5 to 10 technological generations
– Smaller (heterogeneous) toolset
Fab Type LMHV HMLV
(Litho) Tools ~160 15 - 30
Masks Levels ~40 25 – 45
ML per Tool 1 – 4 10 – 30
Tools per ML 4 - 16 1 - 5
High Mix / Low Volume
HMLV
Mathematics are merciless
LMHV Low Mix / High Volume
High Mix / Low Volume
HMLV
Number of “identical”
Machines
Equipment Utilization Rate
Variability Factor
Flow Factor =
Average CT vs. Theoretical
Tool Time & Efficiency Monitoring
• Wait Time Waste analysis
Very high granularity available for precise analysis of WTW
Capacity Planning
• We also developed some very nice
tools for production
& (finite) capacity planning
• It’s called OPERA
• And our capacity models are
updated based on statistics
extracted from ToTEM
An integrated environment with fully interfaced
tools, working on standardized data schemes
WIP Management• Priority Intervention Tool
• “Wippers” (SW + Human) Introduce new practices
• Dispatch rules Automate them
• Scheduling Optimize factory flows
Factory Automation
• AMHS
• Pre-routing
• Load balancing
• Simulation
Management of Crisis Situations
in a Large Unified AMHS of a Semiconductor Manufacturing Facility .
(Ndiaye M., Dauzère‐Pérès S., Yugma C., Rullière L, Lamiable G. 2016)
Best Student paper award ASMC‐2016
And this also stands true for process control!
• SPC
• FDC, APC
• Run to Run
• Virtual Metrology
• Predictive Maintenance
• Advanced analytics
• FDC fingerprint
• Smart OCAP
• …
The McKinsey Digital Compass
maps Industry 4.0 levers to the 8 main value drivers
All industry players know that it takes time…
• To qualify the right (number of) equipment
• To update rules & procedures
• To adapt control system
Half Full!
• Regarding work done
in SC Manufacturing
vs. other industries…
It’s for sure more
than half full!
IPHW, SW
ICcomponent
SubSystem
FinalProduct
OEMSystem Integrator
After Sale
Services
Brands,Retailers,Operators
Tier1Suppliers
Tier2Suppliers
Co
nsu
mer
Global supply chain
End-to-End engineering
Materials Technology
Solutions
Academics& Research Institutes
SW editors& Integrators
Challenge1: More stringent requirements in terms of traceability & data exploration
Challenge2: More flexibility & agility for factory infrastructure & control systems
Equipment Vendors
Equipment
Second stage challenges
• Global optimization
• Interoperability
• Traceability
• Complex decision making
• Advanced Diagnostic &
Prognostic
Fortunately, Maths are still there to help!
A lot of collaborative opportunities ahead!
• Regarding work done in SC
Manufacturing vs. other
industries…
It’s for sure more than half full!
• Regarding perspectives
and potential advances
well… let’s say there are
lots of exciting
opportunities ahead!