© 2015
Yole Développement
More than Moore market
and technology trends
2©2015 | www.yole.fr | Yole Développement
OUTLINE OF THE PRESENTATION
• Presentation ofYOLE Développement
• Major trends in the industry
• Focus on MEMS
• Focus on Image Sensing
• Focus on Advanced Packaging
• Elements for a conclusion
3©2015 | www.yole.fr | Yole Développement
MEMS &
Sensors
LED
Compound
Semi.
Imaging Photonics
MedTech
Manufacturing
Advanced
PackagingPV
Power
Electronics
FIELDS OF EXPERTISE
Yole Développement’s 30 analysts operate in the following areas
4©2015 | www.yole.fr | Yole Développement
4 BUSINESS MODELS
o Consulting and Analysis
• Market data & research, marketing analysis
• Technology analysis
• Strategy consulting
• Reverse engineering & costing
• Patent analysis
www.yole.fr
o Reports
• Market & Technology reports
• Patent Investigation and patent infringement risk analysis
• Teardowns & Reverse Costing Analysis
• Cost Simulation Tool
www.i-Micronews.com/reports
o Financial services
• M&A (buying and selling)
• Due diligence
• Fundraising
• Maturation of companies
• IP portfolio management & optimization
www.yolefinance.com
o Media
• i-Micronews.com website
• @Micronews e-newsletter
• Technology magazines
• Communication & webcast services
• Events
www.i-Micronews.com
5©2015 | www.yole.fr | About Yole Développement
A GROUP OF COMPANIES
Market,
technology and
strategy
consulting
www.yole.fr
M&A operations
Due diligences
www.yolefinance.com
Fundraising
Maturation of companies
IP portfolio management & optimization
www.bmorpho.com
Manufacturing costs analysis
Teardown and reverse engineering
Cost simulation tools
www.systemplus.fr
IP analysis
Patent assessment
www.knowmade.fr
6©2015 | www.yole.fr | About Yole Développement
OUR GLOBAL ACTIVITY
Yole JapanYole Inc.
Yole
Korea
40% of our business is in
EU countries30% of our business is in
North America
30% of our business is in
Asia
Blue Morpho
7©2015 | www.yole.fr | About Yole Développement
SERVING THE ENTIRE SUPPLY CHAIN
Our analysts provide market analysis,
technology evaluation,
and business plan along the entire
supply chain
Integrators and
end-users
Device
makers
Suppliers: material,
equipment, OSAT,
foundries…
Financial investors,
R&D centers
8©2015 | www.yole.fr | About Yole Développement
SERVING MULTIPLE INDUSTRIAL FIELDS
We are workingaccross
multiples industries to understand
the impact of More-than-
Moore technologies from deviceto system
From A to Z…
Transportation
makers
Mobile phone
and consumer
electronics
Automotive
Medical
systemsIndustrial and
defense
Energy
10©2015 | www.yole.fr | Yole Développement
COMPUTING TRENDS
3 key drivers
Miniaturization
Functionality
Mobility
11©2015 | www.yole.fr | Yole Développement
THE DRIVING FORCES ARE CHANGING
Wireless is the trend!
12©2015 | www.yole.fr | Yole Développement
MARKET TRENDS AND DRIVERS
Information! Key driver for mobile
applications
http://ec.europa.eu/digital-agenda/en/about-mobility
http://www.tutorialspoint.com/shorttutorials/reasons-why-we-cant-develop-without-mobile-technology
There is a high need of being constantly:
connected to a high flow of information
being updated to information
update our mobile gadgets
to know everything that is going around us and around the world
to be informed at every second
the need to share – social networking just exploded
Mobile Globalization where information is the main currency
13©2015 | www.yole.fr | Yole Développement
MOBILITY FACTS
Mobile phones a continousgrowth!
http://mashable.com/2013/10/03/mobile-phones-2017/
2013
4.3 billionmobile phones users
Due to increased access to mobile devices and information, the use of mobiles will continue to increase
2017
> 5 billionmobile phones users
14©2015 | www.yole.fr | Yole Développement
WHAT OPTIONS DO WE HAVE?
Mainly two routes
Alternative solution
required to Moore’s law
Continue with development of advanced technology nodes (follow Moore’s Law)
Develop new alternative technologies/packages (More than Moore) in order to be able to meet the market requirements:
The CMOS transistors continue to shrink but at the increase of fab expenses.
Although performance is increasing, the same trend of reduced cost has reached its end
15©2015 | www.yole.fr | About Yole Développement
PACKAGING ADDEDVALUE:
More Moore and More than Moore
More thanMoore:
THE alternative to scaling
More Moore : miniaturization
130nm 90nm 65nm 45nm 32nm 22nm 14nm 10nm
Anal
og
+
RF
Pas
sive
sPow
er
Senso
rsEnerg
y
Sourc
es
Bio
chip
s
More
Than
Moore
: div
ers
ific
atio
n
SoC
SiP
IPD
RF CMOS
SMOS
Analog
Power
Low Power
CMOS
High Perf.
SOI
Non
Volatile
Memory
GaAS RF
MEMS
…
3D integration is seen today as a
new paradigm for the future of the
semiconductor industry, as it will
enable several more decades of
chip evolution at ever lower cost,
higher performance and smaller-
size features.
…
16©2015 | www.yole.fr | Yole Développement
EVOLUTION OF SELECTED MORE THAN MOORE APPLICATIONS
>$85B in 2020…
$0M
$10 000M
$20 000M
$30 000M
$40 000M
$50 000M
$60 000M
$70 000M
$80 000M
$90 000M
$100 000M
2012 2013 2014 2015 2016 2017 2018 2019 2020
Selected More than Moore applications
MEMS Market Image sensors LED market
Power devices market Microfluidic market Printed electronic Market
>$85B in 2020
>$50B in 2014
More than
Moore
Applications
keep growing!
17©2015 | www.yole.fr | Yole Développement
ADVANCED PACKAGING PLATFORMS
Broad range of Advanced Packaging Platforms!
Wafer-Level Electrical Redistribution
Flip-chip & Wafer-LevelStacking / Integration
WL CSP‘Fan-in’
FOWLP‘Fan-out’
2.5DInterposer
FC wafer bumping on
BGA
3D IC & TSV
Embedded die in PCB /
laminate
Wafer-Level Interface / Encapsulation
3D WLPFor MEMS & sensors(also called 3D SiP)
LED & SensorsWLOptics
RDL
Bumping
Wafer Bonding
TSV
Middle-End Process Steps
TSV
Wafer Bonding
Balling
19©2015 | www.yole.fr | Yole Développement
MEMS APPLICATIONS
Nothing standard
…
20©2015 | www.yole.fr | Yole Développement
MEMS MARKETS AND EXPECTED GROWTH
Consumer applications
are nowdriving the
growth.
21
FROM MICRO MACHINES TO NEMS
For chemical & inertial sensors, NEMS are already products.
2020+2010200019901960
Co
st(U
S$)
Siz
e (
mm
²)
FIRST INTEGRATED
SENSOREx: SA20 Sensonor for Airbag
systems.
CAPACITIVE COMB
DRIVE BECOMES
DOMINANTEx: ST, Bosch …
PACKAGING /
INTEGRATION AS
ENABLING
TECHNOLOGYEx: SiTime, ST, Bosch …
From micro machines to MEMS
MEMS to NEMS
NEMS
MIX MEMS (thick layer)
& NEMS (gauge) FOR
MIN AREA & IMPROVED
PERF.Ex: Tronics
DISRUPTIVE
APPROACHESEx: EPFL, CNRS, CEA Leti,
Caltech, Berkeley …
3
10
1
15
0.5
1
0.1
5
Smaller, smaller & smaller …
22
TSV IN MEMS
Packaging has been the workhorse of many MEMS players.
RF MEMS
mCube
3-Axis MEMS
Accelerometer
Bosch Sensortec
BMG160
3-Axis MEMS Gyro
MEMSFoundries
Accelerometers
GyroscopeOscillators
Silicon Labs Si504
MEMS Oscillator
Avago FBAR filter
ACMD-7612 UMTS
Band I Duplexer
2014/15 market status (courtesy of Yole Advanced Packaging team)
23©2015 | www.yole.fr | Yole Développement
3D IN MEMS - DIFFERENT TSV ARCHITECTURES
3-Axis Accelerometers
Evolution of MEMS
packaging towards
smaller formfactor
2012
Cu TSV in ASIC TSVs of 10:100 (AR=10:1)(temporary bonding)
W TSV-like with 3:30 (AR =10:1) connecting MEMS to IC metallayers (fusion bonding)
TSV Trench to connectwith wirebonding fromMEMS to ASIC
2013 2014
24©2015 | www.yole.fr | Yole Développement
PACKAGE SIZE COMPARISON
3-Axis Accelerometers
Up to 55% reduction in package size with 3D TSV technology!
Surface: SST= 4mm²
Package thickness: TST= 1mm
Surface: SmCube= 4mm²
Package thickness: TmCube=
0.9mm
Surface: SBosch= 1.8mm²
Package thickness: TBosch=
0.8mmBosch achieved 55% in
package reduction and has
the thinner package (0.8mm)
SST = SmCube > SBosch
TST > TmCube > TBosch
25
WEARABLE ELECTRONIC & IOT
Requiring sensor fusion / processing
Wearable electronics is a new big opportunity for sensors
• Fitness / activity monitoring, healthcare, sports applications
• In many cases the sensor acts as a hub
Apple watch (2015)
Integrates accelerometer + gyro +
magnetometer + pressure
Pebble Watch (0,4 MUnits sold in 2013)
Features STMicroelectronics accelerometer
Moto 360 by Motorola (End 2014)
27©2015 | www.yole.fr | About Yole Développement
IMAGE SENSORS : TRIPLE DISRUPTION HISTORY
Technologies & markets have changed dramatically over the years
CIS is now the
undisputed image sensor technology
1865 1945 1985 2005 2015 2020
First color
pictures from
emulsion
plates in
1860’sTube
technology
Never took
over Film
Technology x Market Penetration
CCD
technology
Took over
Film in the
2000’s
CMOS
technology
Took over
CCD in 2010
Acceleration : The speed in technology changes doubles every technology shift
Era of Digital
PhotographyEra of Film
Photography
Era of Mobile
Photography
5 years10 years20 years40 years80 years
28©2015 | www.yole.fr | Yole Développement
MARKET SEGMENTATION
We have defined 7 market
segments relevant to CIS
Segment Application
Industry / defense /
space
Machine vision (FA), barecode readers,
defense, professional & broadcast
Security Security & surveillance cameras
Medical Medical endoscopes, X-Ray, camera pills
Automotive Front side, rear side, inside view, ADAS
Computing Computer mice, notebooks, PC, tablet
Consumer
DSLR, DSC, camcorders, wearables, game
stations, smart TV
Mobile Smartphones, feature phones
29©2015 | www.yole.fr | Yole Développement
CMOS IMAGE SENSOR APPLICATIONS
2014 CIS market landscape by application
Today smartphone main camera
and DSLR are the 2 main CIS
applications
$3.0B
$1.0B
$0.2B
Today
Consumer
High End
Mobile
Yole Développement © January 2015
• Mobile is currently driving CIS markets
• Smartphone secondary camera adoption made Mobile sub-segment very significant. Its future importance should increase as ASP rises.
• Tablets appear to be part of computing, even though the technology came from Mobile
30©2015 | www.yole.fr | Yole Développement
Backside
illumination will
enable ~ 100% fill-
factor!
Front-Side
illuminated (FSI)
MAIN TECHNOLOGY TRENDS IN CIS
From FSI to BSI to 3D stacked BSI – pixel level
3D stacked technology is
the logical next step in respect to
BSI
3D Stacked
BSI
Silicon Bulk Silicon Bulk
Backside
illuminated (BSI)
Bonding
Interface
Silicon Bulk
Upper
Wafer
Lower
Wafer
• Conventional BSI is adding a silicon wafer essentially as a mechanical support.
• 3D stacked technology is using a processed wafer with digital circuits supplementing the upper CIS array.
31©2015 | www.yole.fr | Yole Développement
Backside
illumination will
enable ~ 100% fill-
factor!
MAIN TECHNOLOGY TRENDS IN CIS
3D Stacked BSI should use hybrid bonding in a short future
TSV is the current
interconnection technology
3D Stacked
BSI
Silicon Bulk
TSVTSV
Backside
illumination will
enable ~ 100% fill-
factor!
3D Hybrid
BSI
Silicon Bulk
Interco upper to
lower wafer
Interco upper
to lower wafer
Connection within pixels
become possible
• The key technology step for 3D stack is the interconnection of the upper and lower part of the circuit.
• Currently TSV is the main technology to connect 3D stacked wafers.
• Cu-Cu hybrid bonding should be the next step
• Hybrid bonding could open the way to in pixel connections
32©2015 | www.yole.fr | Yole Développement
IPHONE 5S TEARDOWN - CAMERA MODULE
8Mp 1.5µm Stacked BSI CIS
TSV technology
enablessmaller formfactor for BSI
CIS
BSI stacked CIS from SONY
33©2015 | www.yole.fr | Yole Développement
COMPARISON WITH PREVIOUS 8MP SENSORS
Significant improvement brought by Sony
Significantsize
reduction for CIS
application
SONY leader in that area
Phone Ref. (Year)CIS
Manufacturer
Resolution
/TechnoPixel size
Pixel Array
AreaCIS Area
Dies per wafer
(12-inch)
Motorola Razor (2011) Omnivision 8Mp/BSI 1.4µm 16mm² 43mm² 1,500
Apple iPhone 4S (2011) Sony 8Mp/BSI 1.4µm 16mm² 35.4mm² 1,816
Samsung Galaxy SII (2011) Samsung 8Mp/BSI 1.4µm 16mm² 34.2mm² 1,884
Apple iPhone 5S (2013) Sony 8Mp/BSI 1.5µm 18mm² 28.5mm² 2,268
~50% ~60% ~60% ~90%Increase of pixel area
34©2015 | www.yole.fr | Yole Développement
CIS EVOLUTION USING TSV
TSV accrossthe evolution
of CIS –different size, different use
FSI BSI 3D Stacked BSI
20122008
TSV Hole to replace shellcase approach
Wafer Level PackagingInterconnection
Trench TSVBEOL Interconnection
TSV BEOL and DSP Interconnection
« Real 3D »
TSV
Cro
ss-s
ect
ion
SEM
TSV
Ne
ed
sIn
teg
rati
on
Sch
em
e
35©2015 | www.yole.fr | Yole Développement
WAFER PRODUCTION FORECAST 2009-2020
Wafer production trend & assumption
Currently ~20% of 3D stacked BSI
By 2020, 3D stacked BSI
should capture
above 50% market share
3%9%
15%22%
30%
9%
18%
27%
31%
33%
33%
32%
27%
2% 5%
16%
31%
33%
35%
32%
29%
25%
22%18%
16%
98% 95%
84%
69%
58%
47%41%
37%33% 30% 28% 27%
0%
10%
20%
30%
40%
50%
60%
70%
80%
90%
100%
2009 2010 2011 2012 2013 2014e 2015e 2016e 2017e 2018e 2019e 2020e
BSI technology penetration - revenue split
BSI Hybrid % BSI Stacked % BSI % FSI %Yole Développement © January 2015
Our assumption :
• All wafers are taken into account
o Some are CIS + Digital
o Some are pure processing (3D stacked BSI & 3D Hybrid BSI)
• Stacked BSI technologies will penetrate more than 50% of CIS production by 2020.
36©2015 | www.yole.fr | Yole Développement
IMAGE SENSORS : WHAT IS NEXT
A roadmap for the next 15 years
From “vision for imaging”
to “vision for sensing”
1900 1980 2020 2030 2040 2045
Technology x Market Penetration
Acceleration : The speed in technology change doubles every technology shift
Era of
Photography
5 years10 years20 years40 years80 years
Era of Machine
Sensing
Main
Players
will
change
Proximity
Sensor
Autofocus
Single
Photon
Imagers?
Multi
Wavelength
Imagers?
Next Era
Sensor
Fusion ?
Human Vision
Enhancement ?
3D Time
of Flight
By 2030 new
technologies serving
machine sensing could
become dominant
Holographic
imagers?
?
38©2015 | www.yole.fr | Yole Développement
TSV IN A NUTSHELL
TSV - a key advanced packaging technology
Broad range of
applications for this
technologyPhotonics
Others(Power,
LED, RF…)
Memory
MEMS
Logic
CMOS Image
Sensors
ThroughSilicon
ViaTSV
39©2015 | www.yole.fr | Yole Développement
TSV WAFER START BY APPLICATION
High End needsrequires
performance
TSV technology is
key in that field
2014 2015 2016 2017 2018 2019
WSPY 300 eq
MEMS
Memory
Photonic
CIS
MEMS
HBM
HMC
Photonic interposer
FPGA
SK
Hynix
Micron
XilinxAltera
<2013
CIS
FPGA
Logic on Logic
HMCHBMWide I/ODDR4
40©2015 | www.yole.fr | Yole Développement
MEMORY USING TROUGH SILICON VIAS
A brief overview of announced products
Big Memory Players
moving to 3D
41©2015 | www.yole.fr | Yole Développement
2.5/3DIC COMMERCIAL ANNOUNCEMENTS!
2015 Key turning yearfor 3D TSV technology
2014
2013
2015
2017
2016
Nvidia Pascal
Graphics Module
EX-800
Blade Server using
HMC
New second generation Xenon Phi processor“Knights Landing” using HMC
Next Generation PRIMEHPC
POST FX10
CPU memory board using
HMC
DDR4 3DDual Inline Memory Modules(RDIMMs)
First Heterogeneous 3D FPGAVirtex-7 H580T
AMD R9 390X
Graphics product with HBM
built with 20nm technology
Whatelse?
43©2015 | www.yole.fr | Yole Développement
4 DIFFERENT WAVES ARE IMPACTING THE SEMICONDUCTOR BUSINESS
The 4 waves of the
semiconductortrends
• The first wave:• More Moore trends
• The second wave:• Re-use of semiconductor process to make non IC devices is creating totally new
opportunities.
• The third wave:• How module manufacturing is becoming the future of device makers.
• The fourth wave:• A supply chain evolution to maximize the added value and provide complete services
to customers.
44©2015 | www.yole.fr | Yole Développement
CONCLUSION
• Their is a growing importance of the devices outside the digital IC world, where analog, mixedsignal devices, sensors, power management, embedded memories… are becoming inceasinglyimportant and reaching big sales level
• We see more and more speciality foundries that are grabing a significant part of these morethan Moore applications, as the process to be mastered are totally different from the digital ICworld.
More thanMoore has
a brightfuture
46©2015 | www.yole.fr | Yole Développement
REPORTS COLLECTION
o Yole Développement publishes a comprehensive collection of market & technology reports and patent analysis in:
• MEMS & Sensors
• Imaging
• Medical technologies (MedTech)
• Advanced packaging
• Power electronics
• Compound semiconductors
• OLED, LED & Laser diode
• Semiconductor Manufacturing
• Photovoltaics
• Batteries
o Our reports are unmatched in quality and technology depth and typically include:
• Technology trends and evolution: costs, barriers, roadmaps, etc.
• Supply & value chain analysis: business models, relationships, value flows, etc.
• In-depth analysis of applications and market drivers: challenges, inflection points, etc.
• Market data ($, units, wafer starts, etc.)
o Every year, Yole Développement, System Plus Consulting and Knowmade publish +60 reports.
o Take the full benefit from our Bundle and Annual Subscription offers.
www.i-Micronews.com
47©2015 | www.yole.fr | Yole Développement
OUR 2015 REPORTS PLANNING
MARKET & TECHNOLOGY REPORTS by Yole Développement
o MEMS & SENSORS
− Sensors and Data Management for Autonomous Vehicles
− AlN Thin Film Markets And Applications
− Sensors for Wearable Electronics And Mobile Healthcare
− Status of the MEMS Industry
− Uncooled IR Imagers
− IR Detectors
− High End Gyro, Accelerometers and IMU
− Non-Volatile Memory
o IMAGING & OPTOELECTRONICS
− Camera Module Packaging (Vol 1 : Market & Technology Trends / Vol 2 Teardowns &
Reverse Engineering)
− Uncooled IR Imagers
− Wafer Level Optics
− Status of the CMOS Image Sensors
− Machine Vision
o MEDTECH
− Microfluidic for Sample Preparation
− Microfluidic Applications
− Sensors for Wearable Electronics And Mobile Healthcare
o COMPOUND SEMICONDUCTORS
− High Purity Alumina (HPA)
− Sapphire
− Wide Bandgap Materials For Power Electronics: SiC, GaN (and also Ga2O3, AlN,
Diamond, Graphene… as a trend)
* Reports to be decided within 2015
o LED
− LED Module
− OLED for Lighting
− UV LED
− LED Phosphors Market
o POWER ELECTRONICS
− Power Packaging
− Thermal Management for LED and Power
− Power Electronics for Renewable Energy
− Energy Management For Smart Grid And Smart Cities
− Status of Chinese Power Electronics Industry
− New Technologies For Data Center
− Inverter Market Trends For 2013 – 2020 And Major Technology Changes*
− IGBT Markets And Application Trends
− Power Electronics for HEV/EV*
− Status of Power Electronics Industry
o ADVANCED PACKAGING
− Advanced Packaging in Emerging Markets in China
− Status of the Advanced Packaging Industry
− Supply Chain Readiness for Panel Manufacturing in Packaging
− WLCSP*
− Flip Chip Business Update
− 2.5D & 3DIC Business Update
− Fan-Out and Embedded Business Update
o MANUFACTURING
− Lithography for MEMS, Advanced Packaging and LED
− Thinning & Dicing Equipment for Advanced Packaging, MEMS, Photovoltaics, LED, CMOS
Image Sensors
− Non-Volatile Memory
48©2015 | www.yole.fr | Yole Développement
OUR 2015 REPORTS PLANNING
PATENT ANALYSIS by Knowmadeo Patent Infringement (crossed analysis based on Knowmade and System Plus Analysis expertise)
− MEMS Microphone Applications
− Infrared Imaging
o Patent Investigation (crossed analysis based on Knowmade &Yole Développement expertise)
− Power GaN
− MEMS Gyroscope
− 6-axis & 9-axis Inertial MEMS IMUs
− Microbatteries
− Embedded Active & Passive Packages
− Interposer
− Phosphors for LED
TEARDOWN & REVERSE COSTING by System Plus ConsultingMore than 30 teardowns and reverse costing analysis and cost simulation tools to be published in 2015.
* Reports to be decided within 2015
49©2015 | www.yole.fr | Yole Développement
OUR 2014 PUBLISHED REPORTS LIST
MARKET & TECHNOLOGY REPORTS
by Yole Développement
o MEMS & SENSORS
− Technologies & Sensors for the Internet of Things: Businesses & Market Trends 2014-2024
− MEMS Microphone: Market, Applications and Business Trends 2014
− Status of the MEMS industry
− MEMS & Sensors for Mobile Phones and Tablets
− High End Gyroscopes and Accelerometer Applications
− Inertial MEMS Manufacturing Technical Trends
− New Detection Principles & Technical Evolution for MEMS & NEMS
− 6/9 DOF Applications in Consumer Electronics
− MEMS for RF filters and Antena Switches - BAW / SAW
o IMAGING & OPTOELECTRONICS
− Status of the CMOS Image Sensor Industry
− Uncooled Infrared Imaging Technology & Market Trends
− Silicon Photonics
o MEDTECH
− Point of Care Testing: Applications for Microfluidic Technologies
− Solid State Medical Imaging: X-ray and Endoscopy
o COMPOUND SEMICONDUCTORS
− RF GaN Technology & Market Analysis: Applications, Players, Devices & Substrates 2010-
2020
− SiC Modules, Devices and Substrates for Power Electronics Market
− GaN-on-Si Substrate Technology and Market for LED and Power Electronics
− Power GaN Market
− Graphene Materials for Opto & Electronic Applications
− Sapphire Applications and Market: from LED to Consumer Electronics
o LED
− LED Packaging
− LED Front-End Manufacturing Trends
− LED Front-End Equipment Market
o POWER ELECTRONICS
− Power Electronics for HEV/EV
− Inverters
− Gate Driver Unit Market for Power Transistors
o PHOTOVOLTAICS
− Emerging and Innovative Technology Approaches in the Solar Industry
o ADVANCED PACKAGING
− 3DIC Equipment and Materials
− 3DIC & 2.5D TSV Interconnect for Advanced Packaging - 2014 Business Update
o MANUFACTURING
− Market & Technology Trends in Materials & Equipment for Printed & Flexible Electronics
− Permanent Wafer Bonding for Semiconductor: Application Trends & Technology
PATENT ANALYSIS
by Knowmade− LED Based on Nano-wires Patent Investigation
− GaN on Si Patent Investigation (LED, Power devices and RF Devices)
− New MEMS Devices Patent Investigation
− Non Volatile Memory Patent Investigation
TEARDOWN & REVERSE COSTING
by System Plus ConsultingMore than 30 teardowns and reverse costing analysis and cost simulation tools to be published in 2014.
50©2015 | www.yole.fr | About Yole Développement
MICRONEWS MEDIA
o About Micronews Media
Micronews Media, powered by Yole
Développement, ensures you the best visibility
in the disruptive semiconductor community.
With our services, we help you to reach your
customers worldwide with the media products
they prefer, including our website, e-newsletter,
webcasts, and magazines. Invest in a high added-
value editorial program and get access to Yole
Développement’s network (48 000+ contacts).
o Five supports and channels for your visibility
• A technology magazine to highlight
your visibility with advertisements,
company profiles, product descriptions and
white papers
• A webcast to highlight your expertise and
develop your business identifying
commercial leads
• Articles, advertisements & logo and
banners dedicated to your company, its
products and expertise in @Micronews e-
newsletter and on i-Micronews.com
Focused
community
Identified
contacts
Large
community
Mass contacts
51©2015 | www.yole.fr | About Yole Développement
COMMUNICATION SERVICES
All services listed below are available on–demand.
o i-Micronews.com, the website
Slider – Banners (on English or Japanese websites) – Articles –
Logo and profile as sponsor
o @Micronews, the e-newsletter
Headline article - Tiles
o Custom webcast
Develop your dedicated event with a high added-value program. A
turnkey event withYole support (logistics, promotion, data…)
o Technology Magazines: Custom – Co-produced
Increase your visibility through a dedicated technology magazine
with ads, company profile, product descriptions and white papers.
It can be a custom magazine: your company is the only one to
benefit from it – or a co-produced one: up to 2 companies.
Contacts:
Camille Veyrier ([email protected]) and Clotilde Fabre ([email protected]),
Media & Communication Coordinators.
52©2015 | www.yole.fr | Yole Développement
CONTACT INFORMATION
o Consulting and Specific Analysis
• North America: Steve LaFerriere
Email: [email protected]
• Japan: Yutaka Katano, General Manager, Yole Japan & President, Yole K.K.
Email: [email protected]
• RoW: Jean-Christophe Eloy, President & CEO, Yole Développement
Email: [email protected]
o Report business
• North America: Steve LaFerriere
Email: [email protected]
• Europe: Fayçal El Khamassi, Headquarter Sales Coordination & Customer Service
Email: [email protected]
• Japan & Asia: Takashi Onozawa, Sales Asia & General Manager, Yole K.K.
Email: [email protected]
• Korea: Hailey Yang, Business Development Manager, Korean Office
Email: [email protected]
o Financial services
• Jean-Christophe Eloy, CEO & President
Email: [email protected]
o General
• Email: [email protected]
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