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transcript
October 2016 DocID029647 Rev 2 1/17
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UM2103 User manual
Getting started with STEVAL-OET003V1 evaluation board for automotive-grade ESD protection
Introduction The STEVAL-OET003V1 evaluation board is designed to provide a demonstration tool to evaluate ESD protection robustness for automotive applications.
The demonstration tool includes:
1. two STM8AF528 MCUs (one configured as the master node and the other as the slave node) 2. two NXP LIN bus transceivers 3. two NXP CAN bus transceivers 4. a step-up converter to boost 5 to 12 V for transceiver supply voltage 5. a linear regulator to obtain a 3.3 V supply voltage 6. an automotive-grade ESD protection device for each transceiver 7. possibility to test several ESD protection part numbers
The protection robustness is evaluated by monitoring the communication flow between the master and the slave nodes.
Figure 1: STEVAL-OET003V1 evaluation board
Contents UM2103
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Contents
1 Getting started ................................................................................ 4
2 Board description ........................................................................... 5
2.1 Board supply .................................................................................... 5
2.2 LIN and CAN connectors ................................................................. 5
3 Firmware description ..................................................................... 6
4 Block diagram ................................................................................. 7
5 ESD test .......................................................................................... 8
5.1 Connections (supply and data lines) ................................................ 8
5.2 ESD application ................................................................................ 8
5.3 ESD part number changes ............................................................... 9
6 Schematic diagrams ..................................................................... 10
7 Layout ........................................................................................... 13
8 Revision history ........................................................................... 16
UM2103 List of figures
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List of figures
Figure 1: STEVAL-OET003V1 evaluation board ........................................................................................ 1 Figure 2: STEVAL-OET003V1 block diagram ............................................................................................ 7 Figure 3: Contact ESD discharge ............................................................................................................... 8 Figure 4: Air ESD discharge ....................................................................................................................... 9 Figure 5: Power section ............................................................................................................................ 10 Figure 6: LIN section ................................................................................................................................. 10 Figure 7: CAN section ............................................................................................................................... 11 Figure 8: Master node ............................................................................................................................... 11 Figure 9: Slave node ................................................................................................................................. 12 Figure 10: STEVAL-OET003V1 top layer ................................................................................................. 13 Figure 11: STEVAL-OET003V1 bottom layer ........................................................................................... 14 Figure 12: STEVAL-OET003V1 silk screen top layer ............................................................................... 15
Getting started UM2103
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1 Getting started
To start the application board, connect the 5 V supply voltage to the screw connector and push the reset button to align the nodes.
The three-color LED (orange, yellow and blue) starts blinking sequentially to indicate normal communication; if a communication fault occurs, the blinking LED switches off and the red LED turns on.
UM2103 Board description
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2 Board description
The evaluation board implements a master/slave structure, by using two on-board STM8AF528 MCU nodes which communicate via a LIN/CAN protocol implementation.
The board features:
5 V input voltage
12 V output, boost topology converter for transceiver supply voltage
3.3 V regulated voltage
LIN bus transceiver
CAN bus transceiver
automotive grade ESD protections
IEC61000-4-2 & ISO10605 compatibility
The board is specifically designed to reduce noise impact due to electrostatic discharge. Refer to Section 7: "Layout" to view the ground track and plane design.
Regarding the ground net, a star connection links all the tracks to the A7985A ground reference pin; whereas, the ground plane is split in two parts: one for the master and one for the slave node, both referring to the respective ground connection.
2.1 Board supply
The board supplies three different voltage references: the microcontroller section, the LIN/CAN transceiver modules and the CAN connector.
The main voltage reference (Vin = 5 V) is provided through the J5 screw connector and the A7985A DC - DC converter (in boost topology) raises it to 12 V to obtain the supply voltage for the LIN and CAN transceivers.
Moreover, a 3.3 V reference (not available by default) is generated by using the ST LF33CDT-TRY very low drop voltage regulator, starting from 5 V input voltage (this reference is shown on the CAN connector); to enable this reference voltage, the J6 jumper must be closed and the C19 and C20 capacitors must be assembled.
2.2 LIN and CAN connectors
The CAN connection uses two standard RS232 connectors; while LIN communication uses two screw connectors (where it is possible to connect an external supply voltage for the transceiver module and the LIN bus).
Firmware description UM2103
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3 Firmware description
The communication described is mainly based on a simple LIN/CAN communication, where the loop status (normal or fault) is shown respectively by:
a three-color LED (orange, blue or purple in case of normal operation)
a red LED if the communication fails
The communication flow starts when the master sends the LIN frame to the slave.
If the received frame is correctly recognized, the slave sends a new frame to the master through the CAN protocol; after frame reception, the status loop is incremented by switching a new LED on.
If the communication is corrupted, the status LED turns off and the red LED switches on.
UM2103 Block diagram
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4 Block diagram Figure 2: STEVAL-OET003V1 block diagram
ESD test UM2103
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5 ESD test
5.1 Connections (supply and data lines)
Supply: 5 V must be connected to the J5 screw connector.
CAN connection: through DB9 female connectors, connect one wire between pins 2 (CANL) to standard RS232 connector (DB9 male P1 and P2) and one other wire between pins 7 (CANH) standard RS232 connector (DB9 male P1 and P2).
LIN: 1 wire between pin 1 of J12 and pin 3 of J9 screw connectors.
When the board is supplied and data lines connected, the green and red LEDs will turn on. Push the “SW1” button and then, 3 LEDs will blink (the red LED turns off).
The evaluation board is now ready for the ESD test.
5.2 ESD application
Figure 3: Contact ESD discharge
ESD contact: the ground ESD gun can be applied directly to the PCB ground with the GND plane close to the P1 connector. The ESD gun tip is applied on nail LIN (ESD_TIP6 & 7 markings) or nail CAN (ESD_TIP1 to 4 markings) and then ESD shoots can be performed.
UM2103 ESD test
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If the LEDs stop blinking, push the “SW2” button and then the “SW1” button. The demo board is still operational and the LEDs blink again.
Figure 4: Air ESD discharge
ESD air: the same connections must be done, but the ESD gun tip placed close to DB9 and the screw connectors where the data line wires are connected.
By default, ESDCAN02-2BWY and ESDLIN1524BJ are soldered on the PCB to protect the transceivers against ESD discharge.
For each ESD protection device (see the next section to test other ESD protection devices), the evaluation board is always operational even for ESD levels equal to ± 30 kV in contact or air ESD discharge, and this is for R = 330 Ω and C = 330 pF or other RC values and for more than 3 pulses (ISO10605 conditions).
5.3 ESD part number changes
It is possible to change ESD protection devices. The first step is to unsolder (with air heater, for example) ESDLINxx (D14(15)) or D17(18)), or ESDCANxx (D1(2) or D7(8)) close to the connectors. ESDLINxx and ESDCANxx samples are available in a bag (see list below). ESDCAN footprints are compatible with all ESDCANxx part numbers and for LIN part. ESD tests can be performed again after ESD device replacement.
ESD protection available in STEVAL-OET003:
ESDCAN02-2BWY in SOT323-3L (Marking: C02) (2 samples soldered on PCB)
ESDLIN1524BJ in SOD323 (Marking: 24) (2 samples soldered on PCB)
Part numbers available in bag:
ESDCAN03-2BWY in SOT323-3L (Marking: C03) (1 sample)
ESDCAN01-2BLY in SOT23-3L (Marking: EN24) (1 sample)
ESDCAN24-2BLY in SOT23-3L (Marking: EL24) (1 sample)
ESDLIN03-1BWY in SOT323-3L (Marking: C12) (1 sample)
Schematic diagrams UM2103
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6 Schematic diagrams Figure 5: Power section
Figure 6: LIN section
1
R21
1.5k
C22n2, 25V
U16
ESDA14V2SC5Y
C9470pF
6
1
Vcc
9
3
1
D6
STPS3L40-Y
3
R111K
2
7
2
Fsw
C6
100nF
2
4 1
EN
STEP UP CONVERTER 5V to 12V
2
2
R222.49k, 1%
R1947k, 1%
1
1
2
Q1STN4NF06L
D5STPS3L40-Y
L222uH
8
5
1
4COMP
+5V
TP
2
2
1
3FB
2
1
C10100nF
1
2
2
GND
Vout
1
2
R20220R
1
1
2
SY
C82n2, 25V
2
4
1
2
R18110k
2
+12V
1
U2
A7985A
2
1
5
1
C5
10uF
6
1
2
B1
CG2
C17N.M
C202.2u N.M.
J5
DC-10B
D11SM4T6V7AY
1VIN
3PSG
C15100nF
3V3
1
POWER INPUT AND PROTECTION
5Vin
5
GN
D
1
1
1
1
1
1
2
6CG3
2
U7LF33CDT-TRY N.M.
2
2
2
2
3VOUT
1
0
U6
Murata BNX002-01
2
2
CG1
1
2
2 1CB
J65Vto3V3
C18N.M.
2
2
R39PTC 0.12 1/8W
+5V
C1610uF
C19100nF N.M.
4
LINCAN MCUPOWER
D15
22
1
+12V
1
BAT48ZFILMD16
TP14
UART3_TX
2
BAT48ZFILM
GND
1
1
1
2
UART1_RX INH
2
1
2
D18
1
6
1
LIN
2
J12LIN OUTPUT
1
FOR VOLTAGE PROBE
HIGH CURRENT 50A for 1nSec
TXD
2
R404K7
LIN_EN_MCU2
4
TP13
2
WUP3
LIN
2
1
1
R49N.M
1
C25100nF
INH8
2
TP20
ESD_Tip7
R52N.M.10k
U8
1
1
D13
LIN
C26100nF
RXD
1
2
1RXD
8
D17
ESDLIN1524
J11
JUMPER1
3
Vs
WUP
1
TP18
TP21
2
1
1
2
1R480
VBAT
1
NORMAL OPEN
7
6
3
VBAT
2
J10
JUMPER
1
C22100nF
2
2
U10
TP19
TP17
1
2
J8
JUMPER1
R410
MASTER
12V VCC
LIN
GND
UART3_RX
+12V
UART1_TX
1
R5010k
2
1
U9
TJA1021T/10
C27220pF
1
SLAVE
SLP_N
ESD PROTECTION LIN
1
J9LIN OUTPUT
7
12V VCC
LIN
GND
D14
ESDLIN1524
1
1
R4510k
1
2
R510R
2
2
TP16
Vs
1
TP15
2
2
FOR VOLTAGE PROBE
HIGH CURRENT 50A for 1nSec
2
R440R
5
SLP_N
2
R474K7
1
C231nF
U11
TJA1021T/10
2
C21
100nF
1
1
2
2
2
2
ESD PROTECTION LIN
SOD323 SOD523
D12BAT48ZFILM
C24
100nF
1
GND5
SOD323 SOD523
1
LIN_EN_MCU1
TXD
R46N.M.10k
R43
1K
1
1
NORMAL OPEN
J7
JUMPER
2
2
1
ESD_Tip6
4
3
UM2103 Schematic diagrams
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Figure 7: CAN section
Figure 8: Master node
11
2
R26N.M.
6
U5
R23N.M.
2
J2
JUMPER1
M1
GND
1
CAN TX_MCU2
+12V
3V3
J1JUMPER
Vbat
SPLIT
CANH
CANL
CANH
CANL
GND
1
1
R340R
C747pF
1
R4N.M.
EN
1 BAT48ZFILM
CAN RX_MCU1
1
ESD_Tip1
7
1
2
2
1
1
2
CA
N C
ON
NE
CT
OR
BAT48ZFILM10
2
J4JUMPER
2
2
4
TP9
8
RXD
3
2
C1100nF
9
1
3V3
ERR_N
12
8
1
C1347pF
ESD PROTECTION CAN
2
2
2
ESD_Tip4TP7
1
R38N.M.10k
WAKE
1
3
2
2
2
2
INH
1
1
1
1
R15N.M.
TXD
R27N.M.
TP8
1
R36N.M.
2
EN CAN_MCU2
VBATCANL 2
STB_N
ESD PROTECTION CAN
9
SPLIT
P2
M2
1
1
2
4RXD
R140R
R10
N.M.
C1447pF
2
1
1
C347pF
C12100nF
2
2
TP2
8
2
L3
CHOKE CM
Vbat
7
12
2
R90R
2
NORMAL CLOSED
1
2
VIO
VCC
2
1
6
4
TP1
1
CANL
D2
ESDCAN24
L1
CHOKE CM
NORMAL CLOSED
CA
N C
ON
NE
CT
OR
1
1
1
1 1
2
R25N.M.
6
2
4
ESD_Tip3
R300R
D10
1
2
5
VCC
R35N.M.
1
U1
TJA1043T
2
R13120R
1
STB_NR240R
GND
1
R320R
13CANH
CANH
CANL
4
14
+5V
EN CAN_MCU1
M1
D1ESDCAN24
1
11
VIO
SPLIT
10
1
R10R
3
VBAT
1
TP10
R1710k
R8N.M.
1
4
TP4 1
R33120R
J3
JUMPER1
1
9WAKE
TXD
2
2
D7
ESDCAN24
3
1
ERR_N
1
7
2
M2
2
1
C447pF
INH
R31
N.M.
3
CAN TX_MCU1
Common Mode ChokeACT45B-101-2PTDK
2
R29N.M.
SPLIT
CANH
CANL
D8
ESDCAN24
U3ERR_N CAN_MCU1
5
P1
R3710k
R2N.M.
CAN RX_MCU2S
TB
_N
CA
N_
MC
U2
6
D4
ESD_Tip2
2
3
2
EN
TP5
R5N.M.
5
1
R3N.M.10k
5
2
13CANH
R120R
ERR_N CAN_MCU2
9
CANH
CANL
CANH
CANL
GND
1
8
2
CAN
R6N.M.
MASTER
SLAVE
7
14
Common Mode ChokeACT45B-101-2PTDK
R16N.M.
2
R7N.M.
1
+12V
ST
B_
N C
AN
_M
CU
1
C1147pF
R28N.M.
1
1 U4
TJA1043T
2
1
1
Schematic diagrams UM2103
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Figure 9: Slave node
UM2103 Layout
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7 Layout Figure 10: STEVAL-OET003V1 top layer
Layout UM2103
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Figure 11: STEVAL-OET003V1 bottom layer
UM2103 Layout
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Figure 12: STEVAL-OET003V1 silk screen top layer
Revision history UM2103
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8 Revision history Table 1: Document revision history
Date Revision Changes
26-Aug-2016 1 Initial release.
24-Oct-2016 2 Added Section 5: "ESD test"
Minor text corrections throughout document
UM2103
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