portion formed on the bottom sur­face; a metal plate for an anodeplaced on the inclined portion; ametal rod for a cathode held by amotor, which can rotate the metalrod; a metal plate for the cathode,which is wound around the metalrod for the cathode; and a DCpower supply.

.lET STREAM PLATING APPARATUSUS. Patent 6,017,438. Jan. 25, 2000Y. Takayama et al., assignors toNitto Denko Corp., Osaka, Japan

Ajet stream method for producinga circuit substrate having a bumpcontact point comprising dispos­ing a positive electrode in a plat­ing solution; exposing a conduc-

tive circuit formed on aninsulating substrate, wherein theinsulating substrate is providedabove the surface of the platingsolution; disposing a jet streamopening below the surface of theplating solution and opposite theconductive circuit; and spoutingout the plating solution from the

ELECTROWINNING CELLUS. Patent 6,017,428. Jan. 25, 2000E.L. Hill and C.O. Gale, assignors toSummit Valley Equipment andEngineering Inc., North Salt Lake,Utah

An electrowinning cell assemblyfor removal of at least one pre­cious metal dissolved in an elec­trolyte solution wherein the cath­ode comprises woven wire mesh.

COPPER CATHODE ELEMENTUS. Patent 6,017,429. Jan. 25, 2000S.V. Persson, assignor to SvedalaSkega AB, Ersmark, Sweden

A cathode element for the produc­tion of electrolytic copper,wherein the cathode element isreusable and includes a cathodeplate and electrically insulatingedge strips.

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CATIONIC ELECTROCOATUS. Patent 6,017,431. Jan. 25, 2000D.J. Augustini et al., assignors toPPG Industries Ohio Inc., Cleveland

A cationic electrodepositable coat­ing composition and process forretarding the growth of bacteriain such a bath.

ELECTROCOATING COMPOSlnONUS. Patent 6,017,432. Jan. 25, 2000D.W. Boyd et al., assignors to PPGIndustries Ohio Inc., Cleveland

A method of electrocoating an elec­troconductive substrate whereinthe electrodepositable compositioncomprises an active hydrogen­containing, cationic salt group­containing resin electrodepositableon a cathode; a capped polyisocya­nate curing agent; and, optionally,a metal-containing catalyst.

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January 2001 113

jet stream opening toward theconductive circuit opposite the jetstream opening for electroplatingto form the bump contact point onthe surface of the conductive cir­cuit.

UV-CUIIABU POWDER coan_u.s. Patent 6,017,593. Jan. 25, 2000A.T. Daly et al., assignors to MortonInternational Inc., Chicago

A method for producing a coatinghaving either a high or low glossappearance from a UV-curablepowder coating.

.DA' , "A'IIOII OPTHIID-DI......... MATERIALSU.S. Patent 6,017,613. Jan. 25, 2000T.R. Baum et al., assignors toInternational Business MachinesCorp., Armonk, N. Y.An electronic circuit package com­prising a three-dimensional sub­strate including a circuitized di­electric and one or more,selectively metallized three-di­mensional cone-shaped projec­tions disposed on the surface ofthe dielectric.

DUAL THEIIIIAL AND UV-CURABLEPOWDER COAnNGSU.S. Patent 6,017,640. Jan. 25, 2000J. Muthiah et al., assignors toMorton International Inc., Chicago

An opaquely pigmented dual ther­mal and ultraviolet-curable powdercoating composition, which is ablend of an unsaturated resin se­lected from unsaturated polyacry­lates, unsaturated polymethacry­lates, and mixtures thereof;between 0.1 and 10 phr of a photo­initiator selected from a photolyti­cally activated free radical generat­ing compound; between 0.1 and 10phr of a thermal initiator selectedfrom a thermally activated freeradical generating compound; and,between 1 and 100 phr of an opaci­fier selected from pigments, fillers,and mixtures thereof, in which thecomposition is essentially fully cur­able, both on the surface andthroughout, with combined ther­mal and UV radiation cure.

HOT-DIP ALU.INIZED STEEL SHEETU.S. Patent 6,017,643. Jan. 25, 2000M. Kobayashi et al., assignors to

Nisshin Steel Co. Ltd., Tokyo

A hot-dip aluminized steel sheetcomprising a base-metal steelsheet; an AI-Si coating-metallayer having an Si content of 3 to13%; and an Fe-AI-Si alloylayer, formed between the base­metal steel sheet and the Al-Sicoating-metal layer.

PLATED LEAD FRAMEU.S. Patent 6,017,777. Jan. 25, 2000J. Kim et al., assignors to SamsungAerospace Industries Ltd.,Kyongsangnam-do, Rep. of Korea

A method of forming a platinglayer of a lead frame having ananticorrosive property comprisingsequentially plating at least aportion of a lead frame with anickel or nickel alloy and a palla­dium or palladium alloy; firstheating the plated portion of thelead frame to a first temperaturefor a predetermined amount oftime; and second heating the firstheated plated portion of the leadframe to a second temperaturehigher than the first temperature.

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