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The top documents tagged [power layers]
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power layers
Packaging. Packaging Requirements Desired package properties Electrical: Low parasitics Mechanical: Reliable and robust Thermal: Efficient heat removal.
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Introduction to CMOS VLSI Design Lecture 20: Package, Power, and I/O Credits: David Harris Harvey Mudd College (Material taken/adapted from Harris’ lecture.
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Z. Feng MTU EE4800 CMOS Digital IC Design & Analysis 13.1 EE4800 CMOS Digital IC Design & Analysis Lecture 13 Packaging, Power and Clock Distributions.
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