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The top documents tagged [tinlead solder]
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tinlead solder
LOW COST AND LOW MASS BUMP BONDING SAMI VAEHAENEN – CERN PH-ESE 1.
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EMERGING FINE-PITCH BUMP BONDING TECHNIQUES SAMI VAEHAENEN – CERN PH-ESE LCD-WG4 Vertex detector technology meeting 3-September-2010 1.
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Low cost and low mass bump bonding
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Insitu Internal Epoxy Coating Spec
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SMT - Rework on the PTH
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