©2019 by System Plus Consulting | UnitedSiC Cascode JFET 650V Family | Sample 1
+33 2 40 18 09 16 [email protected] www.systemplus.fr
UnitedSiC Cascode JFET 650V FamilyGen3 Silicon Carbide JFET co-packaged with Silicon MOSFET
22 Bd Benoni Goullin44200 NANTES - FRANCE
SP19467 - Power Semiconductor report by Amine ALLOUCHE Laboratory Analysis by Guillaume CHEVALIER
August 2019 – SAMPLE
REVERSE COSTING® – STRUCTURAL, PROCESS & COST REPORT
©2019 by System Plus Consulting | UnitedSiC Cascode JFET 650V Family | Sample 2
Table of Contents
Introduction 4
o Executive Summary
o Reverse Costing Methodology & Glossary
o SiC Power Device Market
Company Profile & Supply Chain 10
o UnitedSiC Portfolio & Technology
o Supply Chain
Physical Analysis 18
o Summary of the Physical Analysis
o UF3C065030K3S
Package Analysis
• Package Opening
• Package Cross-Section
SiC JFET Die
• JFET Die View & Dimensions
• JFET Die Process
• JFET Die Cross-Section
Si MOSFET Die
• MOSFET Die View & Dimensions
• MOSFET Die Process
• MOSFET Die Cross-Section
o UF3C065030T3S
o UJ3C065030K3S
o UJ3C065080K3S
o UJ3C065080B3
Manufacturing Process 109
o JFET Die Front-End Process
o JFET Die Fabrication Unit
o MOSFET Die Front-End Process
o MOSFET Die Fabrication Unit
o Final Test & Packaging Fabrication unit
Cost Analysis 121
o Synthesis of the cost analysis
o Yields Explanation & Hypotheses
o UF3C065030K3S
o JFET die
JFET Front-End Cost
JFET Die Probe Test, Thinning & Dicing
JFET Wafer & Die Cost
o MOSFET die
MOSFET Front-End Cost
MOSFET Die Probe Test, Thinning & Dicing
MOSFET Wafer & Die Cost
o Complete Device
Packaging Cost
Final Test Cost
Component Cost
o UF3C065030T3S
o UJ3C065030K3S
o UJ3C065080K3S
o UJ3C065080B3
Selling Price 174
o Estimation of selling price
Comparison 181
o Comparison between the different devices
o Comparison with SiC MOSFET with close electrical performances
Feedbacks 194
Company services 196
©2019 by System Plus Consulting | UnitedSiC Cascode JFET 650V Family | Sample 3
Overview / Introductiono Executive Summaryo Reverse Costing
Methodologyo Glossaryo Market
Company Profile & Supply Chain
Physical Analysis
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
Comparison
Related Reports
About System Plus
Executive Summary
The silicon carbide (SiC) power market is taking off and its value will approach US$2 billion by 2024. The reason is that SiC-based device penetration is expanding in different applications. Taking advantage of this growing market, UnitedSiC,, announced a strategic investment and long-term supply agreement with Analog Devices, Inc. (ADI) in March 2019.
UnitedSiC offers a large portfolio of SiC devices, mainly with its unique cascode co-pack configuration.
In this design, a Silicon MOSFET is combined with a SiC JFET in one package.
UnitedSiC offers two types of cascodes: UJ3C for “ease of use” when upgrading from a silicon device and UF3C for high-performance designs with faster switching Moreover it proposes the latest solution in die assembling; the silver sintering
In this report, System Plus Consulting presents a deep technology analysis of the 650V cascode family: five components are analysed across the UJ3C and UF3C series, assembled in two different types of packages; whith and without silver sintering
Detailed optical pictures, scanning electron microscope cross-section, and energy-dispersive X-ray analyses are included to reveal UnitedSiC’s technical choices at the microscopic level of the die designs.
This report provides a detailed manufacturing cost analysis of the JFET, the MOSFET and the package as well as the estimated selling price of each one of the five cascode components.
Finally, this report compares the technological, physical parameters as well as the production cost and price of the Cascode JFET family’s devices.
A technology and cost comparison with a SiC MOSFET, with similar electrical performance, is also included.
©2019 by System Plus Consulting | UnitedSiC Cascode JFET 650V Family | Sample 4
Overview / Introduction
Company Profile & Supply Chain
Physical Analysis o Synthesiso UF3C065030K3So UJ3C065030K3So UJ3C065080K3So UJ3C065080B3
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
Comparison
Related Reports
About System Plus
Summary of the Physical Analysis
UJ3C065080K3S (80mΩ - 31A):
o xx dimensions: xx mm²
o xx dimensions: xx mm²
UJ3C065030K3S (30mΩ - 85A):
o xx dimensions: xx mm²
o xx dimensions: xx mm²
TO-247
TO-247
UF3C065030K3S (30mΩ - 85A):
o xx dimensions: xx mm²
o xx dimensions: xx mm²
xx
xx
xxx TO-247
xx
UJ3C065080B3 (80mΩ - 25A):
o xx dimensions: xx mm²
o xx dimensions: xx mm²
D²PAK
xx
xx
xxx
xx
xx
xx
xxx
xxxx
xx
xxx
xx
©2019 by System Plus Consulting | UnitedSiC Cascode JFET 650V Family | Sample 5
Overview / Introduction
Company Profile & Supply Chain
Physical Analysis o Synthesiso UF3C065030K3S
Package xx Die xx Die
o UJ3C065030K3So UJ3C065080K3So UJ3C065080B3
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
Comparison
Related Reports
About System Plus
Gate Wire Bonding:
o xx Al wire.
o Diameter: xx µm
o Medium length: xx mm
Source Wire Bonding:
o xx Al wire.
o Diameter: xx µm
o Medium length: xx mm
Package Opening
Package Opening – Tilted View©2019 by System Plus Consulting
Package Opening – Optical View©2019 by System Plus Consulting
xxxxxx
xxx
xxx
xxx
xxx
xxx
xx
xx
xx
xx xx xx
xxx
©2019 by System Plus Consulting | UnitedSiC Cascode JFET 650V Family | Sample 6
Overview / Introduction
Company Profile & Supply Chain
Physical Analysis o Synthesiso UF3C065030K3S
Package xx Die xx Die
o UJ3C065030K3So UJ3C065080K3So UJ3C065080B3
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
Comparison
Related Reports
About System Plus
Package Cross-Section
Package Cross-Section – Optical View©2019 by System Plus Consulting
xx
DBCxx
xx
xx
o xx is used as substrate for xx.
o Xx is soldered with xx on xx leadframe.
o Layers thickness:
xx : xx µm
xx Top xx : xx µm
xx Bottom xx : xx µm
(x) xx layers : xx µm
o xx solder xx quantity : xx mm³
xxxx solder section xx mm²
xx
xx
xx
Copper leadframe
xx
xx layers
xx
xx
xx µm
xx
xxµm
©2019 by System Plus Consulting | UnitedSiC Cascode JFET 650V Family | Sample 7
Overview / Introduction
Company Profile & Supply Chain
Physical Analysis o Synthesiso UF3C065030K3S
Package xx Die xx Die
o UJ3C065030K3So UJ3C065080K3So UJ3C065080B3
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
Comparison
Related Reports
About System Plus
JFET Die Process – Pitch & Guard Ring
xxx
Die Process after delayering – SEM View©2019 by System Plus Consulting
o Pitch: xx µm
xx µm
Die Process after delayering – SEM View©2019 by System Plus Consulting
Guard ring xx µm
©2019 by System Plus Consulting | UnitedSiC Cascode JFET 650V Family | Sample 8
Overview / Introduction
Company Profile & Supply Chain
Physical Analysis o Synthesiso UF3C065030K3S
Package xx Die xx Die
o UJ3C065030K3So UJ3C065080K3So UJ3C065080B3
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
Comparison
Related Reports
About System Plus
JFET Die Cross-Section – Source area
xx Cross-Section after oxide revelation – SEM View©2019 by System Plus Consulting
xx Cross-Section before oxide revelation – SEM View©2019 by System Plus Consulting
Cross-section axis
xx
Alxx
xxxxx
xx
xx
xx
SiC substrate
xx
xx xx
xx
xx
xx
©2019 by System Plus Consulting | UnitedSiC Cascode JFET 650V Family | Sample 9
Overview / Introduction
Company Profile & Supply Chain
Physical Analysis o Synthesiso UF3C065030K3S
Package xx Die xx Die
o UJ3C065030K3So UJ3C065080K3So UJ3C065080B3
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
Comparison
Related Reports
About System Plus
JFET Die Cross-Section vs Delayering
Cross-section axis
xx µm
xx µmxx µm
xx Delayering top views and Cross-Section – SEM View©2019 by System Plus Consulting
©2019 by System Plus Consulting | UnitedSiC Cascode JFET 650V Family | Sample 10
Overview / Introduction
Company Profile & Supply Chain
Physical Analysis o Synthesiso UF3C065030K3S
Package xx Die xx Die
o UJ3C065030K3So UJ3C065080K3So UJ3C065080B3
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
Comparison
Related Reports
About System Plus
JFET Die Cross-Section – Backside EDX Analysis
xx
xx solder
xx Xx Substrate
xx
xxxx
o xxlayers are detected on the xx die backside.
o Layers thickness:
xx : xx µm
xx : xx µm
xxxx
EDX Anlysis©2019 by System Plus Consulting
©2019 by System Plus Consulting | UnitedSiC Cascode JFET 650V Family | Sample 11
Overview / Introduction
Company Profile & Supply Chain
Physical Analysis o Synthesiso UF3C065030K3S
Package xx Die xx Die
o UJ3C065030K3So UJ3C065080K3So UJ3C065080B3
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
Comparison
Related Reports
About System Plus
MOSFET Die Process
Die Process after delayering – SEM View©2019 by System Plus Consulting
Die Process after delayering – SEM View©2019 by System Plus Consulting
xx µm
o Pitch: xx µm
xx µm
©2019 by System Plus Consulting | UnitedSiC Cascode JFET 650V Family | Sample 12
Overview / Introduction
Company Profile & Supply Chain
Physical Analysis o Synthesiso UF3C065030K3S
Package xx Die xx Die
o UJ3C065030K3So UJ3C065080K3So UJ3C065080B3
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
Comparison
Related Reports
About System Plus
xx
xx
xxx
xx
Die Cross-Section
Package Cross-Section – Optical View©2019 by System Plus Consulting
Package Opening – Optical View©2019 by System Plus ConsultingCross-section axis
Si xx
xx
xx
xx
xx xx
xx
xx
xx
xx
©2019 by System Plus Consulting | UnitedSiC Cascode JFET 650V Family | Sample 13
Overview / Introduction
Company Profile & Supply Chain
Physical Analysis o Synthesiso UF3C065030K3S
Package xx Die xx Die
o UJ3C065030K3So UJ3C065080K3So UJ3C065080B3
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
Comparison
Related Reports
About System Plus
MOSFET Die Cross-Section
xx
xx
xx
xx
xx
xx depth: xx µmxx depth: xx µm
xx
xx
xx Cross-Section after oxide revelation – SEM View©2019 by System Plus Consulting
©2019 by System Plus Consulting | UnitedSiC Cascode JFET 650V Family | Sample 14
Overview / Introduction
Company Profile & Supply Chain
Physical Analysis o Synthesiso UF3C065030K3So UJ3C065030K3So UJ3C065080K3S
Package xx Die xx Die
o UJ3C065080B3
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
Comparison
Related Reports
About System Plus
xx Die Dimensionsxx mm
xx m
m
xx Die – Optical View©2019 by System Plus Consulting
o Die dimensions: xx mm² (xx x xx).
o No marking on the die.
©2019 by System Plus Consulting | UnitedSiC Cascode JFET 650V Family | Sample 15
Overview / Introduction
Company Profile & Supply Chain
Physical Analysis
Manufacturing Process Flowo Process flowo Front-End Fab Unito Back-End Fab Unit
Cost Analysis
Selling Price Analysis
Comparison
Related Reports
About System Plus
xx Process Flow (1/4)
Epitaxy
• N- Epitaxy
Doping Implantation
• xx deposition
• Pattern xx
• P well implantation
• N+ implantation
xxx• xxx deposition and pattern
SiC Substrate
N- Drift Region Epitaxy
SiC Substrate
SiC Substrate
00
©2019 by System Plus Consulting | UnitedSiC Cascode JFET 650V Family | Sample 16
Overview / Introduction
Company Profile & Supply Chain
Physical Analysis
Manufacturing Process Flowo Process flowo Front-End Fab Unito Back-End Fab Unit
Cost Analysis
Selling Price Analysis
Comparison
Related Reports
About System Plus
Description of the Wafer Fabrication Unit – xx
In our calculation, we simulate a production unit using xxx wafers.
xx wafer fab unit:
Name: xxx
Wafer diameter: xxx
Clean room class: xx
Capacity of xx line: xx wafers / month
Year of start: xx
Products: xx
Location: xx
©2019 by System Plus Consulting | UnitedSiC Cascode JFET 650V Family | Sample 17
Overview / Introduction
Company Profile & Supply Chain
Physical Analysis
Manufacturing Process Flowo Process flowo Front-End Fab Unito Back-End Fab Unit
Cost Analysis
Selling Price Analysis
Comparison
Related Reports
About System Plus
xx Process Flow
©2019 by System Plus Consulting | UnitedSiC Cascode JFET 650V Family | Sample 18
Overview / Introduction
Company Profile & Supply Chain
Physical Analysis
Manufacturing Process Flow
Cost Analysiso Yields Explanationo UF3C065030K3So UJ3C065030K3So UJ3C065080K3So UJ3C065080B3
Selling Price Analysis
Comparison
Related Reports
About System Plus
xx Front-End Cost
The front-end cost ranges from $xx to $xx according toyield variations.
The main part of the wafer cost is due to the xx (xx%).The xx steps represent a large part of consumable andequipment cost (see details in the following pages).
©2019 by System Plus Consulting | UnitedSiC Cascode JFET 650V Family | Sample 19
Overview / Introduction
Company Profile & Supply Chain
Physical Analysis
Manufacturing Process Flow
Cost Analysiso Yields Explanationo UF3C065030K3So UJ3C065030K3So UJ3C065080K3So UJ3C065080B3
Selling Price Analysis
Comparison
Related Reports
About System Plus
xx Wafer Cost per process steps
©2019 by System Plus Consulting | UnitedSiC Cascode JFET 650V Family | Sample 20
Overview / Introduction
Company Profile & Supply Chain
Physical Analysis
Manufacturing Process Flow
Cost Analysiso Yields Explanationo UF3C065030K3So UJ3C065030K3So UJ3C065080K3So UJ3C065080B3
Selling Price Analysis
Comparison
Related Reports
About System Plus
xx Die Cost
The xx die manufacturing cost ranges from $xx to $xx according to yield variations. Withxx margin, the die cost ranges from $xx to $xx.
The Front-End manufacturing represents xx% of the component cost, medium yield.
Probe test, dicing and scrap account for xx% of the component cost.
©2019 by System Plus Consulting | UnitedSiC Cascode JFET 650V Family | Sample 21
Overview / Introduction
Company Profile & Supply Chain
Physical Analysis
Manufacturing Process Flow
Cost Analysiso Yields Explanationo UF3C065030K3So UJ3C065030K3So UJ3C065080K3So UJ3C065080B3
Selling Price Analysis
Comparison
Related Reports
About System Plus
Cost Breakdown Cost Breakdown Cost Breakdown
JFET Die Cost $2.490 80.8% $2.160 79.3% $1.889 77.7%
MOSFET Die Cost $0.038 1.2% $0.036 1.3% $0.035 1.4%
Alumina DBC cost $0.050 1.6% $0.050 1.8% $0.050 2.1%
Packaging cost $0.395 12.8% $0.392 14.4% $0.389 16.0%
Final test & Calibration cost $0.032 1.0% $0.032 1.2% $0.032 1.3%
Yield losses cost $0.077 2.5% $0.054 2.0% $0.036 1.5%
Component Cost $3.082 100% $2.724 100% $2.431 100%
Low Yield Medium Yield High Yield
UF3C065030K3S | (30 mΩ) - (TO247)
Component Cost
The component cost ranges from $xx to $xx according to yield variations.
The JFET die manufacturing represents xx% of the component cost.
The MOSFET die manufacturing represents xx% of the component cost.
The xx represents xx% of the component cost.
The packaging represents xx% of the component cost.
Final test and yield losses account for xx% of the component cost.
©2019 by System Plus Consulting | UnitedSiC Cascode JFET 650V Family | Sample 22
Overview / Introduction
Company Profile & Supply Chain
Physical Analysis
Manufacturing Process Flow
Cost Analysiso Yields Explanationo UF3C065030K3So UJ3C065030K3So UJ3C065080K3So UJ3C065080B3
Selling Price Analysis
Comparison
Related Reports
About System Plus
Packaging Cost – xx
©2019 by System Plus Consulting | UnitedSiC Cascode JFET 650V Family | Sample 23
Overview / Introduction
Company Profile & Supply Chain
Physical Analysis
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
Comparison
Related Reports
About System Plus
Estimated Manufacturer Price
o The component manufacturing cost ranges from $xx to $xx for the cheapest to $xx to $xx for the most expensive, according toyield variations.
o With a gross margin estimated to xx%, the component selling price ranges from $xx to $xx for the cheapest to $xx to $xx for themost expensive, according to yield variations.
©2019 by System Plus Consulting | UnitedSiC Cascode JFET 650V Family | Sample 24
Overview / Introduction
Company Profile & SupplyChain
Physical Analysis
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
ComparisonTechnology & CostComparison:o Cascode JFET Familyo SiC MOSFET vs SiC JFET
Feedbacks
About System Plus
Cascode Family – Cost Comparison
©2019 by System Plus Consulting | UnitedSiC Cascode JFET 650V Family | Sample 25
Overview / Introduction
Company Profile & SupplyChain
Physical Analysis
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
ComparisonTechnology & CostComparison:o Cascode JFET Familyo SiC MOSFET vs SiC JFET
Feedbacks
About System Plus
Cascode Family – Cost & Price Comparison
©2019 by System Plus Consulting | UnitedSiC Cascode JFET 650V Family | Sample 26
Overview / Introduction
Company Profile & SupplyChain
Physical Analysis
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
ComparisonTechnology & CostComparison:o Cascode JFET Familyo SiC MOSFET vs SiC JFET
Feedbacks
About System Plus
Cascode Family – Physical and Technological Comparison
Parameter UF3C065030K3S UJ3C065030K3S UJ3C065080K3S UJ3C065080B3
Package type TO-247 TO-247 TO-247 D²PAK
xx layer on xx xx xx xx xx
Resistance xx xx xx xx
xx Die Size xx mm² xx mm² xx mm² xx mm²
Wire bonding xx xx xx xx
Series UF3C UJ3C UJ3C UJ3C
Xx solder xx xx xx xx
©2019 by System Plus Consulting | UnitedSiC Cascode JFET 650V Family | Sample 27
Overview / Introduction
Company Profile & SupplyChain
Physical Analysis
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
ComparisonTechnology & CostComparison:o Cascode JFET Familyo SiC MOSFET vs SiC JFET
Feedbacks
About System Plus
650V – SiC MOSFET vs SiC Cascode JFET
Manufacturer Year Device CodeSiC
TechnologyPackaging
Vds (V)
Id (A) @
25°C
Rdson(mOh
m)
Qg(nC)
SiC Die Size
(mm²)
Epitaxy (µm)
Pitch (µm)
Wafer Thick (µm)
CurrentDensity
(A/mm²)
FOM (Qg*
Rsdon)
FOM (Rsdon*
Area)
Wafer Cost
SiC Die Cost
Component Cost
$/A cost
Rohm 2013 xxx xx xx 650 xx xx xx xx xx xx xx xx xx xx xx xx xx xxUnitedSiC 2017 UJ3C065080K3S xx xx 650 xx xx xx xx xx xx xx xx xx xx xx xx xx xx
Package Opening – Rohm SiC MOSFET xxx
©2019 by System Plus Consulting
xxxx
xx
Package Opening – UnitedSiC Cascode JFET UJ3C065080K3S
©2019 by System Plus Consulting
• The co-packaged xx in cascode configuration from UnitedSiC costs xx than the SiC xx from Rohm. Although the 2 componentshave very close xx with the xx, the cascode component seems to have xx since it uses xx than xx from Rohm for a same xx.
• Besides this xx on the xx cost, the xx cost of the cascode (including xx cost) is xx..
• ….
©2019 by System Plus Consulting | UnitedSiC Cascode JFET 650V Family | Sample 28
Overview / Introduction
Company Profile & SupplyChain
Physical Analysis
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
ComparisonTechnology & CostComparison:o Cascode JFET Familyo SiC MOSFET vs SiC JFET
Feedbacks
About System Plus
650V – SiC MOSFET vs SiC Cascode JFET
MOSFET Die SEM Cross-Section – Rohm SiC MOSFET xxx
©2019 by System Plus Consulting
JFET Die SEM Cross-Section – UnitedSiC Cascode JFET UJ3C065080K3S
©2019 by System Plus Consulting
©2019 by System Plus Consulting | UnitedSiC Cascode JFET 650V Family | Sample 29
Overview / Introduction
Company Profile & Supply Chain
Physical Analysis
Cost Analysis
Selling Price Analysis
Comparison
Related Reports
About System Plus
Related Reports
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©2019 by System Plus Consulting | UnitedSiC Cascode JFET 650V Family | Sample 30
COMPANYSERVICES
©2019 by System Plus Consulting | UnitedSiC Cascode JFET 650V Family | Sample 31
Overview / Introduction
Company Profile & Supply Chain
Physical Analysis
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
Comparison
Related Reports
About System Pluso Company serviceso Contact
Business Models Fields of Expertise
Custom Analyses(>130 analyses per year)
Reports(>60 reports per year)
Costing Tools
Trainings
©2019 by System Plus Consulting | UnitedSiC Cascode JFET 650V Family | Sample 32
Overview / Introduction
Company Profile & Supply Chain
Physical Analysis
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
Comparison
Related Reports
About System Pluso Company serviceso Contact
Contact
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total invoice amount when placing his order.
5. OWNERSHIPSystem Plus Consulting remains sole owner of the delivered services until total payment of the invoice.
6.DELIVERIESThe delivery schedule on the purchase order is given for information only and cannot be strictly guaranteed.Consequently any reasonable delay in the delivery of services will not allow the buyer to claim for damages or tocancel the order.
7.ENTRUSTED GOODS SHIPMENTThe transport costs and risks are fully born by the Buyer. Should the customer wish to ensure the goods against lost ordamage on the base of their real value, he must imperatively point it out to System Plus Consulting when theshipment takes place. Without any specific requirement, insurance terms for the return of goods will be the carriercurrent ones (reimbursement based on good weight instead of the real value).
8.FORCE MAJEURESystem Plus Consulting responsibility will not be involved in non execution or late delivery of one of its dutiesdescribed in the current terms and conditions if these are the result of a force majeure case. Therefore, the forcemajeure includes all external event unpredictable and irresistible as defined by the article 1148 of the French CodeCivil?
9.CONFIDENTIALITYAs a rule, all information handed by customers to system Plus Consulting are considered as strictly confidential.A non-disclosure agreement can be signed on demand.
10.RESPONSABILITY LIMITATIONThe Buyer is responsible for the use and interpretations he makes of the reports delivered by System Plus Consulting.Consequently, System Plus Consulting responsibility can in no case be called into question for any direct or indirectdamage, financial or otherwise, that may result from the use of the results of our analysis or results obtained usingone of our costing tools.
11.APPLICABLE LAWAny dispute that may arise about the interpretation or execution of the current terms and conditions shall be resolvedapplying the French law.It the dispute cannot be settled out-of-court, the competent Court will be the Tribunal de Commerce de Nantes.
TERMS AND CONDITIONS OF SALES