XZZ-TIM2
2.4 GHz IEEE 802.15.4 and ZigBee Module
Version 1.0
Shenzhen RF-star Technology Co., Ltd.
Jan. 19th, 2020
XZZ-TIM2
www.szrfstar.com V1.0 - Jan., 2020
Shenzhen RF-star Technology Co., Ltd. Page 1 of 17
ZigBee Module List
Chipset Core FLASH
(KB)
RAM
(KB) Model Antenna
Dimension
(mm)
TX
Power
(dBm)
Range
(M) Photo
CC2530 8051 256 8
XZZ-TIM2 PCB /
IPEX 18 34.4 20
PCB: 1000
IPEX: 1500
XZZ-TIM3 PCB /
IPEX 16 26.2 4.5
PCB: 400
IPEX: 600
XZZ-TIM4 PCB /
IPEX 16 26.2 20
PCB: 1000
IPEX: 1500
WE1005 PCB 16 22 4.5 300
RF-ZM-1338A PCB /
IPEX 16.8 22 3
PCB: 300
IPEX: 450
RF-ZM-1738A PCB /
IPEX 16.8 27.9 17
PCB: 550
IPEX: 850
RF-ZM-TI01 PCB 15.1 22.3 4.5 300
EFR32
MG1B232 M4 256 32
3B32_V102 PCB /
IPEX 14.8 20.4 19.5
PCB: 1000
IPEX: 1500
RF-ZM-SL01 PCB 14 21 19.5 1000
Note:
1. The communication distance is the longest distance obtained by testing the module's maximum transmission power
in an open and interference-free environment in sunny weather.
2. Click the picture to buy modules.
3. All modules with PCB antenna and IPEX connector are dispatched with PCB antenna only by default. If IPEX
connector is needed, pls check with me before quotation.
http://www.szrfstar.com/https://www.alibaba.com/product-detail/Long-range-home-automation-TI-CC2530_62499475463.html?spm=a2747.manage.0.0.378271d2ZqnIWhhttps://www.alibaba.com/product-detail/Long-distance-smart-home-TI-CC2530_62499943816.html?spm=a2747.manage.0.0.378271d2ZqnIWhhttps://www.alibaba.com/product-detail/FCC-UART-Programmable-lower-price-CC2530_60772637694.html?spm=a2747.manage.0.0.670e71d2SCl1cnhttps://item.taobao.com/item.htm?spm=a1z10.4-c.w5003-22129378448.4.31115e8eXcePxJ&id=36060515930&scene=taobao_shophttps://item.taobao.com/item.htm?spm=a1z10.4-c.w5003-22129378448.5.31115e8eXcePxJ&id=36061147272&scene=taobao_shophttps://www.alibaba.com/product-detail/Home-automation-FCC-Programmable-zigbee-wireless_60818796410.html?spm=a2747.manage.0.0.670e71d2SCl1cnhttps://www.alibaba.com/product-detail/RF-star-long-range-long-distance_62307310286.html?spm=a2747.manage.0.0.670e71d2SCl1cn
XZZ-TIM2
www.szrfstar.com V1.0 - Jan., 2020
Shenzhen RF-star Technology Co., Ltd. Page 2 of 17
1 Device Overview
1.1 Description
XZZ-TIM2 is a low power IEEE 802.15.4, ZigBee and RF4CE module based on TI CC2530F256 and a power amplifier
RFX2401C. This module can be widely applied to short distance wireless network communication field with the
characteristics of low power consumption, small volume, strong anti-interference ability and so on. The module uses RF-
specific high dielectric constant, low loss sheet, and four-layer board wiring. Capacitance inductance components are
from high-precision and high Q Murata GRM series. The module also uses onboard power supply filter circuit and RF
optimization matching circuit, which makes the module better stability and farther transmission distance. To meet the
industrial application requirements, the module can be equipped with a shield on it, which increases the anti-jamming
capability.
1.2 Key Features
• RF
- 2.4 GHz IEEE 802.15.4 compliant RF
transceiver
- Excellent receiver sensitivity and robustness
to interface
- Programmable output power up to +4.5 dBm
- Very few external components
- Suitable for systems targeting compliance
with worldwide radio-frequency regulations:
ETSI EN 300 328 and EN 300 400 (Europe),
FCC CFR47 Part 15 (US) and ARIB STD-T-
66 (Japan)
• Microcontroller
- High-performance and low-power 8051
microcontroller core with code prefetch
- 256 KB in-system-programmable flash
- 8 KB RAM with retention in all power modes
- Hardware debug support
• Peripherals
- Powerful five-channel DMA
- Integrated high-performance op-amp and
ultralow-power comparator
- IEEE 802.15.4 MAC timer, general-purpose
timers (one 16-bit, two 8-bit)
- IR generation circuitry
- 32-kHz sleep timer with capture
- CSMA / CA hardware support
- Accurate digital RSSI / LQI support
- Battery monitor and temperature sensor
- 12 bit ADC with 8 channels and configurable
resolution
- AES security coprocessor
- Two powerful USARTs with support for
several serial protocols
- 12 general-purpose I/O pins
- Watchdog timer
1.3 Applications
• 2.4 GHz IEEE 802.15.4 systems
• RF4CE remote control systems
• ZigBee systems
• Home automation
• Building automation
• Industrial control and monitoring
• Low-power wireless sensor networks
• Consumer electronics
http://www.szrfstar.com/
XZZ-TIM2
www.szrfstar.com V1.0 - Jan., 2020
Shenzhen RF-star Technology Co., Ltd. Page 3 of 17
• Health care
1.4 Functional Block Diagram
Figure 1. Functional Block Diagram of XZZ-TIM2
12 GPIOs
Reset
LC Balun Antenna Matching
32.0 MHz 32.768 kHz
Power Filter
CC2530 RFX
2401C PCB Antenna
IPEX Connector
Power Supply 2.0 V ~ 3.6 V
http://www.szrfstar.com/
XZZ-TIM2
www.szrfstar.com V1.0 - Jan., 2020
Shenzhen RF-star Technology Co., Ltd. Page 4 of 17
Table of Contents
ZigBee Module List ............................................................................................................................................................ 1
1 Device Overview ............................................................................................................................................................. 2
1.1 Description............................................................................................................................................................ 2
1.2 Key Features ....................................................................................................................................................... 2
1.3 Applications .......................................................................................................................................................... 2
1.4 Functional Block Diagram .............................................................................................................................. 3
Table of Contents ................................................................................................................................................................ 4
Table of Figures ................................................................................................................................................................... 5
Table of Tables ..................................................................................................................................................................... 5
2 Module Configuration and Functions ...................................................................................................................... 6
2.1 Module Parameters ........................................................................................................................................... 6
2.2 Module Pin Diagram ......................................................................................................................................... 7
2.3 Pin Functions ....................................................................................................................................................... 7
3 Specifications ................................................................................................................................................................... 9
3.1 Recommended Operating Conditions ....................................................................................................... 9
3.2 Handling Ratings ................................................................................................................................................ 9
4 Application, Implementation, and Layout............................................................................................................. 10
4.1 Module Photos .................................................................................................................................................. 10
4.2 Recommended PCB Footprint .................................................................................................................... 10
4.3 Antenna ................................................................................................................................................................ 11
4.4 Schematic Diagram ......................................................................................................................................... 12
4.5 Basic Operation of Hardware Design ...................................................................................................... 12
4.6 Trouble Shooting .............................................................................................................................................. 13
4.6.1 Unsatisfactory Transmission Distance ........................................................................................ 13
4.6.2 Vulnerable Module .............................................................................................................................. 14
4.6.3 High Bit Error Rate ............................................................................................................................. 14
4.7 Electrostatics Discharge Warnings ........................................................................................................... 14
4.8 Soldering and Reflow Condition ................................................................................................................. 14
4.9 Optional Packaging ......................................................................................................................................... 15
5 Revision History ............................................................................................................................................................ 16
http://www.szrfstar.com/
XZZ-TIM2
www.szrfstar.com V1.0 - Jan., 2020
Shenzhen RF-star Technology Co., Ltd. Page 5 of 17
6 Contact Us ....................................................................................................................................................................... 17
Table of Figures
Figure 1. Functional Block Diagram of XZZ-TIM2 ........................................................................................ 3
Figure 2. Pin Diagram of XZZ-TIM2 ................................................................................................................... 7
Figure 3. Photos of XZZ-TIM2 ............................................................................................................................ 10
Figure 4. Recommended PCB Footprint of XZZ-TIM2 (mm) ................................................................. 10
Figure 5. Specification of Antenna Seat ......................................................................................................... 11
Figure 6. Specification of IPEX Wire ................................................................................................................ 11
Figure 7. Schematic Diagram of XZZ-TIM2 .................................................................................................. 12
Figure 8. Recommendation of Antenna Layout ........................................................................................... 13
Figure 9. Recommended Reflow for Lead Free Solder ............................................................................ 15
Figure 10. Optional Packaging Mode .............................................................................................................. 15
Table of Tables
Table 1. Parameters of XZZ-TIM2 ...................................................................................................................... 6
Table 2. Pin Functions of XZZ-TIM2 .................................................................................................................. 7
Table 3. Recommended Operating Conditions of XZZ-TIM2 ................................................................... 9
Table 4. Handling Ratings of XZZ-TIM2 ........................................................................................................... 9
http://www.szrfstar.com/
XZZ-TIM2
www.szrfstar.com V1.0 - Jan., 2020
Shenzhen RF-star Technology Co., Ltd. Page 6 of 17
2 Module Configuration and Functions
2.1 Module Parameters
Table 1. Parameters of XZZ-TIM2
Chipset CC2530F256 + RFX2401C
Supply Power Voltage 2.0 V ~ 3.6 V, recommended to 3.3 V
Frequency 2394 MHz ~ 2507 MHz
Maximum Transmit Power +20 dBm
Receiving Sensitivity -97 dBm
GPIO 12
Crystal 32 MHz, 32.768 kHz
RAM 8 KB
Flash 256 KB
Package DIP Packaging
Frequency Error ±20 kHz
Dimension 25.2 mm x 16.0 mm x (2.1 ± 0.1) mm
Communication Interface UART, ADC
Type of Antenna PCB Antenna (by default) / IPEX Connector
Operating Temperature -40 ℃ ~ +85 ℃
Storage Temperature -40 ℃ ~ +125 ℃
http://www.szrfstar.com/
XZZ-TIM2
www.szrfstar.com V1.0 - Jan., 2020
Shenzhen RF-star Technology Co., Ltd. Page 7 of 17
2.2 Module Pin Diagram
Figure 2. Pin Diagram of XZZ-TIM2
2.3 Pin Functions
Table 2. Pin Functions of XZZ-TIM2
Pin Name Chip Pin Pin Type Description
1 RST RST Reset, active low
2 P22 P2_2 GPIO / Debug DC GPIO / Debug DC
3 P21 P2_1 GPIO / Debug DD GPIO / Debug DD
4 GND GND GND Ground
5 VCC VCC VCC Power supply: 2.0 V ~ 3.6 V, recommended to 3.3 V
6 VCC VCC VCC Power supply: 2.0 V ~ 3.6 V, recommended to 3.3 V
7 P02 P0_2 GPIO GPIO
8 P03 P0_3 GPIO GPIO
9 GND GND GND Ground
10 VCC VCC VCC Power supply: 2.0 V ~ 3.6 V, recommended to 3.3 V
http://www.szrfstar.com/
XZZ-TIM2
www.szrfstar.com V1.0 - Jan., 2020
Shenzhen RF-star Technology Co., Ltd. Page 8 of 17
11 GND GND GND Ground
12 P12 P1_2 GPIO GPIO
13 P10 P1_0 GPIO GPIO
14 P07 P0_7 GPIO GPIO
15 P06 P0_6 GPIO GPIO
16 P05 P0_5 GPIO GPIO
17 P04 P0_4 GPIO GPIO
18 P01 P0_1 GPIO GPIO
19 P00 P0_0 GPIO GPIO
http://www.szrfstar.com/
XZZ-TIM2
www.szrfstar.com V1.0 - Jan., 2020
Shenzhen RF-star Technology Co., Ltd. Page 9 of 17
3 Specifications
3.1 Recommended Operating Conditions
Functional operation does not guarantee performance beyond the limits of the conditional parameter values in the table
below. Long-term work beyond this limit will affect the reliability of the module more or less.
Table 3. Recommended Operating Conditions of XZZ-TIM2
Items Condition Min. Typ. Max. Unit
Operating Supply Voltage Battery Mode 2.0 3.3 3.6 V
Operating Temperature / -40 +25 +85 ℃
Environmental Hot Pendulum / -20 +20 ℃/min
Notes: To ensure the RF performance, the ripple wave on the source must be less than ±200 mV.
3.2 Handling Ratings
Table 4. Handling Ratings of XZZ-TIM2
Items Condition Min. Typ. Max. Unit
Storage Temperature Tstg -40 +25 +125 ℃
Human Body Model HBM ±2000 V
Moisture Sensitivity Level 2
Charged Device Model ±500 V
http://www.szrfstar.com/
XZZ-TIM2
www.szrfstar.com V1.0 - Jan., 2020
Shenzhen RF-star Technology Co., Ltd. Page 10 of 17
4 Application, Implementation, and Layout
4.1 Module Photos
Figure 3. Photos of XZZ-TIM2
4.2 Recommended PCB Footprint
Figure 4. Recommended PCB Footprint of XZZ-TIM2 (mm)
http://www.szrfstar.com/
XZZ-TIM2
www.szrfstar.com V1.0 - Jan., 2020
Shenzhen RF-star Technology Co., Ltd. Page 11 of 17
4.3 Antenna
XZZ-TIM2 module is integrated the IPEX version 1 antenna seat, the specification of antenna seat is as follow:
Figure 5. Specification of Antenna Seat
The specification of IPEX wire end is as follow:
Figure 6. Specification of IPEX Wire
http://www.szrfstar.com/
XZZ-TIM2
www.szrfstar.com V1.0 - Jan., 2020
Shenzhen RF-star Technology Co., Ltd. Page 12 of 17
4.4 Schematic Diagram
Figure 7. Schematic Diagram of XZZ-TIM2
4.5 Basic Operation of Hardware Design
1. It is recommended to offer the module with a DC stabilized power supply, a tiny power supply ripple coefficient and
the reliable ground. Please pay attention to the correct connection between the positive and negative poles of the
power supply. Otherwise, the reverse connection may cause permanent damage to the module;
2. Please ensure the supply voltage is between the recommended values. The module will be permanently damaged
if the voltage exceeds the maximum value. Please ensure the stable power supply and no frequently fluctuated
voltage.
3. When designing the power supply circuit for the module, it is recommended to reserve more than 30% of the margin,
which is beneficial to the long-term stable operation of the whole machine. The module should be far away from the
power electromagnetic, transformer, high-frequency wiring and other parts with large electromagnetic interference.
4. The bottom of module should avoid high-frequency digital routing, high-frequency analog routing and power routing.
If it has to route the wire on the bottom of module, for example, it is assumed that the module is soldered to the Top
Layer, the copper must be spread on the connection part of the top layer and the module, and be close to the digital
part of module and routed in the Bottom Layer (all copper is well grounded).
5. Assuming that the module is soldered or placed in the Top Layer, it is also wrong to randomly route the Bottom Layer
or other layers, which will affect the spurs and receiving sensitivity of the module to some degrees;
6. Assuming that there are devices with large electromagnetic interference around the module, which will greatly affect
the module performance. It is recommended to stay away from the module according to the strength of the
interference. If circumstances permit, appropriate isolation and shielding can be done.
7. Assuming that there are routings of large electromagnetic interference around the module (high-frequency digital,
high-frequency analog, power routings), which will also greatly affect the module performance. It is recommended
http://www.szrfstar.com/
XZZ-TIM2
www.szrfstar.com V1.0 - Jan., 2020
Shenzhen RF-star Technology Co., Ltd. Page 13 of 17
to stay away from the module according to the strength of the interference. If circumstances permit, appropriate
isolation and shielding can be done.
8. It is recommended to stay away from the devices whose TTL protocol is the same 2.4 GHz physical layer, for
example: USB 3.0.
9. The antenna installation structure has a great influence on the module performance. It is necessary to ensure the
antenna is exposed and preferably vertically upward. When the module is installed inside of the case, a high-quality
antenna extension wire can be used to extend the antenna to the outside of the case.
10. The antenna must not be installed inside the metal case, which will cause the transmission distance to be greatly
weakened.
11. The recommendation of antenna layout.
The inverted-F antenna and IPEX connector position on PCB is free space electromagnetic radiation. The location
and layout of antenna is a key factor to increase the data rate and transmission range.
Therefore, the layout of the module antenna location and routing is recommended as follows:
(1) Place the antenna on the edge (corner) of the PCB.
(2) Make sure that there is no signal line or copper foil in each layer below the antenna.
(3) It is the best to hollow out the antenna position in the following figure so as to ensure that S11 of the module
is minimally affected.
Figure 8. Recommendation of Antenna Layout
Note: The hollow-out position is based on the antenna used.
4.6 Trouble Shooting
4.6.1 Unsatisfactory Transmission Distance
1. When there is a linear communication obstacle, the communication distance will be correspondingly weakened.
Temperature, humidity, and co-channel interference will lead to an increase in communication packet loss rate. The
performances of ground absorption and reflection of radio waves will be poor, when the module is tested close to
the ground.
http://www.szrfstar.com/
XZZ-TIM2
www.szrfstar.com V1.0 - Jan., 2020
Shenzhen RF-star Technology Co., Ltd. Page 14 of 17
2. Seawater has a strong ability to absorb radio waves, so the test results by seaside are poor.
3. The signal attenuation will be very obvious, if there is a metal near the antenna or the module is placed inside of the
metal shell.
4. The incorrect power register set or the high data rate in an open air may shorten the communication distance. The
higher the data rate, the closer the distance.
5. The low voltage of the power supply is lower than the recommended value at ambient temperature, and the lower
the voltage, the smaller the power is.
6. The unmatchable antennas and module or the poor quality of antenna will affect the communication distance.
4.6.2 Vulnerable Module
1. Please ensure the supply voltage is between the recommended values. The module will be permanently damaged
if the voltage exceeds the maximum value. Please ensure the stable power supply and no frequently fluctuated
voltage.
2. Please ensure the anti-static installation and the electrostatic sensitivity of high-frequency devices.
3. Due to some humidity sensitive components, please ensure the suitable humidity during installation and application.
If there is no special demand, it is not recommended to use at too high or too low temperature.
4.6.3 High Bit Error Rate
1. There are co-channel signal interferences nearby. It is recommended to be away from the interference sources or
modify the frequency and channel to avoid interferences.
2. The unsatisfactory power supply may also cause garbled. It is necessary to ensure the power supply reliability.
3. If the extension wire or feeder wire is of poor quality or too long, the bit error rate will be high.
4.7 Electrostatics Discharge Warnings
The module will be damaged for the discharge of static. RF-star suggest that all modules should follow the 3 precautions
below:
1. According to the anti-static measures, bare hands are not allowed to touch modules.
2. Modules must be placed in anti- static areas.
3. Take the anti-static circuitry (when inputting HV or VHF) into consideration in product design.
Static may result in the degradation in performance of module, even causing the failure.
4.8 Soldering and Reflow Condition
1. Heating method: Conventional Convection or IR/convection.
2. Temperature measurement: Thermocouple d = 0.1 mm to 0.2 mm CA (K) or CC (T) at soldering portion or equivalent
methods.
3. Solder paste composition: Sn/3.0 Ag/0.5 Cu
4. Allowable reflow soldering times: 2 times based on the following reflow soldering profile.
http://www.szrfstar.com/
XZZ-TIM2
www.szrfstar.com V1.0 - Jan., 2020
Shenzhen RF-star Technology Co., Ltd. Page 15 of 17
5. Temperature profile: Reflow soldering shall be done according to the following temperature profile.
6. Peak temperature: 245 ℃.
Figure 9. Recommended Reflow for Lead Free Solder
4.9 Optional Packaging
Figure 10. Optional Packaging Mode
Note: Default tray packaging.
http://www.szrfstar.com/
XZZ-TIM2
www.szrfstar.com V1.0 - Jan., 2020
Shenzhen RF-star Technology Co., Ltd. Page 16 of 17
5 Revision History
Date Version No. Description Author
2019.10.22 V0.1 The initial version is released. Aroo Wang
2020.01.19 V1.0 Add ZigBee module list. Sunny Li
http://www.szrfstar.com/
XZZ-TIM2
www.szrfstar.com V1.0 - Jan., 2020
Shenzhen RF-star Technology Co., Ltd. Page 17 of 17
6 Contact Us
SHENZHEN RF-STAR TECHNOLOGY CO., LTD.
Shenzhen HQ:
Add.: Room 601, Block C, Skyworth Building, High-tech Park, Nanshan District, Shenzhen, Guangdong, China
Tel.: 86-755-3695 3756
Chengdu Branch:
Add.: No. B4-12, Building No.1, No. 1480 Tianfu Road North Section (Incubation Park), High-Tech Zone, Chengdu,
China (Sichuan) Free Trade Zone, 610000
Tel.: 86-28-6577 5970
Email: [email protected], [email protected]
Web.: www.szrfstar.com
http://www.szrfstar.com/mailto:[email protected]://www.szrfstar.com/
ZigBee Module List1 Device Overview1.1 Description1.2 Key Features1.3 Applications1.4 Functional Block Diagram
Table of ContentsTable of FiguresTable of Tables2 Module Configuration and Functions2.1 Module Parameters2.2 Module Pin Diagram2.3 Pin Functions
3 Specifications3.1 Recommended Operating Conditions3.2 Handling Ratings
4 Application, Implementation, and Layout4.1 Module Photos4.2 Recommended PCB Footprint4.3 Antenna4.4 Schematic Diagram4.5 Basic Operation of Hardware Design4.6 Trouble Shooting4.6.1 Unsatisfactory Transmission Distance4.6.2 Vulnerable Module4.6.3 High Bit Error Rate
4.7 Electrostatics Discharge Warnings4.8 Soldering and Reflow Condition4.9 Optional Packaging
5 Revision History6 Contact Us