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Used Semiconductor Equipment Source
Chemical Deposition(CVD,PECVD)ADVANCED CRYSTAL SCIENCES LPCVD SYSTEM
AIXTRON AIX200 LP-MOCVD Chemical Vapor DepositionAMP-3300 Plasma II PECVD Deposition System
NOVELLUS Deposition Tool CONCEPT 2 Altus DLCM
Oxford PlasmaLab 80 Plus DLC Deposition System
Plasma-Therm 730 SLR PECVD Load-Locked System
Plasma-Therm 790 Dual Chamber PECVD & RIE System
Plasma-Therm 790™ Series Platform
Plasma-Therm LAPECVD™
Plasma-Therm Productivity Enhancements
Plasmafab PF310 (STS 310) PECVD
Plasmatherm 790 PECVD
Plasmatherm Dual Chamber PVD-RIE
Plasmatherm SLR 730 PECVD Plasma Shuttle-Lock
Plasmatherm SLR 730 PECVD Shuttle lock PECVD
PlasmaTherm Versalock 700 PECVD
ROTH & RAU AK 800
Solid State Equipment SSEC 3308 Cassette to Cassette
Technics PEIIA PECVD / RIE System
TEMESCAL BJD-1800
Used CHA SEC 1000 RAP 4 pocket E-Beam evaporatorUsed CVC Old Style Shutter Assembly
Used CVD Semicoductor Equipment List
Used Plasmatherm 700 VLR (Versalock ) PECVD System
Used Plasmatherm 790 PECVD Stand alone deposition
Used Plasmatherm 790 PECVD/RIE Dual Chamber 790
Deposition SystemSputter
hysical sputtering is driven by momentum exchange between the ions and atoms in the materials, due to collisions.
The incident ions set off collision cascades in the target. When such cascades recoil and reach the target surface with an energy greater the surface binding energy, an atom would be ejected, known as sputtering. If the target is thin on an atomic scale the collision cascade can reach the back side of the target and atoms can escape the surface binding energy `in transmission'. The average number of atoms ejected from the target per incident ion is called the sputter yield and
Page 1 of 22Sputter Deposition System - Semiconductor Equipment Source
12/14/2012https://sites.google.com/site/semiconductorequipmentsource/sputter-deposition-system
Used Plasmatherm PT530 PECVD Deposition System
Veeco RF350 C2 IBE (Ion Beam Deposition)
Watkins Johnson (WJ) 1000
Watkins Johnson (WJ) 1500
Watkins Johnson (WJ) 999R APCVD
Coater and DeveloperKarl Suss ACS200 Cassette to Cassette Coat-Develop
Suss Microtec Delta 20T2/150VPO
Used SVG Coater and Developer Equipment
Contact Us
Dicing SawsThermocarbon Dicing Saw 8003
E-TestersAgilent HP 4062UX Semiconductor Process Control System
Evaporation EquipmentBalzers Evaporator
CHA Industries Mark 40 Source Evaporator
CHA Industries Mark 50 Source Evaporator
CHA Industries SE 1000 E-Beam Evaporation System
CHA Industries SE 600 E-Beam Evaporator
CHA Mark 50 system for sale (real CHA)
CHA SE 600 EBEAM SYSTEM
CHA SE 600 EVAPORATOR
CHA SE 600 RAP CHA
Cooke Filament Evaporator
CTI 8 CRYOPUMP CTI
Denton 502 Denton
Edwards Auto 500
NRC / Varian 3117 Thermal Evaporator
NRC / Varian 3125 E-Beam Evaporator
Temescal BJD 1800 6 Pocket E-Beam Evaporator
Temescal FC 1800 E-Beam Evaporator
depends on the ion incident angle, the energy of the ion, the masses of the ion and target atoms, and the surface binding energy of atoms in the target. For a crystalline target the orientation of the crystal axes with respect to the target surface is relevant.
The primary particles for the sputtering process can be supplied in a number of ways, for example by a plasma, an ion source, an accelerator or by a radioactive material emitting alpha particles.
A model for describing sputtering in the cascade regime for amorphous flat targets is Thompson's analytical model.[4] An algorithm that simulates sputtering based on a quantum mechanical treatment including electrons stripping at high energy is implemented in the program TRIM.[5]
A different mechanism of physical sputtering is heat spike sputtering. This may occur when the solid is dense enough, and the incoming ion heavy enough, that the collisions occur very close to each other. Then the binary collision approximation is no longer valid, but rather the collisional process should be understood as a many-body process. The dense collisions induce a heat spike (also called thermal spike), which essentially melts the crystal locally. If the molten zone is close enough to a surface, large numbers of atoms may sputter due to flow of liquid to the surface and/or microexplosions.[6] Heat spike sputtering is most important for heavy ions (say Xe or Au or cluster ions) with energies in the keV–MeV range bombarding dense but soft metals with a low melting point (Ag, Au, Pb, etc.). The heat spike sputtering often increases nonlinearly with energy, and can for small cluster ions lead to dramatic sputtering yields per cluster of the order of 10000.[7] For animations of such a process see here.
Physical sputtering has a well-defined minimum energy threshold which is equal to or larger than the ion energy at which the maximum energy transfer of the ion to a sample atom equals the binding energy of a surface atom. This threshold typically is somewhere in the range 10–100 eV.
Preferential sputtering can occur at the start when a multicomponent solid target is bombarded and there is no solid state diffusion. If the energy transfer is more efficient to one of the target components, and/or it is less
Page 2 of 22Sputter Deposition System - Semiconductor Equipment Source
12/14/2012https://sites.google.com/site/semiconductorequipmentsource/sputter-deposition-system
Temescal VES 2550 Four Pocket E-Beam Evaporator
Used CHA 1000 E-Beam Evaporator
Used CHA 600 Gold Evaporator
Used Semiconductor Equipment
Used Temescal FCE 3200 Six Pocket E - Beam Evaporator
VARIAN 3117 FILIMENT EVAPORATOR
Varian 3118 Thermal Filament Evaporator
Varian 3180 Sputtering System
Veeco RF350 C2 IBD Ion Beam DepositionVEECO/SLOAN ELECTRON BEAM EVAPORATOR
Furnace and OvenLab-Line Squaroid DUO-VAC OVEN
LINDBERG TUBE FURNACE
MRL Cyclone C430 LH Nitride/Oxidation Furnance
Vacuum Furnace for Hard Bake special parts
Inductively coupled plasma-ICPSTS (Surface Tech Sys) MultiplexInductively-Coupled Plasma (ICP) Advanced Silicon Etch (ASE) System
STS Inductively Coupled Plasma High Density Plasma Etch
STS Multiplex ASE AOE ICP CLUSTER TOOL
STS MultiplexInductively-Coupled Plasma (ICP) Advanced Silicon Etch (ASE) System
Lithography & Photoresist
Metrology SystemsClean Room Partice Count Meter model 100
ESD RING Automatic Cold Resistance Meter of Sliders
Hitachi CD-SEM S-8820 Used Semiconductor EquipmentHItachi CD-SEM S-8840 Used Semiconductor Equipment
HITACHI Field Emission SEM (FE-SEM) S-5000
Hitachi S-800 SEM Scanning Electron Microscope
JWS-7555S Wafer Inspection
Kla-Tencor OmniMap Auto RS55 / tc USED
strongly bound to the solid, it will sputter more efficiently than the other. If in an AB alloy the component A is sputtered preferentially, the surface of the solid will, during prolonged bombardment, become enriched in the B component thereby increasing the probability that B is sputtered such that the composition of the sputtered material will be AB.
Electronic sputtering
The term electronic sputtering can mean either sputtering induced by energetic electrons (for example in a transmission electron microscope), or sputtering due to very high-energy or highly charged heavy ions which lose energy to the solid mostly by electronic stopping power, where the electronic excitations cause sputtering.[8] Electronic sputtering produces high sputtering yields from insulators, as the electronic excitations that cause sputtering are not immediately quenched, as they would be in a conductor. One example of this is Jupiter's ice-covered moon Europa, where a MeV sulfur ion from Jupiter's magnetosphere can eject up to 10,000 H2O molecules.[9]
Potential sputtering
In the case of multiply charged projectile ions a particular form of electronic sputtering can take place which has been termed potential sputtering. In these cases the potential energy stored in multiply charged ions (i.e., the energy necessary to produce an ion of this charge state from its neutral atom) is liberated when the ions recombine during impact on a solid surface (formation of hollow atoms). This sputtering process is characterized by a strong dependence of the observed sputtering yields on the charge state of the impinging ion and can already take place at ion impact energies well below the physical sputtering threshold . Potential sputtering has only been observed for certain target species and requires a minimum potential energy.
Etching and chemical sputtering
Page 3 of 22Sputter Deposition System - Semiconductor Equipment Source
12/14/2012https://sites.google.com/site/semiconductorequipmentsource/sputter-deposition-system
PEGASUS 2000 Flying Height Test System Model FHT
Tencor TF-1 Thin films monitor
Used Hitachi CD-SEM Equipment
Used Hitachi FE-SEM/SEM Equipment
Used KLA-Tencor Metrology Equipment
Zeiss/Leo DSM 982 FE SEM
Plasma Asher Descum Systems
Plasma EtcherTechnics PEIIB Planar Etch Plasma System
Two Used Matrix 10 Plasma Asher Machine for 8 inch Wafe
Used Hydrogen Chloride (HCl) Etching System
Rapid Thermal ProcessA.G. Associates 410 Table
AG ASSOCIATES 2146
AG Associates 4100 Heatpulse Rapid Thermal Processor
AG Associates Heatpulse 210 Rapid Thermal Process
AG ASSOCIATES HEATPULSE 210 RAPID THERMAL PROCESSOR
AG Associates Heatpulse 410 Rapid Thermal Anneal
AG ASSOCIATES HEATPULSE 410 RAPID THERMAL PROCESSOR
AG Associates Heatpulse 610 I Rapid Thermal Processor
AG Associates Heatpulse 610 Rapid Thermal Anneal
AG Associates Heatpulse 610 Rapid Thermal Process
AG ASSOCIATES HEATPULSE 610 RAPID THERMAL PROCESSOR
AG Associates Heatpulse RTPAG Associates Heatpulse Services
AG Associates Heatpulse210
AG Associates Heatpulse410 Rapid Thermal Processor
AG Associates Heatpulse610 Rapid Thermal Processor
AG ASSOCIATES MINIPULSE 310 RAPID THERMAL PROCESSOR
Removing atoms by sputtering with an inert gas is called `ion milling' or 'ion etching'.
Sputtering can also play a role in reactive ion etching (RIE), a plasma process carried out with chemically active ions and radicals, for which the sputtering yield may be enhanced significantly compared to pure physical sputtering. Reactive ions are frequently used in Secondary Ion Mass Spectrometry (SIMS) equipment to enhance the sputter rates. The mechanisms causing the sputtering enhancement are not always well understood, but for instance the case of fluorine etching of Si has been modeled well theoretically.
Sputtering which is observed to occur below the threshold energy of physical sputtering, is also often called chemical sputtering. The mechanisms behind such sputtering are not always well understood, and may be hard to distinguish from chemical etching. At elevated temperatures, chemical sputtering of carbon can be understood to be due to the incoming ions weakening bonds in the sample, which then desorb by thermal activation. The hydrogen-induced sputtering of carbon-based materials observed at low temperatures has been explained by H ions entering between C-C bonds and thus breaking them, a mechanism dubbed swift chemical sputtering.
Applications and phenomena
Film depositionMain article: Sputter deposition
Sputter deposition is a method of depositing thin films by sputtering which involves eroding material from a "target" source onto a "substrate" e.g. a silicon wafer. Resputtering, in contrast, involves re-emission of the deposited material, e.g. SiO2 during the deposition also by ion bombardment.
Sputtered atoms ejected into the gas phase are not in their thermodynamic equilibrium state, and tend to deposit on all surfaces in the vacuum chamber.
Page 4 of 22Sputter Deposition System - Semiconductor Equipment Source
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AG Associates Minipulse310 Rapid Thermal Processor
APPLIED MATERIALS 0010-22033 Rapid Thermal Process
APPLIED MATERIALS Centura 5200
APPLIED MATERIALS Centura 5200 TPCC
APPLIED MATERIALS Centura ACP 2X Radiance ISSG
APPLIED MATERIALS Centura RTP TPCC XE+
APPLIED MATERIALS Centura TPCC Rapid Thermal Anneal
BOC EDWARDS Helios
BOC EDWARDS Helios S Rapid Thermal ProcessingBOC EDWARDS IGRC
CEE/Brewer Science UV-Thermal Processing System
DAINIPPON LA-3000-F
EATON NOVA / AXCELIS 808
EATON NOVA / AXCELIS Reliance 850
INSTRON RHS 1533A
Koyo Thermo Systems RTP and RTA Systems:RLA3100 series RLA1200 series
LPT TM 100 / 300 FC RTA RTP RTO RTN Systems
Mattson AST2800
Mattson AST2900 RTP
Mattson AST3000
Mattson SHS-2900 RTA RTP System for 200 mm Wafer
METRON / AG ASSOCIATES 4108 Rapid Thermal Annealing RTA RTP RTO RTN Systems
METRON / AG ASSOCIATES Heatpulse 8108 Rapid Thermal Process RTA RTP RTN RTO Systems
METRON / AG ASSOCIATES Heatpulse 8800 Rapid Thermal Anneal RTA RTP RTN RTOMETRON / AG ASSOCIATES Heatpulse 8800 RTA RTP RTN RTO Rapid Thermal Anneal
Modular Pro RTP-600S
MPT Used UV-600 UV-OZONE CLEANING SYSTEM
A substrate (such as a wafer) placed in the chamber will be coated with a thin film. Sputtering usually uses an argon plasma.
EtchingIn semiconductor industry sputtering is used to etch the target. Sputter etching is chosen in cases where a high degree of etching anisotropy is needed and selectivity is not a concern. One major drawback of this technique is wafer damage.
For analysisAnother application of sputtering is to etch away the target material. One such example occurs in Secondary Ion Mass Spectrometry (SIMS), where the target sample is sputtered at a constant rate. As the target is sputtered, the concentration and identity of sputtered atoms are measured using Mass Spectrometry. In this way the composition of the target material can be determined and even extremely low concentrations (20 µg/kg) of impurities detected. Furthermore, because the sputtering continually etches deeper into the sample, concentration profiles as a function of depth can be measured.
In spaceSputtering is one of the forms of space weathering, a process that changes the physical and chemical properties of airless bodies, such as asteroids and our moon. It is also one of the possible ways that Mars has lost most of its atmosphere and that Mercury continually replenishes its tenuous surface-bounded exosphere.
Page 5 of 22Sputter Deposition System - Semiconductor Equipment Source
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MPTC RTP-600XP Rapid Thermal Annealing Systems RTP RTA RTN RTO Systems
MPTC RTP-600XP Rapid Thermal Processors Systems RTA RTP RTO RTN Systems
NEWYOUNG RTA 200HRapid Thermal Processing Systems RTO RTN RTA RTP Systems
PEAK ALP 5000 Flash Rapid Thermal Annealing Systems RTN RTO RTP RTA Systems
PPC 2016 BT Rapid Thermal Process Systems RTA RTP RTO RTN Equipment
Rapid Thermal Processing: AG ASSOCIATES 8800
Rapid Thermal Processors: AET RX-V4
Rapid Thermal Processors: AG ASSOCIATES 210
Rapid Thermal Processors: AG ASSOCIATES 2106
Rapid Thermal Processors: AG ASSOCIATES 210M
Rapid Thermal Processors: AG ASSOCIATES 2146
Rapid Thermal Processors: AG ASSOCIATES 410
Rapid Thermal Processors: AG ASSOCIATES 410 C23
Rapid Thermal Processors: AG ASSOCIATES 8108
Rapid Thermal Processors: AG ASSOCIATES Heatplus 2146
Rapid Thermal Processors: AG ASSOCIATES Heatpulse 2101-01
Rapid Thermal Processors: AG ASSOCIATES Heatpulse 210T
Rapid Thermal Processors: AG ASSOCIATES Heatpulse 4100
Rapid Thermal Processors: AG ASSOCIATES Heatpulse 4108
Rapid Thermal Processors: AG ASSOCIATES Heatpulse 610
Rapid Thermal Processors: AG ASSOCIATES Heatpulse 8108
Rapid Thermal Processors: AG ASSOCIATES Heatpulse 8800
Rapid Thermal Processors: AG ASSOCIATES Mini-Pulse 310Rapid Thermal Processors: APPLIED MATERIALS Centura
Rapid Thermal Processors: APPLIED MATERIALS Centura 5200
Rapid Thermal Processors: APPLIED MATERIALS Centura 5200 TPCC
Rapid Thermal Processors: APPLIED MATERIALS Centura ACP
Page 6 of 22Sputter Deposition System - Semiconductor Equipment Source
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Rapid Thermal Processors: APPLIED MATERIALS Centura RTP XE+
Rapid Thermal Processors: BOC EDWARDS TCS 1
Rapid Thermal Processors: BOC EDWARDS TCS-S
Rapid Thermal Processors: DAINIPPON LA-820
Rapid Thermal Processors: JIPELEC JetFirst 300
Rapid Thermal Processors: MATTSON 3000
Rapid Thermal Processors: METRON / AG ASSOCIATES 4100
Rapid Thermal Processors: METRON / AG ASSOCIATES Heatpulse 8108
Rapid Thermal Processors: STEAG / MATTSON / AST 2800
Rapid Thermal Processors: STEAG / MATTSON / AST 2800e
Rapid Thermal Processors: STEAG / MATTSON / AST SHS 2800
Rapid Thermal Processors: STEAG / MATTSON / AST SHS 3000
RAYTEK Marathon MR Series Pyrometer
RTP 2 INCH 115V RAPID THERMAL PROCESSOR, RAPID THERMAL ANEALER
RTP Matton SHS 2900 AST 2900 Rapid Thermal Process
Spare Parts for AG Associates Product Lines
SSI Solaris 150 Rapid Thermal Annealing System
TEL / WAFERMASTERS SA0150LP Rapid Thermal Processing Systems
TEL / WAFERMASTERS SRTF200-LP Rapid Thermal Processor RTA RTP RTN RTO System
Used ANNEALSYS Products RTP & RTCVD AS-Master
Used ANNEALSYS Products RTP & RTCVD AS-One
Used Annealsys Rapid Thermal Annealing furnaces AS-Micro
Used CEE/Brewer Science 2100 UV-Thermal processingUsed CVD RTA RTP Systems
Used Jipelec JetClip -200-mm RTP & RTCVD Cluster Tool
Used Jipelec JetClip sg
Used Jipelec JetFirst RTA-Low cost bench top RTP processor - Up to 12"
Page 7 of 22Sputter Deposition System - Semiconductor Equipment Source
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Used Jipelec JetStar -Versatile RTP processor to transfer your process from development to production.
Used Koreavac KVR-2000 Series RTP(Rapid Thermal Process)
Used Koreavac KVR-4000 Series RTP(Rapid Thermal Process)
Used Koreavac KVR-6000 Series RTP(Rapid Thermal Process)
Used Modular Process Technology Rapid Thermal Processing System: RTP-3000
Used Modular Process Technology Rapid Thermal Processing System: RTP-800S (200 mm)Used Modular Process Technology Rapid Thermal Processing Production System: MODULAR One
Used Rapid Thermal Annealing System AO 500
Used Rapid Thermal Annealing System: RTP-600S (150 mm) Modular Process Technology
Used SSI Inc Solaris 100 Rapid Thermal Processor
Used SSI Inc Solaris 150 Rapid Thermal Processor
Used SSI Inc Solaris 200 Rapid Thermal Processor
Used SSI INC Solaris Eclipse Vacuum RTP
Used SSI Solaris 150UV
Used Summit XT RAPID THERMAL PROCESSING
Used ULVAC Technologies MILA-5000-P-F Mini Lamp Annealer
Used ULVAC Technologies MILA-5000-P-N Mini Lamp Annealer
Used ULVAC Technologies MILA-5000-UHV Mini Lamp Annealer
Used UniTemp GmbH RTP-1000-150 Front loading
Used UniTemp GmbH RTP-1200-100 Front loading
Used UniTemp GmbH VPO-1000-300 Top loading
WAFERMASTERS 5BAO-200 Rapid Thermal Anneal Equipment RTA RTP RTN RTO
Reactive ion etching-RIEAlcatel 601E DRIE
Plasma-Therm Reactive Ion Etching System Model 70 Serie
Plasmatherm SLR 720 RIE,700 series
STS RIE system
Page 8 of 22Sputter Deposition System - Semiconductor Equipment Source
12/14/2012https://sites.google.com/site/semiconductorequipmentsource/sputter-deposition-system
Used Plasmatherm 790 RIE Stand alone 790 RIE
Sciber BreakerDynatex DX-III wafer sciber breaker
Dynatex GST-150 wafer sciber breaker
Sputter Deposition System2400 series single piece product line
2KVA Evaporator From CVC system 2KVA transformer
AIRCO TEMESCAL FDC-8000 Sputtering Systems:
Airco Temescal HRS 2550 Sputtering SystemAIRCO TEMESCAL HRS 2550 Sputtering Systems:
AIRCO TEMESCAL VES 2550 Sputtering Systems:
AKT 1600 Sputtering Systems:
ALCATEL / MEIVAC / COMPTECH 2480 Sputter Deposition Systems:
ALCATEL PUMA 500 Sputtering Systems:
AMAT Endura® 5500 SIP EnCoRe™ System
ANATECH / TECHNICS HUMMER V
ANATECH / TECHNICS Hummer V-A Sputter Coater System
ANATECH / TECHNICS HUMMER X
ANATECH / TECHNICS RF-2C
ANATECH / TECHNICS: HUMMER 6.2
ANATECH / TECHNICS: HUMMER IV Sputter Deposition System PECVD
ANATECH / TECHNICS: HUMMER V
ANATECH / TECHNICS: Hummer V-A Sputter
ANATECH / TECHNICS: HUMMER VI
ANATECH / TECHNICS: HUMMER VI Sputter SystemsANATECH / TECHNICS: HUMMER VII
Anelva ILC-3935S Sputter
APPLIED MATERIALS CENTURA 300MM
APPLIED MATERIALS ENDURA 5500 SIP ENCORE
APPLIED MATERIALS HDP
APPLIED MATERIALS: Endura
Page 9 of 22Sputter Deposition System - Semiconductor Equipment Source
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APPLIED MATERIALS: Endura 5500
APPLIED MATERIALS: Endura 5500 Sputter Deposition
APPLIED MATERIALS: Endura 5500 Sputter Systems PECVD
APPLIED MATERIALS: Endura 5500P Sputtering Coating Equipment
APPLIED MATERIALS: Endura PECVD Semiconductor Equipment
APPLIED MATERIALS: Endura Sputter Deposition Systems
APPLIED MATERIALS: Endura Sputter Systems
AURION Custom Sputter SystemsAurion Sputter
AVIZA AL203 Process Module for Nano-ALD System
AVIZA NANO-ALD Brooks Automation Gemini Express
BALZERS: LLS 801
Bellopressor Technologies Four Stage Compressor
Blank off Flange for CVC 2800/611 8" target P/N 288536
Blank off Flange for CVC 601 8" target
Buy Perkin-Elmer Sputter
CANON / ANELVA: C-7100
CANON / ANELVA: ECR 300E
CANON / ANELVA: I-1012
CANON / ANELVA: I-1012 Sputter Coater
CANON / ANELVA: I-1060 SVII Plus 1
CANON / ANELVA: ILC 1012 MK II
CANON / ANELVA: ILC 1013
CANON / ANELVA: ILC 1015
CANON / ANELVA: ILC 1051
CANON / ANELVA: ILC 1060CANON / ANELVA: ILC 1060SV
CANON / ANELVA: ILC 3103
CANON / ANELVA: ILD 4100
CANON / ANELVA: MIG 430
CANON / ANELVA: SPF-540H
Page 10 of 22Sputter Deposition System - Semiconductor Equipment Source
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CANON / ANELVA: SPF-710H
CANON / ANELVA: SPF-730H
CHA 600 Evaporator
CHA Industries Mark 50 Source Evaporator
CHA INDUSTRIES SPUTTERING SYSTEM
CHA SE 600 EBEAM SYSTEM
CHA WEB/ROLL SPUTTER COATER
CHESSEN Sputter Systems
CPA V2000 Five Target RF and DC Magnetron In LineCPA V2000 Five Target RF and DC Magnetron Inline Sputtering System
CVC 601 Four Target RF Sputtering System
CVC 601 LL Load Lock with RF Etch
CVC 601 sputter systems
CVC parts
CVC SPUTTERING SYSTEM, ION ETCH AST-304
Denton Desktop Pro Sputtering System
Denton Explorer Thin Film Deposition Platform
Denton Integrity Precision Optics Coating Platform
DENTON KSE 2AA Denton
DENTON VACUUM DESK II
EDWARDS 306 FILAMENT EVAPORATOR
Edwards 306 Sputtering System
Edwards AUTO 306 Sputtering System
Edwards Auto 500
ELECTRON MICROSCOPY SCIENCES EMS575XD
Fulintec FSE-ANE-IBS - 6”/ 8” wafer UBM sputter for saleGENCOA PLANAR MAGNETRON CATHODE
INNO VAC KVTS-T0138
ION BEAM SPUTTER TARGET
KDF 654ix Wafer Processing System
KURT J. LESKER Vacuum System
Page 11 of 22Sputter Deposition System - Semiconductor Equipment Source
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L / VARIAN MB2-830
L91510 Perkin Elmer PE-2400 Sputtering System parts/repair w/Accessories
Leybold Balzers Z660, Used, Oerlikon Complete System
LEYBOLD HERAEUS A 1350 BM sputtering Systems
LEYBOLD HERAEUS: A 1350 BM sputter
LEYBOLD HERAEUS: Z650
LGA Thin Films
Magnetron Sputter Source - High Vacuum DC/RF MagnetronMagnetron Sputtering
Magnetron Sputtering Cathode Services
Manufacturer: MAGNETRON Sputter
Manufacturer: MAGNETRON Sputter coater
MEIVAC / ALCATEL / COMPTECH VQ 200-ISO-U-SM
Mfr of Sputter Systems
MILL LANE DUAL CHAMBER RESEARCH SPUTTERING SYSTEM
MILL LANE ENGINEERING REEL COATER 4123
MKS 250/B
MKS 252A
MRC / TEL Eclipse Mark II
MRC / TEL Eclipse Mark II Pre-Star
MRC / TEL Eclipse Mark IV
MRC / TEL Eclipse Star
MRC / TEL: Eclipse Mark II sputtering
MRC / TEL: Eclipse Star
MRC / TEL: Eclipse Star sputter coaterMRC 600 Series Sputtering Tool
MRC 603 II
MRC 603 Sputter System
MRC 603-III MRC INLINE SPUTTERING SYSTEM, CRYO PUMPED Used
MRC 643 Sputtering System (643)
Page 12 of 22Sputter Deposition System - Semiconductor Equipment Source
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MRC 902 sputter
MRC 903M MRC MRC 903M 3 TARGET SPUTTERING DEPOSITION SYSTEM
MRC 943 Down Sputter System
MRC 943 Down sputter system.
MRC IN-LINE SPUTTER ETCH SYSTEM MRC 902
MRC Planar
MRC THREE TARGET INLINE SPUTTERING SYSTEM MRC 903MNORDIKO: 2550 sputter deposition
NORDIKO: 8550
NORDIKO: 8550 sputtering deposition
NOVELLUS SYSTEM: CONCEPT 3 INOVA-xT sputter
NOVELLUS SYSTEM: CONCEPT 3 sputter
NOVELLUS: CONCEPT 2 sputter system
NOVELLUS: MB2 sputter deposition
NOVELLUS: MB2 used sputter coater
NOVELLUS: MBB 830 sputtering systems
NOVELLUS: XM 90 Used
NRC / Varian 3117 Thermal Evaporator
NRC / Varian 3125 E-Beam Evaporator
Nu Vacuum Systems Ultrahigh Vacuum Box Coater
OERLIKON / BALZERS Sprinter-9
OPAL: 3 Pro sputter despostion
PELCO: 3 sputter deposition
Perkin Elmer 2400 Sputter Tool: New Water Interlock Switch Details
Perkin Elmer 2400 Sputtering System with RFPerkin Elmer 2400 Sputtering System with RF Generator
Perkin Elmer 2400-SSA Physical Vapor Deposition
Perkin Elmer 4400 Sputtering System
Perkin Elmer 4410
PERKIN ELMER 4410 (WITH LOAD LOCK)
Perkin Elmer 4410 Sputtering System
Page 13 of 22Sputter Deposition System - Semiconductor Equipment Source
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Perkin Elmer 4450 Sputtering
PERKIN ELMER 5 kV
Perkin Elmer 6J Sputtering System
Perkin Elmer 8L Sputtering System
Perkin Elmer PE-2400 Sputtering System parts/repair w/Accessories
Perkin Elmer PVD System Available Parts
Perkin Elmer Sputter
Perkin-Elmer 2400-6J RF Sputter System, 3 targetPerkin-Elmer 2400-8L Sputtering Deposition Systems Service
Perkin-ELmer 2400-8SA Sputtering System Technical Service
Perkin-Elmer 2400-8SA Sputtering Systems
Perkin-elmer 4400 series batch product line
Perkin-Elmer 4400 Sputtering Deposition Systems Service
Perkin-Elmer 4410 Sputtering Deposition Systems Service
PERKIN-ELMER 4450 SPUTTERING DEPOSITION SYSTEM
Perkin-Elmer 4450 Sputtering Deposition Systems Service
Perkin-Elmer 4480 Sputtering Deposition Systems Service
PERKIN-ELMER PE 2400-8L Sputtering System Spare Parts
Perkin-Elmer PE 2400-8L Sputtering Systems
Perkin-Elmer PE 4400 Sputtering Systems
Perkin-Elmer PE 4410 Sputtering Systems
Perkin-Elmer PE 4450 Sputtering Systems
Perkin-Elmer PE 4480 Sputtering Systems
PERKIN-ELMER PE2400-8SA Sputtering System Spare Parts
PERKIN-ELMER PE4400 Sputtering System Spare Parts
PERKIN-ELMER PE4410 Sputtering System Spare PartsPERKIN-ELMER PE4450 Sputtering System Spare Parts
PERKIN-ELMER PE4480 Sputtering System Spare Parts
PERKIN-ELMER SPUTTERING DEPOSITION SYSTEM For Sale
Perkin-Elmer Sputtering Deposition Systems
Page 14 of 22Sputter Deposition System - Semiconductor Equipment Source
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PERKIN-ELMER SPUTTERING SYSTEM START-UP PROCEDURE
Physical Vapor Deposition (PVD) Suppliers
PLASMA SCIENCES: Arc
PLASMA SCIENCES: HRC 150
PLASMA SCIENCES: HRC 200 sputter
Plasma-Therm Versalock™ Cluster Based Platform
PLATECH: 3
Pre-Owned Sputtering SystemsPROCESS INTEGRATION: 944 used
QUORUM TECH / BIO-RAD / POLARON: E-5100
QUORUM TECH / BIO-RAD / POLARON: E-5100 sputter
QUORUM TECH / BIO-RAD / POLARON: E-5150
QUORUM TECH / BIO-RAD / POLARON: E-9200
QUORUM TECH / BIO-RAD / POLARON: ISI PS-2
SANYU: SC-701C sputter
SEMICORE: SC 1500 sputter
SFI Endeavor 8600 Cluster Sputtering
SHARON VACUUM SPUTTERING SYSTEM
SHIBAURA BM-1400PC
SHIBAURA: CFS-12P-100H
SHOWA SHINKU SBC-08C
SHOWA SHINKU SBC-08CX
SHOWA SHINKU SBC-10DXC
SHOWA SHINKU SPH-2016
SHRADER sputter deposition used
SIGMA INSTRUMENTS SID-142SIGMA Sputtering System
SLOAN SL 1800-S
SONOTEK Ultrasonicator Flexicoat FC
SPI 11425 SPI 11430 sputter
SPI 11425/11430 Tabletop Sputter Coater for SEM
Page 15 of 22Sputter Deposition System - Semiconductor Equipment Source
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SPI-Module Sputter/Carbon Coater System
Sputter Deposition Equipment Accessories
Sputter Deposition Key Words-A
Sputter Deposition Key Words-B ,C
Sputter Deposition Key Words-D,E,F,G,H
Sputter Deposition Key Words-I,J,K,L,M,N,O
Sputter Deposition Key Words-P,Q,R
Sputter Deposition Key Words-S,T,U,V,W,X,Y,Z
sputter Varian 3180 3280 3190 3290 3290 STQ thin film sputteringsputter Varian 3180 3280 3190 3290 thin film sputtering
SPUTTERED FILMS INC / SFI Endeavor 8600
SPUTTERED FILMS INC / SFI Shamrock 6
Sputtering and Evaporation Service
Sputtering Deposit System Spare Parts
Sputtering system about by Second Source, Inc.
Sputtering system reliability ..... for the last 25 years
Sputtering System, Perkin Elmer-4400
Sputtering Systems Emitech / Emcore K650
Sputtering Systems Emitech / Emcore K950 sputter
Sputtering Systems Comtech
Sputtering Systems Cvc 2800
Sputtering Systems Cvc 2800LL
Sputtering Systems Cvc 601
Sputtering Systems Cvc 601LL
Sputtering Systems Cvc AST 400
Sputtering Systems Cvc AST 601
Sputtering Systems Cvc ICS 660Sputtering Systems Cvc PSE 403
Sputtering Systems Denton DESK I
Sputtering Systems Denton DESK I Sputter
Sputtering Systems Denton DESK II
Sputtering Systems Denton DESK II coater
Page 16 of 22Sputter Deposition System - Semiconductor Equipment Source
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Sputtering Systems Denton DESKTOP I
Sputtering Systems Denton DESKTOP II
Sputtering Systems Edwards 306 sputter
Sputtering Systems Edwards E09602000
Sputtering Systems Edwards E09602000 sputter
Sputtering Systems Emscope SC-650 sputter
Sputtering Systems Emscope SM-300 sputter
Sputtering Systems Enercon LM3214-09
Sputtering Systems Evatec Process System Radiance SputterSputtering Systems Fulintec FSE FU-16PEB
Sputtering Systems Fulintec FSE-CLS-UBM-200
Sputtering Systems Fulintec FSE-UBM-200
Sputtering Systems Fulintec UBM Sputter
Sputtering Systems Glow Research Sputterglow
Sputtering Systems Indel 3 RF GUN
Sputtering Systems Inficon XMS-1
Sputtering Systems Inficon XMS-3
Sputtering Systems Innotec DS 24
Sputtering Systems Innotec Sputter
Sputtering Systems Innotec VS 24C
Sputtering Systems VARIAN 3190
Sputtering Systems VARIAN 3280
Sputtering Systems Various sputtering target
Sputtering Systems, Cpa / Kurdex
Sputtering Systems: AMCI GT777
Sputtering Systems: AMCI GT7777
Sputtering Systems: AURIONSputtering Systems: BALZERS 450
Sputtering Systems: BALZERS BA 810
Sputtering Systems: BALZERS LLS 900
Sputtering Systems: BALZERS SCD 040
Sputtering Systems: BOC EDWARDS 306
Page 17 of 22Sputter Deposition System - Semiconductor Equipment Source
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Sputtering Systems: BOC EDWARDS AR
Sputtering Systems: CANON / ANELVA SBH 2306DE
Sputtering Systems: CPA / KURDEX 9900
Sputtering Systems: CPA V2000
Sputtering Systems: ISI PS 2 Sputter Coater
Sputtering Systems: JM IOTA
Sputtering Systems: KDF 945
Sputtering Systems: KRAUSS MAFFEI Triathlon
Sputtering Systems: KURT J. LESKER Torus 10lSputtering Systems: LEYBOLD / BALZERS ZH 620
Sputtering Systems: LEYBOLD / BPS Z 600
Sputtering Systems: LEYBOLD HERAEUS 240
Sputtering Systems: LEYBOLD HERAEUS A550 VZK
Sputtering Systems: LEYBOLD HERAEUS APS 1104
Sputtering Systems: LEYBOLD HERAEUS LH 550
Sputtering Systems: LEYBOLD HERAEUS V1500 V-7
Sputtering Systems: LEYBOLD HERAEUS Z400
Sputtering Systems: LEYBOLD HERAEUS Z550 used
Sputtering Systems: LEYBOLD HERAEUS Z550MS
Sputtering Systems: LEYBOLD HERAEUS Z700
Sputtering Systems: LEYBOLD HERAEUS ZV 1200 used
Sputtering Systems: LEYBOLD HERAEUS ZV 6000
Sputtering Systems: LEYBOLD Univex 450C
Sputtering Systems: LEYBOLD Univex 500
Sputtering Systems: LK TECHNOLOGIES NGI 3000
Sputtering Systems: MAGNETRON Sputtering
Sputtering Systems: MAT-VAC MVT-60X/3TSputtering Systems: MEIVAC 2252
Sputtering Systems: MRC / KDF 943
Sputtering Systems: MRC / TEL Eclipse Mark II / UHV
Sputtering Systems: MRC 600 Series
Sputtering Systems: MRC 603
Page 18 of 22Sputter Deposition System - Semiconductor Equipment Source
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Sputtering Systems: MRC 643
Sputtering Systems: MRC 8667
Sputtering Systems: MRC 902A
Sputtering Systems: MRC 902M
Sputtering Systems: MRC 903
Sputtering Systems: MRC 903A
Sputtering Systems: MRC 903M
Sputtering Systems: MRC 943
Sputtering Systems: MRC SS-8633Sputtering Systems: NORDIKO 2050
Sputtering Systems: PERKIN ELMER 2400
Sputtering Systems: PERKIN ELMER 2400 6J
Sputtering Systems: PERKIN ELMER 2400 8J
Sputtering Systems: PERKIN ELMER 2400 Series
Sputtering Systems: PERKIN ELMER 2400-8L
Sputtering Systems: PERKIN ELMER 2400-SSA
Sputtering Systems: PERKIN ELMER 4400
Sputtering Systems: PERKIN ELMER 4410
Sputtering Systems: PERKIN ELMER 4450
Sputtertech Perkin-Elmer, TFE, and STI sputter systems
SST 2200 Vacuum Furnace
Suss Micro Tec 2004 Delta 20T/150 VPO Manual Coat
Sustaining Engineering - sustainingengineering
Tabletop Sputter Coater for SEM Samples
TED PELLA INC SC650
TEL / VARIAN MB2 sputter
TEL / VARIAN MB2-730TEL / VARIAN MB2-730 coater
TEL / VARIAN MB2-730 HT
TEL / VARIAN MB2-730 HT-HT
TEL / VARIAN MB2-730W
TEMESCAL BJD-1800
Page 19 of 22Sputter Deposition System - Semiconductor Equipment Source
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Temescal BJD-1800 E-Beam Sputter System
Temescal FC-3200
Temescal FCE 3200 Six-Pocket E-Beam Evaporator
tescal.com
TITAN SpraySafe
TORR CRC-150
TORR CRC-150 sputter
Torr International Model CRC 150 Sputtering System
TOUSIMIS Samsputter IIATOUSIMIS Samsputter IIA sputter coater
TRIKON ELECTROTECH 6310
TRIKON / ELECTROTECH 308
TRIKON / ELECTROTECH MS 6200
TRIKON / ELECTROTECH MS 6210
TRIKON / ELECTROTECH MS 6210 sputter
TRIKON / ELECTROTECH ND 6200
ULVAC Ceraus thin film sputter
ULVAC Ceraus Z-1000 thin film coater
ULVAC Ceraus Zi-1000 thin film sputtering
ULVAC Ceraus Zi-1000N sputtering thin film
ULVAC Ceraus ZX-1000 sputtering thin film coater
ULVAC Ceraus ZX-1000 thin film deposition
Ulvac Entron W-200T6 PVD System
ULVAC MCH-4500 thin film deposition
ULVAC MLX-3000N thin film sputtering
UNAXIS / BALZERS LLS 502
Used Anatech Hummer VI SEM Sputter CoaterUsed Cryco Automated Dual Stack loader for Mini-brute
Used CVC 601 Physical Vapor Deposition system
Used ESC ELAS Large Area Sputtering System
Used MRC 643 Horizontal PVD Sputtering System
Used or Refurbished Perkin Elmer 2400 Series Sputtering Systems
Page 20 of 22Sputter Deposition System - Semiconductor Equipment Source
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Used Perkin Elmer 2400-SSA Physical Vapor Deposition
Used Perkin-Elmer Sputtering Deposition System
Used Polaron Instruments Sputtering System
Used Sputter Deposition Semiconductor Equipment
Used Sputtering Systems
Used Technics Hummer VI Sputtering System
Used Vacuum Bell Jars
VAGATHERM 550 thin film sputtering deposition
VARIAN NOVELLUS M 2000/8VARIAN NOVELLUS M2i M2000 sputtering
VARIAN / NOVELLUS M2000 thin film sputtering
VARIAN / NOVELLUS M2i sputtering thin film
Varian 3118 E-Beam Evaporator
VARIAN 3180 sputtering deposition thin film
Varian 3180 Sputtering System
Varian 3190 Metal Sputtering System, 5"
VARIAN 3190 SPUTTER SYSTEM
Varian 3290 Sputtering System
VARIAN 3290STQ sputtering deposition thin film
VARIAN HIGH PERFORMANCE VACUUM COATER SYSTEM 3118
VARIAN NOVELLUS M2i M2000 sputtering deposition thin film used semiconductor equipment
VARIAN NOVELLUS M2i / M2000
VARIAN Varian 7 CFM D/D
VARIAN XM 90 thin film deposition sputtering
VEECO / CVC CX 6 thin filmVeeco 400 E-Beam System
Veeco 775 Veeco
VEECO EBEAM Veeco
VERGASON TECHNOLOGY RAPID CYCLE METALIZING SYSTEM Press-Side 2000
VST | Thin Film Deposition | Equipment Upgrade | Perkin-Elmer
Page 21 of 22Sputter Deposition System - Semiconductor Equipment Source
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WELCH 1397 Welch
XYTEC COATINGS (a BOC EDWARDS design) ML-8
Wafer Handling & RoboticsBrooks Automation Wafer Aligner USED, 4 inch to 8 inch
Wafer ProbesELECTROGLAS EG 1034 wafer probe or prober
ELECTROGLAS EG 2001X wafer probe or prober
ELECTROGLAS EG 2010 wafer probe or proberELECTROGLAS EG 2080 wafer probe or prober
ELECTROGLAS EG 4085X wafer probe or prober
ELECTROGLAS EG 4085X wafer prober for parts
Signatone Probe station S-250
Wet ProcessingSemitool SDC-400 photo mask etch spinner
SH-801 Spin Rinse Dryer
SV-702 Spin Rinse Dryer
Wire & Die BondingKTC Wire Bond Test machine Model: BT-30 W/TD
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Page 22 of 22Sputter Deposition System - Semiconductor Equipment Source
12/14/2012https://sites.google.com/site/semiconductorequipmentsource/sputter-deposition-system