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High-Voltage, High-Frequency
Semiconductor Devices,
Smart Grid Power Conditioning Systems,
Metrology for HV-HF Device and u-Grid PCS
Allen Hefner
National Institute of Standards and Technology
Power Electronics Technologies, and Smart Grid
• Today’s Grid:
• Electricity is generated by rotating machines with large inertia
• Not much storage: generation instantaneously matches load using
• load shedding at large facilities
• low efficiency fossil generators for frequency regulation
• Future Smart Grid:
• High penetration of renewables with power electronic grid interface:
• dispatchable voltage, frequency, and reactive power
• response to abnormal conditions without cascading events
• dispatchable “synthetic” inertia and spinning reserve (w/ storage)
• Storage for frequency regulation and renewable variability / intermittency
• High-speed and high-energy storage options
• Load-based “virtual storage” through scheduling and deferral
• Plug-in Vehicles increase efficiency, provide additional grid storage
• HVDC, DC circuits, SST, SSCB provide stability, functionality and low cost
• Microgrids & automation provide secure, resilient operation
Grid Transformation via PCS Functionality
HV-HF Switch Mode Power Conversion
• Switch-mode power conversion (Today):
• advantages: efficiency, control, functionality, size, weight, cost
• semiconductors from: 100 V, ~MHz to 6 kV, ~100 Hz
• New semiconductor devices extend application range:
• 1990’s: Silicon IGBTs
• higher power levels for motor control, traction, grid PCS
• Emerging: SiC Schottky diodes and MOSFETs, & GaN
• higher speed for power supplies and motor control
• Future: HV-HF SiC: MOSFET, PiN diode, Schottky, and IGBT
• enable 15-kV, 20-kHz switch-mode power conversion
Power Semiconductor Applications
• Switching speed decreases with voltage
• SiC enables higher speed and voltage
HVDC and FACTS
Power distribution,
transmission and
generation
A. Hefner, et.al.; "SiC power diodes provide breakthrough performance for a wide range of
applications" IEEE Transactions on Power Electronics, March 2001, Page(s):273 – 280.
DARPA/ONR/NAVSEA HPE Program
10 kV HV-HF MOSFET/JBS
High Speed at High Voltage
-5
0
5
10
15
20
5.0
E-
08
6.5
E-
08
8.0
E-
08
9.5
E-
08
1.1
E-
07
1.3
E-
07
1.4
E-
07
1.6
E-
07
1.7
E-
07
1.9
E-
07
2.0
E-
07
Time (s)
Drain
Cu
rren
t (
A)
-1500
0
1500
3000
4500
6000
Drain
-S
ou
rce V
olt
ag
e (
V)
Area = 0.125 cm 2
T = 25o C
Vd
Id
SiC MOSFET: 10 kV, 30 ns Silicon IGBT: 4.5 kV, 2us
1us /div
3000 V
15 ns /div
0 V
Area= 0.15 cm2
A. Hefner, et.al. “Recent Advances in High-Voltage, High-Frequency Silicon-Carbide Power
Devices,” IEEE IAS Annual Meeting, October 2006, pp. 330-337.
ARPA-e ADEPT NRL/ONR
12 kV SiC IGBT 4.5 kV SIC-JBS/Si-IGBT
Future option Low cost now
SiC JBS: improves Si IGBT turn-on SiC IGBT: HV, high Temp, 1 us
Sei-Hyung Ryu, Craig Capell, Allen Hefner, and Subhashish Bhattacharya, “High Performance, Ultra High Voltage 4H-SiC IGBTs” Proceedings of the IEEE Energy Conversion Congress and Exposition (ECCE) Conference 2012, Raleigh, NC, September 15 – 20, 2012.
K.D. Hobart, E.A. Imhoff, T. H. Duong, A.R. Hefner “Optimization of 4.5 kV Si IGBT/SiC Diode Hybrid Module” PRiME 2012 Meeting, Honolulu, HI, October 7 - 12, 2012.
10 kV SiC MOSFET/JBS Half-Bridge Module
Model and Circuit Simulation
• Half-bridge module model: • 10 kV SiC power MOSFETs
• 10 kV SiC JBS for anti-parallel diodes
• low-voltage Si Schottky diodes
• voltage isolation and cooling stack
• Validated models scaled to
100 A, 10 kV half bridge module
• Model used to perform
simulations necessary to: • optimize module parameters
• determine gate drive requirements
• SSPS system integration
• high-megawatt converter cost analysis
Tj
Th
Tc
Ta Ta
Tc
Th
Tj
TjTj
Th
Tc
Ta Ta
Tc
Th
SiC_MOS1
SiC_MOS2
SiC
_J
BS
1S
iC_
JB
S2
Si_
JB
S2
Si_
JB
S1
G1
G2
S1
S2_D1
D2
Half-Bridge
Si_
Sc
h1
Si_
Sc
h2
Semiconductors
Packaging and Interconnects
HF transformers
Filter Inductors and Capacitors
Cooling System
60 Hz Transformer up to 18 kV
Breakers and Switchgear
Ripple < 2%
Stack Voltage Range
~700 to 1000 V
$40-$100 / kW
SECA: 300 MW PCS
18 kV
AC
345 kV
AC
Approx.
500
Fuel
Cells
~700 V
DC
~700 V
DC
IEEE – 519
IEEE – 1547
Harmonic Distortion
Future: HVDC transmission ?
$0
$20
$40
$60
$80
$100
$120
$140
$160
$180
$200Transformer &
Switchgear
Other PE
Semiconductor
Cooling
Magnetics
Inverter Voltage Medium Medium High High High
HV-SiC Diode Schottky Schottky Schottky PiN
HV-SiC Switch MOSFET MOSFET IGBT
HF Transformer Nano Nano Nano Nano Nano
60 Hz Transformer yes yes
Estimated $/kW: MV & HV Inverter
Risk Level: High Considerable Moderate Low
loss
loss
DOE Sunshot - SEGIS-AC, ARPA-E “$1/W Systems: A Grand Challenge for Electricity from Solar” Workshop, August 10-11, 2010
Goal : 1$/W by 2017
for 5 MW PV Plant
$0.5/W – PV module
$0.4/W – BOS
$0.1/W – Power electronics
Smart Grid Functionality
High Penetration
Enhanced Grid Value
$1/W achieves cost parity in most states!
High Penetration of Distributed Energy Resources
• Power Conditioning Systems (PCS) convert to/from 60 Hz AC for
interconnection of renewable energy, electric storage, and PEVs
• “Smart Grid Interconnection Standards” required for devices to be
utility-controlled operational asset and enable high penetration: • Dispatchable real and reactive power
• Acceptable ramp-rates to mitigate renewable intermittency
• Accommodate faults faster, without cascading area-wide events
• Voltage/frequency regulation and utility-controlled islanding
Energy Storage Plug-in Vehicle to Grid Renewable/Clean Energy
PCS PCS Communication
Power Smart Grid PCS
http://www.nist.gov/pml/high_megawatt/2008_workshop.cfm
PCS Architectures for PEV Fleet as Grid Storage
PCS PCS
Energy Storage Renewable/Clean Energy
Communication
Power Smart Grid
Plugin
Vehicle
Fleet
PCS PCS PCS
http://www.nist.gov/pml/high_megawatt/jun2011_workshop.cfm
Large Inverter with DC Circuits to Fleet PEVs
Energy Storage Renewable/Clean Energy
DC Circuits or DC Bus
Plugin
Vehicle
Fleet
Storage Asset Management
Charging Station
(Multiple Vehicles)
DC-DC DC-DC DC-DC
PCS PCS Communication
Power Smart Grid DC-AC
Islandable Microgrid
DC-AC
DC Microgrid: DC-AC with DC Circuits
Energy Storage Renewable/Clean Energy
Plugin
Vehicle
Fleet
Device Asset Management
DC Circuits / DC Bus
DC-DC DC-DC DC-DC
24 V DC Loads
380 V DC Loads
Smart Grid
Flow Control Microgrid: AC-AC with AC Circuits
Plugin
Vehicle
Fleet
PCS PCS PCS
Energy Storage Renewable/Clean Energy
PCS PCS
AC-AC DC Options Smart Grid
Microrid
Controller
Managed
AC Loads
AC Circuits
Device Asset Management
Islandable Microgrid
Microgrid using Disconnect and Local EMS
Smart Grid
Plugin
Vehicle
Fleet
PCS PCS PCS
Energy Storage Renewable/Clean Energy
PCS PCS
Disconnect
Switch
Microgrid
Controller
Managed
AC Loads
Device Asset Management
AC Circuits
Islandable Microgrid
ECONOMIC BENEFITS OF INCREASING ELECTRIC GRID RESILIENCE TO WEATHER OUTAGES
Executive Office of the President August 2013 ”Priority 3: Increase System Flexibility and Robustness”
“Additional transmission lines increase power flow capacity and provide greater control over energy flows. This can increase system flexibility by providing greater ability to bypass damaged lines and reduce the risk of cascading failures. Power electronic-based controllers can provide the flexibility and speed in controlling the flow of power over transmission and distribution lines. Energy storage can also help level loads and improve system stability. Electricity storage devices can reduce the amount of generating capacity required to supply customers at times of high energy demand – known as peak load periods. Another application of energy storage is the ability to balance microgrids to achieve a good match between generation and load. Storage devices can provide frequency regulation to maintain the balance between the network's load and power generated. Power electronics and energy storage technologies also support the utilization of renewable energy, whose power output cannot be controlled by grid operators. A key feature of a microgrid is its ability during a utility grid disturbance to separate and isolate itself from the utility seamlessly with little or no disruption to the loads within the microgrid. Then, when the utility grid returns to normal, the microgrid automatically resynchronizes and reconnects itself to the grid in an equally seamless fashion. Technologies include advanced communication and controls, building controls, and distributed generation, including combined heat and power which demonstrated its potential by keeping on light and heat at several institutions following Superstorm Sandy.”
Smart Grid – U.S. National Priority
“We’ll fund a better, smarter electricity
grid and train workers to build it…”
President Barack Obama
“To meet the energy challenge and create a 21st
century energy economy, we need a 21st century
electric grid…” Secretary of Energy Steven Chu
“A smart electricity grid will revolutionize the way we use energy, but
we need standards …” Secretary of Commerce Gary Locke
Congressional Priority: EISA 2007, ARRA, oversight, new bills …
Administration Priority – www.whitehouse.gov/ostp/
• A Policy Framework for the 21st Century Grid (June 2011)
• Green Button Initiative – available to 35 Million by 2013
– www.nist.gov/smartgrid/greenbutton.cfm
Today’s Electric Grid
Markets and Operations
Generation
Transmission Distribution Customer Use
One-way flow of electricity
Centralized, bulk generation
Heavy reliance on coal, natural gas
Limited automation
Limited situational awareness
Consumers lack data to manage energy usage
Smart Grid = Electrical Grid + Intelligence
2-way flow of electricity and information
NIST Role in Smart Grid
Energy Independence and Security Act (2007)
In cooperation with the DoE, NEMA, IEEE, GWAC, and other stakeholders, NIST has “primary responsibility to coordinate development of a framework that includes protocols and model standards for information management to achieve interoperability of smart grid devices and systems…”
http://sgip.org
http://www.nist.gov/smartgrid/
White House Kickoff Meeting
• May 18, 2009: Meeting chaired by Secretaries of Energy and Commerce
• 66 CEOs and senior executives, federal and state regulators
• Commitment of industry CEOs for their people (staff) to participate in NIST process to accelerate development of a smart grid roadmap
Federal Advisory Committee Input
NEXT CHAPTER Private-Public
“New” Smart Grid Interoperability
Panel (2.0)
Domain Expert
Working Groups
(w/ GWAC)
2008 2010 &
PHASE 2
Public-Private Smart Grid
Interoperability Panel (SGIP)
2012 2009
2011
2013 and on
Stakeholder Outreach
NIST / Grass Roots
Support
NIST Staff and Research
& Stds
PHASE 1 Initial
Framework and
Standards based on Summer
2009 workshops,
finalized Jan2010
PHASE 3 Testing &
Certification
NIST Smart Grid Research &
Standards Program
NIST Smart Grid Interoperability Plan
NIST SG Framework and Roadmap 3.0 Draft
Applications and Requirements - Nine Priority Areas:
– Demand response and consumer energy efficiency
– Wide-area situational awareness
– Distributed Energy Resources (DER)
– Energy storage
– Electric transportation
– Network communications
– Advanced metering infrastructure (AMI)
– Distribution grid management
– Cybersecurity
Service Providers
Third-Party
Provider
Utility
Provider
Operations
RTO/ISO
OpsTransmission
Ops
Distribution Ops
Distribution
Transmission
Customer
Generation
Markets
Demand
Response
CIS
Energy
Services
Interface
Meter
Customer
Equipment
Appliances
Customer
EMS
Aggregator
Billing
ISO/RTO
Participant
Energy
Market
Clearinghouse
Others
Thermostat
Plant Control
System
Substation
DeviceElectric
Storage
Substation
Controller
Retailer /
Wholesaler
Home / Building
Manager
Premises
Networks
Data
Collector
DMS
Generators
EMS
Internet /
e-Business
Enterprise
Bus
Wide Area
NetworksField Area
Networks
Substation
LANsField
Device
Market
Services
Interface
Roles and Actors
Domain
Gateway Role
Network
Comms Path
Comms Path Changes Owner / Domain
Aggregator
Distribution
SCADA
Metering
System
WAMS
Asset
Mgmt
MDMS
EMS
Internet /
e-Business
Transmission
SCADA
Retail
Energy
Provider
CIS
Billing
Enterprise
Bus
Enterprise
Bus
RTO
SCADA
Distributed Energy Resources
Electric
Storage
Distributed
Generation
Electric
Storage
Electric
Vehicle
Distributed
Generation
NIST SG Architecture Reference Model
SGIP 2.0 Inc, Organization (Draft)
SGIP 2.0 Inc, Organization (Draft)
PAPs
Task 4: Develop and Harmonize Object Models
IEC 61850-7-420: Expanded to include • Multifunctional ES-DER operational interface • Harmonized with CIM & MultiSpeak • Map to MMS, DNP3, web services, & SEP 2
a)
b)
c)
d
e)
Task 0: Scoping Document
Prioritized timeline for ES-DER standards
Task 1: Use Cases, *EPRI PV-ES Inverter
Define requirements for different scenarios
Task 5: Test, Safe and Reliable Implementation
Implementation UL 1741, NEC-NFPA70, SAE, CSA and IEC
Task 3: Unified interconnection method with multifunctional operational interface for range of storage and generation/storage.
IEEE 1547.8 (a) Operational interface (b) Storage without gen (c) PV with storage (d) Wind with storage (e) PEV as storage
Task 2: IEEE 1547.4 for island applications and IEEE 1547.6 for secondary networks
PAPs
MIC Info exchanges
PAP 7: Smart Grid ES-DER Standards
Identify Needed
Functions
Represent in Standard
Information Model
IEC 61850-7-420
DNP3
Smart Energy Profile
MMS, Web
Services, Other
Map to Protocols
Select a Specific Way to
Implement each Function
Interest Group, Demonstrations, PAP7, IEEE 1547
Smart Inverter Focus Group
Published IEC 61850-90-7
Informative document
Standards Groups, Funded Efforts
EPRI/Sandia NL Smart Inverter Initiative
courtesy: Brian Seal (EPRI)
Modbus- Sunspec
EPRI/SNL Volt-Var Control Function
VA
Rs G
enera
ted
Capacitive
Inductive
System
Voltage
V1 V2 V3
V4
Q1
Q4
Q3 Q2
Volt/Var
Mode 1 –
Normal
Regulation V
AR
s G
enera
ted
Capacitive
Inductive
System
Voltage
V1
V2
Q2
Q1
Volt/Var
Mode 2 –
Transmission
VAR Support
Utility-Defined Curve Shapes
Simple
Broadcast
courtesy: Brian Seal (EPRI)
SGIP 2.0 Inc, Organization (Draft)
DEWGs
Distributed Renewables, Generators and Storage
• DRGS Domain Expert Working Group initiated September 2011
• Identify Smart Grid standards and interoperability issues/gaps for
– Integration of renewable/clean and distributed generators and storage
– Operation in high penetration scenarios, weak grids, microgrids, DC grids
– Including interaction of high-bandwidth and high-inertia type devices
• Focus on Smart Grid functions that
– mitigate impact of variability and intermittency of renewable generators
– enable generators and storage to provide valuable grid supportive services
– prevent unintentional islanding and cascading events for clustered devices
• Activities of DRGS DEWG
– Consistent approaches for generators/storage types and domains
– Use cases and information exchange requirements
– Define new PAPs to address standards gaps and issues
• Subgroups: A, B, C, D, E, and F
DRGS DEWG Activities
• DRGS Subgroups: A. Standards Roadmap – Al Hefner
B. UCs, Information Exchange, and Object Models – Frances Cleveland
C. Microgrids and Hierarchical Distributed Control – Jim Reilly
D. Conformity and Interoperability Test and Certification
– Robert Broderick
– Ward Bower
E. Regulatory and Market Issues – Amanda Stallings
F. DER Interconnection Standards – Tom Basso
Weather Information PAP – Al Hefner
• Special Topics – Hierarchical Classification of DER Use Cases
– Information Support for Integration of Microgrids into Grid Operation
– California Rule 21 Updates for Smart Inverters
– Regulatory Issues for Microgrid Development
Cyber-Physical Architecture Reference for Resilient/Transactive Power Systems
Bulk
Generation
and Storage
Distributed
Generation and
Storage “DER”
Premises, Loads
“Prosumer”
Markets Providers
Transmission
T-Operations
Distribution
D-Operations
Microgrids
uG-Operator
Electricity delivery system
Electrical connections (Physical) ______
Secure Communications (Cyber) ______
Mobile:
EV, rail, ship, air,
microgrids
Al Hefner 091713
SGIP Smart Grid
Interoperability
NIST
Measurement
Science
DOE/DOD Labs,
Test & Certification
ESI, EMS, Microgrid
& Storage functions
Sensors,
IT Networks
& meter stds.
NIST Power
Electronics
Technologies
Grid-Interactive
DER functions &
Energy appliances
Smart u-Grid PCS Testing
Electronic Grid Emulator
36 kW Power Source
(phase, harmonics,
transient faults, …)
…
Oscilloscope and
Network Analyzer Virtual Instrument Computer with
Network and IEEE 488 Bus Cards
and Instrumentation Cards
Microgrid PCS Under Test
HAN
Probes
Virtual Instrument
Microgrid PCS
Testbed
Electronic Load
Emulator (nonlinear,
motor,
reactive, rectifier, …)
Electronic Load
Emulator (nonlinear,
motor,
reactive, rectifier, …)
Energy Operating
System: ESI, EMS
Power Electronics, Relays,
Data Acquisition, Control
Utility
Network
Emulator
Optional
Smart Meter:
Power and
Communication
HAN
IEEE 488
(((
Smart Microgrid PCS Lab
A0
27
A
02
5
DC Supply A
C/D
C
Load
s
208 V, 400 A
Panel DC/AC Load
ReGen Cabinet
12kW Grid
12kW Grid
12kW Grid
20” long, 19” wide, <4’ tall each
28” wide 3’ long 6’ high each
DC/AC Load
ReGen Cabinet
Scope
Safety
Interlock
controls
Energy Operating
System: ESI, EMS
Instrument Console
Safety
Window
μ-Grid PCS
Under Test
25 kV Curve Tracer Schematic
1000 X
Probe
Clamped
Probe
Rlimit
Rsense
Arbitrary
Waveform
Generator
High Voltage
Amplifier
Source Meter
± 200 V, ± 1 A
Oscilloscope
DUT
IEEE 488 Bus
HV safety interlocks
Model Validation for
100 A, 10 kV SiC Power MOSFET
active area = 3 cm2
* Dashed curves based on area scaling of 10 A die to 100 A multi-chip module.
Dra
in C
urr
en
t [A
]
Drain Voltage [V]
Vgs=20 V
Vgs=4 V
Vgs=6 V
Vgs=8 V
0 1 3 4 5 6 7 8 9 102 11 12 13 14
100
90
80
70
60
50
40
30
20
10
0
Simulated
Measured
T = 125 oC
VT
Vgs=10 V
250 W/cm2
Vgs=20 V
Vgs=6 V
Vgs=8 V
Vgs=10 V
100
90
80
70
60
50
40
30
20
10
00 1 2 3 4 5 6 7 8 9 10
Simulated
Measured
Drain Voltage [V]
Dra
in C
urr
en
t [A
]
T = 25 oC IPEAK
= 0.5KP (V
GS-V
T)2
25 oC 125 oC
0 – 450V
Inductor Supply
0 – 15kV
Clamp Supply
2.5 µF
Load
Inductor
Gate Driver
1Ω,15ns
(-5 to 20V)
Pulse In Rg
Gate Current
Probe
Drain Current
Probe
Load
Resistor
HV-HF Switching Test Circuit
SW
DUT
High Voltage
Probe
Gate Voltage
Probe
Model Validation for
100 A, 10 kV SiC Power MOSFET
active area = 3 cm2
50 50.05 50.1 50.15 50.2
Time [µs]
-80
-40
0
40
80
120
160
200
240D
rain
Cu
rre
nt
[A]
Measured
Simulated
-2
-1
0
1
2
3
4
5
6
Dra
in V
olt
ag
e [
kV
]
* Dashed curves based on area scaling of 10 A die to 100 A multi-chip module.
High Speed
Transient Thermal Impedance
D2
D1
IGBT1
IGBT2 1.2mF
470
470
7.5k
62V
Anode
Scope
Scope
Ch.1
Ch.2
PulsedCurrentSource
GateVoltage
IGBTModule
Cathode-Gate Voltage
+
-
+
+
-
Multi-Chip Module Heat Conduction Model
Direct Bonded Cooper
Voltage Isolation Stack
(15 kV)
Chip and DBC Layout
Dynamic Thermal
Component Model