Basic Nanotechnology · ADF Scientific Computing and Modeling NV (SCM) AMBER Peter Kollman, UCSF...

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© 2003 by Glenn Fishbine

Basic NanotechnologyBasic Nanotechnology

What’s the Technology Landscape?

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State of basic researchState of basic research

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Highlights - MetrologyHighlights - MetrologyHighlights of major accomplishments in past 15-20 years

Metrology: Measurements & images & motion can be controlled to 10 pico-metersWe can see what we’re doing

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Highlights - ModelingHighlights - ModelingHighlights of major accomplishments in past 15-20 years

Modeling: Software can now successfully model the dynamics of most molecularinteractions under numerous static and dynamic conditions.

We can simulate what we want to build

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Highlights - ManufacturingHighlights - ManufacturingHighlights of major accomplishments in past 15-20 years

Manufacturing: Certain processes exist to actually fabricate nanostructures.We can build some of what what we want to build

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Highlights - MEMSHighlights - MEMSHighlights of major accomplishments in past 15-20 years

MEMS: Fabrication of micro-meter scale devices is routine.We can build much of what we want at larger scales.

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Highlights - PolicyHighlights - PolicyHighlights of major accomplishments in past 15-20 years

Policy: There is a growing consensus of what nanotechnology is.We almost know what we’re talking about.

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Tools & TechniquesTools & TechniquesCurrent foundation of research tools and techniques

• Microscopy• Metrology• Simulation• Crystallography• Interferometry• Chemical Synthesis• Plasma & other regimens• Lithography

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MicroscopyMicroscopyCurrent foundation of research tools and techniques

• Microscopy

– Acoustic / Ultrasonic– Fluorescent / UV– Laser / Confocal– Polarizing– Portable Field– Scanning Electron Microscope (SEM)– Scanning Probe / Atomic Force (SPM / AFM)– Transmission Electron Microscope (TEM)– Scanning Near-Field Optical Microscope (SNOM)

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MetrologyMetrologyCurrent foundation of research tools and techniques

• Metrology

– Critical Dimension Measurement– Film Thickness Testers– Resistivity/Electromagnetic Testers – Stress Measurement – Wafer Inspection Tools– Quantum measurements

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SimulationSimulationCurrent foundation of research tools and techniques

• Simulation

– molecular modeling– kinetic modeling– quantum effect modeling– semiconductor effects

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CrystallographyCrystallographyCurrent foundation of research tools and techniques

• Crystallography

– x-ray

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InterferometryInterferometryCurrent foundation of research tools and techniques

• Interferometry

– optical– x-ray– quantum (Stern Gerlach)

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Chemical SynthesisChemical SynthesisCurrent foundation of research tools and techniques

• Chemical Synthesis

– organic– biological– genomic

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Plasma, et alPlasma, et alCurrent foundation of research tools and techniques

• Plasma & other regimens

– coatings– materials fabrication– surface treatments

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LithographyLithographyCurrent foundation of research tools and techniques

• Lithography

– manufacturing– prototyping/testing

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Recent Progress - AFMSRecent Progress - AFMSSample of recent progress - tools - AFM Array

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Recent Progress - SoftwareRecent Progress - Software

AbM Oxford MolecularADF Scientific Computing and Modeling NV (SCM)AMBER Peter Kollman, UCSFAMPAC A. Holder, Semichem, Inc., 7204 Mullen, Shawnee, KS 66216AMSOL Chris Cramer, D. Truhlar, Univ. of MinnesotaAPEX-3D http://www.dcl.co.il/DCL Systems International, Ltd.AutoDock Garrett M. Morris, David S. Goodsell, Ruth Huey, William E. Hart, Scott

Halliday, Arthur J. OlsonBabel Pat Walters, Univ. of ArizonaCAChe CAChe Scientific, Inc. (Oxford Molecular)Cambridge Structural Database (CSD) Cambridge Crystallographic Data CentreCAVEAT Paul Bartlett, UC BerkleyCHARMm Molecular Simulations, Inc.CHARMM Documentation: Rick Venable, FDA/CBER; WWW site: M. Karplus, Harvard

Univ., Dept. of Chemistry, 12 Oxford Street, Cambridge, MA 02138;Chem-X Chemical Design, Inc., 200 Route 17 South, Ste. 120, Mahwah, NJ 07430ChemDBS-3D Chemical Design, Inc., 200 Route 17 South, Ste. 120, Mahwah, NJ 07430CHIME MDL Information Systems, Inc.ClogP BiobyteCMR BiobyteCLIP Institute of Medicinal Chemistry, Univ. of LausanneComposer Tripos, Inc.CONCORD Tripos, Inc.CS ChemOffice Pro CambridgeSoft Corp.DGEOM 95 QCPE, Indiana Univ.DGII http://www.chem.indiana.edu/qcpe.htm, Indiana Univ.DISCO Tripos, Inc.Discover Molecular Simulations, Inc.

DMol Molecular Simulations, Inc.DOCK Irwin Kuntz, UCSFDSSP C. Sander, EMBLEGO H. Heller, Ludwig Maximilians Univ., MunichGALAXY AM Technologies, incGAMESS M. Gordon, Iowa State Univ.GASP Tripos, Inc.Gaussian Gaussian, Inc., 4415 Fifth Ave., Pittsburgh, PA 15213 GEMM B.K. Lee, National Cancer Institute, NIHGERM D.E. Walters, Chicago Medical School, Department of Biological Chemistry

3333 Green Bay Road, North Chicago, IL 60064gOpenMol Center for Scientific ComputingGRAMM Ilya A. Vakser, Rockefeller Univ.GRASP A. Nicholls, Columbia Univ.GROMOS Biomos B.V., The NetherlandsGROMACS H.J.C. Berendsen, Univ. of Groningen, The NetherlandsHASL eduSoft, P.O. Box 1811, Ashland, VA 23005HBPLUS I.K. McDonald, University College, LondonHINT eduSoft, P.O. Box 1811, Ashland, VA 23005Homology Molecular Simulations, Inc.HONDO IBM, Neighborhood Road MLMA/428, Kingston, NY 12401HyperChem HyperCube, Inc.ICM MolSoft, LLCIditis Oxford MolecularInsight II Molecular Simulations, Inc.ISIS MDL Information Systems, Inc.Jaguar S chrödinger, Inc.Leapfrog Tripos, Inc.

Sample of recent progress - software techniques - molecular modeling

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Recent Progress - MaterialsRecent Progress - MaterialsSample of recent progress - materials

• Films– Plastic semiconductors

• Polycrystalline– Low cost photovoltaics

• Nanocomposites– Anti-bacteria soap

• Patterned structures– Nanoscale magnetic dots and wires

• Bulk structures– Cutting tools

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Recent Progress - ElectronicsRecent Progress - Electronics

Sample of recent progress - electronics

• December 4, 2002: Toshiba and SonyAnnounce 65-Nanometer CMOS ProcessTechnology

• January 6, 2003: researchers at the Universityof Toronto have invented a tiny circuit that asingle electron can activate

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Recent Progress Energy/PowerRecent Progress Energy/Power

ATP motion system– cellular motion power system

Fuel Cells– 10 X capacity of a Lithium Battery

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Recent Progress – Life SciencesRecent Progress – Life SciencesBiochip

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Grand ChallengesGrand ChallengesNNI

Nanostructured materials "by design"Nanoelectronics, optoelectronics and magneticsAdvanced healthcare, therapeutics, diagnosticsEnvironmental improvementEfficient energy conversion and storageMicrocraft space exploration and industrializationCBRE Protection and Detection (revised in 2002)Instrumentation and metrologyManufacturing processes

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Grand ChallengesGrand ChallengesNNI

Shrinking the entire contents of the Library of Congress in a device the size of a sugar cubethrough the expansion of mass storage electronics to multi-terabit memory capacity thatwill increase the memory storage per unit surface a thousand fold

Making materials and products from the bottom-up, that is, by building them up from atoms andmolecules. Bottom-up manufacturing should require less material and pollute less

Developing materials that are 10 times stronger than steel, but a fraction of the weight formaking all kinds of land, sea, air and space vehicles lighter and more fuel efficient

Improving the computer speed and efficiency of minuscule transistors and memory chips byfactors of millions making today's Pentium IIIs seem slow

Using gene and drug delivery to detect cancerous cells by nanoengineered MRI contrast agentsor target organs in the human body

Removing the finest contaminants from water and air to promote a cleaner environment andpotable water

Doubling the energy efficiency of solar cells

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Pace of ProgressPace of ProgressIn many new technologies, it is common to overestimate what can be

done in five years' time, and to underestimate what can be done in 50years' time.

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BreakBreak

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Primer on manufacturing processes

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Primer on manufacturing processesPrimer on manufacturing processes• — Bottom-up self assembly (wet chemistry)

– intrinsic, autonomous– biomimetic, controlled

• — Top-down assembly (lithography and derivatives)– dip-pen lithography– soft lithography and nanoscale printing– e-beam and deep UV lithography

• — Other production processes– vapor deposition– evaporation– combustion– thermal plasma– milling– cavitation– coating (spin or dip)– thermal spray– electrodeposition

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Bottom-up self assemblyBottom-up self assemblyUnderstand and control the intramolecular

quantum behavior of specifically designed andsynthesized molecules

Using a surface to localize and stabilize them

To interconnect, assemble and test nano-devicesand nano-machines starting from atomic ormolecular parts

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Self AssemblySelf AssemblyVon Neumann's universal constructor ~500,000Internet worm (Robert Morris, Jr., 1988) ~500,000Mycoplasma genitalium 1,160,140E. Coli 9,278,442Drexler's assembler ~100,000,000Human ~6,400,000,000NASA Lunar Manufacturing Facility over 100,000,000,000

-Ralph C. Merkle

main(){char *c="main(){char *c =%c%s%c;printf(c,34,c,34);}";printf(c,34,c,34);}

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intrinsic, autonomousintrinsic, autonomousSelf assembly mechanisms are inherent

within the structures

Self assembly occurs without any externalforces or controls

i.e. crystals

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biomimetic, controlledbiomimetic, controlledUsing organic like processes, or organisms, to

create new structures as a controlledmanufacturing process

“biomimetic carpentry”

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Top-down assemblyTop-down assemblyImposes a structure on the system

through the definition of patterns andtheir creation from larger parts

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LithographyLithography

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Resolution to 65 nm(10 nm with x-rays)

Vacuum environment

Multiple layer writing

Current standard for semiconductor industry

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dip-pen lithographydip-pen lithography

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dip-pen lithographydip-pen lithography

Resolution 10-15 nm

Liquid environment


Multiple pen writing

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soft lithography & nanoscale printingsoft lithography & nanoscale printing

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soft lithography & nanoscale printingsoft lithography & nanoscale printing

Resolution 100 nm

Liquid environment


Wide areas & rapidproduction rates

A stamp wasmolded off themaster and usedfor printingalkanethiols onto agold layer, followedby a selective etchto develop thepattern.

IBM Zurich

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e-beam and deep UV lithographye-beam and deep UV lithography

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e-beam and deep UV lithographye-beam and deep UV lithography

Resolution 20 nm

Vacuum environment

Slow writing speed

Multiple beam technologiesin development

Direct write & directexposure

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Electromagnetic SpectrumElectromagnetic Spectrum

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Other production processesOther production processes

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vapor depositionvapor depositionDeposition of material transferred from its source to the substrate

without changing its chemical composition

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vapor depositionvapor depositionPrimarily a coating process

As low as 3 nm/minute

Can be used for surface chemistry

Can coat almost anything

Used extensively in semiconductor fabrication

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evaporationevaporationHeating a material in a vacuum until it melts and evaporates

condensing on a cooler surface

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evaporationevaporationPrimarily a coating process for materials that can withstand high

temperature and vacuum

Minimum rate or thickness is atomic

Can coat almost anything

Used extensively in semiconductor fabrication

'The Sounds of Earth' copper with goldplating placed on Voyager. Two hours ofsound and movie plus some digital data:pictures and a message from JimmyCarter.

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combustioncombustion

Combustion wire process

Combustion powder process

Burning a material such that the products of its combustioncondense on a cooler surface.

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combustioncombustionPrimarily a coating process for materials that can have unique

properties after burning, or to coat materials that cannot becoated in other ways

Also used to create nano-scale materials in bulk

Relatively limited use. High promise for production of bulknanomaterials

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thermal plasmathermal plasmaPlasma is frequently referred to as the 4th state of matter-

solid, liquid, gas, and plasma

A plasma is an ionized gas comprised of molecules, atoms, ions (in theirground or in various excited states), electrons, and photons.

Overall, a plasma is electrically neutral.

A thermal plasma is a plasma in Local Thermodynamic Equilibrium:

(Te = Th), > 104 Kelvinswhere Te : electron temperature

Th : heavy particle temperature)

Typically operated in high pressure oratmospheric pressure

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thermal plasmathermal plasmacreating chemical reactions in a high-purity atmosphere

creating rapid large area nano-scale coatings

creating nano-scale particles

creating nano-materials in large quantities

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millingmillingAtomic Sand Blaster

submicrometer particles are accelerated to bombard thesurface of a substrate.

They remove any material not protected by a resistmaterial

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millingmillingPrimarily an etching process, but can

be used to create new materials

Feature resolution around 50 nm

Can be used for surface chemistry

Can operate faster than e-beam insome processes, especially highatomic # substrates

Has little backscatter, unlike e-beam(increases contrast)

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cavitationcavitation the formation, growth, and implosive collapse

of vapor bubbles in a liquid created byfluctuations in fluid pressure

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cavitationcavitationA highly controllable tool for the

synthesis of nanostructuredcatalysts, ceramics, andpiezoelectrics in high phasepurities

Resolution of ~ 130 nanometers

Can be used to initiate production ofspecialized nanomaterials

May operate faster than e-beam orion-beam

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coating (spin or dip)coating (spin or dip)A means of inexpensively applying a thin film to a

surface with high precision.

Material must be liquid.

Does not require vacuum, heat or other processes thatcan destroy material chemistry

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coating (spin or dip)coating (spin or dip)Routinely used to disperse photo-resist for

semiconductor manufacturing.

Can produce well dispersed mix of nanostructureswithin coatings

Nanostructures can be uniformly grown during the spinprocess

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thermal spraythermal sprayTakes the source of energy such as inflammable and ionized gas,

explosive gas, electric energy

Heats the powder of the thermal spray coating material (metal,nonmetal, ceramics, ceramicmetal, plastic)

Melts it or strongly blows the particles

Types:PlasmaHVOF (high velocity oxygen fuel)Wire FlamePowder FlameElectric Arc Spray

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thermal spraythermal spraycreating chemical reactions in an arbitrary atmosphere

creating rapid large area nano-scale coatings

creating nano-scale particles

creating nano-materials in large quantities

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electrodepositionelectrodeposition

the deposition of a substance on anelectrode by the action of electricity

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electrodepositionelectrodepositionPrimarily a coating process for materials that can withstand liquids andcan be electrically charged temperature and vacuum

Minimum rate or thickness is highly controllable

Can deposit complex chemistries

Used extensively in semiconductor fabrication

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BreakBreak

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Commercial Activity

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Small Dreams?Small Dreams?

Get your facts first,

and then you can distort them as much as you please.

-Mark Twain

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Labs - NNI fundedLabs - NNI fundedInstitution Partners Title Topics Funding 1st

YR $MFunding5 Yrs $M

NorthwesternUniversity

Argonne National Lab; HaroldWashington College; U. Illinois,Urbana-Champaign; U. Chicago;Chicago Museum of Science andIndustry; Lawrence Livermore; NASA;Dupont; Exxon Mobil; Rohm and Hass;Motorola; IBM; Unilever

NSEC: IntegratedNanopatterning andDetectionTechnologies

chem-bio recognition,polymers, DNA / RNAdetection methods; surfacedirected assembly; sensors

2.303 11.102

CornellUniversity-Endowed

Brigham Young U.; Colgate U.; U.New Mexico; Pomona College

NSEC: NanoscaleSystems in InformationTechnologies

Nano-electronics, -photonics, -magnetics, enabling science

2.390 11.590

HarvardUniversity

MIT; Princeton; UC Santa Barbara;Boston Museum of Science;Brookhaven National Lab; Oak RidgeNational Lab; Sandia National Lab;Delft U., The Netherlands; U. Tokyo

NSEC: Science ofNanoscale Systems andtheir DeviceApplications

scanning probes, coherentelectronics, heterostructures

2.368 10.798

ColumbiaUniversity

Barnard College; CUNY City College;Rowan U.; Lucent; IBM

NSEC: ElectronicTransport in MolecularNanostructures

charge transport in molecules,carbon nanotubes interfaces,assembly

2.245 10.845

WilliamMarsh RiceUniv

Oak Ridge National Lab; TDAResearch Inc.; GeosciencesEnvironmental Lab, France

NSEC: Nanoscience inBiological andEnvironmentalEngineering

fullerines, nanomaterials incells, bioengineering,environmental applications

2.108 10.540

RensselaerPolytech Inst

U. Illinois, Urbana-Champaign; LosAlamos National Lab; Colleges:Morehouse, Mount Holyoke, Smith,Spelman, Wiliams; Industry:ABB,Albany International, IBM,Eastman Kodak, Philip Morris; State ofNew York

NSEC: DirectedAssembly ofNanostructures

gels amd polymernanocomposites;nanostructured biomolecularmaterials; theory

2.000 10.000

13.414 64.875

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Labs - National Nanofabrication Users NetworkLabs - National Nanofabrication Users NetworkCornell Nanofabrication Facility Prof. Sandip Tiwari, Director Cornell University, Knight Laboratory Ithaca, New York 14853-5403 Voice: (607) 255-2329 Fax: (607) 255-8601 URL: http://www.cnf.cornell.edu/

Materials Science Center for Excellence Prof. Gary Harris, Director Howard University School of Engineering 2300 Sixth St, NW Washington, D.C. 20059 Voice: (202) 806-6618 Fax: (202) 806-5367 URL: http://www.msrce.howard.edu/~nanonet/NNUN.HTM

PSU Nanofabrication Facility Prof. Stephen Fonash, Director 189 Materials Research Institute The Pennsylvania State University University Park, PA 16802 Voice: (814) 865-4931 Fax: (814) 865-3018 URL: http://www.nanofab.psu.edu

Stanford Nanofabrication Facility Dr. Yoshio Nishi, Director Stanford University CIS 103, Via Ortega St Stanford, CA 94305 Voice: (650) 723-9508 Fax: (650) 725-0991 URL: http://www-snf.stanford.edu/

UCSB Nanofabrication Facility Prof. Mark Rodwell, Director University of California at Santa Barbara Department of Electrical & Computer Engineering 5153 Engineering I Santa Barbara, CA 93106 Voice: (805) 893-3244 Fax: (805) 893-3262 URL: http://www.nanotech.ucsb.edu/

Provides users with access to some of the mostsophisticated nanofabrication technologies in theworld with facilities open to all users fromacademia, government, and industry.

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Lab EquipmentLab Equipment

• Fabrication examples– semiconductor– CNT

• Microscopy examples• nanopositioning examples• software examples

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Semiconductor - Industry ElementsSemiconductor - Industry Elements

• $42 Billion/year (equipment & materials)• over 1,000 U.S. companies

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Semiconductor - Equipment TypesSemiconductor - Equipment Types300-mm ComponentsAsherAutomation/RobboticsbearingsBlow-Off GunsBrushes,Pads,RollersCarbon Dioxide Cleaning

SystemsCeramic AccessoriesChemical Vapor DepositionChemical-Mechanical

PolishingChillerCleaning AccessoriesCleaning

Systems,Batch/SingleCleanroom OvensCluster ToolsCMP ConsumablesDepositionDI Water Heaters

Diffusion/Oxidation/AnnealingDry EtchDry-Clean Systems(gas-phase,etc)ElectropolishingEpitaxyFurnacesHeat ExchangersIn Situ CleanersIn Situ MonitorsIon BeamIon ImplantationlaserLithography, DUV/g/i-lineMegasonic/Ultrasonic SystemsMinienvironment,Automated/ManualMonitoring/Analysis ToolsNon-CFC Cleaning SystemsOrganic SolventsPellicles/Mounting EquipmentPhotomask Equipment/MaterialsPhotoresist ProcessingPhotoresist StrippingPhysical Vapor DepositionPiping/Tubing,Stainless Steel/OtherPlasma Cleaning Systems

Post-CMP Cleaning SystemsPower Supplies,Accessoriespressure gagesPumpsQuartzwareRapid Thermal ProcessorsRecycling,Reprocessing SystemsreticleRinsers/DryersSoftware(Operating,Simulatings,etc)Spin ProcessorsSpray-Clean SystemsSputterersSputtering TargetsStepperstransducersUV Ozone Cleaning SystemsVacuumComponents/Gages/Seals(O-rings,metal,etc.)Valves/ControllersWafer IdentificationWafer-Transport SystemsWet EtchWet Process Stations

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THE INTERNATIONAL TECHNOLOGY ROADMAP FORTHE INTERNATIONAL TECHNOLOGY ROADMAP FORSEMICONDUCTORSSEMICONDUCTORS

The International Technology Roadmap for Semiconductors (ITRS) is an assessment of the semiconductortechnology requirements. The objective of the ITRS s to ensure advancements in the performance ofintegrated circuits. This assessment, called roadmapping, is a cooperative effort of the global industrymanufacturers and suppliers, government organizations, consortia, and universities.

The ITRS identifies the technological challenges and needs facing the semiconductor industry over the next15 years. It is sponsored by the Semiconductor Industry Association (SIA), the European ElectronicComponent Association (EECA), the Japan Electronics & Information Technology Industries Association(JEITA), the Korean Semiconductor Industry Association (KSIA), and Taiwan Semiconductor IndustryAssociation (TSIA) .

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Semiconductor - Focus - MetrologySemiconductor - Focus - MetrologyYEAR OF PRODUCTION 2002 2003 2004 2005 2006 2007DRAM ½ PITCH (nm) 115 100 90 80 70 65

ProblemsInline, nondestructive microscopyresolution (nm) 0.53 0.45 0.37 0.32 0.3 0.25

Materials and Contamination CharacterizationReal particle detection limit (nm) 53 45 37 32 30 25

Minimum particle size for compositionalanalysis (dense lines on patterned wafers) 35 30 24 21 20 17

Solution in hand Solution known Solution unknown

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Semiconductor - Focus - MetrologySemiconductor - Focus - MetrologyYEAR OF PRODUCTION 2010 2013 2016DRAM ½ PITCH (nm) 45 32 22

Problems

Inline, nondestructive microscopy resolution(nm) 0.18 0.13 0.09

Materials and Contamination CharacterizationReal particle detection limit (nm) 18 13 9

Minimum particle size for compositionalanalysis (dense lines on patterned wafers) 12 9 6

Solution in hand Solution known Solution unknown

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Semiconductor - Focus - OtherSemiconductor - Focus - Other

• Lithography

• Interconnect

• Assembly & Packaging

• Modeling & Simulation

• et al

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Semiconductor - Leading FirmsSemiconductor - Leading FirmsRank Company 2001 Semiconductor Sales1 Intel $23,8502 Toshiba $6,7813 STMicroelectronics $6,3594 Texas Instruments $6,1005 Samsung $5,8146 NEC $5,3097 Hitachi $5,0378 Motorola $4,8289 Infineon $4,55810 Philips $4,23511 IBM $3,89812 AMD $3,89113 Mitsubishi $3,47314 Matsushita $3,17615 Fujitsu $3,08416 Agere Systems [Lucent] $3,05117 Sanyo $2,67518 Hynix $2,45019 Micron $2,41120 Sony $2,10021 Analog Devices $1,89722 Sharp $1,85823 Agilent Technologies $1,67124 National Semiconductor $1,62625 LSI Logic $1,597

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CNT - FabricationCNT - FabricationCNT - Carbon NanoTube

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CNT - FabricationCNT - FabricationSWCNT - Single Wall Carbon NanoTube

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CNT - FabricationCNT - FabricationMWCNT - Multi-Wall Carbon Nanotube

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CNT - Fabrication - how toCNT - Fabrication - how to

A vacuum chamber is pumpeddown and back filled with somebuffer gas, typically neon or Arto 500 torr. A graphite cathode and anodeare placed in close proximity toeach other. The anode may befilled with metal catalystparticles if growth of single wallnanotubes is required. A voltage is placed across theelectrodes, (20 – 40 V). The anode is vaporized whilethe cathode evaporates. Carbon nanotubes form on thecathode in the sheath region.

Carbon Arc or Arc Discharge

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CNT - Fabrication - how toCNT - Fabrication - how toLaser Ablation or Pulsed Laser Vaporization (PLV)

© American Scientist 1997

A laser is aimed at a block of graphite, vaporizing thegraphite.

Contact with a cooled cooper collector causes thecarbon atoms to be deposited in the form ofnanotubes.

The nanotube "felt" can then be harvested

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CNT - Fabrication - how toCNT - Fabrication - how toChemical Vapor Deposition (CVD)

Single-wall nanotubes are produced in agas-phase process by catalyticdisproportionation of CO on ironparticles. Iron is in the form of ironpentacarbonyl. Adding 25% hydrogenincreases the SWNT yield. The synthesisis performed at 1100 C at atmosphericpressure.

Multi-wall nanotubes are grown in thesame apparatus where the catalyticmetal particles are supported on asubstrate (Si wafers or the quartzfurnace tube). Iron is deposited fromiron pentacarbonyl or by electron beamsputtering while nanotube growth isachieved by catalytic CVD fromhydrocarbon molecules (acetylene,methane) or fullerenes at temperaturesbetween 750 and 1100 C.

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CNT - Fabrication - how toCNT - Fabrication - how toHigh-pressure CO conversion(HiPCO)

Method is similar to CVDCarbon source is carbon monoxideCatalytic particles are generated in-situ

Thermal decomposition of ironpentacarbonyl in a reactor heated to 800- 1200°C

High pressure to speed up the growth(~10 atm)

Bulk production of SWNTs

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CNT - Sample CompaniesCNT - Sample CompaniesMetrotube - Located at the Tokyo Metropolitan University, supplies single-walled carbon nanotubes for research andcollaboration

Applied Nanotechnologies - ANI fabricates carbon nanotubes(CNTs) and produces carbon nanotube based devices such asx-ray tubes, microwave amplifiers, gas discharge tubes and field emission cathodes.

Nanostructured and Amorphous Materials - Manufacturer and supplier of nanoscale metal oxides, nitrides, carbides,diamond, Carbon nanotubes / Particles for research and industries

Carbon Solutions Inc. - Research, development and commercialization of single-walled carbon nanotubes, its chemistry andapplication to carbon based nanotechnology

Carbon Nanotechnologies Inc. - CNI intends to be a leader in carbon nanotechnology, beginning with its first product,Bucky(TM)tubes, which are single-wall carbon nanotubes made by the HiPco(TM) process.

NanoLab Inc. - Produces carbon nanotubes using the CVD growth process. The process produces arrays of aligned carbonnanotubes on substrates.

CarboLex, Inc. - Manufacturer of single-walled carbon nanotube fibers. Products are sold to composite manufacturers,display technology researchers, government researchers and universities.

Hyperion Catalysis International - Producer of graphite nanotubes. Based in Cambridge, Massachusetts.

Skeleton Technologies Group - Provides research and development of advanced materials and their applications, includingnanotubes, shaped diamond composites, supercapacitors, and metal-ceramic composites.

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CNT - Market FundamentalsCNT - Market FundamentalsGlobal market for nanotubes in 2002 was ~ $12 million

About 20 producers of carbon nanotubes, half of which are inthe United States.

Other producers in Japan, Korea, China and France

Global CNT production capacity is over 2.5 tons per day

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nanopositioning examples

$5-$50 million/year - depending on definition

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Nano-positioningNano-positioning

nanopositioning is the ability to preciselyposition a device with a precisionmeasured in nanometers

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Nano-positioningNano-positioningFlexure stage

A translation stage that uses flexures (stiff flat springs) to constrain themotion of the stage.

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Roller-bearingHigh precision roller-bearing stages, with glass scale count encoders used in a

closed-loop system to create the necessary stability for maintaining the position.

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Piezo-assistedPiezo-assisted fine-displacement combined with control circuitry and conventional

roller-bearing or flexure technology.

The piezoelectric effect is:

1. the production of avoltage when a crystal plateis subjected to mechanicalpressure or when it isphysically deformed bybending.

2. The physical deformationof the crystal plate (bending)when it is subjected to avoltage.

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Nano-positioningNano-positioningCombinations

Any combination of technologies using ultraprecise methods for moving very smallincrements, such as linear motors.

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Nano-positioningNano-positioningSample companies

Burleigh Instruments, Inc.Danaher Precision SystemsETEL, Inc.Hysitron Inc.LUMINOS IndustriesMad City Labs, Inc.Melles Griot OpticsPhysik Instrumente GmbH & Co.Piezomax Technologies, Inc.Piezosystem Jena, Inc.Polytec PI, Inc.PrimaticsSDL Queensgate Ltd

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manufacturers frequently confuse– encoder resolution– controller resolution– amplifier noise– D/A resolution and– stability

with the overall precision of the motion system

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Lab Equipment – MicroscopyLab Equipment – Microscopy

microscopy examplesacoustic

atomic forceelectric forcelateral force

magnetic forcescanning electron

scanning near field opticalscanning probe

scanning tunnelingtransmission electron

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MicroscopeMicroscopeThe resolution of an optical microscope is about a third of a wavelength

in diameter, which is about 200 nm.

Acoustic, 30 micrometers at 50Mhz, 200 Mhz to maybe 20 nm Theresolution of a SEM is about 10 nanometers (nm).

The resolution of a TEM is about 0.2 nanometers (nm). This is the typicalseparation between two atoms in a solid.

The optical resolution limit for SNOM is governed by the light intensitypassing through the aperture. A practical limit is usually found withaperture diameters between 80 nm and 200 nm, but in ideal caseseven down to < 20 nm.

Some of the best values for AFM imaging are 3.0 nm. Sub-nanometer ispossible

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Microscopy MarketMicroscopy Market

MME President Barbara Foster cited microscopyas the worst reported of all analyticalinstrumentation markets

$25 Million or more/year…Maybe

> 1,000 microscopy companies

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Software Examples

Considering the cost of prototype fabrication

If you build it,

will they come?

996/26/03


Software – Molecular ModelingSoftware – Molecular ModelingMolecular modeling is techniques used to build, display,

manipulate, simulate and analyze molecularstructures, and to calculate properties

Molecular mechanics methods take a classical approach to calculatingthe energy of a structure.

Molecular dynamics can be used to simulate the thermal motion of astructure as a function of time, using the forces acting on the atoms todrive the motion

Quantum mechanics takes account of conjugation (quantum electronorbital effects)

1006/26/03


Software - AtomsSoftware - Atoms

1016/26/03



1026/26/03



1036/26/03


Software - MoleculesSoftware - Molecules

1046/26/03


Software - MarketSoftware - MarketGlobal Market in excess of $800 million

including informaticsLeading Company - Accelrys (subsidiary of

Pharmacopeia which includes Molecular Simulations,Synopsys, Scientific Systems, Oxford Molecular,Genetics Computer Group, and Synomics)

Revenue > $120 Million

> 100 companies, large body of open sourcesoftware

1056/26/03


End of Part 2End of Part 2

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Basic Nanotechnology · ADF Scientific Computing and Modeling NV (SCM) AMBER Peter Kollman, UCSF...

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