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The top documents tagged [d chips]
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d chips
CS61C L34 Virtual Memory I (1) Garcia, Spring 2007 © UCB 3D chips from IBM IBM claims to have found a way to build 3D chips by stacking them together.
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3D Interconnect: Architectural Challenges and Opportunities UC SANTA BARBARA Tim Sherwood.
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Company Overview Dec., 2004. 2 Matrix Semiconductor: Commercializing 3-D Integrated Circuits Technology: Breakthrough Technology First high-volume.
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Emerging Technologies: A CompSci Perspective UC SANTA BARBARA Tim Sherwood.
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Vertexing for SID status N. B. Sinev University of Oregon, Eugene 1 April 23, 2015,A LCW2015, Japan Nick Sinev.
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45nm Processors & Beyond A Presentation On By Ajaypal Singh Dhillon Kurukshetra university.
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Emerging Technologies: A CompSci Perspective
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3D Interconnect: Architectural Challenges and Opportunities
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3-Dimensional IC Fabrication
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