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© 2011 ANSYS, Inc. June 18, 2012 1
Chip, Package and System (CPS) Design
Steve G. Pytel, PhD. SI Product Manager
Confidence by Design Chicago, IL June 14, 2012
© 2011 ANSYS, Inc. June 18, 2012 2
• On August 1st, 2011, ANSYS announced that it successfully closed acquisition of Apache Design Solutions, Inc.
– Apache is the leading simulation software provider for advanced, low power solutions in the electronics industry.
• The addition of Apache’s technology is complementary and expands the breadth, depth, functionality, usability and interoperability of ANSYS’ simulation capabilities.
• Apache will operate is a wholly-owned subsidiary of ANSYS
ANSYS and Apache: Acquisition
© 2011 ANSYS, Inc. 3
Focused •Simulation is all we do. •Leading product technologies in all physics areas •Largest development team focused on simulation
Capable More than 2,000 employees 60 locations, 40 countries
Trusted 96 of top 100 FORTUNE 500 industrials •ISO 9001 and NQA-1 certified
Proven Recognized as one of the world’s most innovative and fastest-growing companies*
Independent Long-term financial stability CAD agnostic
*BusinessWeek, FORTUNE
ANSYS Strengths
© 2011 ANSYS, Inc. 4
Apache Strengths
Largest global R&D and support team focused on power and noise
Irvine, CA San Jose, CA
Seattle
San Diego, CA Texas
North Carolina
New Hampshire Colorado
United Kingdom
Sales, Support Offices
R&D Centers
Israel
France
Germany
Chengdu, China
Shanghai, China
Noida, India
Beijing, China
Bangalore, India
Japan
South Korea
Taiwan
Singapore
• Established 2001
• HQ in San Jose, CA
• 22 Offices
• 11 Countries
• 7 R&D Centers
At a Glance Global Footprint
© 2011 ANSYS, Inc. 5
Old Paradigms Single Physics Circuit and System Simulation Single User and Single Component Simulation Few Design Points Studied
New Paradigms Single-Platform Multiphysics Simulation Including SI/PI, EMI/EMC, Electronics Cooling, RF/MW and Structural Mechanics Circuit and System Simulation Integrated with High-Fidelity Multiphysics Analysis Collaborative Multi-user and Multi-scale Simulation (component to system) Extensive Multiphysics and Multiscale Design Exploration with High-Performance Computing
ANSYS Vision for Electronics Industry
© 2011 ANSYS, Inc. 6
ANSYS & Apache Technology
Power Integrity Signal Integrity
Thermal/Stress Electromagnetic Interference
© 2011 ANSYS, Inc. 7
Apache Strengths
System Cooling
Interference
Battery life
Integration
40/28/22nm EM and ESD
Power Budgeting Power Delivery
Advanced Reliability Chip – Package - System
© 2011 ANSYS, Inc. 8
Highly Complementary
• ANSYS –Leader in package/board EM, system, and
mechanical/thermal for electronics
• Apache –Leader for mobile low power, reliability
and chip-package-system simulation
Expand Breadth and Depth of Simulation
• Design Flow for Chip/Package/System
• Allows for an end-to-end chip/package/system
solution platform
ANSYS and Apache: Synergy
End-to-End Chip-Package-System Power, Thermal, EMI, Timing Platform
CHIP RedHawk
Totem, PowerArtist
PACKAGE HFSS, SIwave
Q3D, TPA Sentinel – NPE, PSI, TI
Icepak, Mechanical
BOARD SIwave, HFSS Q3D
DesignerSI Icepak
CONNECTOR HFSS, Q3D
© 2011 ANSYS, Inc. 9
Infotainment
• Voice, Video, Internet, apps, etc., …
Impacts
• System miniaturization
• Power and cooling
• EMI
• IP and SoC integration
ANSYS Software used
• HFSS / DesignerSI / Q3D Extractor
• SIwave / Icepak
• RedHawk
• Totem
ANSYS and Apache: Examples
Smartphone EMI Simulation in HFSS
SIwave Calculates PCB Power & Currents
Board Temperature and Forced Air Cooling using IcePak
Power Temp
CPM from RedHawk
© 2011 ANSYS, Inc. 10
Mobile Data
• Mobile data to grow over 2500% by 2015 from 2010 levels*
Impacts
• Antennas and EMI
• RF-IC modules
• I/O DDR jitter
ANSYS Software used
• DesignerSI / SIwave / HFSS
• Sentinel-SSO / PSI
ANSYS and Apache: Examples
Cellular Base Station Antenna Using HFSS
RF Module in ANSYS Designer using HFSS Solver on Demand (Model Courtesy Skyworks)
IO/DDR Power and Signal integrity aware timing/jitter using Sentinel-SSO
* Jeffries Mobility 2020
© 2011 ANSYS, Inc. 11
Power Consumption / Power Budget
• Gap is Increasing
• 6X gap in 2015 to be 10X gap in 2010
Impacts
• Battery life
• Handset / Tablet cooling
• Reliability
ANSYS Software Used
• PowerArtist
• Sentinel-TI
• ANSYS CFD / HFSS
ANSYS and Apache: Examples
Modern 3DIC Stacked Die Simulation in Sentinel-TI
RTL Design for Power Flow using
PowerArtist
Mu
lti-
ph
ysic
s b
att
ery
mo
del
ing
* ITRS
© 2011 ANSYS, Inc. 12
More and Faster Data
• 2 GHz and beyond designs
• Lowered voltage supply to reduce power consumption
Impacts
• Noise margin and power integrity
• Power induced noise
ANSYS Software Used
• HFSS / Q3D / SIwave / Sentinel
• RedHawk
• Totem-CSE
ANSYS and Apache: Examples
Multi-core high speed ARM based mobile processor power analysis using RedHawk (from
blogs.ARM.com)
Power Noise Coupling Analysis Using Totem-CSE
HFSS and Q3D Electrical Simulators evaluate how
signals enter and exit
© 2011 ANSYS, Inc. 13
ANSYS and Apache: The Future
The future will require greater co-simulation capabilities and innovations
• Automotive EMI • 3DIC With Thermal • High-speed I/O
© 2011 ANSYS, Inc. 14
ANSYS and Apache: The Future
Model Based Electronic System Co-Analysis
SoC Level Simulation
System Level Analysis
CPM
Package, PCB Model
Chip Power Model
• Captures chip current & parasitics
• Distributed and cross-coupled • SPICE ready
Package, PCB Extraction
• S-parameter or RLCG
• 3D full-wave / Hybrid / 3D Quasi-static • Full package / PCB extraction • IC on PKG on PKG on BRD Extraction
Co-Simulation
• Direct CPM import
• AC, DC, transient, EMI analysis • Integrated query and editing
© 2011 ANSYS, Inc. 16
CPS Solution
Ansoft
Package/PCB
RTL
PowerArtist
SoC
RedHawk
Analog/IP
Totem
RTL Power Model (RPM)
Compact Macro Model (CMM)
Chip Power Model (CPM)
Chip Package Protocol
(CPP)
RPM
CMM CPP
CPM
© 2011 ANSYS, Inc. 19
Product portfolio (Quasi-Static)
Large-scale and application specific
Attentive and flexibility
Speed Accuracy
Quasi-Static RLCG Analysis
Q3D •Golden Standard RLCG •Adaptive Mesh •3D MCAD I/F
Connector model extraction QFP(Lead flame) extraction PBGA extraction
Sentinel-NPE •ECAD I/F - For PKG •Large scale •High speed extraction •CPS flow
Large scale power model extraction Power/Signal extraction for SSO
TPA •Used Q3D Solver Engine - Non Adaptive Mesh •ECAD I/F - For PKG specific
BGA signal extraction Middle Scale Model extraction
© 2011 ANSYS, Inc. 20
Product portfolio (Full-wave)
Large-scale and application specific
Attentive and flexibility
Speed Accuracy
Full-wave Analysis
Sentinel-PSI •High Speed FEM of Prism element •PI/SI analysis for Package •Complement 3D effect for SIwave •The power supply for SSO and Signal of package and board with single substance EMI
SIwave •High speed Hybrid solver for PKG/BRDの •Large scale analysis
• Large-scale board power supply model extraction
• Package-Board EMI analysis
HFSS •Golden Standard Full wave analysis •Flexible full 3D •Strong extraction for critical net • Layout front end for HFS System level sign off Critical PCB signal extraction
© 2011 ANSYS, Inc. 23
Interface for chip analyses
ploc File
gsr file
Chip pad location
power-supply-voltage domain
Redhawk
Package
Compiler
Check Package structure
Termination process of solder ball
Connect Chip-Package pins
Check passivity
Export corrected package model
Export corrected ploc
CPP header
Package
Model
Redhawk
Totem
Sentinel-NPE
Q3D
Dynamic
voltage drop
Timing
impact
ESD
Dynamic low
power
Signal
Power
EM
Create CPM
© 2011 ANSYS, Inc. 24
Package compiler - Pin mapping
VDDC
VDDQ
VSSQ
VSSC
* Start Power Ground Ports
* D1-105:( 0.586232E+01 -0.460654E+01):GND-MP_1_1=GND:GND_Group_1:DIE
* D1-109:( 0.586232E+01 -0.415747E+01):GND-MP_1_1=GND:GND_Group_1:DIE
* D1-113:( 0.586232E+01 -0.370840E+01):GND-MP_1_1=GND:GND_Group_1:DIE
* D1-118:( 0.586232E+01 -0.314706E+01):GND-MP_1_1=GND:GND_Group_1:DIE
* D1-124:( 0.586232E+01 -0.247345E+01):GND-MP_1_1=GND:GND_Group_1:DIE
* D1-130:( 0.586232E+01 -0.179984E+01):GND-MP_1_1=GND:GND_Group_1:DIE
* D1-136:( 0.586232E+01 -0.112624E+01):GND-MP_1_1=GND:GND_Group_1:DIE
* D1-142:( 0.586232E+01 -0.452628E+00):GND-MP_1_1=GND:GND_Group_1:DIE
* D1-146:( 0.586232E+01 -0.355600E-02):GND-MP_1_1=GND:GND_Group_1:DIE
* D1-148:( 0.586232E+01 0.220980E+00):GND-MP_1_1=GND:GND_Group_1:DIE
* D1-15:(-0.382067E+01 -0.586334E+01):GND-MP_1_1=GND:GND_Group_1:DIE
* P1-B3:(-0.133350E+02 0.146050E+02):VCC-MP_2_2=VCC:VCC_Group_2:PCB
* P1-C2:(-0.146050E+02 0.133350E+02):VCC-MP_2_2=VCC:VCC_Group_2:PCB
* P1-C24:( 0.133350E+02 0.133350E+02):VCC-MP_2_2=VCC:VCC_Group_2:PCB
* P1-C25:( 0.146050E+02 0.133350E+02):VCC-MP_2_2=VCC:VCC_Group_2:PCB
* P1-C3:(-0.133350E+02 0.133350E+02):VCC-MP_2_2=VCC:VCC_Group_2:PCB
* End Power Ground Ports
DVDD1 4905 878.85 METAL4 POWER
DVSS1 4880 938.85 METAL4 GROUND
DVDD2 4905 998.85 METAL4 POWER
DVSS2 4880 1058.85 METAL4 GROUND
DVDD3 4905 1118.85 METAL4 POWER
DVSS3 4880 1178.85 METAL4 GROUND
DVDD4 4905 1238.85 METAL4 POWER
DVSS4 4880 1298.85 METAL4 GROUND
DVDD5 4905 1358.85 METAL4 POWER
DVSS5 4880 1418.85 METAL4 GROUND
DVDD6 4905 1478.85 METAL4 POWER
DVSS6 4880 1538.85 METAL4 GROUND
DVDD7 4905 1598.85 METAL4 POWER
DVSS7 4880 1658.85 METAL4 GROUND
DVDD8 4905 1718.85 METAL4 POWER
DVSS8 4880 1778.85 METAL4 GROUND
DVDD9 4905 1838.85 METAL4 POWER
DVSS9 4880 1898.85 METAL4 GROUND
DVDD10 4905 1958.85 METAL4 POWER
DVSS10 4880 2018.85 METAL4 GROUND
DVDD11 4905 2078.85 METAL4 POWER
DVSS11 4880 2138.85 METAL4 GROUND
Redhawk Pin location Package Model(CPP Header)
315° Rotate
X axis center flip
Matched Pin location!
© 2011 ANSYS, Inc. 25
Package compiler-Create Package model structure
Chip side Multi ports
Connect Redhawk DB
by Ploc
Solder Ball side Single port
V
Terminal process
by importing Gsr
© 2011 ANSYS, Inc. 27
The interface for system analysis
CPM
(Chip Power Model)
Impedance in Chip
Pad current
Model supply
Sentinel-PSI
SIwave Redhawk
Totem
Dynamic
Voltage drop
Timing
Impact
ESD
Dynamic low
power
Signal
Power
EM
Create CPM
© 2011 ANSYS, Inc. 28
CPM overview
Static (Iavg, R) Frequency Domain(RLC) Time Domein (I(t), RLC)
Analysis Mode Model
reduction
The real chip in the system analysis is available.
© 2011 ANSYS, Inc. 29
System AC Simulation
Package/PCB DC Analysis
Capacitor in package
Capacitor in board
BGA Package Bulk capacitor
Power Line
GND Line
CPM
PDN analysis in whole system
Capacitor placement Time domain system analysis
© 2011 ANSYS, Inc. 31
CPS Example
‐EMI Co-Simulation‐
Apache Design : CPM Integration RH+CPM+SIwave+DesignerSI
© 2011 ANSYS, Inc. 35
DesignerSI
Nexxim &
HSPICE
CPS Down Stream System Design Flow: SI, PI & EMI
FWS, SYZ, Transient, Near & Far Field
Solutions
RedHawk Totem
CPM
Package Databases
PCB Database
SIwave HFSS for ECAD
Sentinel-PSI
FWS, SYZ for SI, PI, & EMI
Frequency-Domain Sources
for EMI
HFSS for MCAD
© 2011 ANSYS, Inc. 37
Chip-Pkg-System EMI Co-Simulation
• Chip-Pkg-System Co-Simulation
– The real operated noise source of IC is applied.
EMI analysis model
The waveform of supplied power and ground.
Transient analysis
Apache CPM
PCB+Pkg SIwave
ANSYS DesignerSI™ with Nexxim®
© 2011 ANSYS, Inc. 38
Chip-Pkg-System EMI Co-Simulation
• Chip-Pkg-System Co-Simulation
– Extraction Model (Package + Board)
With Decoupling 3m Far Field plot(dBμV/m)
Far Field - 1.27v with Decaps
-20.00
-10.00
0.00
10.00
20.00
30.00
40.00
50.00
60.00
0.00 0.50 1.00 1.50 2.00GHz
dB
uV
/m__
Without Decoupling
✍Virtual EMI Test environment
Near Field Plot (1.5GHz)
© 2011 ANSYS, Inc. 39
J3 V
olt
ag
e [
dB
V]
Frequency [Hz]
J3 V
olt
ag
e [
dB
V]
Frequency [Hz]
Conclusion - CPS Simulation Example Automotive Electronic Verification for EMI
• ST Microelectronics
– Already demonstrated solution using tools from ANSYS, Apache, and other vendors
• New Opportunity
– Single vendor for integrated multi-physics platform
– Data transfer and model exchange
– Component, sub-system and system level validation
– Monitor and validate entire design chain
– From virtual prototyping to design sign-off
– From specification planning to system acceptance
System EMI