North Carolina State University © 2014 Next Generation Power Electronics Manufacturing Innovation...

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N o r t h C a r o l i n a S t a t e U n i v e r s i t y © 2 0 1 4

Next Generation Power Electronics Manufacturing Innovation InstituteFebruary 27, 2014

Research Retreat

D e n n i s K e k a s

I n t e r i m E x e c u t i v e D i r e c t o r ,N e x t G e n e r a t i o n P o w e r E l e c t r o n i c s M a n u f a c t u r i n g I n n o v a t i o n I n s t i t u t e

Year

Empl

oyee

s (th

ousa

nds)

Source: data.bls.gov, Current Employment Statistics Survey

$25,634,942 (18%)State Appropriated FundsChallenge:

Loss of U.S. Manufacturing Employment

Vision: Wide bandgap technology for a more energy efficient world

Mission: Develop a manufacturing-focused innovation ecosystem to reduce cost, improve performance and reliability, and enable U.S. industry dominance in WBG semiconductor devices and systems to create jobs.

Next Generation Power ElectronicsManufacturing Innovation Institute

Applications

Operate above 300 oC compared to 150 oC for Silicon-based devices

Handle 10 timeshigher voltages

Reduce losses during DC-to-AC electricity conversion by 90%

Produce bulbs with 10 times more light that last 30 times longer …

saving $250B by 2030

RD&D

Wafer Suppliers

Deviceand Package

Foundry

PowerElectronicsCompanies

Design House/Device

Manufacture

Founding Partners

N o r t h C a r o l i n a S t a t e U n i v e r s i t y © 2 0 1 4

CommercialProduct Acceleration

Production& Packaging

Foundries

Comprehensive Education and

Workforce Development

Program

Research, Development &Demonstration

Thriving Power Electronics Industry

Ecosystem

$25,634,942 (18%)State Appropriated Funds

TALENT:Comprehensive Education andWorkforce Development Program

Summer Institute Training for working professionals Training community college and high school teachers

Undergraduate Research Program

WBG Professional Science Masters

Online WBG University

MEP provided training

ApproachTo

Innovation

WaferSuppliers Market Demand

and Feedback

DeviceDesignHouse

WaferFabs

PackagingFabs

OEMs

600V, GaN HFET

1200V, SiC JBS, MOSFET

1700V, SiC JBS, MOSFET

4500VSiC JBS, MOSFET

10kV, SiC JBS, MOSFET

RFMD

1200V, GaN

Vertical Tr.Avogy

Monolith Semi. &

X-Fab

Monolith Semi. &

X-Fab

USCi

CREE

600V

1200V

1700V

4.5kV

10kV

20kW 75kW

John DeereHeavy Duty EV

Inverter

Toshiba MVD

Toshiba PV Inverter

Toshiba PV Inverter

Toshiba PV Inverter

GridBridgeGrid Energy

Router

DelphiVehicle Traction

Inverter

VaconMedium Voltage

Drive

200kW Power

Voltage

End ProductsDevices

15kV

MARKET DEMAND:Commercial Product Acceleration

Low Voltage Devices

(600V to 1700V) Medium VoltageDevices

(3300V to 6500V)3 years

5 years

High Voltage Devices(> 10kV)

10 years

Achieve last 50%cost reduction viaPower Electronics

InnovationTARGET:WBG CostsReach Parity with Silicon Cost

Parity

Don’t Exist

Currently 10X

Currently 10X

1.5X

• Establish standard testing benchmarks ❶❷❻• Long-term reliability test ❶❷❹❺• Identify physics of failure mechanism ❹❺❻• Develop ruggedness by process/device ❸❹❻

Reliability

• Devices to exploit WBG benefits ❸❹❻• Advanced package development ❶❷❺• Application aligned device choice ❶❷❸• Develop WBG exclusive application ❶❷

Performance

• Improve materials for predictive output ❹❺❻• Larger volume inviting many customers ❶❷❺• Silicon compatible manufacturability ❸❹❻• Novel device, package development ❸❺❻

Cost

1WBG High Power Electronics

2WBG Power Supply

3WBG Device Design

4WBG Device Failure Analysis

5WBG Power Module Failure Analysis & Reliability

6WBG Device Fabrication & Characterization

WBG Service Centers1

High Power Electronics

2Power Supply

3Device Design

4Device Failure Analysis

5Power Module Failure Analysis & Reliability

6Device Fabrication & Characterization

WBG Service Centers

Wide Bandgap Service Centers and Shared RD&D Facilities

Increase reliability

Improve performance

Reduce cost

IP Generation&

TechnologyTransfer

RD&D Thrust AreasCritical GaN Research - Umesh Mishra, Lead

- GaN Ron Scaling- Stability and Reliability- Normally-off mode

Critical SiC Research - Jay Baliga, Lead

- MOS interface quality- Stability and Reliability- Bipolar degradation

Power Electronics - Fred Lee, Lead

- High density converters- Low cost PV inverters- High temperature EV inverters

Packaging - Doug Hopkins, Lead

- High temperature packaging- Low Rth- Low parasitic inductance

NC State Expertise

N o r t h C a r o l i n a S t a t e U n i v e r s i t y © 2 0 1 4

NNF, AIF

NSF FREEDM

NC State’s Centennial Campus NCSU Nanofabrication Facility

Analytical Instrumentation Facility

Existing Infrastructure at NC State

NC State Competency: Building Industry Partnerships

Centers & Institutes draw about 180 partners,including some of the top names in industry.

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Transforming Economies

Dennis Kekasresearch.ncsu.edu/power