Method for reducing seed deposition in electroless plating

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POWDD COATING ..NONCONDUCTORSU.S. Patent 5,997,959. Dec. 7, 1999R. Lebioda, assignor to Societe LCSInternational, Villeneuve De LaRiviere, FranceA method and apparatus for elec•trostatically painting parts madeof dielectric or low-conductivitymaterial.

MITROD POll ...DUCING saD.........OIlIINIUCTllOUUPLATINGU.S. Patent 5,997,997. Dec. 7, 1999A.P. Angelopoulos et al., assignors toInternational Business MachinesCorp., Armonk, N.Y.A circuit structure produced bythe following method: providing aworkpiece comprising a substratecoated with a polymeric dielectric

layer, wherein the polymeric di•electric layer comprises hydroxylgroups and scavenging groupshaving sulfur moieties or atoms;baking the workpieces; applying apolymeric surfactant to the poly•meric dielectric layer, wherein thepolymeric surfactant is capable ofhydrogen bonding to the hydroxylgroups on the polymeric dielectriclayer; applying a seed to the di•electric layer; and electrolesslyplating metal to the seed.

.... COA'IING PAINTU.S. Patent 5,998,035. Dec. 7, 1999G. Iwamura et al., assignors toMazda Motor Corp., Hiroshima,Japan, and Dainippon Ink andChemicals Inc., Tokyo

A base coating paint composition

comprising a hydroxy group-con•taining oligomer and an amin•oplast resin, which together arecurable upon being subjected toheat, said composition furthercontaining a basic curing catalyst,wherein the basic curing catalystis present for the purpose of act•ing as a curing catalyst for a clearcoating paint to be coated in awet-on-wet state on the base coat•ing paint composition, with thetwo coatings being subsequentlybaked.

POIICILalNINAMIL COMPOSITIONPOIIIUCTIIONIC APPLICATIONSU.S. Patent 5,998,037. Der. 7, 1999S. Sridharan et al., assignors toFerro Corp., Cleveland

A coating for use in forming a

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