Post on 28-Feb-2019
transcript
CEE New Biz Virtual Team
Internet Of things Andrzej.Jankowski@intel.com
Internet of Things Group
1. IDC2. MC/EDC: The Digital Universe of Opportunities 3. Goldman Sachs4. IMS Research
Things network cloud
50Bdevices1
44zetabytes2
212Bsensors1
85%unconnecte
d4
Cost of
Sensors1
Past 10 Years
Cost of Bandwidth2
Past 10 Years
Cost of Processing3
Past 10 Years2X 40X 60X
2
5
NEW efficient
business
Impact of Iot
Internet of Things Group
CONNECTED
smart autonomous
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Internet of Things Group
One Direction
Network Infrastructure
Data Center / Cloud
Simple Sensors
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Internet of Things Group
Mobile
Home
Industrial
Virtualized, Reconfigurable, Software-Defined, Autonomous
Fog
Network Infrastructure
Real Time
Data Center / Cloud
6
Internet of Things Group
Our ApproachCreate Vertical
Solutions
buildStrong Ecosystem
Build on HorizontalPlatform & Products+ +
Things network cloud
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Internet of Things Group
Internet of Things Group 9*Other names and brands may be claimed as the property of others.
Internet of Things Group
Microcontraller family
Intel® Quark™
D1000 (Silver Butte)• Ultra low power, Entry Level
• 32MHz, 32-bit Microcontroller,
32kB Flash, 8kB SRAM
• Software Development Kit with
sample apps and libraries
• Pre-validated comms and sensor
modules
Intel® Quark™ D2000
(Mint Valley)• Ultra low power, Entry Level
• 32MHz, 32-bit x86 Microcontroller,
32kB Flash, 8kB SRAM
• Scalable Software Development Kit,
with sample apps and libraries
• Pre-validated comms and sensor
modules
• Full Intel x86 instruction set
architecture for compatibility and
scalability
Intel® Quark™ SE
(Atlas Peak)• High-efficiency power consumption
• 32MHz, 32-bit x86 Microcontroller
• 384Kb Flash, 80kB SRAM
• Scalable Software Development Kit,
with sample apps and libraries
• Pre-validated comms and sensor
modules
• Full Intel x86 instruction set
architecture for compatibility and
scalability
• Always sensing: always-listening
Internal Sensor Hub
• Intelligent: Neural network engine
https://software.intel.com/en-us/intel-system-studio-microcontrollers/download
NVM Solutions Group
NVM Solutions Group
3D Xpoint™ TECHNOLOGYA new class of non-volatile memory media
1Technology claims are based on comparisons of latency, density and write cycling metrics amongst memory technologies recorded on published specifications of in-market memory products against
internal Intel specifications
1000Xfaster
THAN NAND1
1000Xendurance
OF NAND1
10Xdenser
THAN DRAM1
Nand-like densities and dram-like speeds
NVM Solutions Group
3D Xpoint™ TECHNOLOGYIn Pursuit of Large Memory Capacity … Word Access … Immediately Available …
Word (Cache Line)
Crosspoint Structure
Selectors allow dense packingand individual access to bits
Large Memory Capacity
Crosspoint & ScalableMemory layers can be stacked in a 3D manner
NVM Breakthrough Material AdvancesCompatible switch and memory cell materials
Immediately Available
High Performance Cell and array architecture that can switch states 1000x faster than NAND
NVM Solutions Group
NAND SSDLatency: ~100,000X
Size of Data: ~1,000X
Latency: 1X
Size of Data: 1X
SRAM
Latency: ~10 MillionX
Size of Data: ~10,000X
HDD
Latency: ~10X
Size of Data: ~100X
DRAM
3D XPoint ™
Memory MediaLatency: ~100X
Size of Data: ~1,000X
STORAGE
MEMORY
3D Xpoint™ TECHNOLOGYBreaks the Memory Storage Barrier
Internet of Things Group
• Support designing new products
• Technical support/Samples
• ODM platform selection based on customer specification
• Design House selection/matchmaking
• Ecosystem matchmaking
• Sales/marketing support for Intel based devices
• Customer matchmaking
• Join marketing activities (also out of the region)
• PR support
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Andrzej Jankowski
Intel Confidential – Internal Only Intel Confidential – Internal Only
Labs in emeaLabs in emeaMunich, GermanyAndreas Dott
andreas.dott@intel.com
Swindon,UK
Anna Cheng
anna.cheng@intel.com
Istanbul, Turkey
Sue Akcetin
isinsu.akcetin@intel.com
Stockholm, Sweden
Johan Falk
johan.falk@intel.com
Moscow, Russia
Ksenia Simakova
ksenia.simakova@intel.com
Dublin, Ireland
Finian Rogers
finian.rogers@intel.com
Haifa, Israel
Yvonne Palacio
yvonne.b.palacio@intel.com
Dubai, UAE
Arathi Ajay
arathi.ajay@intel.com
Warsaw, Poland
Andrzej Jankowski
andrzej.jankowski@ntel.com
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Intel Confidential – Internal Only Intel Confidential – Internal Only
End to End AnalyticsInnovation and
Solutions
Integrated test & development
Matchmaking
Create end to end solutions - from
intelligent edge gateways and
sensors to cloud based analytics and
data management
Technology Showcase offers real
life experience of Intel
technology and stimulates
solutions creation.
Enables creation of fast scalable,
standardised solutions & building
blocks, which can shorten TTM
for solution or service
Provides opportunity for
integrators and end customers to
match-make thus enabling real
deployable solutions in minimum
time
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IOT ignition lab services
Intel Confidential – Internal Only Intel Confidential – Internal Only
Warsaw IoT Ignition Lab
• Wide range of IoT solutions
• Smart City – Cybercom: smart
parking/smart waste management
• Smart Transport - Passengera
transport Infotainment
• TeleMedicine – Comarch
• Smart Retail - AstaLabs
• Smart Retail – InfoCam: video analitics
system for retail
• Smart City - Flood Water monitoring
system
• Smart Manufacturing – Elmodis electric
engines monitoric/predictive analisys
Intel Confidential – Internal Only Intel Confidential – Internal Only
Build &
Deploy
solutions
Analyze&
Scale
Show
regional IoT
solutions
Discuss how
IoT can help
solve
business
problem
Match
customers
with partners
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IOT ignition lab
Intel Confidential – Internal Only Intel Confidential
New Intel® Embedded Design Center
Quick links to
popular pagesAdditional blades for frequently
accessed content
Convenient drop-down menus for
easy site navigation
Simple sign-in process
for CNDA content
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Intel Confidential – Internal Only
Intel® Embedded Design Center Tools Available
Interactive Product
Roadmap
Test Tool Loaner
Program
Design/Debug Tools to
Purchase
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Intel Confidential – Internal Only
Development Kits
Development Kits launching in June at product launch available for
purchase through Intel® Embedded Design Center (Intel® EDC) or Intel
Distributors
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Intel Confidential – Internal Only
Resources –ARKhttp://ark.intel.com
Automated Relational Knowledgebase
provides data on all publically available
Intel® processors and chipsets
Mobile version available for iOS*
and Android* devices
*Other names and brands may be claimed as the property of others.25