Download - Verios™ XHR SEM · Verios™ XHR SEM Discover the world of Extreme High Resolution SEM The Verios is the second generation of FEI’s leading XHR SEM family, offering sub-nanometer

Product Data

Key benefits• Best-in-classElstar™SchottkyMonochromated(UC)FESEMtechnologyandperformancewithsub-nanometerresolutionfrom1to30kV

• Innovativeelectronoptics,includingFEI’spatentedUCgun(monochromator),constantpowerlensesandelectrostaticscanningforaccurateandstableimaging

• ConsistentmeasurementresultswiththeabilitytocalibratetoaNIST-traceablestandardathighmagnification

• Easyaccesstobeamlandingenergiesaslowas20eVwithveryhighresolutionfortruesurfacecharacterization

• Advancedsuiteofhigh-sensitivity,in-column&below-the-lensdetectorsandsignalfilteringforlowdoseoperationandoptimalcontrastselection

• Uniqueimagingtechnologiesandsolutions,includingthesecondgenerationofFEI’sadvanceddetectors,FEISmartSCAN™andDCFItoaccuratelyimagechargingsamples

• Veryhighprecision&stability,piezo-driven100x100mmstageinalargeanalyticalchamber

• Multiplenavigationpackagesavailable,includingfastandrobustbitcellcounting

• Fullanalyticalandprototypingcapabilities

Verios™ XHR SEMDiscover the world of Extreme High Resolution SEM

TheVeriosisthesecondgenerationofFEI’sleadingXHRSEMfamily,offeringsub-nanometerresolutionoverthefull1keVto30keVenergyrangewithexcellentmaterialscontrast.Itsextraordinarylow-voltageperformanceprovidesextremelyprecise,surface-specificinformationthathasbeenunavailablepreviouslyfromothertechniques.

Extends SEM Capability IntheSemiconductorandDataStoragemarkets,theVerios’sunprecedentedperformancesignificantlyextendsSEMcapabilitytothe22nmnodeandbelow,offeringacompletesolutionforbasicresearch,processandmaterialdevelopment,processcontrolandfailureanalysis.Itdeliversaccurate,repeatablemeasurementresults,evenonextremelysensitivematerials.CombinedwithFEI’sIC3DTMmetrologysoftware,Veriosprovidestheprecisemeasurementsneededtocontrolthetechnologydevelopmentprocess.TheVeriosfeaturesindustryleadingperformancewithoutcompromisingthehighthroughput,sampleflexibilityandeaseoftraditionalSEM.

The Highest Resolution and Contrast Required for Materials ResearchForMaterialsScientists,theVeriosenablesimportantnewinsightsbyextendingsub-nanometercharacterizationtonovelmaterialsbeingdevelopedtoday(e.g.,catalystparticles,nanotubes,porosities,interfaces,biologicalobjectsandothernanoscalestructures).High-resolution,high-contrastimagesareobtainedwithouttheneedtotransitiontoTEMorotherimagingtechniques.VeriosoffersalltheflexibilityrequiredfromResearchapplicationstoaccommodatelargespecimenslikefullwafersormetallurgicalsamples,performfastanalysisthankstoitshighcurrentmodeorworkonpreciseprototypingapplicationssuchaselectronbeam-induceddirectdepositionofmaterialsorlithography.

Boost Accuracy with Superior PerformanceTheoutstandingimagingcapabilitiesoftheVeriosbeginwiththeElstar™FESEMcolumn.Ontopofitsintegratedmonochromator(UC)andbeamdeceleration,whichenablesVerios’suniquelowkVperformance,theElstarfeaturesotheruniquetechnologiessuchasconstantpowerlensesforhigherthermalstabilityandelectrostaticscanningforhigherdeflectionlinearitywhichleadstobettermeasurementaccuracy.Itstraditionalthrough-the-lensdetector,setforhighestcollectionefficiencyofSE(secondaryelectrons)andon-axisBSE(backscatteredelectrons),iscomplementedbytwonewin-columndetectorsandsignalfilteringcapabilitiesforstunningresolutionandrefinedmaterialscontrast.Furthermore,anoptionalSTEM(scanningtransmissionelectronmode)detectorprovidessuperiorperformanceonthinS/TEMsamples.

EmpoweredbyitsevolutionaryxTsoftwareplatform,theVeriosaddressesboththeoccasionaluserwithasimpleyetrobustinterface,andtheSEMexpertwhocanrelyontheinstrument’sflexibilityandextendedcontrolsforXHRwork.

Product Data Verios™XHRSEM

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• Everhart-ThornleySEdetector(ETD)• IRcameraforviewingsample/column• ChambermountedNav-Cam+™*• Retractablelowvoltage,highcontrastsolid-statebackscatterelectrondetector(DBS)**

• RetractableSTEMdetectorwithBF/DF/HAADFsegments*• Integratedbeamcurrentmeasurement

Chamber• E-beamandEDXcoincidencepointat4mmWD• 21ports

Ultra high precision 5-axes piezo-motorized stage• X,Y=100mm• Z≥20mm• T=-10°to+60°• R=720°stroke• X,Yrepeatability0.5μm• X,Yaccuracy<1.5μm85%toleranceinterval• Mechanicallytilteucentricstagewith<5μmimagemotionwhentilting0°to52°

• Compucentricrotationandtilt

Sample sizes• Maximumsize:100mmdiameterwithfullrotation• Maximumsamplethickness(vialoadlock):19mmincl.stub• Maximumsamplethickness(viachamberdoor):19mmincl.stub• Weight:200g(incl.holder)

Sample holders• Multi-stubholder**• Multi-samplecross-sectionalholder**• Singlestubmount,mountsdirectlyontostage• Variouswaferandcustomholder(s)availablebyrequest

Image processor• Dwelltimerangefrom0.025to25000μs/pixel• Upto6144x4096pixels• Filetype:TIFF(8,16,24-bit),BMPorJPEG• Singleframeor4quadrantimagedisplay• SmartSCAN(256frameaverageorintegration,lineintegrationandaveraging,interlacedscanning)andDCFI(DriftCompensatedFrameIntegration)

Essential specifications

Electron optics

ElstarXHRimmersionlensFESEMcolumn• Elstarelectrongunwith:

– Schottkythermalfieldemitter– Hot-swapcapability– UCtechnology(monochromator)

• 60degreedualobjectivelenswithpolepieceprotection• Heatedobjectiveapertures• Electrostaticscanning• ConstantPower™lenstechnology• Beamdecelerationwithstagebiasfrom-50Vto-4kV• IntegratedFastBeamBlanker*

Source lifetime• Electronsourcelifetime:12months

Electron beam resolution(site survey required to guarantee resolution specification)• Resolution@optimumWD

– 0.6nmat30kV(STEM*)– 0.7nmat15kV– 0.7nmat1kV– 1.0nmat500V(ICD**)– 1.2nmat200V(ICD**)

Maximum horizontal field width• E-beam:1.5mmatWD4mm

Landing energy range• 20eV-30keV

Probe current• E-beam:0.8pAupto100nA

Vacuum system• 1x210l/sTMP• 1xPVP(drypump)• 2xIGP• Chambervacuum:<2.6*10-6mbar(after24hpumping)

Detectors• Elstarin-lensSEdetector(TLD-SE)• Elstarin-lensBSEdetector(TLD-BSE)• Elstarin-columnSEdetector(ICD)**• Elstarin-columnBSEdetector(MD)**

*=optional**=optionalforVerios460,

standardforVerios460L


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System control• 32-bitGUIwithWindows® XP,keyboard,opticalmouse• Two24inchwidescreenLCDdisplays,WUXGA1920x1200pixels• Microscopecontrollingandsupportcomputersseamlesslysharingonekeyboardandmouse

• Joystick**• Multifunctionalcontrolpanel**• Remotecontrol*

Supporting software • 'Beamperquad'graphicaluserinterfaceconcept,withupto4simultaneouslyactivequads

Software options • Webenableddataarchivesoftware*• Imageanalysissoftware*• iFASTforadvancedautomation*• MAPS™forautomaticacquisitionoflargeimagesandcorrelativework*

• IC3Dmetrologyofflinesoftware**• CellNavigatorTMforbitcellnavigation**

Documentation• On-linehelp• PreparedforRAPID™(remotediagnosticsupport)• FreeaccesstoFEIforownerson-lineresources

Common accessories• Analysis:EDS*• Loadlock**• IntegratedPlasmaCleaner• FEICryoCleaner• ElectronBeamLithography:kitsfromRaith,Nabityorothervendors*

• FEIacousticenclosure*• CryoSEM:Sampletransferandpreparation,cryostage• GasInjectionSystem(GIS)*• NISTtraceablemagnificationcalibrationsample*

Consumables (partial list)• ReplacementSchottkyelectronsourcemodule• Aperturestripsforelectron

Warranty and training • 1yearwarranty• Choiceofservicemaintenancecontracts• Choiceofoperation/applicationtrainingcontracts

*=optional**=optionalforVerios460,

standardforVerios460L

MDdetector–Excellentmaterialscontrastonsemiconductormaterialssuchasthis32nmFlashdevice

Sample courtesy of ChipWorks

ICDDetector-ExceptionalsurfacesensitivityGoldonCarbon

©2012.Weareconstantlyimprovingtheperformanceofourproducts,soallspecificationsaresubjecttochangewithoutnotice.Verios,Rapid,Nav-Cam+,ConstantPower,Elstar,SmartSCAN,MAPSandtheFEIlogoaretrademarksofFEICompany,andFEIisaregisteredtrademarkofFEICompany.Allothertrademarksbelongtotheirrespectiveowners.

Learn more at FEI.com

World HeadquartersPhone:+1.503.726.7500

FEI EuropePhone:+31.40.23.56000

FEI JapanPhone:+81.3.3740.0970

FEI AsiaPhone:+65.6272.0050

FEI AustraliaPhone:+61.7.3512.9100

TÜVCertificationfordesign,manufacture,installationandsupportoffocusedion-andelectron-beammicroscopesfortheElectronics,LifeSciences,ResearchandNaturalResourcesmarkets.


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Floor plan without enclosureFloor plan with enclosure


World HeadquartersPhone:+1.503.726.7500

FEI EuropePhone:+31.40.23.56000

FEI JapanPhone:+81.3.3740.0970

FEI AsiaPhone:+65.6272.0050

FEI AustraliaPhone:+61.7.3512.9100

TÜVCertificationfordesign,manufacture,installationandsupportoffocusedion-andelectron-beammicroscopesfortheElectronics,LifeSciences,ResearchandNaturalResourcesmarkets.


Installation requirements

(refer to pre-install guide for additional data)

• Power:voltage100-240VAC,frequency50or60Hz±1%)• Powerconsumption:<3.0kVAforbasicmicroscope• Earthresistance:<0.1Ω• Environment:

– temperature20°C±3°C– relativehumiditybelow80%RH,20°C– strayACmagneticfields:sitesurveyrequired– acousticsguidelines:Sitesurveyrequiredasfloorspectrumrelevant– floorvibrations:Sitesurveyrequiredasfloorspectrumrelevant

• Doorwidthxheight:preferred1.2mx2.0m(minimum0.9mx2.0m)

• Weight:columnconsole850kg• Drynitrogen• Compressedair:4to6bar-clean,dryandoilfree• Systemchiller• Vibrationisolationtable*

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