ENMA 465 Spring 2003Copyright G. W. Rubloff 2003, all rights reserved
Signal PropagationAlong Interconnects
Signal propagation along wires (interconnects) can’t keep up with the devices
Time to propagate signal along interconnect between devices is an RC delay
R = electrical resistance of wireDepends on metal resistivityDepends on wire length & width
C = capacitance of wire relative to its surroundings
Depends on insulator dielectric constantDepends on wiring geometries
device
interconnect
device A switches at t=0device B receives triggerto switch at t=RC
Interconnect wire with resistance R and capacitance C to rest of circuit
Research Review Day 5/11/00G. W. Rubloff
Microelectronics Silicon ULSI, and more
• Amazing successMarket +15%/yr for >30 yrsProductivity +25-30%/yrSpringboard for the IT revolution
• But…Factory costs escalating +20%/yrIncreasing technology challenges,
possible show-stoppersMarket diversifying, segmenting, and
reconfiguring
Semiconductor International Jan 1998
• Key questionsMaintaining productivity growth
curveNew technologies for end of
roadmap
ENMA 465 Spring 2003Copyright G. W. Rubloff 2003, all rights reserved
Advanced Interconnect Technology
ITRS Interconnect 1999, Fig. 28
KA Monnig, Sematech 09/02/96
drawing to scalewithin 10%
Etch stops
Polish stops
Low-K dielectric
Metal barrier
Cu seed +Cu fill
BPSG dielectric
W plug
ENMA 465 Spring 2003Copyright G. W. Rubloff 2003, all rights reserved
Advanced Si ULSI Technology
KA Monnig, Sematech 09/02/96
drawing to scalewithin 10%
Etch stops
Polish stops
Low-K dielectric
Metal barrier
Cu seed +Cu fill
BPSG dielectric
W plug
