SizeMatters

Bare DieSmall Solutions For The Information Age

ES Components108 Pratts Junction Road

Sterling, MA 01564978-422-7641

www.escomponents.com

Great! We've got your attention.So what's next?

Are you using standard semiconductor packaging?

Are your design engineers challenged with shrinkingspace and expanding functional needs?

If the answer is yes...

Then you need to use unpackaged Bare Die.

Motorola CX68EN360RC25B Quad Communicator Controller

Why?

Because the design engineers will have opportunities for more efficient use of limited space.

What else you say?Well, how about...

Think SmallSmall Solutions For The Information AgeBare Die

Unpackaged Bare Die...

Improves electrical performance.

Gives better signal integrity.

Has higher levels of integrationwith reduced weight and height.

Can be used in wire bondapplications.

Can reduce space consumptionby greater than 50%

Okay, take a break.Take a deep breath.

This is a lot to absorb.There's more...

Okay, time to recap.

Electrical Performance

Size and Weight

Reliability

Lower Cost of Ownership

The main application drivers:

Unpackaged Bare Die

The lower inductance and capacitance of bare die is important in analog, RF, and powerapplications. Signal propagation and power/ground distributions are also improved.

Improvements vary based on the current packaging in use.

The reduced number of interconnects with die use leads to improved reliability. The typicalpackaged part has three connection points per 1/O. Compare this with only two for wire bonds.

This is most notable in high volume applications where density is required and high yield silicon isimplemented. The lower cost of ownership takes into consideration sustrate, assembly, system test,equipment utilization, rework, and increased product value. In addition, the cost of a die product istypically lower than the package equivalent.

Just a bit more...

We want you to remember...

Promote:

Higher levels of integration using existing products.Lead to increased functionality per square area, and reduce costs.Performance improvements are achieved with no additional cost penalty.Integrating bare die for SIP (System-in-Package) solutions provides a benefitover both standard package solutions and SOC (System-on-Chip) solutions.

The Bare Die Advantages

Finally...

SizeMatters

ThinkSmall

Bare DieSmall Solutions For the Information Age

Need more information?Glad to help.

AllSupport

It's

About

ES Components

Call978-422-7641

For more informationtES Components

108-Pratts Junction RoadSterling, MA 01564

www.escomponents.com