Basic Nanotechnology · ADF Scientific Computing and Modeling NV (SCM) AMBER Peter Kollman, UCSF...

transcript

16/26/03

Basic NanotechnologyBasic Nanotechnology

What’s the Technology Landscape?

26/26/03

State of basic researchState of basic research

36/26/03

Highlights - MetrologyHighlights - MetrologyHighlights of major accomplishments in past 15-20 years

Metrology: Measurements & images & motion can be controlled to 10 pico-metersWe can see what we’re doing

46/26/03

Highlights - ModelingHighlights - ModelingHighlights of major accomplishments in past 15-20 years

Modeling: Software can now successfully model the dynamics of most molecularinteractions under numerous static and dynamic conditions.

We can simulate what we want to build

56/26/03

Highlights - ManufacturingHighlights - ManufacturingHighlights of major accomplishments in past 15-20 years

Manufacturing: Certain processes exist to actually fabricate nanostructures.We can build some of what what we want to build

66/26/03

Highlights - MEMSHighlights - MEMSHighlights of major accomplishments in past 15-20 years

MEMS: Fabrication of micro-meter scale devices is routine.We can build much of what we want at larger scales.

76/26/03

Highlights - PolicyHighlights - PolicyHighlights of major accomplishments in past 15-20 years

Policy: There is a growing consensus of what nanotechnology is.We almost know what we’re talking about.

86/26/03

Tools & TechniquesTools & TechniquesCurrent foundation of research tools and techniques

• Microscopy• Metrology• Simulation• Crystallography• Interferometry• Chemical Synthesis• Plasma & other regimens• Lithography

96/26/03

MicroscopyMicroscopyCurrent foundation of research tools and techniques

• Microscopy

– Acoustic / Ultrasonic– Fluorescent / UV– Laser / Confocal– Polarizing– Portable Field– Scanning Electron Microscope (SEM)– Scanning Probe / Atomic Force (SPM / AFM)– Transmission Electron Microscope (TEM)– Scanning Near-Field Optical Microscope (SNOM)

106/26/03

MetrologyMetrologyCurrent foundation of research tools and techniques

• Metrology

– Critical Dimension Measurement– Film Thickness Testers– Resistivity/Electromagnetic Testers – Stress Measurement – Wafer Inspection Tools– Quantum measurements

116/26/03

SimulationSimulationCurrent foundation of research tools and techniques

• Simulation

– molecular modeling– kinetic modeling– quantum effect modeling– semiconductor effects

126/26/03

CrystallographyCrystallographyCurrent foundation of research tools and techniques

• Crystallography

– x-ray

136/26/03

InterferometryInterferometryCurrent foundation of research tools and techniques

• Interferometry

– optical– x-ray– quantum (Stern Gerlach)

146/26/03

Chemical SynthesisChemical SynthesisCurrent foundation of research tools and techniques

• Chemical Synthesis

– organic– biological– genomic

156/26/03

Plasma, et alPlasma, et alCurrent foundation of research tools and techniques

• Plasma & other regimens

– coatings– materials fabrication– surface treatments

166/26/03

LithographyLithographyCurrent foundation of research tools and techniques

• Lithography

– manufacturing– prototyping/testing

176/26/03

Recent Progress - AFMSRecent Progress - AFMSSample of recent progress - tools - AFM Array

186/26/03

Recent Progress - SoftwareRecent Progress - Software

AbM Oxford MolecularADF Scientific Computing and Modeling NV (SCM)AMBER Peter Kollman, UCSFAMPAC A. Holder, Semichem, Inc., 7204 Mullen, Shawnee, KS 66216AMSOL Chris Cramer, D. Truhlar, Univ. of MinnesotaAPEX-3D http://www.dcl.co.il/DCL Systems International, Ltd.AutoDock Garrett M. Morris, David S. Goodsell, Ruth Huey, William E. Hart, Scott

Halliday, Arthur J. OlsonBabel Pat Walters, Univ. of ArizonaCAChe CAChe Scientific, Inc. (Oxford Molecular)Cambridge Structural Database (CSD) Cambridge Crystallographic Data CentreCAVEAT Paul Bartlett, UC BerkleyCHARMm Molecular Simulations, Inc.CHARMM Documentation: Rick Venable, FDA/CBER; WWW site: M. Karplus, Harvard

Univ., Dept. of Chemistry, 12 Oxford Street, Cambridge, MA 02138;Chem-X Chemical Design, Inc., 200 Route 17 South, Ste. 120, Mahwah, NJ 07430ChemDBS-3D Chemical Design, Inc., 200 Route 17 South, Ste. 120, Mahwah, NJ 07430CHIME MDL Information Systems, Inc.ClogP BiobyteCMR BiobyteCLIP Institute of Medicinal Chemistry, Univ. of LausanneComposer Tripos, Inc.CONCORD Tripos, Inc.CS ChemOffice Pro CambridgeSoft Corp.DGEOM 95 QCPE, Indiana Univ.DGII http://www.chem.indiana.edu/qcpe.htm, Indiana Univ.DISCO Tripos, Inc.Discover Molecular Simulations, Inc.

DMol Molecular Simulations, Inc.DOCK Irwin Kuntz, UCSFDSSP C. Sander, EMBLEGO H. Heller, Ludwig Maximilians Univ., MunichGALAXY AM Technologies, incGAMESS M. Gordon, Iowa State Univ.GASP Tripos, Inc.Gaussian Gaussian, Inc., 4415 Fifth Ave., Pittsburgh, PA 15213 GEMM B.K. Lee, National Cancer Institute, NIHGERM D.E. Walters, Chicago Medical School, Department of Biological Chemistry

3333 Green Bay Road, North Chicago, IL 60064gOpenMol Center for Scientific ComputingGRAMM Ilya A. Vakser, Rockefeller Univ.GRASP A. Nicholls, Columbia Univ.GROMOS Biomos B.V., The NetherlandsGROMACS H.J.C. Berendsen, Univ. of Groningen, The NetherlandsHASL eduSoft, P.O. Box 1811, Ashland, VA 23005HBPLUS I.K. McDonald, University College, LondonHINT eduSoft, P.O. Box 1811, Ashland, VA 23005Homology Molecular Simulations, Inc.HONDO IBM, Neighborhood Road MLMA/428, Kingston, NY 12401HyperChem HyperCube, Inc.ICM MolSoft, LLCIditis Oxford MolecularInsight II Molecular Simulations, Inc.ISIS MDL Information Systems, Inc.Jaguar S chrödinger, Inc.Leapfrog Tripos, Inc.

Sample of recent progress - software techniques - molecular modeling

196/26/03

Recent Progress - MaterialsRecent Progress - MaterialsSample of recent progress - materials

• Films– Plastic semiconductors

• Polycrystalline– Low cost photovoltaics

• Nanocomposites– Anti-bacteria soap

• Patterned structures– Nanoscale magnetic dots and wires

• Bulk structures– Cutting tools

206/26/03

Recent Progress - ElectronicsRecent Progress - Electronics

Sample of recent progress - electronics

• December 4, 2002: Toshiba and SonyAnnounce 65-Nanometer CMOS ProcessTechnology

• January 6, 2003: researchers at the Universityof Toronto have invented a tiny circuit that asingle electron can activate

216/26/03

Recent Progress Energy/PowerRecent Progress Energy/Power

ATP motion system– cellular motion power system

Fuel Cells– 10 X capacity of a Lithium Battery

226/26/03

Recent Progress – Life SciencesRecent Progress – Life SciencesBiochip

236/26/03

Grand ChallengesGrand ChallengesNNI

Nanostructured materials "by design"Nanoelectronics, optoelectronics and magneticsAdvanced healthcare, therapeutics, diagnosticsEnvironmental improvementEfficient energy conversion and storageMicrocraft space exploration and industrializationCBRE Protection and Detection (revised in 2002)Instrumentation and metrologyManufacturing processes

246/26/03

Grand ChallengesGrand ChallengesNNI

Shrinking the entire contents of the Library of Congress in a device the size of a sugar cubethrough the expansion of mass storage electronics to multi-terabit memory capacity thatwill increase the memory storage per unit surface a thousand fold

Making materials and products from the bottom-up, that is, by building them up from atoms andmolecules. Bottom-up manufacturing should require less material and pollute less

Developing materials that are 10 times stronger than steel, but a fraction of the weight formaking all kinds of land, sea, air and space vehicles lighter and more fuel efficient

Improving the computer speed and efficiency of minuscule transistors and memory chips byfactors of millions making today's Pentium IIIs seem slow

Using gene and drug delivery to detect cancerous cells by nanoengineered MRI contrast agentsor target organs in the human body

Removing the finest contaminants from water and air to promote a cleaner environment andpotable water

Doubling the energy efficiency of solar cells

256/26/03

Pace of ProgressPace of ProgressIn many new technologies, it is common to overestimate what can be

done in five years' time, and to underestimate what can be done in 50years' time.

266/26/03

BreakBreak

276/26/03

Primer on manufacturing processes

286/26/03

Primer on manufacturing processesPrimer on manufacturing processes• — Bottom-up self assembly (wet chemistry)

– intrinsic, autonomous– biomimetic, controlled

• — Top-down assembly (lithography and derivatives)– dip-pen lithography– soft lithography and nanoscale printing– e-beam and deep UV lithography

• — Other production processes– vapor deposition– evaporation– combustion– thermal plasma– milling– cavitation– coating (spin or dip)– thermal spray– electrodeposition

296/26/03

Bottom-up self assemblyBottom-up self assemblyUnderstand and control the intramolecular

quantum behavior of specifically designed andsynthesized molecules

Using a surface to localize and stabilize them

To interconnect, assemble and test nano-devicesand nano-machines starting from atomic ormolecular parts

306/26/03

Self AssemblySelf AssemblyVon Neumann's universal constructor ~500,000Internet worm (Robert Morris, Jr., 1988) ~500,000Mycoplasma genitalium 1,160,140E. Coli 9,278,442Drexler's assembler ~100,000,000Human ~6,400,000,000NASA Lunar Manufacturing Facility over 100,000,000,000

-Ralph C. Merkle

main(){char *c="main(){char *c =%c%s%c;printf(c,34,c,34);}";printf(c,34,c,34);}

316/26/03

intrinsic, autonomousintrinsic, autonomousSelf assembly mechanisms are inherent

within the structures

Self assembly occurs without any externalforces or controls

i.e. crystals

326/26/03

biomimetic, controlledbiomimetic, controlledUsing organic like processes, or organisms, to

create new structures as a controlledmanufacturing process

“biomimetic carpentry”

336/26/03

Top-down assemblyTop-down assemblyImposes a structure on the system

through the definition of patterns andtheir creation from larger parts

346/26/03

LithographyLithography

356/26/03

366/26/03

Resolution to 65 nm(10 nm with x-rays)

Vacuum environment

Multiple layer writing

Current standard for semiconductor industry

376/26/03

386/26/03

dip-pen lithographydip-pen lithography

396/26/03

dip-pen lithographydip-pen lithography

Resolution 10-15 nm

Liquid environment

Multiple pen writing

406/26/03

soft lithography & nanoscale printingsoft lithography & nanoscale printing

416/26/03

soft lithography & nanoscale printingsoft lithography & nanoscale printing

Resolution 100 nm

Liquid environment

Wide areas & rapidproduction rates

A stamp wasmolded off themaster and usedfor printingalkanethiols onto agold layer, followedby a selective etchto develop thepattern.

IBM Zurich

426/26/03

e-beam and deep UV lithographye-beam and deep UV lithography

436/26/03

e-beam and deep UV lithographye-beam and deep UV lithography

Resolution 20 nm

Vacuum environment

Slow writing speed

Multiple beam technologiesin development

Direct write & directexposure

446/26/03

Electromagnetic SpectrumElectromagnetic Spectrum

456/26/03

Other production processesOther production processes

466/26/03

vapor depositionvapor depositionDeposition of material transferred from its source to the substrate

without changing its chemical composition

476/26/03

vapor depositionvapor depositionPrimarily a coating process

As low as 3 nm/minute

Can be used for surface chemistry

Can coat almost anything

Used extensively in semiconductor fabrication

486/26/03

evaporationevaporationHeating a material in a vacuum until it melts and evaporates

condensing on a cooler surface

496/26/03

evaporationevaporationPrimarily a coating process for materials that can withstand high

temperature and vacuum

Minimum rate or thickness is atomic

Can coat almost anything

Used extensively in semiconductor fabrication

'The Sounds of Earth' copper with goldplating placed on Voyager. Two hours ofsound and movie plus some digital data:pictures and a message from JimmyCarter.

506/26/03

combustioncombustion

Combustion wire process

Combustion powder process

Burning a material such that the products of its combustioncondense on a cooler surface.

516/26/03

combustioncombustionPrimarily a coating process for materials that can have unique

properties after burning, or to coat materials that cannot becoated in other ways

Also used to create nano-scale materials in bulk

Relatively limited use. High promise for production of bulknanomaterials

526/26/03

thermal plasmathermal plasmaPlasma is frequently referred to as the 4th state of matter-

solid, liquid, gas, and plasma

A plasma is an ionized gas comprised of molecules, atoms, ions (in theirground or in various excited states), electrons, and photons.

Overall, a plasma is electrically neutral.

A thermal plasma is a plasma in Local Thermodynamic Equilibrium:

(Te = Th), > 104 Kelvinswhere Te : electron temperature

Th : heavy particle temperature)

Typically operated in high pressure oratmospheric pressure

536/26/03

thermal plasmathermal plasmacreating chemical reactions in a high-purity atmosphere

creating rapid large area nano-scale coatings

creating nano-scale particles

creating nano-materials in large quantities

546/26/03

millingmillingAtomic Sand Blaster

submicrometer particles are accelerated to bombard thesurface of a substrate.

They remove any material not protected by a resistmaterial

556/26/03

millingmillingPrimarily an etching process, but can

be used to create new materials

Feature resolution around 50 nm

Can be used for surface chemistry

Can operate faster than e-beam insome processes, especially highatomic # substrates

Has little backscatter, unlike e-beam(increases contrast)

566/26/03

cavitationcavitation the formation, growth, and implosive collapse

of vapor bubbles in a liquid created byfluctuations in fluid pressure

576/26/03

cavitationcavitationA highly controllable tool for the

synthesis of nanostructuredcatalysts, ceramics, andpiezoelectrics in high phasepurities

Resolution of ~ 130 nanometers

Can be used to initiate production ofspecialized nanomaterials

May operate faster than e-beam orion-beam

586/26/03

coating (spin or dip)coating (spin or dip)A means of inexpensively applying a thin film to a

surface with high precision.

Material must be liquid.

Does not require vacuum, heat or other processes thatcan destroy material chemistry

596/26/03

coating (spin or dip)coating (spin or dip)Routinely used to disperse photo-resist for

semiconductor manufacturing.

Can produce well dispersed mix of nanostructureswithin coatings

Nanostructures can be uniformly grown during the spinprocess

606/26/03

thermal spraythermal sprayTakes the source of energy such as inflammable and ionized gas,

explosive gas, electric energy

Heats the powder of the thermal spray coating material (metal,nonmetal, ceramics, ceramicmetal, plastic)

Melts it or strongly blows the particles

Types:PlasmaHVOF (high velocity oxygen fuel)Wire FlamePowder FlameElectric Arc Spray

616/26/03

thermal spraythermal spraycreating chemical reactions in an arbitrary atmosphere

creating rapid large area nano-scale coatings

creating nano-scale particles

creating nano-materials in large quantities

626/26/03

electrodepositionelectrodeposition

the deposition of a substance on anelectrode by the action of electricity

636/26/03

electrodepositionelectrodepositionPrimarily a coating process for materials that can withstand liquids andcan be electrically charged temperature and vacuum

Minimum rate or thickness is highly controllable

Can deposit complex chemistries

Used extensively in semiconductor fabrication

646/26/03

BreakBreak

656/26/03

Commercial Activity

666/26/03

Small Dreams?Small Dreams?

Get your facts first,

and then you can distort them as much as you please.

-Mark Twain

686/26/03

Labs - NNI fundedLabs - NNI fundedInstitution Partners Title Topics Funding 1st

YR $MFunding5 Yrs $M

NorthwesternUniversity

Argonne National Lab; HaroldWashington College; U. Illinois,Urbana-Champaign; U. Chicago;Chicago Museum of Science andIndustry; Lawrence Livermore; NASA;Dupont; Exxon Mobil; Rohm and Hass;Motorola; IBM; Unilever

NSEC: IntegratedNanopatterning andDetectionTechnologies

chem-bio recognition,polymers, DNA / RNAdetection methods; surfacedirected assembly; sensors

2.303 11.102

CornellUniversity-Endowed

Brigham Young U.; Colgate U.; U.New Mexico; Pomona College

NSEC: NanoscaleSystems in InformationTechnologies

Nano-electronics, -photonics, -magnetics, enabling science

2.390 11.590

HarvardUniversity

MIT; Princeton; UC Santa Barbara;Boston Museum of Science;Brookhaven National Lab; Oak RidgeNational Lab; Sandia National Lab;Delft U., The Netherlands; U. Tokyo

NSEC: Science ofNanoscale Systems andtheir DeviceApplications

scanning probes, coherentelectronics, heterostructures

2.368 10.798

ColumbiaUniversity

Barnard College; CUNY City College;Rowan U.; Lucent; IBM

NSEC: ElectronicTransport in MolecularNanostructures

charge transport in molecules,carbon nanotubes interfaces,assembly

2.245 10.845

WilliamMarsh RiceUniv

Oak Ridge National Lab; TDAResearch Inc.; GeosciencesEnvironmental Lab, France

NSEC: Nanoscience inBiological andEnvironmentalEngineering

fullerines, nanomaterials incells, bioengineering,environmental applications

2.108 10.540

RensselaerPolytech Inst

U. Illinois, Urbana-Champaign; LosAlamos National Lab; Colleges:Morehouse, Mount Holyoke, Smith,Spelman, Wiliams; Industry:ABB,Albany International, IBM,Eastman Kodak, Philip Morris; State ofNew York

NSEC: DirectedAssembly ofNanostructures

gels amd polymernanocomposites;nanostructured biomolecularmaterials; theory

2.000 10.000

13.414 64.875

696/26/03

Labs - National Nanofabrication Users NetworkLabs - National Nanofabrication Users NetworkCornell Nanofabrication Facility Prof. Sandip Tiwari, Director Cornell University, Knight Laboratory Ithaca, New York 14853-5403 Voice: (607) 255-2329 Fax: (607) 255-8601 URL: http://www.cnf.cornell.edu/

Materials Science Center for Excellence Prof. Gary Harris, Director Howard University School of Engineering 2300 Sixth St, NW Washington, D.C. 20059 Voice: (202) 806-6618 Fax: (202) 806-5367 URL: http://www.msrce.howard.edu/~nanonet/NNUN.HTM

PSU Nanofabrication Facility Prof. Stephen Fonash, Director 189 Materials Research Institute The Pennsylvania State University University Park, PA 16802 Voice: (814) 865-4931 Fax: (814) 865-3018 URL: http://www.nanofab.psu.edu

Stanford Nanofabrication Facility Dr. Yoshio Nishi, Director Stanford University CIS 103, Via Ortega St Stanford, CA 94305 Voice: (650) 723-9508 Fax: (650) 725-0991 URL: http://www-snf.stanford.edu/

UCSB Nanofabrication Facility Prof. Mark Rodwell, Director University of California at Santa Barbara Department of Electrical & Computer Engineering 5153 Engineering I Santa Barbara, CA 93106 Voice: (805) 893-3244 Fax: (805) 893-3262 URL: http://www.nanotech.ucsb.edu/

Provides users with access to some of the mostsophisticated nanofabrication technologies in theworld with facilities open to all users fromacademia, government, and industry.

706/26/03

Lab EquipmentLab Equipment

• Fabrication examples– semiconductor– CNT

• Microscopy examples• nanopositioning examples• software examples

716/26/03

Semiconductor - Industry ElementsSemiconductor - Industry Elements

• $42 Billion/year (equipment & materials)• over 1,000 U.S. companies

726/26/03

Semiconductor - Equipment TypesSemiconductor - Equipment Types300-mm ComponentsAsherAutomation/RobboticsbearingsBlow-Off GunsBrushes,Pads,RollersCarbon Dioxide Cleaning

SystemsCeramic AccessoriesChemical Vapor DepositionChemical-Mechanical

PolishingChillerCleaning AccessoriesCleaning

Systems,Batch/SingleCleanroom OvensCluster ToolsCMP ConsumablesDepositionDI Water Heaters

Diffusion/Oxidation/AnnealingDry EtchDry-Clean Systems(gas-phase,etc)ElectropolishingEpitaxyFurnacesHeat ExchangersIn Situ CleanersIn Situ MonitorsIon BeamIon ImplantationlaserLithography, DUV/g/i-lineMegasonic/Ultrasonic SystemsMinienvironment,Automated/ManualMonitoring/Analysis ToolsNon-CFC Cleaning SystemsOrganic SolventsPellicles/Mounting EquipmentPhotomask Equipment/MaterialsPhotoresist ProcessingPhotoresist StrippingPhysical Vapor DepositionPiping/Tubing,Stainless Steel/OtherPlasma Cleaning Systems

Post-CMP Cleaning SystemsPower Supplies,Accessoriespressure gagesPumpsQuartzwareRapid Thermal ProcessorsRecycling,Reprocessing SystemsreticleRinsers/DryersSoftware(Operating,Simulatings,etc)Spin ProcessorsSpray-Clean SystemsSputterersSputtering TargetsStepperstransducersUV Ozone Cleaning SystemsVacuumComponents/Gages/Seals(O-rings,metal,etc.)Valves/ControllersWafer IdentificationWafer-Transport SystemsWet EtchWet Process Stations

736/26/03

THE INTERNATIONAL TECHNOLOGY ROADMAP FORTHE INTERNATIONAL TECHNOLOGY ROADMAP FORSEMICONDUCTORSSEMICONDUCTORS

The International Technology Roadmap for Semiconductors (ITRS) is an assessment of the semiconductortechnology requirements. The objective of the ITRS s to ensure advancements in the performance ofintegrated circuits. This assessment, called roadmapping, is a cooperative effort of the global industrymanufacturers and suppliers, government organizations, consortia, and universities.

The ITRS identifies the technological challenges and needs facing the semiconductor industry over the next15 years. It is sponsored by the Semiconductor Industry Association (SIA), the European ElectronicComponent Association (EECA), the Japan Electronics & Information Technology Industries Association(JEITA), the Korean Semiconductor Industry Association (KSIA), and Taiwan Semiconductor IndustryAssociation (TSIA) .

746/26/03

Semiconductor - Focus - MetrologySemiconductor - Focus - MetrologyYEAR OF PRODUCTION 2002 2003 2004 2005 2006 2007DRAM ½ PITCH (nm) 115 100 90 80 70 65

ProblemsInline, nondestructive microscopyresolution (nm) 0.53 0.45 0.37 0.32 0.3 0.25

Materials and Contamination CharacterizationReal particle detection limit (nm) 53 45 37 32 30 25

Minimum particle size for compositionalanalysis (dense lines on patterned wafers) 35 30 24 21 20 17

Solution in hand Solution known Solution unknown

756/26/03

Semiconductor - Focus - MetrologySemiconductor - Focus - MetrologyYEAR OF PRODUCTION 2010 2013 2016DRAM ½ PITCH (nm) 45 32 22

Problems

Inline, nondestructive microscopy resolution(nm) 0.18 0.13 0.09

Materials and Contamination CharacterizationReal particle detection limit (nm) 18 13 9

Minimum particle size for compositionalanalysis (dense lines on patterned wafers) 12 9 6

Solution in hand Solution known Solution unknown

766/26/03

Semiconductor - Focus - OtherSemiconductor - Focus - Other

• Lithography

• Interconnect

• Assembly & Packaging

• Modeling & Simulation

• et al

776/26/03

Semiconductor - Leading FirmsSemiconductor - Leading FirmsRank Company 2001 Semiconductor Sales1 Intel $23,8502 Toshiba $6,7813 STMicroelectronics $6,3594 Texas Instruments $6,1005 Samsung $5,8146 NEC $5,3097 Hitachi $5,0378 Motorola $4,8289 Infineon $4,55810 Philips $4,23511 IBM $3,89812 AMD $3,89113 Mitsubishi $3,47314 Matsushita $3,17615 Fujitsu $3,08416 Agere Systems [Lucent] $3,05117 Sanyo $2,67518 Hynix $2,45019 Micron $2,41120 Sony $2,10021 Analog Devices $1,89722 Sharp $1,85823 Agilent Technologies $1,67124 National Semiconductor $1,62625 LSI Logic $1,597

786/26/03

CNT - FabricationCNT - FabricationCNT - Carbon NanoTube

796/26/03

CNT - FabricationCNT - FabricationSWCNT - Single Wall Carbon NanoTube

806/26/03

CNT - FabricationCNT - FabricationMWCNT - Multi-Wall Carbon Nanotube

816/26/03

CNT - Fabrication - how toCNT - Fabrication - how to

A vacuum chamber is pumpeddown and back filled with somebuffer gas, typically neon or Arto 500 torr. A graphite cathode and anodeare placed in close proximity toeach other. The anode may befilled with metal catalystparticles if growth of single wallnanotubes is required. A voltage is placed across theelectrodes, (20 – 40 V). The anode is vaporized whilethe cathode evaporates. Carbon nanotubes form on thecathode in the sheath region.

Carbon Arc or Arc Discharge

826/26/03

CNT - Fabrication - how toCNT - Fabrication - how toLaser Ablation or Pulsed Laser Vaporization (PLV)

A laser is aimed at a block of graphite, vaporizing thegraphite.

Contact with a cooled cooper collector causes thecarbon atoms to be deposited in the form ofnanotubes.

The nanotube "felt" can then be harvested

836/26/03

CNT - Fabrication - how toCNT - Fabrication - how toChemical Vapor Deposition (CVD)

Single-wall nanotubes are produced in agas-phase process by catalyticdisproportionation of CO on ironparticles. Iron is in the form of ironpentacarbonyl. Adding 25% hydrogenincreases the SWNT yield. The synthesisis performed at 1100 C at atmosphericpressure.

Multi-wall nanotubes are grown in thesame apparatus where the catalyticmetal particles are supported on asubstrate (Si wafers or the quartzfurnace tube). Iron is deposited fromiron pentacarbonyl or by electron beamsputtering while nanotube growth isachieved by catalytic CVD fromhydrocarbon molecules (acetylene,methane) or fullerenes at temperaturesbetween 750 and 1100 C.

846/26/03

CNT - Fabrication - how toCNT - Fabrication - how toHigh-pressure CO conversion(HiPCO)

Method is similar to CVDCarbon source is carbon monoxideCatalytic particles are generated in-situ

Thermal decomposition of ironpentacarbonyl in a reactor heated to 800- 1200°C

High pressure to speed up the growth(~10 atm)

Bulk production of SWNTs

856/26/03

CNT - Sample CompaniesCNT - Sample CompaniesMetrotube - Located at the Tokyo Metropolitan University, supplies single-walled carbon nanotubes for research andcollaboration

Applied Nanotechnologies - ANI fabricates carbon nanotubes(CNTs) and produces carbon nanotube based devices such asx-ray tubes, microwave amplifiers, gas discharge tubes and field emission cathodes.

Nanostructured and Amorphous Materials - Manufacturer and supplier of nanoscale metal oxides, nitrides, carbides,diamond, Carbon nanotubes / Particles for research and industries

Carbon Solutions Inc. - Research, development and commercialization of single-walled carbon nanotubes, its chemistry andapplication to carbon based nanotechnology

Carbon Nanotechnologies Inc. - CNI intends to be a leader in carbon nanotechnology, beginning with its first product,Bucky(TM)tubes, which are single-wall carbon nanotubes made by the HiPco(TM) process.

NanoLab Inc. - Produces carbon nanotubes using the CVD growth process. The process produces arrays of aligned carbonnanotubes on substrates.

CarboLex, Inc. - Manufacturer of single-walled carbon nanotube fibers. Products are sold to composite manufacturers,display technology researchers, government researchers and universities.

Hyperion Catalysis International - Producer of graphite nanotubes. Based in Cambridge, Massachusetts.

Skeleton Technologies Group - Provides research and development of advanced materials and their applications, includingnanotubes, shaped diamond composites, supercapacitors, and metal-ceramic composites.

866/26/03

CNT - Market FundamentalsCNT - Market FundamentalsGlobal market for nanotubes in 2002 was ~ $12 million

About 20 producers of carbon nanotubes, half of which are inthe United States.

Other producers in Japan, Korea, China and France

Global CNT production capacity is over 2.5 tons per day

876/26/03

nanopositioning examples

$5-$50 million/year - depending on definition

886/26/03

Nano-positioningNano-positioning

nanopositioning is the ability to preciselyposition a device with a precisionmeasured in nanometers

896/26/03

Nano-positioningNano-positioningFlexure stage

A translation stage that uses flexures (stiff flat springs) to constrain themotion of the stage.

906/26/03

Roller-bearingHigh precision roller-bearing stages, with glass scale count encoders used in a

closed-loop system to create the necessary stability for maintaining the position.

916/26/03

Piezo-assistedPiezo-assisted fine-displacement combined with control circuitry and conventional

roller-bearing or flexure technology.

The piezoelectric effect is:

1. the production of avoltage when a crystal plateis subjected to mechanicalpressure or when it isphysically deformed bybending.

2. The physical deformationof the crystal plate (bending)when it is subjected to avoltage.

926/26/03

Nano-positioningNano-positioningCombinations

Any combination of technologies using ultraprecise methods for moving very smallincrements, such as linear motors.

936/26/03

Nano-positioningNano-positioningSample companies

Burleigh Instruments, Inc.Danaher Precision SystemsETEL, Inc.Hysitron Inc.LUMINOS IndustriesMad City Labs, Inc.Melles Griot OpticsPhysik Instrumente GmbH & Co.Piezomax Technologies, Inc.Piezosystem Jena, Inc.Polytec PI, Inc.PrimaticsSDL Queensgate Ltd

946/26/03

manufacturers frequently confuse– encoder resolution– controller resolution– amplifier noise– D/A resolution and– stability

with the overall precision of the motion system

956/26/03

Lab Equipment – MicroscopyLab Equipment – Microscopy

microscopy examplesacoustic

atomic forceelectric forcelateral force

magnetic forcescanning electron

scanning near field opticalscanning probe

scanning tunnelingtransmission electron

966/26/03

MicroscopeMicroscopeThe resolution of an optical microscope is about a third of a wavelength

in diameter, which is about 200 nm.

Acoustic, 30 micrometers at 50Mhz, 200 Mhz to maybe 20 nm Theresolution of a SEM is about 10 nanometers (nm).

The resolution of a TEM is about 0.2 nanometers (nm). This is the typicalseparation between two atoms in a solid.

The optical resolution limit for SNOM is governed by the light intensitypassing through the aperture. A practical limit is usually found withaperture diameters between 80 nm and 200 nm, but in ideal caseseven down to < 20 nm.

Some of the best values for AFM imaging are 3.0 nm. Sub-nanometer ispossible

976/26/03

Microscopy MarketMicroscopy Market

MME President Barbara Foster cited microscopyas the worst reported of all analyticalinstrumentation markets

$25 Million or more/year…Maybe

> 1,000 microscopy companies

986/26/03

Software Examples

Considering the cost of prototype fabrication

If you build it,

will they come?

996/26/03

Software – Molecular ModelingSoftware – Molecular ModelingMolecular modeling is techniques used to build, display,

manipulate, simulate and analyze molecularstructures, and to calculate properties

Molecular mechanics methods take a classical approach to calculatingthe energy of a structure.

Molecular dynamics can be used to simulate the thermal motion of astructure as a function of time, using the forces acting on the atoms todrive the motion

Quantum mechanics takes account of conjugation (quantum electronorbital effects)

1006/26/03

Software - AtomsSoftware - Atoms

1016/26/03

1026/26/03

1036/26/03

Software - MoleculesSoftware - Molecules

1046/26/03

Software - MarketSoftware - MarketGlobal Market in excess of $800 million

including informaticsLeading Company - Accelrys (subsidiary of

Pharmacopeia which includes Molecular Simulations,Synopsys, Scientific Systems, Oxford Molecular,Genetics Computer Group, and Synomics)

Revenue > $120 Million

> 100 companies, large body of open sourcesoftware

1056/26/03

End of Part 2End of Part 2

Basic Nanotechnology · ADF Scientific Computing and Modeling NV (SCM) AMBER Peter Kollman, UCSF...

Documents