portion formed on the bottom surface; a metal plate for an anodeplaced on the inclined portion; ametal rod for a cathode held by amotor, which can rotate the metalrod; a metal plate for the cathode,which is wound around the metalrod for the cathode; and a DCpower supply.
.lET STREAM PLATING APPARATUSUS. Patent 6,017,438. Jan. 25, 2000Y. Takayama et al., assignors toNitto Denko Corp., Osaka, Japan
Ajet stream method for producinga circuit substrate having a bumpcontact point comprising disposing a positive electrode in a plating solution; exposing a conduc-
tive circuit formed on aninsulating substrate, wherein theinsulating substrate is providedabove the surface of the platingsolution; disposing a jet streamopening below the surface of theplating solution and opposite theconductive circuit; and spoutingout the plating solution from the
ELECTROWINNING CELLUS. Patent 6,017,428. Jan. 25, 2000E.L. Hill and C.O. Gale, assignors toSummit Valley Equipment andEngineering Inc., North Salt Lake,Utah
An electrowinning cell assemblyfor removal of at least one precious metal dissolved in an electrolyte solution wherein the cathode comprises woven wire mesh.
COPPER CATHODE ELEMENTUS. Patent 6,017,429. Jan. 25, 2000S.V. Persson, assignor to SvedalaSkega AB, Ersmark, Sweden
A cathode element for the production of electrolytic copper,wherein the cathode element isreusable and includes a cathodeplate and electrically insulatingedge strips.
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Precious Metals Processing Consultants, Inc.430 Bergen Boulevard, Palisades Park, NJ 07650Tel: (201) 944-8053 Fax: (201) 944-8003Website: www.preciousmetals-pmpc.comE-mail: [email protected]
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CATIONIC ELECTROCOATUS. Patent 6,017,431. Jan. 25, 2000D.J. Augustini et al., assignors toPPG Industries Ohio Inc., Cleveland
A cationic electrodepositable coating composition and process forretarding the growth of bacteriain such a bath.
ELECTROCOATING COMPOSlnONUS. Patent 6,017,432. Jan. 25, 2000D.W. Boyd et al., assignors to PPGIndustries Ohio Inc., Cleveland
A method of electrocoating an electroconductive substrate whereinthe electrodepositable compositioncomprises an active hydrogencontaining, cationic salt groupcontaining resin electrodepositableon a cathode; a capped polyisocyanate curing agent; and, optionally,a metal-containing catalyst.
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jet stream opening toward theconductive circuit opposite the jetstream opening for electroplatingto form the bump contact point onthe surface of the conductive circuit.
UV-CUIIABU POWDER coan_u.s. Patent 6,017,593. Jan. 25, 2000A.T. Daly et al., assignors to MortonInternational Inc., Chicago
A method for producing a coatinghaving either a high or low glossappearance from a UV-curablepowder coating.
.DA' , "A'IIOII OPTHIID-DI......... MATERIALSU.S. Patent 6,017,613. Jan. 25, 2000T.R. Baum et al., assignors toInternational Business MachinesCorp., Armonk, N. Y.An electronic circuit package comprising a three-dimensional substrate including a circuitized dielectric and one or more,selectively metallized three-dimensional cone-shaped projections disposed on the surface ofthe dielectric.
DUAL THEIIIIAL AND UV-CURABLEPOWDER COAnNGSU.S. Patent 6,017,640. Jan. 25, 2000J. Muthiah et al., assignors toMorton International Inc., Chicago
An opaquely pigmented dual thermal and ultraviolet-curable powdercoating composition, which is ablend of an unsaturated resin selected from unsaturated polyacrylates, unsaturated polymethacrylates, and mixtures thereof;between 0.1 and 10 phr of a photoinitiator selected from a photolytically activated free radical generating compound; between 0.1 and 10phr of a thermal initiator selectedfrom a thermally activated freeradical generating compound; and,between 1 and 100 phr of an opacifier selected from pigments, fillers,and mixtures thereof, in which thecomposition is essentially fully curable, both on the surface andthroughout, with combined thermal and UV radiation cure.
HOT-DIP ALU.INIZED STEEL SHEETU.S. Patent 6,017,643. Jan. 25, 2000M. Kobayashi et al., assignors to
Nisshin Steel Co. Ltd., Tokyo
A hot-dip aluminized steel sheetcomprising a base-metal steelsheet; an AI-Si coating-metallayer having an Si content of 3 to13%; and an Fe-AI-Si alloylayer, formed between the basemetal steel sheet and the Al-Sicoating-metal layer.
PLATED LEAD FRAMEU.S. Patent 6,017,777. Jan. 25, 2000J. Kim et al., assignors to SamsungAerospace Industries Ltd.,Kyongsangnam-do, Rep. of Korea
A method of forming a platinglayer of a lead frame having ananticorrosive property comprisingsequentially plating at least aportion of a lead frame with anickel or nickel alloy and a palladium or palladium alloy; firstheating the plated portion of thelead frame to a first temperaturefor a predetermined amount oftime; and second heating the firstheated plated portion of the leadframe to a second temperaturehigher than the first temperature.
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