©2014 IBM Corporation
zEnterprise EC12 & BC12 Hardware Overview
Nome: Felipe Lanzillotta GrandolphoEmail: [email protected] Brasil – System and Technology Group (STG)Trainee System zEnterprise
©2014 IBM Corporation
TrademarksThe following are trademarks of the International Business Machines Corporation in the United States and/or other countries.
Notes: Performance is in Internal Throughput Rate (ITR) ratio based on measurements and projections using standard IBM benchmarks in a controlled environment. The actual throughput that any user will experience will vary depending upon considerations such as the amount of multiprogramming in the user's job stream, the I/O configuration, the storage configuration, and the workload processed. Therefore, no assurance can be given that an individual user will achieve throughput improvements equivalent to the performance ratios stated here. IBM hardware products are manufactured from new parts, or new and serviceable used parts. Regardless, our warranty terms apply.All customer examples cited or described in this presentation are presented as illustrations of the manner in which some customers have used IBM products and the results they may have achieved. Actual environmental costs and performance characteristics will vary depending on individual customer configurations and conditions.This publication was produced in the United States. IBM may not offer the products, services or features discussed in this document in other countries, and the information may be subject to change without notice. Consult your local IBM business contact for information on the product or services available in your area.All statements regarding IBM's future direction and intent are subject to change or withdrawal without notice, and represent goals and objectives only.Information about non-IBM products is obtained from the manufacturers of those products or their published announcements. IBM has not tested those products and cannot confirm the performance, compatibility, or any other claims related to non-IBM products. Questions on the capabilities of non-IBM products should be addressed to the suppliers of those products.Prices subject to change without notice. Contact your IBM representative or Business Partner for the most current pricing in your geography.This information provides only general descriptions of the types and portions of workloads that are eligible for execution on Specialty Engines (e.g., zIIPs, zAAPs, and IFLs) ("SEs"). IBM authorizes customers to use IBM SE only to execute the processing of Eligible Workloads of specific Programs expressly authorized by IBM as specified in the “Authorized Use Table for IBM Machines” provided at www.ibm.com/systems/support/machine_warranties/machine_code/aut.html (“AUT”). No other workload processing is authorized for execution on an SE. IBM offers SE at a lower price than General Processors/Central Processors because customers are authorized to use SEs only to process certain types and/or amounts of workloads as specified by IBM in the AUT.
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DirMaintECKDHiperSocketsIBM*
IBM (logo)*OMEGAMON*Performance Toolkit for VMRACF*
REXXSystem z*zEnterprise*z/VM*
©2014 IBM Corporation
“The postings on this site / presentation are my own and don’t necessarily represent IBM’s positions, strategies or opinions.”
©2014 IBM Corporation
Agenda:
– Sistemas Operacionais e Processadores;– System z Gerações;– zEC12 Hardware;– zBC12 Hardware;– Chips zEC12 x zBC12;– Gerenciamento de Hardware;– Features de I/O;– Referência de Cliente;
©2014 IBM Corporation
N-4N-4
z990•Anunciado em 5/2003•1.2 GHz•32 Cores caracterizáveis•CP, IFL, ICF, zAAP•Memória de 256 GB
z890•Anunciado em 4/2004•1.0 GHz•4 Cores caracterizáveis•CP, IFL, ICF, zAAP•Memória de32 GB Memory
N-3N-3
z9 Enterprise Class•Anunciado em 7/2005•1.7 GHz•54 Cores caracterizáveis•CP, IFL, ICF, zAAP, zIIP•Memória de 512 GB
z9 Business Class•Anunciado em 4/2006•1.4 GHz•7 Cores caracterizáveis•CP, IFL, ICF, zAAP, zIIP•Memória de 64 GB
N-5N-5
z800•Anunciado em 2/2002•625 MHz•4 Cores caracterizáveis•CP, IFL, ICF•Memória de 32 GB
z900•Anunciado em 10/2000•770 MHz•16 Cores caracterizáveis •CP, IFL, ICF•Memória de 64 GB
N-2N-2
z10 Enterprise Class•Anunciado em 2/2008•4.4 GHz•64 Cores caracterizáveis•CP, IFL, ICF, zAAP, zIIP•Memória de 1.5 TB
z10 Business Class•Anunciado em 10/2008•3.5 GHz•10 Cores caracterizáveis• 5 GCP•CP, IFL, ICF, zAAP, zIIP•Memória de 248 GB
N-1N-1
zEnterprise 196•Anunciado em 22/07/2010•5.2 GHz•80 Cores caracterizáveis•CP, IFL, ICF, zAAP, zIIP•Memória de 3 TB
zEnterprise 114•Anunciado em 12/07/2011•3.8 GHz•10 Cores caracterizáveis •5 GCP•CP, IFL, ICF, zAAP, zIIP•Memória de 256 GB
IBM System z - Gerações
©2014 IBM Corporation
zEnterprise EC12
• zEC12 - Lançada em 28 de Agosto de 2012
– RAIM como design de memória– Memória mínima de 32 GB– Até 768 GB por book– 101 Cores rodando a 5.5 GHz– Até 3 TB por sistema e até 1 TB por LPAR
• 32 GB HSA gerenciado separadamente
©2014 IBM Corporation
For IBM and Business Partner Education Use Only prior to Announcement
Baterias Internas
(opcional)
Fontes de
Energia
2 x SupportElements
PCIe I/O drawers(Máximo de 5 por
zEC12)
Overhead Power
(opcional)
Processor Books com Flexible Support Processors (FSPs), PCIe and HCA I/O fanouts
Radiador N +1 bombas, ventiladores e motores
Cabos PCIe I / O de interconexão,cabos Ethernet e placas de controle do SFP cage
Overhead I/O feature é um co-requisito para a opção de overhead power
zEC12 com Resfriamento a ar baseada em radiador – (Model H89 ou HA1) Vista Frontal
©2014 IBM Corporation
For IBM and Business Partner Education Use Only prior to Announcement
Baterias Internas
(opcionais)
Fontes de
energia
I/O cageCarried
Forward Unidades de Resfriamento a água N+1
SupportElements
PCIe I/O drawer
Processor Books com Flexible Support Processors (FSPs), PCIe and HCA I/O fanouts
Cabos PCIe I / O de interconexão,cabos Ethernet e placas de controle do SFP cage
zEC12 Resfriada a Água (Upgraded de uma z196) - (Model H89 ou HA1)
©2014 IBM Corporation
zEnterprise EC12 - Modelos
Memória
Memória
MCM
Frente
Conector de resfriamento
3 x Fontes deenergia DCA n+1(Distributed Converter Assemblies)
16 DIMMs( 4 GB, 16 GB,ou 32 GB )
14 DIMMs
©2014 IBM Corporation
zEnterprise EC12 – MCM (Multi Chip Module)
PU 0PU 2
SC 0
SC 1
PU 1
PU 5PU 3 PU 4
Cada PU chip possui 6 cores com Cache L1 e L2 internos, ainda dividindo 2 SC chips de Cache L3 48 MB.
Cada MCM posui 2 SC chips de Cache L4 com 384 MB, que são divididos pelos PU Chips.
©2014 IBM Corporation
zEnterprise BC12
zBC12 - Lançada em 23 de Julho de 2013 – 13 Cores rodando a 4.2 GHz– Até 512 GB por sistema
• Sistema mínimo = 8 GB (Modelo H06), 16 GB (Modelo H13)
• 16 GB HSA gerenciado separadamente• RAIM• Máximo para uso do cliente 496 GB
(Modelo H13)
© 2014 IBM CorporationzBC12TLLB14
Bateria interna
(opcionais)
Fontes de
Energia
I/O Drawer
2 x CPC Drawers, Memória & HCAs
PCIe I/O drawers
Vista Traseira
Vista Frontal
2 x Support
Elements
zBC12 Model H13
©2014 IBM Corporation
zEnterprise BC12 - Modelos
Processor SCM
Processor SCM
Storage Control SCM
Slots for 5 DIMMs
Slots for 5 DIMMs
2 x DCA n+1
©2014 IBM Corporation
zEnterprise BC12 – SCM (Single Chip Module) Cache
– Cache L1 e L2 compartilhado por core
– Cache L3 de 24MB compartilhado por chip
– Cache L4 de 192MB compartilhado por CPC-drawer
Mais processadores no mesmo espaço de uma z114
– 6 cores por PU chip
– Mesmo consumo de energia que a z114– 4.2 GHz por core
L3
C 0
L3
C 1
GXMC
U
Core0
Core1
Core2
Core3
Core4
Core5
© 2014 IBM CorporationzBC12TLLB17
MCM– MCM : 96mm x 96mm– 6 PU chips por MCM
• 6 core chips com 4, 5 ou 6 cores ativos• PU Chip : 23.7 mm x 25.2 mm • 5.5GHz
– 2 SC chips por MCM• 384 MB cache L4 per MCM (por book) • SC Chip : 26.72 mm x 19.67 mm
– Até 4 MCMs por System
zEC12 Multi Chip Module (MCM)
PU SCM– SCM : 50mm x 50mm– Hexa core chip com 4 ou 5 cores ativos– 2 PU SCMs para H06 e 4 PU SCMs para H13– PU Chip: 23.7 mm x 25.2 mm– 4.2 GHz
SC SCM– 1 SC SCM para H06, 2 SC SCMs para H13– 192 MB cache L4 por CPC Drawer– SC Chip : 26.72 mm x 19.67 mm
zBC12 Single Chip Module (SCM)
PU 0PU 2
SC 0
SC 1
PU 1
PU 5PU 3 PU 4
zBC12 SCM vs zEC12 MCM
© 2014 IBM CorporationzBC12TLLB18
Uma HMC pode se comunicar com todos as outras HMCs
– Controle de qualquer servidor em qualquer site.
– No caso de Ensemble existe a necessidade de um HMC secundário
O SE possui uma relação de backup ativo com o segundo SE
– Controle dedicado a um único servidor
HMCHMC HMC
HMC
HMCs e SEs
©2014 IBM Corporation
I/O features
Flash Express FICON Express8SCrypto Express 4S
10km LX Feature– 10km – One slot in the PCIe I/O
Drawer– 2Gbps,4Gbps e 8Gbps
SX Feature– 2Gbps até 500 metros– 4Gbps até 380 metros– 8Gbps até 150 metros
– Disponível em pares de placas
– Memória SSD de 1.4 TB por par
– Máximo de 4 pares por máquina
– RAID 10
– Acelerador para operações de criptografia usando SSL/TLS
– Co-processador– De 1 até 16 features por
máquina
©2014 IBM Corporation
I/O features
IBM zEDC Express 10 GbE RoCE OSA- Express 5S
– Prover acelereção para compressão e decompressão dados
– De 1 até 5 features por sistema
– Uma placa pode ser divida por até 15 LPARs
– Exclusiva para z/OS
– Reduzir o consumo de CPU por aplicações TCP/IP
– De 1 até 16 placas por máquina
– Cada placa deve ser dedicada a uma LPAR
10GbE LR Feature 10GbE SR Feature GbE LX Feature GbE SX Feature 1000BASE-T Feature
© 2013 IBM Corporation
22
Desafio
Para suportar a crescente demanda, a Algar Telecom precisava de uma infraestrutura forte e flexível, que entregasse alta disponibilidade e confiabilidade para os serviços de telecomunicações.
Solução
A Algar Telecom consolidou mais de 90 servidores distribuídos em servidores virtuais Linux, usando z/VM em uma única IBM zEnterprise 196, utilizando também uma IBM zEnterprise BladeCenter Extension.
Benefícios
Entregou uma plataforma confiável e flexível para os serviços de ponta, que : Reduziram os custos do data center em 70% Reduziu os esforços em manutenção em 65% Impulsionou a eficiência operacional em 30%
“Transformamoscompletamente nossainfraestrutura e a formacomo a gerenciamos com oIBM zEnterprise System.Como consequência,estimamos que nossaeficiência operacionalaumentou em pelo menos30%.”
Rogério Okada, Gerente de TIAlgar Telecom
Referência de cliente – Algar Telecom
©2014 IBM Corporation
Siglas
CP – Central Processor zEDC - zEnterprise Data Compression
zAAP - System z Application Assist Processors OSA - Open System Adapter
zIIP - System z Integrated Information Processor RoCE – Remote Direct Access over Converged
ICF – Internal Coupling Facility Ethernet
SAP – System assist processor CICS – Costumer Information Control System
IFL – Integrated Facility for Linux IMS – Information Management System
RAIM – Redundant Array of Independent Memory
HSA – Hardware System Area
PCIe - Peripheral Component Interconnect Express
MCM – Multi Chip Module
SCM – Single Chip Module
DIMM - Dual Inline Memory Modules
DCA – Distributed Convertor Assemblies
PU – Processor Unit
SC – Storage Control
CPC – Central Processor Complex
HMC – Hardware Management Console
SE – Support Elements
FICON – Fiber Channel Connection
©2014 IBM Corporation
Referências Bibliográficas
IBM zEnterprise BC12 Technical Guide ( http://www.redbooks.ibm.com/abstracts/sg248138.html?Open )
IBM zEnterprise EC12 Technical Guide ( http://www.redbooks.ibm.com/abstracts/sg248049.html?Open )
Estudo de caso Algar Telecom ( http://www-01.ibm.com/common/ssi/cgi-bin/ssialias?subtype=AB&infotype=PM&appname=STGE_ZS_ZS_BRPT&htmlfid=ZSC03161BRPT&attachment=ZSC03161BRPT.PDF )