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The top documents tagged [sensor chip]
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sensor chip
Surface plasmon resonance spectroscopy for characterisation of membrane protein – ligand interactions and its potential for drug discovery
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biacore s200
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30 April 20151 Prepared by Avinash Kumar Chauhan B.Tech (IT) 4 th Year Roll No : 0600115013 Virtual Keyboard.
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Results of the ASIC Test New Developments Next Steps Project Meeting.
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LOW COST AND LOW MASS BUMP BONDING SAMI VAEHAENEN – CERN PH-ESE 1.
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History of Digital Camera By : Dontanisha Williams P2.
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Teacher: Kenji Tachibana Digital Photography I. Art 115 – DOF 8 Slides Copyright © 2003 – 2009 Kenji Tachibana.
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EMERGING FINE-PITCH BUMP BONDING TECHNIQUES SAMI VAEHAENEN – CERN PH-ESE LCD-WG4 Vertex detector technology meeting 3-September-2010 1.
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Computer Vision Geometric Camera Models and Camera Calibration.
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Low cost and low mass bump bonding
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Advisor : Ru-Li Lin Advisee :Shih-Min Chen Southern Taiwan University of Science and Technology, Department of Mechanical Engineering, Tainan, TAIWAN Date.
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Welcome to Heart Guard Technologies New Product Presentation
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