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The CCI SunStar range Engineered to challenge your definition of impossible
Optical interferometry without compromise • 2.2mmverticalrangewithclosedlooppiezolessZaxisscanner
• 0.1ångströmresolutionovertheentiremeasurementrange
• 2048x2048pixelarrayforlargeFOVwithhighresolution
• 0.3%-100%reflectivitysurfacesmeasuredwithease
Virtual elimination of measurement uncertainty • <0.2ångströmRMSrepeatability,<0.1%stepheightrepeatability
• FEAoptimisedmechanicaldesignforexcellentR&Rcapability
• Calibrationutilisingtraceabilitystandardsensuresacceptanceofresults
• Automaticset-upfeatureseliminateoperatorvariability
Robust design for long-term cost effectiveness • PiezolessZaxisscannereliminatesexpensiverepairbills
• Automaticsurfacedetectionpreventscrashdamagetolens
• Builtinself-diagnostictoolsforquickandeasytroubleshooting
• Easeofoperationreducesthepossibilityofoperatormishandling
64-bit control and analysis software • Multi-languagesupporttoeasecommunicationwith
global partners
• CompatiblewithmostPCplatformsforcollaborative research projects
• Newtoolsincluding4Danalysisof3Dsurfacesas theyevolveovertime
• Automaticreportgenerationbasedonbatchesof measurement data
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Range, resolution, accuracy, reliability – our formula for your success Howeverquicklyyoumustanalyseit,confidenceinyour3DarealmeasurementresultisassuredwiththerevolutionaryCCISunStarnon-contactopticalprofilers.Thehighresolutioncamera,combinedwith1/10ångströmverticalresolution,deliversanincrediblydetailedanalysisofallsurfacetypesfromveryroughtoextremelysmooth.
Versatile – ready for a production run or a research project KeepingpacewiththeexpertiseofPVresearchersandscientists,theCCISunStarisreadyforthedemandingmeasurementrequirementsofthesolarenergyfield.Combiningpowerfuldimensionalandroughnessanalysissoftwarewithuncompromisedengineeringgivesyoutheidealinspectiontoolforstepandtrenchmeasurement.World-beatingthinfilmthicknessmeasurementcapabilitycompletesanoutstandingmetrologypackagedesignedforthePVindustry.
Ease-of-use – reduces the cost of operator training Designedforease-of-use,theCCISunStarrequiresnoclosesupervisionofoperators,makingitusablebyscientists,students,developersorproductioninspectors.ItsinnovativefeaturessuchasAutoRangeandAutoFringeFindsimplifysetting-upandstagingofcomponents,savingvaluabletime,reducingerrorsandhelpingyouquicklygettheresultsyouneed.
Comprehensive platform–simplifiesISO-17025integrationGreatlyexpandyouranalysiscapabilitieswithoutincreasingthecomplexityofyouranalysisprogram.Abroadrangeofcomponentsandsurfacescanbemeasuredwithoutthecomplicationofswitchingbetweenmeasurementmodesortheextraburdenofintermediatelenscalibration.Standardisedmethods,proceduresandreportingeasetheintegrationof CCISunStarintoyourqualitymanagementsystem.
CCI SunStar is an industry-changing blend of science, experience and imagination
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The speed and extraordinary sensitivity makes the CCI SunStar an ideal tool for R&D and quality assurance.Prof. Michael Walls, Professor of Photovoltaics at CREST, UK
Improving solar cell performanceUnique metrology capability and outstanding software analysis tools make CCI SunStar the optimal PV tool.
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Next generation 3D camera technology
Higher resolution CCISunStarimagesensorswithupto2048x2048pixelarrayarevastlysuperiortooldVGAvideocameratechnologywhere640x480pixelarraygrosslylimitedlateralresolution.Nowyoucanmeasurelargeareaswithoutthecomplexityorpotentialdistortioncausedbyfieldofviewmultipliers.
Faster measurementsLargerFOV(fieldofview)meansfewerset-ups,faster inspection speeds and better utilisation of equipmentandoperators.Costeffectivenessismuchimprovedasyoucaninspectmorepartsmorethoroughlyandingreaterdetailwithoutadditionalexpense.
Superb resultsWithupto4milliondatapoints,themeasuredsurfaceisdefinedasneverbefore.YoucanidentifysurfaceflawsorpotentialareasofconcernanywhereinthewideFOVand'zoomin'fordetailedanalysiswithouthavingtowastetimere-measuringthecomponent.
NEW camera technology Highresolutionvisualanalysisprovidesanessentialtoolformonitoringandimprovingyourmanufacturingprocess.Stunning3Dimageswithsub-microndetailcanalsobeusedtoeducate,informorsimplyimpresspotentialcustomerswithyourengineeringexpertise.
Last century 640 x 480
CCI SunStar 2048 x 2048
Controlling PV cell efficiencyThe complex morphology of etched silicon is easy to understand using a CCI high resolution camera.
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21st century optical profiling
Automatic surface detection AutoFringeFindincreasesinspectionthroughputbyeliminatingmanualset-upandtheneedtore-takemeasurementscausedbyfalseidentificationofthesamplesurface.Unlikeautofocusroutineswhichrequireaflatandsmoothsurface,thisinnovativecouplingofsoftwareandopticalexpertisecandetectalltypesofsurfacesquicklyandautomatically.
Automatic range setting SignificantreductionsinmeasurementtimeareachievedwithourexclusiveAutoRangefeaturewhichautomaticallysetstheoptimumscanrangebasedonthesamplesurface.Manualsettingofthescanrangeistypicallyaguessinggamethatoftenresultsinoverscanning,longermeasurementtimesandfrustrationforeventhemostskilledoperators.
Universal measurement of different surfaces Streamline your inspection program by eliminating multiple inspection routines andincompatiblemeasurementreports.OurpatentedCoherenceCorrelationalgorithmprovidessub-angstromresolutionregardlessofscanningrangesothatall surfaces at any stage in production can be measured on the same instrument usingthesamemeasuringtechnique.ThealgorithmisidealforlookingatverylowreflectivesurfacessuchasARcoatings.
Large area high resolution measurementThefieldofviewopticsrequiredbyoldersystemsleadstolowerlateralresolutionandreducedanglesensitivityandtheincreaseinmissingdatagivespoorersurfaceunderstandingandthereforelessprocesscontrol.UsingthehighresolutioncameraoftheCCISunStarcombinedwithalargeareaobjectiveisessentialforunderstandingofthesurfacepropertiesnecessarytoimproveefficiency.
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Innovation in PV technology prize for 2011 has been awarded by SOLAR to Taylor Hobson Ltd for their development of the CCI SunStar.
Enabling high value low cost PVOptimising laser scribe parameters reduces manufacturing cost.
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‘‘ ’’Helping to improve the efficiency of solar cells
Savevaluabletime,reduceerrorsandquicklygettheresultsyouneed.
Step and trench measurementsOptimisingthetrenchdepthofthecellsisimportanttominimiseexpensivesilvertraceusage.ForcontrollingthetrenchdimensionstheCCISunStarofferstheabilitytomeasuresilvertraceheightandwidthallowingoptimisationofcellefficiencytherebyreducingcost.Thehighmeasurementspeedgiveshighsamplethroughputandtheoptionalautomationgivestheabilitytosamplemultiplesitesand/orstitchtogetherlargedata-setsleadingtomorerepresentativesampling.
Controllingtheparametersofetchedscribelinesimprovesmanufacturingefficiencybyidentifyinglinedeptherrorssuchasshallowlines,whichgiveproblemswithconductivity,anddeeplineswhichleadtoelectricalshorts.
Surface roughnessTherelationshipbetweenthesurfaceroughnessandefficiencyiscomplex.Roughsurfacestrapmorelightthansmoothsurfaces.Surfacesthataretooroughreducetheefficiencyduetoscattering.Otherinterfacesneedtobesmoothtoreducescatteringandabsorption. WiththewealthofanalysisparametersavailableinTalyMapyouhave theabilitytochoosetheparametersthataremostrelevanttotheapplication,ratherthansimplyrelyingontraditionalparameterslikeRa,whichdonotgiveinformationaboutthefeaturescriticalforefficiencysuchaspitdimensions.
Advanced3Dparametersoffercorrelation.ValleysonthesurfacehelptotraplightsoparameterssuchasSskshowstrongcorrelationwithcellefficiency.OthernonISOstandardparameterssuchasSbicanalsobecorrelated.
CCISunStarissuppliedwithcustomisedsoftwareinterfacethatincludesacomprehensivesetof3Dparameters.
Optimising PV cell efficiencyUniform trench depth prevents conducting material flowing out of the trench reducing efficiency – CCI SunStar evaluates depth, width, shape, height and volume.
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Controlling coating quality
Thick films (>1.5 microns)
• Multi-layeraswellassinglecoatings can be measured
• 3Dthickness,thicknessuniformity, delamination and interfacial roughness can all be studied in a single measurement
• Automationallowsthemeasurement of multiple sites on one sample and measurement of multiple samples
Coating uniformitySurface coating quality and uniformity can be improved by measuring the film thickness.
Film
Substrate
TheHelicalComplexField(HCF)*approach,patentedbyTaylorHobson,nowprovidesuniquemeasurementcapabilitytomeasurefilmthicknessbelow1.5micronwithunsurpassedverticalandspatialresolution.
Test measurement of SiO2 thin film on Si Threesamplesranginginthicknessfrom50nmto1000nm
*MansfieldD,'ThinFilmExtractionfromScanningWhiteLightInterferometry',Proc.oftheTwentyFirstAnnualASPEMeeting,Oct2006
Sample # 1 # 2 # 3
CCI(HCF)thickness(nm) 47.3 191.7 1053.4
NISTcalibratedthickness(nm) 47.0 191.2 1055.7
Measurementerror(%) 0.6 0.3 0.2
Measurementoffilmthicknessdownto25nmisachievable,dependentupontheopticalpropertiesofthefilm.Informationonfilmslessthan 50nmisavailableonrequest. MaterialsthattheCCIcanmeasureincludea-Si,CdTe,CdS,CIGS,ITO,ZnO2,TiO2,plusmanyothers.
Film thickness of thin films (>50 nm)
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Different CCI SunStar systems for different applications
CCI SunStar SR issuppliedwitha1millionpixelcameracapable ofscanspeedsupto18micronspersecond,amotorisedsoftwaredrivenstage,2.2mmclosedloopscanrangeandAutoRangesoftwarefunctionality.
Thesystemisoptimisedforautomaticmeasurementandanalysisofstepsandtrenches.Optionalroughnessanalysisanda6-inchsamplefixtureareavailable.
Resolution Software Scan speed
1Mpixels AutoRange 18microns/sec
CCI SunStar TF1 hasthefeaturesofferedwiththeCCISunStarSRbutalsoincludesoptionalthickfilmanalysissoftwaresuitableformulti-layerthicknessandroughnessofcoatingsgreaterthan1.5microns.
Resolution Coatings thickness Scan speed
1Mpixels Downto1.5micron 18microns/sec
CCI SunStar TFE buildsontheCCISunStarTF1byusinga4millionpixelcameraforoptimumlateralresolutionandextrasensitivityforthemeasurementoflowreflectivitysurfaces.Theoptionalfilmthicknessanalysissoftwareisidealforthemeasurementofsinglelayerthinfilmsdownto50nmthick,idealfor2ndgenerationsolarcells.
Resolution Coatings thickness Low reflectivity
4Mpixels Downto50nm ARcoatedsamples
CCI SunStar RD is designed to meet demanding research and developmentneedsandistheidealforallsolarcellmetrologyapplications,including3rdand4thgeneration.Thesystemcomessuppliedwithautomaticmeasurement,stitching,multi-siteandroughnessanalysisasstandard.A6-inchstageandfilmthicknessanalysissoftwarecanalsobeadded.
Resolution Automation Flexibility
4Mpixels Multi-sitemeasurement Optimisedforresearch
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System Configurations
Specifications are subject to change without notice.
Main BodyController Box
Objectives
X Y Stages
Tip Tilt Stage
Light Sources
High end PC1 or 2 Monitor Option
Turret
CCI SunStar SR CCI SunStar TF1 CCI SunStar TFE CCI SunStar RD
Camera 1Mpixel 1Mpixel 4Mpixel 4Mpixel
Step height ü ü ü ü
Trenchwidth ü ü ü ü
TalyMapLite(roughness) l l ü û
TalyMapGold l l l û
TalyMapPlatinum l l l ü
Verylowreflectivitysurface(ARcoated) û û ü ü
Thickfilmanalysis(>1.5µm) û l l ü
Filmthickness(>50nm) û û l l
Stitching l l l ü
Multi-site l l l ü
Standard lens 20x 20x 10x 10x
Otherlenses l l l l
Joystick l l l ü
112x78mmstage ü ü ü ü
156x156mmstage l l l l
6-inchwaferfixture(156x156mmstage) l l l l
InternalAV ü ü ü ü
ActiveAV û û û l
ü= Included l = Optional û = Not available
Controller box
High end PC 1 or 2 monitor option
Light sources
Tip tilt stage
Turret
Main body
Objectives
XY stages
Specificationsaresubjecttochangewithoutnotice
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Powerful software options
Control software specific for solar applications Nowwith64-bitprocessing,theCCIcontrolsoftwarefeaturesmoreflexibility,fasteroperatingspeedandimprovedoverallperformance.CustomisedtemplatesspecifictosolarcellapplicationsmakeTalyMapsoftwaretheidealanalysissoftwareplatform.
Multi-languagesupportisnowavailabletokeeppacewiththeglobaleconomyandinternationalmanufacturingpartnerships.
TalyMap analysis software Researchfacilities,factoriesanduniversitiesworldwidehavemadeTalyMaptheirpreferredsurfaceanalysissoftware.Itisusedforproductdevelopment,processimprovement,predictivebehaviouranalysisandroutineinspectioninmanysectors.
TalyMapiscontinuouslyevolvedbyamulti-disciplinaryteamofspecialistsinmetrology,softwareengineeringand automation in order to meet present and future surfacemetrologyneeds.
Key features
• Full metrological traceability withanewanalysisworkflowthatmakesiteasytotraceeverystepin ananalysisdocument.Newstepscanbeaddedandexistingstepscanbefine-tunedordeletedatanytime.
• Statistics for quality control makesitpossibletotrackandgeneratestatisticsonparametersacrossmultiplemeasurementdatasets.
• Multi-language support givesoptionstochangethesoftwaretoworkinoneofsixEuropeanlanguages,Japanese,Chinese,KoreanorBrazilianPortuguese.
• Quick results achievedfromtheMinidocfunction,whereanysequenceofanalysisstepscanbedefined andsavedintoaMinidoclibrary,significantly speeding upthepreparationofnewreports.
• Customisationallowsyoutoaddcompanylogos,measurement identity cards, screen notes and illustrationsincludingbitmaps,textblocks,arrows.
• Advanced Modules enhance the functionality of TalyMapbyprovidingadditionalanalysisorpresentationcapabilities.
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*Allparametersmarkedwithanasteriskaresuitableforuser-assignedsingleormultiplequalifiers,e.g.,materialratio(mr)maybeassessedatoneormoreslicelevelswithinasinglemeasurement.
Flexible, user-friendly, all-inclusive software
ThelatestgenerationofTalyMapsoftwareassuresconformitywiththe3DstandardISO25178aswellasfullmetrologicaltraceability.Idealforresearchanddevelopmentproducts,thelatest2Dand3Dparameterswillbecriticalforfuturedevelopments.
Alongwithphoto-realisticfullcolourimages,TalyMapalsoincludesenhancedproductivitytoolssuchastemplatesforrepetitiveworkandautomaticreportgeneration based on batches of measurementdata.
TaylorHobsonhasawell-deservedreputationforindustry-leadingdataprocessing. Analysisparametersandsoftwaremodulesavailableinclude:
2D parameters 3D parameters
Primary (unfiltered)Pa,Pc,Pdc,Pdq,PHSC,PHtp,Pku,Plo,Plq,Pmr,Pp,PPc,Pq,Prms,Psk,PSm,Pt,Ptp,Pv,Py,Pz,Pz(JIS),P3z,Pfd,Pda,Pla,PH,PD,PS,Pvo
AmplitudeSa,Sq,Sp,Sv,St,Ssk,Sku,Sz
Waviness (filtered)Wa,Wc,Wdc,Wdq,WHSC*,WHtp,Wku,Wlo,Wlq,Wmr*,Wp,WPc*,Wq,Wrms,Wsk,WSm,Wt,Wtm,Wtp,Wv,Wy,Wz,Wz(JIS),W3z,Wda,Wla,Wmax,WH,WD,WS,Wvo
Area & volumeStp,SHtp,Smmr,Smvr,Smr,Sdc
Roughness (filtered)Ra,Rc,Rdc,Rdq,RHSC,RHtp,Rku,Rlo,Rlq,Rmr*,Rp,RPc,Rq,Rrms,Rsk,RSm,Rt,Rtm,Rtp,Rv,Ry,Rz,Rz(JIS),R3z,Rfd,Rda,Rla,Rmax,RH,RD,RS,Rvo
Data analysisStepheight,LateralDistance,Pitch,AngleMeasurement,PeakCount,InteractiveAbbott-FirestoneCurve,VolumeofIslands,FractalAnalysis,MotifsAnalysis,FrequencyAnalysis,DataPatching
Rk (DIN 4776, ISO 13565-2)A1,A2,Mr1,Mr2,Rk,Rpk,Rvk,Rpk*,Rvk*
FunctionalSk,Spk,Svk,Sr1,Sr2,Sbi,Sci,Svi,Sm,Vv,Vm,Vmp,Vmc,Vvc,Vvv
R&W (ISO 12085)AR,AW,HTrc,Pt,R,Rke,Rpke,Rvke,Rx,Trc,W,Wte,Wx,Kr,Nr,SR,SAR,Kw,
FlatnessFLt,FLTp,FLTs,FLTq,FLTv
Autocorrelation,Nw,SW,SAW
Hybrid & spatialSdq,Ssc,SdrSpc,Sds,Str,Sal,Std,Sfd
Straightness (ISO 12780)STRt,STRp,STRv,STRq
FiltersGaussian,RobustGaussian,Spline,Wavelet,RobustWaveletandMorphological
540 mm
830
mm
540 mm
830
mm
SystemCCI
SunStar SRCCI
SunStar TF1CCI
SunStar TFECCI
SunStar RD
Measurement type 3D non-contact
Measurement mode Coherence Correlation Interferometry (CCI)
Z scanner Ultra high precision closed loop piezoless scanner
Objective mount 3 position turret
Stages CCI SunStar SR CCI SunStar TF1 CCI SunStar TFE CCI SunStar RD
Component weight (max) 10 Kg
Automated X-Y stage (medium) 112 mm x 75 mm
Automated X-Y stage (large) 150 mm x 150 mm
Manual tip/tilt (standard) +/- 4 degrees
Performance CCI SunStar SR CCI SunStar TF1 CCI SunStar TFE CCI SunStar RD
Single scan range (Z) 2.2 mm as standard (closed loop)
Z -stitching range Greater than 50 mm (closed loop)
Noise floor (Z) 1 <0.08 nm [0.8 Å] <0.08 nm [0.8 Å] <0.02 nm [0.2 Å] <0.02 nm [0.2 Å]
Repeatability of surface RMS 2 <0.02 nm [0.2 Å] <0.02 nm [0.2 Å] <0.02 nm [0.2 Å] <0.02 nm [0.2 Å]
Number of measurement points 1024 1024 2048 2048
Step height repeatability 3 <0.1% <0.1% >0.05% >0.05%
Surface reflectivity <0.3% - 100% <0.3% - 100% <0.3% - 100% <0.3% - 100%
Software CCI SunStar SR CCI SunStar TF1 CCI SunStar TFE CCI SunStar RD
Step height analysis Yes Yes Yes Yes
Roughness Optional Optional Yes Yes
Thick film analysis ( >1.5 microns) No Optional Optional Yes
Film thickness ( >50 nm) No No Optional Optional
Stitching Optional Optional Optional Yes
Multi-site Optional Optional Optional Yes
TalyMap Optional Optional Yes Yes
System dimensions CCI SunStar SR CCI SunStar TF1 CCI SunStar TFE CCI SunStar RD
Full system dimensions (floor space) 530 mm wide x 530 mm deep x 850 mm high
Temperature (storage) 10 - 50°C
Temperature (operating) 10 - 30°C
Temperature gradient < 1°C/hour ( best performance)
Humidity < 70% non-condensing
Internal anti-vibration Supplied as standard
External active anti-vibration N/A N/A N/A Optional
1 As demonstrated by multiple measurements on a levelled fused silica optical flat 2 As demonstrated by 1 sigma standard deviation of 20 Sq (RMS) measurements on SiC flat 3 As demonstrated by 1 sigma standard deviation of 20 measurements on a 5 μm step height standard
Other configurations are available upon request – please contact your local Taylor Hobson representative.Specifications subject to change without prior notice.
CCI SunStar system specifications
Tel: +44 116 276 3771 Email: taylor-hobson.sales@ametek.com www.taylor-hobson.com
A range of objectives lenses are available, the choice of lens will depend on the application. The key parameters are: • Field of view determines the measurement area • Optical resolution defines the smallest features that can be distinguished • Slope is an important consideration for curved and rough samples, a rougher surface will contain steeper slopes. All objective lenses are supplied with a protective storage.
Other objective lenses are available upon request – please contact your local Taylor Hobson representative.Specifications subject to change without prior notice.
Michelson Interferometer
Magnification 10 X, 20 X, 50 X, 100 X
Mirau Interferometer
CC
I Sun
Star
SR
MagnificationField of view (mm)
Optical resolution (um)
Pixel size (um)
Slope (max) (deg)
Working distance (mm)
NA Design
2.5x 6.92 x 6.92 4.07 6.92 2 10.3 0.075 Michelson
5x 3.46 x 3.46 2.35 3.46 4 9.3 0.13 Michelson
10x 1.73 x 1.73 1.02 1.73 7.7 7.4 0.3 Mirau
20x 0.865 x 0.865 0.76 0.865 14.6 4.7 0.4 Mirau
50x 0.346 x 0.346 0.4 - 0.6 0.346 27.7 3.4 0.55 Mirau
100x 0.173 x 0.173 0.3 - 0.5 0.173 33.3 2 0.7 Mirau
CC
I Sun
Star
TF1
MagnificationField of view (mm)
Optical resolution (um)
Pixel size (um)
Slope (max) (deg)
Working distance (mm)
NA Design
2.5x 6.92 x 6.92 4.07 6.92 2 10.3 0.075 Michelson
5x 3.46 x 3.46 2.35 3.46 4 9.3 0.13 Michelson
10x 1.73 x 1.73 1.02 1.73 7.7 7.4 0.3 Mirau
20x 0.865 x 0.865 0.76 0.865 14.6 4.7 0.4 Mirau
50x 0.346 x 0.346 0.4 - 0.6 0.346 27.7 3.4 0.55 Mirau
100x 0.173 x 0.173 0.3 - 0.5 0.173 33.3 2 0.7 Mirau
CC
I Sun
Star
TFE
MagnificationField of view (mm)
Optical resolution (um)
Pixel size (um)
Slope (max) (deg)
Working distance (mm)
NA Design
2.5x 6.6 x 6.6 4.07 3.3 3.5 10.3 0.075 Michelson
5x 3.3 x 3.3 2.35 1.65 6 9.3 0.13 Michelson
10x 1.65 x 1.65 1.02 0.83 14 7.4 0.3 Mirau
20x 0.825 x 0.825 0.76 0.415 19 4.7 0.4 Mirau
50x 0.33 x 0.33 0.4 - 0.6 0.165 27.7 3.4 0.55 Mirau
100x 0.165 x 0.165 0.3 - 0.5 0.0823 33.3 2 0.7 Mirau
CC
I Sun
Star
RD
MagnificationField of view (mm)
Optical resolution (um)
Pixel size (um)
Slope (max) (deg)
Working distance (mm)
NA Design
2.5x 6.6 x 6.6 4.07 3.3 3.5 10.3 0.075 Michelson
5x 3.3 x 3.3 2.35 1.65 6 9.3 0.13 Michelson
10x 1.65 x 1.65 1.02 0.83 14 7.4 0.3 Mirau
20x 0.825 x 0.825 0.76 0.415 19 4.7 0.4 Mirau
50x 0.33 x 0.33 0.4 - 0.6 0.165 27.7 3.4 0.55 Mirau
100x 0.165 x 0.165 0.3 - 0.5 0.0823 33.3 2 0.7 Mirau
Magnification Magnification power of the objective lens
Field of view Area of the sample measured by a given objective
Optical resolution The ability to distinguish adjacent heights
Pixel size Sample resolution, pixel pitch (spatial sampling interval)
SlopeMaximum specular slope, restricted by pixel size and the numerical aperture. steeper slopes can be measured on non-specular surfaces
Working distance Distance between sample and lens
NA Numerical aperture, expresses the angular aperture of the lens
Design Type of interferometer used, Michelson or Mirau
CCI SunStar objective lens specifications
Tel: +44 116 276 3771 Email: taylor-hobson.sales@ametek.com www.taylor-hobson.com
Magnification 5 X, 2.5 X
Copyright© 2012 • Taylor Hobson • CCI SunStar Spec_V1
Copyright© 2013 • Taylor Hobson •CCI SunStar_GB_V5_11 June
Taylor Hobson UK (Global Headquarters)
PO Box 36, 2 New Star RoadLeicester, LE4 9JQ, England
Tel: +44 116 276 3771 Fax: +44 116 246 0579 email: taylor-hobson.uk@ametek.com
Taylor Hobson FranceRond Point de l’Epine Champs
Batiment D, 78990 Elancourt, FranceTel: +33 130 68 89 30 Fax: +33 130 68 89 39
taylor-hobson.france@ametek.com
Taylor Hobson GermanyPostfach 4827, Kreuzberger Ring 6
65205 Wiesbaden, GermanyTel: +49 611 973040 Fax: +49 611 97304600
taylor-hobson.germany@ametek.com
Taylor Hobson India1st Floor, Prestige Featherlite Tech Park
148, EPIP II Phase, Whitefield, Bangalore – 560 006Tel: +91 1860 2662 468 Fax: +91 80 6782 3232
taylor-hobson.india@ametek.com
Taylor Hobson ItalyVia De Barzi
20087 Robecco sul Naviglio, Milan, ItalyTel: +39 02 946 93401 Fax: +39 02 946 93450
taylor-hobson.italy@ametek.com
Taylor Hobson Japan3F Shiba NBF Tower, 1-1-30, Shiba Daimon Minato-ku
Tokyo 105-0012, JapanTel: +81 (0) 3 6809-2406 Fax: +81 (0) 3 6809-2410
taylor-hobson.japan@ametek.com
Taylor Hobson Korea#310, Gyeonggi R&DB Center, 906-5, lui-dong
Yeongtong-gu, Suwon, Gyeonggi, 443-766, KoreaTel: +82 31 888 5255 Fax: +82 31 888 5256
taylor-hobson.korea@ametek.com
Taylor Hobson China Beijing OfficeWestern Section, 2nd Floor, Jing Dong Fang Building (B10)
No.10, Jiu Xian Qiao Road, Chaoyang District, Beijing, 100015, ChinaTel: +86 10 8526 2111 Fax: +86 10 8526 2141
taylor-hobson.beijing@ametek.com
Taylor Hobson China Shanghai OfficePart A, 1st Floor, No. 460 North Fute Road
Waigaoqiao Free Trade Zone, Shanghai, 200131, ChinaTel: +86 21 5868 5111-110 Fax: +86 21 5866 0969-110
taylor-hobson.shanghai@ametek.com
Taylor Hobson SingaporeAMETEK Singapore, 10 Ang Mo Kio Street 65
No. 05-12 Techpoint, Singapore 569059Tel: +65 6484 2388 Ext 120 Fax: +65 6484 2388 Ext 120
taylor-hobson.singapore@ametek.com
Taylor Hobson USA1725 Western Drive
West Chicago, Illinois 60185, USATel: +1 630 621 3099 Fax: +1 630 231 1739
taylor-hobson.usa@ametek.com
www.taylor-hobson.com
© DiskArt™ 1988
TAYLORR HOBSONA8248 ISO9001
OPTIMA�UKAS
Serving a global marketTaylor Hobson is world renowned as a manufacturer of precision measuring instruments used for inspection in research and production facilities. Our equipment performs at nanometric levels of resolution and accuracy.
To complement our precision manufacturing capability we also offer a host of metrology support services to provide our customers with complete solutions to their measuring needs and total confidence in their results.
Contracted Services from Taylor Hobson
• Inspection services measurement of your production parts by skilled technicians using industry leading instruments in accord with ISO standards
• Metrology training practical, hands-on training courses for roundness and surface finish conducted by experienced metrologists • Operator training on-site instruction will lead to greater proficiency and higher productivity • UKAS Calibration and Testing certification for artifacts or instruments in our laboratory or at customer’s site
For the above services, contact our Center of Excellence:email: taylor-hobson.cofe@ametek.com or call: +44 116 276 3779
• Design engineering special purpose, dedicated metrology systems for demanding applications
• Precision manufacturing contract machining services for high precision applications and industries
• Preventative maintenance protect your metrology investment with a Talycare service cover plan
For the above services, contact our Sales Department:email: taylor-hobson.sales@ametek.com or call: +44 116 246 2034
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