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1 © 2016, Amkor Technology, Inc.
1© 2016, Amkor Technology, Inc.
2© 2016, Amkor Technology, Inc.
Standardization of Packaging for the Internet of ThingsAdrian Arcedera l VP of MEMS and Sensor Products
3© 2016, Amkor Technology, Inc.
About Amkor TechnologyAmkor Technology, Inc. is one of the world's largest and most accomplished providers of state-of-the-art packaging design, assembly and test services. Founded in 1968, Amkor is a strategic partner to leading semiconductor companies and electronics OEMs. Our operational base encompasses over 5.8M ft2 of volume production, development, sales and support services in Asia, Europe and the US. Our solutions enable our customers to focus on semiconductor design and wafer fabrication while utilizing Amkor as their turnkey provider and, where required, their packaging technology innovator.
4© 2016, Amkor Technology, Inc.
The Internet of Things
Semiconductors
Services
Hardware
Software
60%
16%
12%
12%
Value SegmentationIC Insights ($96B) 2018
$57.6B
$15.4B
$11.5B
$11.5B
5© 2016, Amkor Technology, Inc.
The Building Blocks of the “Internet of Things”
Internetof
Things
6© 2016, Amkor Technology, Inc.
General IoT Packaging Requirements Low cost Low power RF requirements (shielding) Scalable to high volume
manufacturing Small package size
– Discrete solution – Integrated solution
Stimulus delivery
7© 2016, Amkor Technology, Inc.
Current Discrete Packaging for IoT
Connectivity Memory Power ManagementMicroprocessor &
MicrocontrollerMEMS & Sensor
SOIC/TSSOP *
QFN/TQFP *
Laminate CSP *
WLCSP *Note: *Limited Compatibility
8© 2016, Amkor Technology, Inc.
What makes MEMS and SensorPackaging Different?
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Growth and Adoption of Automotive MEMS SensorsThe role of government regulations in the MEMS market
1970’s 1980’s 1990’s 2000’s 2010’s 2020’s
Fuel Economy Improvements
Airbags
Tire Pressure Monitoring
Electronic Stability Control
Pedestrian/ Collision
Avoidance?
10© 2016, Amkor Technology, Inc.
Rapid Growth in Consumer MEMS
11© 2016, Amkor Technology, Inc.
The Packaging Challenge – Stimulus DeliveryMEMS are NOT ICs!
Source: Yole 2014 MEMS Industry Report
MEMS – Micro Electro Mechanical Systems are tiny structures created in the silicon designed to respond to various stimuli from the “real world”
Bell Labs, US 1947 22 nm Technology Sandia’s, Micromachine (MEMS)
No standard process (CMOS, BiCMOS…) No p-n junction for MEMS And as a consequence, NO ROADMAP
Courtesy Sandia National Laboratories SUMMiT™ Technologies www.mems.sandia.gov
12© 2016, Amkor Technology, Inc.
MEMS and Sensor Packaging Requirements
Acc
el/G
yro
Mag
netic
Mic
roph
one
Tem
pera
ture
/H
umid
ity
Pres
sure
/A
ltim
eter
Gas
Ges
ture
IR RF/
BA
W/S
aw/
Osc
illat
or
Bio
/Med
WaferHandling
Capped Wafer Handling Stealth Dicing
StimulusDelivery
Package Port Hole (Top) Package Port Hole (Bottom)
Die AttachOptions
Low Modulus DA Thermal DA Low CTE Substrates Multi Die-Stacked Multi Die-SBS FlipStack® Multi Sensor
Interconnect Options
Wirebond Au Stud Bump Flip Chip TSV* Copper Pillar + COW
*TSV, TGV is at foundry level.
13© 2016, Amkor Technology, Inc.
MEMS and Sensor Packaging Requirements
Acc
el/G
yro
Mag
netic
Mic
roph
one
Tem
pera
ture
/H
umid
ity
Pres
sure
/A
ltim
eter
Gas
Ges
ture
IR RF/
BA
W/S
aw/
Osc
illat
or
Bio
/Med
PackageProtection
Overmolded Leadframe Overmolded Laminate Lidded Package Lidded + Molded Package Bio-compatible Lid Exposed Die Non-Ferromagnetic Port Hole Filter EMI Shielding
Cavity Fill/Die Coat
Black Die Coating Clear Die Mold Gel Fill
14© 2016, Amkor Technology, Inc.
PackagingInter-connection
MEMS Capping/Interconnect TrendMEMS Wafer Capping
TBD
Through Silicon Vias Overmolded CSP
MEM
S D
evic
e
*TSV, TGV is at foundry level.
3D Functional Cap Through Glass Vias
Chip on Chip
Thin Film Capping(RnD Stage)
Pre-Mold/Cavity
Overmolded CSP/MLF®
Cavity Packaging
Glass Cap
Silicon Cap
Hermetic PackagingBare Die
WLCSP
Cavity CSP
15© 2016, Amkor Technology, Inc.
MEMS Packaging ComplexityOvermolded or cavity package?
Wirebond or flip-chip?
Die attach material?
EMI shielding?
Laminate or leadframe?
Wire type, loop radiusand gauge?
Molded-in stress?
Leaded or not? Encapsulation?
Stacked die or side-by-side?
How/what to test?
16© 2016, Amkor Technology, Inc.
Materials Help Manage Die Stress
From material datasheets From simulation results
0
500
1000
1500
2000
2500
Epoxy - C Film Epoxy - NC Silicone1 Silicone2
Mod
ulus
-M
Pa
Die Attach Adhesives
0
0.001
0.002
0.003
0.004
0.005
0.006
0.007
FR5 Ceramic FR5-1 FR5-2
S1 P
rinci
pal S
tres
s -M
Pa
Substrate Thickness/Material
Thin
Thick
18© 2016, Amkor Technology, Inc.
Packaging Technologies and Material Sets are the Performance Differentiator
0
2
4
6
8
10
12
1 2 3 4 5 6 7 8 9 10 11V
ertic
al H
eigh
t
Series1
Series2
Series3
19© 2016, Amkor Technology, Inc.
MEMS/Sensor Package Standardization
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Standard Platforms Enable Faster Developmentfor MEMS/Sensor Discrete Packaging
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Overmolded ExposedDie SurfaceCavity
Package
SOIC
QFN
LaminateLGA/FPBGA
Evolution Towards Standardizationfor MEMS/Sensor Packaging
22© 2016, Amkor Technology, Inc.
Die Top StressHigh
Low
Pack
age
Cos
t
High
Low
Overmolded Exposed Die Pre-Mold & Cavity
Ceramic Package
Cost vs. Performance Comparison
23© 2016, Amkor Technology, Inc.
Market Acceptance
Overmolded ExposedDie SurfaceCavity
Package
SOIC Widely accepted in the automotive market Cavity package used in automotive pressure sensors
QFN Smaller footprint than SOIC, well suited for consumer market Available “wettable flank” enables more automotive applications
LaminateLGA/FPBGA
Small size and design flexibility make it favorable for sensor fusion and IoT applications for the consumer market
Laminate + cavity package provides very good flexibility Gaining traction in automotive markets
24© 2016, Amkor Technology, Inc.
Today’s Sensor Clusters
http://i-micronews.com/component/hikashop/product/camera-module-industry-report.html?Itemid=0http://i-micronews.com/component/hikashop/product/camera-module-industry-report.html?Itemid=0
25© 2016, Amkor Technology, Inc.
PackagingInter-connection
Sensor Fusion Trend
MEMS Wafer Capping
Overmolded CSP
Through Silicon Vias
WLCSP
MEM
S Se
nsor
s
*TSV, TGV is at foundry level.
3DFunctional Cap
Chip on Chip
Capped, Uncapped Sensors
Flip Chip, Stacked
Wirebond, Side by Side, Stacked Cavity Packaging
Overmolded CSP
Cavity CSP
26© 2016, Amkor Technology, Inc.
Adding IoT Blocks to MEMS/Sensor Package
Bluetooth RadioLGA Package
Pkg Size ~ 3mm sq
Connectivity MEMS/Sensor
Inertial SensorLGA Package
Pkg Size ~ 3.5 mm sq
8-bit Microcontroller
LGA Package
Pkg Size ~ 5 mm sq
Microcontroller LGA PackagePkg Size ~ 6 mm sq
IOT Package
27© 2016, Amkor Technology, Inc.
Adding IoT Blocks to MEMS/Sensor Package
Cavity Package Hybrid Cavity Package
MLF®/QFN
LaminateLGA/FPBGA
28© 2016, Amkor Technology, Inc.
Discrete vs. Integrated IoT Solutions
Integrated Discrete Prospects Smaller body size, smaller motherboard space Packaging cost reduction Less complex SMT process Less inventory (for IoT blocks)
Prospects Widely available, existing assembly and test
infrastructure Flexible sources of IoT blocks/components Known good IoT block/component binning
Potential Concerns Known good IoT block/components MEMS/Sensor die stress management Compounded yield, multi test and sensor
trimming
Potential Concerns Larger motherboard space Limited package size reduction
29© 2016, Amkor Technology, Inc.
In Summary Integration is happening at the front-end to complete the building blocks
of IoT The discrete packaging solutions are available today, but Integration
and the IoT module assembly is needed to push IoT into more applications
MEMS/Sensor device packaging standardization can be applied to IoTmodule assembly to offer a single package solution without sacrificing performance
Standard IoT platforms = faster development – Faster introduction of new products – IoT monetization
30© 2016, Amkor Technology, Inc.
What will you integrate?
Connectivity + Memory + Microprocessor/Microcontrollers
PowerManagement
+ MEMS/Sensors =
=IoT
31© 2016, Amkor Technology, Inc.
Next Steps to Standard Packaging and Test… “Standard package platforms will help speed up
integration and monetize IoT” What will you integrate? Standard Packaging
for IoT– What are the priority MEMS / Sensor devices?– Will it be MEMS + Connectivity or MEMS +
Microcontroller + Connectivity? Etc.– Standard Pre-mold Package Outlines?– Special features needed - Antenna? Shielding?
Tester and Handler Development– How can we minimize Test time and reduce the
number of insertion?
32© 2016, Amkor Technology, Inc.
Thank You
33© 2016, Amkor Technology, Inc.
Contact Amkor for Further InformationSan Jose Sales Office25 Metro DriveSuite 700San Jose, CA 95110 USA
Tel: 408.496.0303Email: [email protected]
Corporate Headquarters2045 East Innovation CircleTempe, AZ 85284 USA
Tel: 480.821.5000Email: [email protected]
34© 2016, Amkor Technology, Inc.
Q & A
Slide Number 1Standardization of Packaging �for the Internet of ThingsAbout Amkor TechnologyThe Internet of ThingsThe Building Blocks of the “Internet of Things”General IoT Packaging RequirementsCurrent Discrete Packaging for IoTWhat makes MEMS and Sensor�Packaging Different?Growth and Adoption of Automotive MEMS SensorsRapid Growth in Consumer MEMSThe Packaging Challenge – Stimulus DeliveryMEMS and Sensor Packaging RequirementsMEMS and Sensor Packaging RequirementsMEMS Capping/Interconnect TrendMEMS Packaging ComplexityMaterials Help Manage Die Stress Low Stress Die Attach MaterialPackaging Technologies and Material Sets �are the Performance DifferentiatorMEMS/Sensor Package StandardizationStandard Platforms Enable Faster Development�for MEMS/Sensor Discrete PackagingEvolution Towards Standardization�for MEMS/Sensor PackagingCost vs. Performance ComparisonMarket AcceptanceToday’s Sensor ClustersSensor Fusion TrendAdding IoT Blocks to MEMS/Sensor PackageAdding IoT Blocks to MEMS/Sensor PackageDiscrete vs. Integrated IoT SolutionsIn SummaryWhat will you integrate? Next Steps to Standard Packaging and Test…Thank YouContact Amkor for Further InformationQ & A
