Silicon wafer fabrication• Taken from
www.egg.or.jp/MSIL/english/index-e.html
Silicon wafer fabrication – slicing and polishing• Taken from www.egg.or.jp/MSIL/english/index-e.html
Wee
k 1
Wee
k 2
N-type Si wafer <100>
Pre-diffusion cleanPad oxidation
Spin photoresist
PR
SiO2
O2
ECE 1406 PMOS Fabrication Sequence
Expose PR with active area maskand develop
Wee
k 3
Wee
k 4
Etch Active Area
Gate oxidation
Deposit LPCVD polysilicon
Poly
PR/etch gate maskStrip PR
O2
SiH4
SFO
6
2
Wee
k 2
Wee
k 5
Wee
k 6
Ion implant BF2+
Pre-diffusion cleanDrive-in/oxidation
PR/etch contact maskStrip PR
CleanSputter deposit Al/1%Si
Al/Si
P doped areas
OH O
2
2
Ar
Wee
k 6
PR/etch metal maskStrip PRAnneal
Source
DrainGate (contact not shown)
Influenza Virus
50 nm Transistor
6 LevelMetallization
IBM 7-Level Cu Metallization
Micromachining Ink Jet Nozzles
Microtechnology group, TU Berlin
TI Digital Micromirror Device
MEMS Gyroscope Chip
1µm Drive
0.01Å Sense
J. Seeger, X. Jiang, and B. Boser
Single chip six-degree-of-freedom inertial measurement unit (uIMU) designed by IMI
principals and fabricated by Sandia National Laboratories
Gene chips, proteomics arrays.
NEMS: TOWARD PHONON COUNTING: Quantum Limit of Heat Flow.
RoukesGroupCal TechTito
Biological Nanomotor
What is a Microswitch?
Surface Micromachined5-500 Micron Size5-300 V Actuation
source
source
source
gate
gate
gate
drain
drain
drain
source
source
gate
gate
drain
drain
Two-Contact Switch
Beam
Gate
Drain
Contact
MEMSMicroswitch
Contact
Contact
Contact
LPCVD Systems