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SMART SYSTEMS - ViSionS bEcoME REAliTY
F r a u n h o F e r I n s t I t u t e F o r e l e c t r o n I c n a n o s y s t e m s e n a s
2 3
Power Source
Commu-nication
UnitMEMS/ NEMS
Electronic Components
Integration& Packaging
F r a u n h o F e r e n a s - P r o F I l e 4
B u s I n e s s u n I t s 6
Micro and Nano Systems 6
Micro and Nano Electronics / Back-end of Line 8
Green and Wireless Systems 10
c o r e c o m P e t e n c e s 1 2
Design and Test of Components and Systems 13
Silicon Based Technologies for Micro and Nano Systems 14
Polymer Based Technologies for Micro and Nano Systems 15
Printing Technologies for Functional Layers and Components 16
Interconnect Technologies 17
System Integration Technologies 18
Reliability of Components and Systems 19
c o n t a c t 2 0
Contact details 21
How to reach Fraunhofer ENAS 22
conTEnTSMART SYSTEMS inTEgRATion bY uSing MicRo And nAno TEchnologiES
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bild ASE
The Fraunhofer-Gesellschaft is one of the leading organizations
for applied research in Germany and Europe. Its core purpose
is the pursuit of knowledge of practical utility. The Fraunhofer
Institute for Electronic Nano Systems ENAS is focusing on smart
systems integration by using micro and nano technologies.
In semiconductor technologies / microelectronics the strategic
research agenda of the European Nanoelectronics Initiative
Advisory Counsil ENIAC as well as the International Technology
Roadmap of Semiconductors ITRS predict with “More Moore”
and “More than Moore” not only a further downscaling of the
structural dimensions but also the diversification of technolo-
gies. Main topic of this so-called “More than Moore“ strategy
is the integration of different components in one system to
ensure the multifunctionality of the system itself.
The European Platform on Smart Systems Integration EPoSS
takes up this trend to multifunctional devices and smart sys-
tems. Smart systems go beyond microsystems for single physi-
cal, biological or chemical parameter measurements combined
with signal processing and actuating functions. Smart systems
integration addresses the demand for miniaturized multi-
functional devices and specialized connected and interacting
solutions. Multidisciplinary approaches featuring devices for
complex solutions and making use of shared and, increasingly,
self-organising resources are among the most ambitious chal-
lenges.
Fraunhofer ENAS is working in both fields. In the “More Moore”
field Fraunhofer ENAS focuses on metallization and interconnect
systems as well as on reliability of microelectronic components.
In the field of smart systems or “More than Moore” sensors,
actuators as well as communication units and therefore more
functionalities are integrated into one system.
These foci of Fraunhofer ENAS are strongly affected by develop-
ments of nanotechnology and ensured by the following unique
features of Fraunhofer ENAS within the Fraunhofer-Gesellschaft:
� High precision MEMS and NEMS
� Digital pilot station (Inkjet-Technikum), adaptive prin-
ting technologies inclusively material development
and characterization
� Nano systems: system design and nano reliability
� Wafer bonding for 3D system integration
� Interconnect technologies, back-end of line for nano
electronics and nano systems.
fRAunhofER EnAS - pRofilE Six departments belong to Fraunhofer Institute for Electronic
Nano Systems:
Multi Device Integration
Micro Materials Center
Printed Functionalities
Back-end of Line
System Packaging
Advanced System Engineering
In order to ensure a longterm scientific and economic success
Fraunhofer ENAS has defined the three business units “Micro
and Nano Systems”, “Micro and Nano Electronics / Back-end of
Line” as well as “Green and Wireless Systems”. They address
different markets and different customers.
Microand NanoSystems
Green andWirelessSystems
Micro and NanoElectronics / BEOL
Fraunhofer ENAS accesses on a broad variety of technologies
and methods for smart systems integration. There have been
defined seven core competences, which are the inner structure
of the technology portfolio of Fraunhofer ENAS.
The core competences “Silicon Based Technologies for Micro
and Nano systems”, “Polymer Based Technologies for Micro
and Nano Systems” as well as “Printing Technologies for
Functional Layers and Components” are the technological
basis for the development of components of micro and nano
systems. “Interconnect Technologies” and “System Integration
Technologies” are so-called cross-sectional technologies. They
have a strong interaction with the other core competences
via common projects. “Design and Test of Components and
Systems” as well as “Reliability of Components and Systems”
are supporting fields for the other technologies. They have a lot
of interfaces to all other core competences. Moreover they also
interact as e.g. reliability issues have to be considered just in the
design phase and vice versa simulations and life time predic-
tions need to be supported and calibrated by measured data.
Based on these basic technologies, the cross-sectional tech-
nologies and methods for design, test and reliability Fraunhofer
ENAS is able to process complete MEMS/NEMS and to integrate
them into challenging smart systems.
6 7
The business unit ”Micro and Nano Systems” includes all
silicon based and polymer based micro and nano systems.
According to markets and customers it is divided into the
three parts “High Precision MEMS/NEMS“, “Polymer Based
low-cost Systems” and “RF-MEMS”. The business unit bases
on the core competences “Design and Test of Components
and Systems“, “Silicon Based Micro and Nano Technologies“,
“Polymer Based Micro and Nano Technologies“, “System In-
tegration Technologies“ as well as “Reliability of Components
and Systems“.
h I G h P r e c I s I o n m e m s / n e m s
“High Precision MEMS/NEMS“ includes the development of
prototypes and system solutions of high precision micro electro
mechanical systems (MEMS) and nano electro mechanical
systems (NEMS). The focus is on high precision actuators for
optical MEMS as well as on high precision inertial sensors for
industrial applications, navigation and medical application.
Fraunhofer ENAS provides services in:
� MEMS/NEMS design and modeling
� System design and modeling
� Technology development
� MEMS/NEMS test
� System test
� Prototypes manufactured by basic and special tech-
nologies.
P o ly m e r B a s e D l o W - c o s t m e m s /
n e m s
“Polymer Based low-cost MEMS/NEMS“ addresses the integra-
tion of micro and nano sensoric as well as actuatoric function-
alities as integrative components of smart systems. Focus is on
nano composite based sensors as well as material integrated
actuators for polymeric micro systems. Thereby two different
markets are addressed. The first one is industrial process moni-
toring and the second one medical and life science. Related
to nano composite based sensors industrial process monitoring
is especially of interest. Thereby the sensors need to fulfill the
following requirements:
� Cost-effective, large area, high sensitive sensors
� Integration of sensor principles which could not be in-
tegrated up to now (integrated condition monitoring)
� Components and systems for precise reliability moni-
toring
� Cost reduction based on mass production.
Fraunhofer ENAS provides services in:
� Development of system integrated functionalities
based on nano composites
� Customer specific configuration of the nano com-
posites for specific applications, e.g. in lightweight
structures engineering
� Condition monitoring based on cost-effective nano
composite based sensors
� Development of customer specific fully integrated
sensoric and actuatoric solutions
� Common developments with SMEs in the field of
molecular diagnostics and cell biology.
r F - m e m s
“RF-MEMS“ comprises manufacturing of components for
radio frequency applications, which electrical properties
may vary based on implementation of micromechanical
components or which functionality is mainly determined
by mechanical components. RF-MEMS include RF-MEMS
switches and varactors, which will be able to substitute exist-
ing conventional products or enable new applications due to
better electrical performance. The market of RF-MEMS can be
divided into two parts.
Aeronautic applications, security and defence applications as
well as measuring technique belong to the first one. Therefore
components are required with extremely high demands on
performance (at the threshold of the physical possibilities). This
is the main market.
The second market is communication technique (stationary and
mobile). Thereby the improvement of main properties is in the
focus. These are power requirements, configuration as well as
functionality. RF-MEMS can be applied for instance as tunable
filters. Using tunable components it is possible to ensure their
functionality at different frequencies and standards without
constructing parallel signal paths.
The following topics are in the focus:
� Concepts and developments of RF-MEMS
� Development of technologies for manufacturing and
integration of RF-MEMS
� Prototypes and small series
buSinESS uniTS
MicRo And nAno SYSTEMS
8 9
The business unit “Micro- and Nanoelectronics / Back-end of
Line“ focuses on three main fields of activity:
� Materials, processes, and technologies for micro- and
nanoelectronics with emphasis on back-end of line
� Modeling and simulation of processes, equipments, as
well as complete interconnect systems
� Characterization and reliability assessment, starting
from BEOL-components towards complete chip-
package interactions.
The back-end of line (BEOL) comprises all process steps start-
ing from contact level till complete wafer processing prior to
electrical testing. In other words, the entire interconnect system
including passivation. Depending on the specific product (high
performance / low power / generic), significant changes in
the back-end of line have been implemented within the past
years due to ongoing downscaling. While transistors become
faster as their dimension shrink, the interconnect system is
limiting this gain in speed, because its RC-product rises. Thus,
signal delay time increases. Appropriate materials can reduce
resistance and capacitance of the interconnect system and
consequently compensate for the losses. While the past decade
was characterized by the introduction of copper and low-k-
dielectrics, future challenges require a more holistic approach.
Strong interactions between technology, material science, as
well as modeling and simulation are necessary to face these
challenges. At Fraunhofer ENAS close meshed interrelations
have been established between the specific fields of activity
within the past years.
The business unit “Micro- and Nanoelectronics / Back-end of
Line” is mainly driven by the core competences “Interconnect
Technologies“ and “Reliability of Components and Systems”.
Moreover, additional input comes from the core competences
“System Integration Technologies“, “Silicon Based Technolo-
gies for Micro and Nano Systems“, and “Design and Test of
Components and Systems “.
Markets and branches, which are relevant to this business unit,
can be derived from the value chain of integrated electronic
devices:
� Materials, chemicals, and consumables
� Device fabrication and testing / equipment manufac-
turing
� Integrated devices (ICs) and systems (SiPs).
Sorting the final products (ICs & SiPs) by application fields, the
following further classification can be conducted:
� Consumer electronics and communication
� Medical
� Automotive
� Aerospace and defense
� Industrial and instrumentation.
Within the working fields materials, processes, technologies,
and simulation, research and development are dedicated mainly
to consumer electronics and communication. Thereby, empha-
sis is placed on leading edge CMOS-technologies with highly
efficient and low parasitic interconnects. Within the working
field reliability, almost all application areas are addressed.
Fraunhofer ENAS offers services in research, development, and
wafer processing specific to markets and branches.
� Device manufacturers:
» Process development, process control methodo-
logy and methods
» Process integration issues
» Analytics and reliability assessment
» Simulation and modeling.
� Equipment manufacturers:
» Process development and optimization dedicated
to specific equipment
» Process and equipment simulation and modeling.
� Chemicals and material manufacturers:
» Evaluation, screening, and development of chemi-
cals and precursors
» Analytics and characterization
» Wafer processing and process optimization.
Further activities within the business unit are determined by the
international semiconductor roadmap (ITRS) as well as by the
global trends “Beyond CMOS“ and “More than Moore“.
Within leading edge micro and nanoelectronics, emphasis will
be on dielectrics as well as metallization and barriers, e.g.:
� Ultra-low-k-materials (k = 2.0 – 2.3), deposited by
CVD or spin-on-technologies
� Alternative ultra-low-k-approaches, e.g. airgaps (k < 1.3)
� Ultra thin CVD and ALD barriers
� Self forming barriers
� Airgap-compatible barriers and barriers for copper
layers with extremely low resistivity.
Beyond CMOS is characterized by new designs and materials,
like carbon nano tubes (CNTs). Fraunhofer ENAS has started
basic research in that field in close cooperation with the Center
for Microtechnologies at Chemnitz University of Technology.
Bringing this research to an application is an important goal for
the coming years.
Various functionalities integrated in two and three dimensional
systems earmark “More than Moore“ approaches. Forwarding
development of integration concepts and technologies specifi-
cally directed to inter-chip interconnections is a central research
topic within that area. Moreover, integration of novel BEOL
materials in MEMS/NEMS-applications is aimed for.
MicRo And nAno ElEcTRonicS /bAck-End of linE
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According to the name the business unit „Green and Wireless
Systems” aggregates all activities of Fraunhofer ENAS which
belong to wireless, periodic data collection and / or monitoring
to protect the environment (environmental monitoring) and
the state of objects (Condition Monitoring). The business unit
focuses on customer specific integration solutions for logistics
and on system solutions for the condition monitoring based on
MEMS / NEMS. It is divided in the two parts “Logistics” and
“Smart Monitoring Systems”.
l o G I s t I c s
“Logistics” addresses the development and integration of
components for manufacturing new smart labels which au-
tonomously and wirelessly transfer data and to some extent
energy with optimal quality at minimal production costs. They
are used for instance in the automation of supply chains. There-
fore application-specific antenna systems are designed and
printed primary cells as well as wireless power supply systems
based on near field coupling are developed. If necessary these
customer specific products are produced at low cost with high
throughput printing systems. Additionally a further focus is on
the development of complex RF labels with integrated MEMS
sensors for data acquisition. Electronic components, that are
necessary for the RF technology and sensor systems, are sup-
plied by industrial partners.
In the field of application-specific antennas, the intention is to
analyze the dielectric environment of the material to be marked
during the lifetime in advance and to include the results in
the design of the RFID solution. In addition, beyond printing
technology work is carried out in the field of antenna design in
the ultra high frequency (UHF) and super high frequency (SHF)
range and for matters of electro magnetic compatibility.
In order to bring together elements printed with silicon based
chips in terms of a hybrid solution there is a strong cooperation
with the core competences “Interconnect Technologies” and
“System Integration Technologies“ as well as with the business
unit “Micro and Nano Electronics / Back-end of Line”.
This strategy targets at the growth market of packaging. Paral-
lel to the activities of the pure packaging market, approaches
are developed to integrate MEMS-based sensors in non-rigid,
thin and smart labels, which collect, store and process data
measured. Such complex systems are used e.g. for container la-
beling. They require an integrated, wireless power supply in ad-
dition to optimized dielectric antennas and sensor systems. For
simple single-use applications, environmentally friendly primary
batteries may be used, which are based on zinc-manganese
dioxide and deliver voltages of 1.5 to 6 volts.
Therefore, highly efficient production technologies are used
based on printing processes. They will be further developed to
inexpensively produce thin, flexible energy reservoirs in (almost)
any form. Competitive advantages exist for the printed batter-
ies last but not least from the in-house design and the existing
infrastructure for their characterization and reliability testing.
Fraunhofer ENAS offers the following services:
� Antenna design and modeling
� Prototype antenna manufacturing and metrological
characterization
� System design for energy supply by wireless near-field
coupling
� Integration of sensors / MEMS in smart label
� Development of assembling and packaging technolo-
gies of printed elements and silicon components
� Adaptation of printing production technologies
� Design and modeling of printed batteries and integra-
tion of these elements
� Small batch production and metrological characteriza-
tion of batteries.
s m a r t m o n I t o r I n G s y s t e m s
“Smart Monitoring Systems“ includes the development of
system solutions for the condition monitoring using MEMS /
NEMS based systems and optimized data analysis / communi-
cation.
Main focus is the application of silicon based MOEMS (transmis-
sion or reflection orders) in miniaturized spectrometers for gas
analysis, environmental monitoring and medical applications.
Today‘s customers are developers and users of IR detectors,
spectrometers and analytical systems.
gREEn And WiRElESS SYSTEMS Smart monitoring systems are another aspect of this sub busi-
ness unit. For example they are relevant for active flow control
systems, which are currently intensively studied since the airline
industry calls for monitoring of components to meet the very
high standards for certification.
Fraunhofer ENAS offers the following services:
� System design and modeling
� Technology development
� Manufacturing of prototypes with specific technologies
� System Test
� Development of applications.
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coRE coMpETEncES
Electronic micro and nano systems use shaped elements and
functional components which have dimensions in the micro
and nano meter range. Comparable to microelectronics the
miniaturization and integration is ongoing. So the scaling of
dimensions has a big influence on functional principles as well
on the design of the elements and components. Moreover, the
diversity of technologies and the integration of heterogeneous
functionalities are increasing, too. Design and test require
a stronger combination of component and system design
methods. There is not only a mechanical design necessary but
also the integration of stationary electrical and magnetic fields,
electromagnetic waves in micro wave and terahertz range as
well as optical radiation, the electronic function and often
aspects of signal and system theory. Due to heterogeneous
composition it is often impossible to do this only based on one
simulation tool. Also in the field of measuring technique a lot of
different devices or meters have to be applied.
The core competence “Design and Test of Components and
Systems“ combines all simulation, layout and design methods
for the development of components and systems with the
test methods for analyzing and characterizing geometrical,
topographical and functional parameters. Design and test of
high precision MEMS/NEMS as well as the development of fast,
broad band near field measuring technique are unique features
of the core competence. The interaction with the technology
driven core competence like “Silicon Based Technologies for
Micro and Nano Systems” and “Polymer Based Technologies
for Micro and Nano Systems” together with their technology
dESign And TEST of coMponEnTS And SYSTEMS
platforms has a positive influence on the core competence
“Design and Test of Components and Systems“. The basis for
the excellent reputation are the high quality technical equip-
ment (design software, models, measuring technique for func-
tional characterization of MEMS on the wafer, chip and system
level, application adapted functional test, RF test, reliability and
analysis of tolerances, software algorithm) as well as the highly
educated and qualified stuff.
The departments Multi Device Integration and Advanced Sys-
tem Engineering mainly contribute to this core competence of
Fraunhofer ENAS.
gREEn AndWiRElESSSYSTEMS
dESign And TEST of coMponEnTS And SYSTEMS
MicRo And nAno SYSTEMS
interaction of the core
competence with the
business units
MicRo And nAno ElEcTRo-
nicS / bEol
The core competences are an indicator for the specific tech-
nological know-how of the Fraunhofer Institute for Electronic
Nano Systems. The excellence of Fraunhofer ENAS is based on
a broad variety of technologies and methods for smart systems
integration.
These are:
� Design and Test of Components and Systems
� Silicon Based Technologies for Micro and Nano Systems
� Polymer Based Technologies for Micro and Nano
Systems
� Printing Technologies for Functional Layers and Com-
ponents
� Interconnect Technologies
� System Integration Technologies
� Reliability of Components and Systems
The three core competences “Silicon Based Technologies for
Micro and Nano Systems“, “Polymer Based Technologies for
Micro and Nano Systems” and “Printing Technologies for Func-
tional Layers and Components” are the technological basis for
the development of components of micro and nano systems.
“Interconnect Technologies” and “System Integration Tech-
nologies” are so-called cross-sectional technologies of smart
systems integration. “Design and Test of Components and
Systems” as well as “Reliability of Components and Systems”
support the other technologies.
The core competences are based on the know-how of the
employees of the six departments of Fraunhofer ENAS. It
needs to be mentioned that departments contribute to dif-
ferent core competences. Moreover the core competences are
supported by the cooperation with our partners:
� Center for Microtechnologies ZfM of Chemnitz
University of Technology
� Chair Digital Printing and Imaging Technology of
the faculty of mechanical engineering of Chemnitz
University of Technology
� Chair Sensor Systems of the faculty of electrical
engineering of University Paderborn
The relevance of the core competences for the different
business units is graphically shown. Any overlap shown is an
indicator that the core competence interacts with the business
unit.
design and test of components and systems
reliability of components and systems
polymer basedtechnologiesfor micro andnano systems
printingtechnologiesfor functional
layers andcomponents
silicon basedtechnologiesfor micro andnano systems
interconnect technologies
system integration technologies
14 15
“Silicon based Technologies for Micro and Nano Systems“
combine the equipment and stuff, the know-how and the tech-
nological processes for manufacturing silicon based micro and
nano systems. Silicon based technologies have been developed
at the Center for Microtechnologies ZfM of Chemnitz University
of Technology just since the early 90s. With the foundation of
the department Multi Device Integration of Fraunhofer IZM in
Chemnitz (now Fraunhofer ENAS) the technological portfolio
has been expanded and further developed in direction of
application-oriented manufacturing of prototypes and integra-
tion technologies.
In the future the focus will be on the development and inte-
gration of nano structures for new and novel systems. The
departments Multi Device Integration and marginally System
Packaging contribute to this core competence.
Based on the technological developments of the past 20 years
the following technologies have been established and are ap-
plied for manufacturing prototypes in the business units “Micro
and Nano Systems“ and “Green and Wireless Systems“ :
� Surface high aspect ratio technologies for high preci-
sion capacitive MEMS (AIM, SCREAM, BDRIE)
� Technologies for reducing pitches to nm range
� Technologies for RF-MEMS based on capacitive and
ohmic principles
� Technologies for hermetic encapsulation on wafer
level
� Application-specific bulk technologies
� Technologies for precision actuators
� Technologies for precision mechanical parts and com-
ponents
� Technological processes for photovoltaics
As the line is very flexible it is possible to develop new technolo-
gies for MEMS/NEMS for the in-house production process (de-
sign, technology development, prototypes, test), for customer
specific MEMS/NEMS and single processes. The technology can
also be transferred to the customer.
Silicon bASEd TEchnologiES foR MicRo And nAno SYSTEMS
This core competence covers the technological and human re-
sources for the development of micro and nano systems based
on polymeric materials. Being affiliated to the department
Multi Device Integration, the focus of the core competence is
not the development of individual sensors and actuators, but a
system approach in which the sensor and actuator functionality
is a direct part of the overall system.
The core competence can be divided into:
� Development of the polymer based integrated func-
tionalities themselves, and
� Key technologies necessary for the fabrication thereof.
Two different types of integrated functionalities are addressed:
� system- and material-integrated actuators:
A completely integrated, low-cost micro actuator
technology has been developed and patented for
polymer based microsystems. Based on these patents
a modular platform for in-vitro-diagnostics has been
developed together with other Fraunhofer Institutes,
which has now gained a high visibility in the market.
� system-integrated polymer based sensors: The
application of nano composites in polymer based
sensors exhibits a high potential. The polymeric matrix
of the composite can be relatively freely chosen and
adapted to a certain application. The sensor’s function-
ality, however, can be realized based only on a proper
selection of nano particles embedded in the polymer
matrix. The main research topics therefore are system-
adapted sensor design, integration technologies for
nano composites in polymeric materials as well as the
measuring techniques for characterization of polymer
based nano composites and sensors.
A certain number of key technologies is needed for the devel-
opment of polymer based sensors and actuators. All necessary
technologies are available at ENAS, such as surface modifica-
tion, metallization, micro structuring, dispersion technologies,
coating technologies for polymers and nano composites, bond-
ing technologies for plastics, and an assembly line for polymer
based micro systems based on electrochemical micro actuators.
polYMER bASEd TEchnologiES foR MicRo And nAno SYSTEMS
polYMER bASEd TEchnologiES
foR MicRo And nAno SYSTEMS
interaction of the core
competence with the
business units
gREEn AndWiRElESSSYSTEMS
MicRo And
nAno SYSTEMS
MicRo And nAno ElEcTRo-
nicS / bEol
interaction of the core
competence with the
business units
Silicon bASEd TEchnologiES
foR MicRo And nAno SYSTEMS
gREEn AndWiRElESSSYSTEMS
MicRo And
nAno SYSTEMS
MicRo And nAno ElEcTRo-
nicS / bEol
16 17
With the establishment of the Fraunhofer ENAS the depart-
ment Printed Functionalities was founded that embodies the
core competence “Printing Technologies for Functional Layers
and Components”.
The core competence “Printing Technologies for Functional
Layers and Components“ includes the usage and optimiza-
tion of industrial printing technologies (gravure, flexo, screen
printing and inkjet printing) for defined pictorially application
of functional coatings for application-relevant, usually flexible
substrates.
The close cooperation with the Chair of Digital Printing and
Imaging Technology of the Institute for Print and Media Tech-
nology pmTUC at Chemnitz University of Technology and the
related technological width are particular strengths of this core
competence. Unique features are in the field of inkjet pilot line
with the available roll-to-roll printing machines for inkjet, flexo
and gravure printing. Due to the aforementioned flexibility of
the implementation of various technical printing substrates and
printing materials, a broadband research and development area
opens up starting from printed batteries via printed reactive
functional layers up to the printed low-cost radio frequency
identification antenna systems which have been adapted to the
specific demands of their usage.
Depending on the particular application, suitable printing
methods are selected taking into account the requested
purpose, whereby customer needs are flexibly and specifi-
cally considered in the context of the technical possibilities. The
process advantages of an effective, pictorial material applica-
tion of functional layers at defined locations on the substrate
(additive technology) limit the use of materials to the required
areas and therefore costs for customers. To achieve the goal of
transferring the manufacturing process into mass production,
the imagewise coating is carried out under ambient conditions.
Only oxygen and humidity-sensitive materials require process-
ing in an artificial atmosphere.
pRinTing TEchnologiES foR funcTionAl lAYERS And coMponEnTS
The core competence “Interconnect Technologies“ is based on
the experience of the research and development carried out
since 1991 at the Center for Mirotechnologies ZfM of Chemnitz
University of Technology, founded as the „Technikum Mikroele-
ktronik“ already in 1979. With the foundation of Fraunhofer
ENAS and the establishment of the department Back-end of
Line, competences were transferred to Fraunhofer ENAS.
The core competence is characterized by two main elements:
� Material and process development as well as process
integration for interconnect systems and NEMS
� Modeling and simulation of processes and equipment,
of material properties and behavior of materials as
well as interconnect systems
With respect to the experimental work, the following topics are
in the focus:
� low-k / ultralow-k materials – deposition, pat-
terning, integration as well as characterization and k-
restore, alternatively airgap concepts and technology
� cVD and alD especially for metals – process develop-
ment based on metalorganic precursors, evaluation
of new precursors, Cu-CVD integrations schemes for
metallization systems and through silicon vias (TSV)
� In-situ plasma diagnostics – development and
optimization of plasma-based etching
Based on the available equipment, complete damascene archi-
tectures with Cu/low-k as well as airgap-based metallization
schemes can be realized on wafers up to 200 mm diameter.
Additionally, new research domains are addressed:
� Development of stressors for mobility enhancement
of charge carriers in MOS transistors
� Wafer-level integration of carbon nano tubes (CNT)
into interconnect systems and NEMS
� Integration of sensor materials, e.g. spintronic film
systems for GMR sensors
The modeling and simulation activities concentrate on processes
like PVD, CVD or CMP. Another focus is put on models and
simulation of devices and nano structures as well as on material
properties at the nanometer scale. In this manner, modeling
and simulation supports the technology development. The
close interaction of the two main elements, modeling and
simulation with material and process development and integra-
tion, represents a unique feature.
inTERconnEcT TEchnologiES
gREEn AndWiRElESSSYSTEMS
inTERcon-nEcT TEchno-
logiES
MicRo And
nAno SYSTEMS
interaction of the core
competence with the
business units
MicRo And nAno ElEcTRo-
nicS / bEol
gREEn And
WiRElESSSYSTEMS
pRinTing TEch-nologiES foR funcTionAl lAYERS And
coMponEnTS
MicRo And
nAno SYSTEMS
interaction of the core
competence with the
business units
MicRo And nAno ElEcTRo-
nicS / bEol
18 19
System integration and packaging technologies are very im-
portant in the value added chain of micro technical products.
Due to the broad range of customer-specific requirements
integration technologies contribute between 20 and 95% to
the component costs. Fraunhofer ENAS focuses on zero level
and first level packaging and develops methods and technolo-
gies for hybrid, monolithic and vertical integration of MEMS/
NEMS with electronic components. The departments System
Packaging and partly Back-end of Line contribute to this core
competence.
Since the early 90s first wafer bonding technologies such as
silicon direct bonding and anodic bonding have been devel-
oped in Chemnitz. With the increasing materials and structure
complexity it is a challenge to join very different materials
and to bridge surface topographies. This is possible by ap-
plying different intermediate layers such as glasses, polymers
or metals, which are used and investigated in new bonding
technologies like eutectic bonding, glass frit bonding and
adhesive bonding.
The request to higher integration densities was a main premise
for the development of technologies for structuring through
silicon vias (TSV) and for the development of TSV metallization.
In parallel barrier and isolation techniques had to be applied
and developed further. With increasing experiences it was
possible to switch from hybrid to vertical system integration.
Fraunhofer ENAS offers now integration technologies based on
hybrid as well as vertical technologies.
A big strength of the core competence is the close connec-
tion to the basic research by cooperating with the Center
for Microtechnologies of Chemnitz University of Technology.
The interaction with MEMS/NEMS and TSV development at
Fraunhofer ENAS and the cooperation with Fraunhofer IZM/
ASSID strengthen also the core competence.
A unique feature is the availability of a broad variety of bond-
ing technologies for MEMS/NEMS and electronic components
based on 4, 6 and 8 inch substrates. Moreover there is a focus
on the development of low temperature bonding, bonding
with reactive nano layers as well as Cu-CVD and Cu-ECD for
starting layer deposition as well as complete filling of TSVs.
SYSTEM inTEgRATion TEchnologiES
The knowledge and the experiences of Fraunhofer ENAS in the
field of reliability are the result of developments in the past 20
years. Started as research work in the field of lifetime prediction,
fracture mechanics, and damage mechanics within the former
Institute of Mechanics in Chemnitz, the methods have been
transferred and widely expanded by the Micro Materials Center
into the field of electronic components and systems during the
90s of the previous century. With the foundation of Fraunhofer
ENAS, the work has been continued with the clear focus on
the reliability of components and systems in the micro / nano
transition range.
Today, the accumulated competences allow the identification,
the analysis, and the evaluation of the effects and their interac-
tions leading to drift or degradation of functional parameters
and finally to failures of components and complete micro/nano
systems. Based on this “physics of failure“ approach, which
includes comprehensive calibration of all models and rigorous
validation of all simulation results by experimental tests and
analysis, the mechanisms and the consequences are studied
thoroughly so that the reliability risks can be quantified and
converted into lifetime models. These models are directly utilized
in the design and development of new smart systems and tech-
nologies (design for manufacturability and reliability). The
ultimate goal is to completely avoid the time and staff consum-
ing preliminary experiments in the design optimization of new
products. Instead, this should be done by „virtual prototyping“,
i.e. by means of perfectly validated numerical simulation, which
requires a fraction of the experimental effort only. Hence, the
solutions and design decisions based on virtual prototyping shall
REliAbiliTY of coMponEnTS And SYSTEMS
be as reliable as those based on the conventional sample tests.
This way, the first physical realization of the new products would
immediately be able to enter und to pass the final qualification
tests. Today‘s best practice in microelectronics‘ circuit design and
in the automotive industry gives rise to optimism that such a
vision can also be implemented successfully in the complex field
of micro and nano systems.
This area of expertise of Fraunhofer ENAS is mainly supported by
the department Micro Materials Center and to some degree also
by the departments Advanced System Engineering and Multi
Device Integration. Through the years of systematic development
and consistent implementation, it has clearly become a unique
feature of this institute. The strategy of seamless combination
of experimental investigations and realistic numerical simulation
pioneered and advanced by Fraunhofer ENAS has reached a
level of excellence that is well known and acknowledged.
gREEn AndWiRElESSSYSTEMS
SYSTEM inTEgRATion
TEchnologiES
MicRo And nAno SYSTEMS
interaction of the core
competence with the
business units
MicRo And nAno ElEcTRo-
nicS / bEol
gREEn AndWiRElESSSYSTEMS
REliAbiliTY of coMponEnTS
And SYSTEMS
MicRo And
nAno SYSTEMS
interaction of the core
competence with the
business units
MicRo And nAno ElEcTRo-
nicS / bEol
20 21
conTAcT
F r a u n h o F e r e n a s
Prof. Dr. thomas Geßner
Director
Phone: +49 (0) 371 45001-100
Fax: +49 (0) 371 45001-101
Email: [email protected]
Prof. Dr. thomas otto
Deputy Director
head of department multi Device Integration
Phone: +49 (0) 371 45001-231
Fax: +49 (0) 371 45001-331
Email: [email protected]
Prof. Dr. Bernd michel
head of department micro materials center
Phone: +49 (0) 371 45001-220
Fax: +49 (0) 371 45001-320
Email: [email protected]
Dr. sven rzepka
head of department micro materials center
Phone: +49 (0) 371 45001-421
Fax: +49 (0) 371 45001-521
Email: [email protected]
Prof. Dr. reinhard Baumann
head of department Printed Functionalities
Phone: +49 (0) 371 45001-234
Fax: +49 (0) 371 45001-334
Email: [email protected]
Prof. Dr. stefan e. schulz
head of department Back-end of line
Phone: +49 (0) 371 45001-232
Fax: +49 (0) 371 45001-332
Email: [email protected]
Dr. maik Wiemer
head of department system Packaging
Phone: +49 (0) 371 45001-233
Fax: +49 (0) 371 45001-333
Email: [email protected]
Dr. christian hedayat
head of department advanced system engineering
Phone: +49 (0) 5251 60-5630
Fax: +49 (0) 49 5251 60-5621
Email: [email protected]
Gottfried höppner
head administration
Phone: +49 (0) 371 45001-210
Fax: +49 (0) 371 45001-310
Email: [email protected]
Dr. martina Vogel
Officer of the director / PR officer
Phone: +49 (0) 371 45001-203
Fax: +49 (0) 371 45001-303
Email: [email protected]
c e n t e r F o r m I c r o t e c h n o l o G I e s
Dr. Karla hiller
Deputy director of Zfm
Phone: +49 (0) 371 45001-400
Fax: +49 (0) 371 45001-500
Email: [email protected]
Dr. andreas Bertz
head of department lithography
Phone: +49 (0) 371 45001-402
Fax: +49 (0) 371 45001-502
Email: [email protected]
Dr. christian Kaufmann
head of department thin Film Deposition
Phone: +49 (0) 371 45001-401
Fax: +49 (0) 371 45001-501
Email: [email protected]
norbert Zichner
technology advisor
Phone: +49 (0) 371 531-33650
Fax: +49 (0) 371 531-833650
Email: [email protected]
Dr. Danny reuter
Project coordinator nanett
Phone: +49 (0) 371 531-35041
Fax: +49 (0) 371 531-835041
Email: [email protected]
u n I V e r s I t y P a D e r B o r n
Prof. Dr. ulrich hilleringmann
chair sensor technology
Phone: +49 (0) 5251 60-2225
Fax: +49 (0) 5251 60-5913
Email: [email protected]
22 23
C.-Süd
C.-Rottlu�
C.-Mitte
Dresdner Straße
Neefestraße
Südring
Augustusburger Straße
Südring
Reichenhainer Straße
Zschopauer Straße
Ann
aber
ger S
traß
eZwickauer Straße
Leipziger Straße
Reichsstraße
Limbacher Straße
Leipzig
Erfurt
Hof
Dresden
ChemnitzTh
üringer W
eg
War
tburg
straß
e
Technologie-Campus
Reichenhainer Straße
Rosenbergstraße
TUC
TUC
Mensa
Smart Systems CampusChemnitz
Technische UniversitätChemnitz
Zentrum
Südring / C.-Reichenhain
hoW To REAch fRAunhofER EnAS B y t r a I n
From the central station Fraunhofer ENAS can be reached by
taxi or bus (5-minute walk to the bus station). Take bus line 51
towards Altchemnitz/Reichenhain (get off at ‚Ebertstrasse‘). Fol-
low Reichenhainer Strasse (same direction as the bus) for 100
m to reach Rosenbergstrasse. Turn right into Rosenbergstrasse.
Go straight on for 200 m to reach the Smart Systems Campus.
Follow main street (passing the 3D-Micromac AG building on
the right and the Start-up building on the left). Fraunhofer
ENAS is located on the left.
B y P l a I n
You can reach Chemnitz via the airports Dresden and Leipzig.
B y c a r
e x I t a 4 , c h e m n I t Z - m I t t e
Follow B 95 and go straight on to the city center (direction
signs: TUC, Campus Reichenhainer Strasse). Go straight ahead
Leipziger Strasse leading into Reichsstrasse and Gustav-Freytag-
Strasse. Turn right into Reichenhainer Strasse. Proceed straight
ahead for approximately 1 km and turn right into Rosenberg-
strasse. Go on for 200 m to reach the Smart Systems Campus.
Follow main street (passing 3D -Micromac AG on the right) and
turn right into Technologie -Campus. Fraunhofer ENAS is located
on the left. Free parking in front of the Fraunhofer building or
at the parking lot in front of the Start-up building.
e x I t a 7 2 , e x I t c h e m n I t Z - s u e D
Coming from the freeway A72 towards Dresden, leave at the
exit Chemnitz Sued. Pass the fly-over (Neefestrasse) and turn
right into South beltway (Suedring). Go straight ahead and
follow direction signs for Annaberg. Continue following the
South beltway straight to the Reichenhainer Strasse (exit on the
right) and turn left into Reichenhainer Strasse (direction sign:
TUC, Campus Reichenhainer Strasse). Proceed straight ahead
for approximately 1 km (passing the cemetery, crematory and
Chemnitz University of Technology TUC) and turn left into
Rosenbergstrasse. Go straight on for 200 m to reach the Smart
Systems Campus. Follow main street (passing the 3D-Micromac
AG building on the right and the Start-up building on the left).
Fraunhofer ENAS is located on the left. Free parking is possible
in front of the Fraunhofer building.
The Fraunhofer Institute for
Electronic Nano Systems is part
of the Smart Systems Campus
Chemnitz and is located next
to Chemnitz University of Tech-
nology (Campus Reichenhainer
Straße).
Please note that Technology
Campus is not yet available in
all navigation systems. Alterna-
tively, you can use the Rosen-
bergstrasse.
CZ
PL
Chemnitz
Leipzig
Dresden
Berlin
Prag
Nürnberg / München
Berlin
13
4
174
14
14
38
9
9
72
4
Frankfurt
Flughäfen/Airports:
1 - Leipzig/Halle2 - Dresden3 - Altenburg-Nobitz
Fraunhofer ENAS
24
conTAcT
Fraunhofer enas
Technologie-Campus 3
09126 Chemnitz
Phone: +49 (0)371 45001 - 0
Fax: +49 (0)371 45001 - 101
Email: [email protected]
www.enas.fraunhofer.de
cover photo: building of Fraunhofer ENAS
photos: Fraunhofer ENAS