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The top documents tagged [thinned wafers]
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thinned wafers
Microwave Characterization and Modeling of High Aspect Ratio Through-Wafer Interconnect Vias in Silicon Substrates
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Pre-bond TSV Test Optimization and Stacking Yield Improvement of 3D ICs Bei Zhang Final Exam Department of Electrical and Computer Engineering Auburn University,
215 views
© Mircea Stan, Kevin Skadron, David Brooks, 2002 Overview 1.Motivation (Kevin) 2.Thermal issues (Kevin) 3.Power modeling (David) 4.Thermal management (David)
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1 IC Wafer Thinning Desired thickness goal for front-end ICs on modules is 150 Prototype results obtained so far have used mechanical thinning(grinding)
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Pre-bond TSV Test Optimization and Stacking Yield Improvement of 3D ICs Bei Zhang Final Exam
27 views