Sep-14 1
Taking the Stress out of Packaging Adrian Arcedera l Sr. Director, MEMS and Sensor Products
Sep-14 2
About Amkor Technology
Amkor Technology, Inc. is one of the world's largest and most
accomplished providers of state-of-the-art packaging design, assembly
and test services. Founded in 1968, Amkor is a strategic partner to
leading semiconductor companies and electronics OEMs. Our
operational base encompasses over 5.8M ft2 of volume production,
development, sales and support services in Asia, Europe and the
United States. Our solutions enable our customers to focus on
semiconductor design and wafer fabrication while utilizing Amkor as
their turnkey provider and, where required, their packaging technology
innovator.
Sep-14 3
MEMS and Sensor Experience
1980s 1990s 2000 2002 2005 2008 2009 2011 2012 2013
CCD
Sensor
Ceramic/
Hermetic
Package
ChipArray® BGA, MLF®,
Fingerprint, SOIC
Cavity MEMS, In-Frame
MLF®, Cavity SOIC
Laminate
to Laminate
Film Assist
SOIC
MLF®,
Cavity
MEMS
Polymer Lid
Sep-14 4
Growth and Adoption of Automotive MEMS Sensors The role of government regulations in the MEMS market
1970’s 1980’s 1990’s 2000’s 2010’s 2020’s
Fuel Economy
Improvements
Airbags
Tire Pressure
Monitoring
Electronic
Stability
Control
Pedestrian/
Collision
Avoidance?
Sep-14 5
Rapid Growth in Consumer MEMS
<2004 2004 2007 2009 2010 2012 2013 2014 2015
Color Inkjet
Nintendo Wii
iPhone
iPhone 3GS
iPhone 4 Samsung S4/iPhone 5S
Samsung S3 Samsung S5
Wearables
Sep-14 6
MEMS Packaging Challenge
Controlling stresses to the
MEMS structure
Allowing the stimuli to
reach the MEMS structure
Protecting the MEMS and
ASIC devices
More stringent device
package protection
Customized requirements
Quick turn-around time
Highly reusable
packaging
Miniaturization roadmap
Automotive Market Consumer Market General Requirements
Sep-14 7
MEMS Packaging Complexity
Overmolded or Cavity Package?
Wirebond or flip-chip?
Die attach material?
EMI shielding?
Laminate or leadframe?
Wire type, loop radius
and gauge?
Molded-in stress?
Leaded or not? Encapsulation?
Stacked die or side-by-side?
How/what to test?
Sep-14 8
MEMS/Sensor
Performance Package Type
Molded MLF®
Molded
ChipArray® LGA
Cavity MLF®
Cavity Ceramic/Hermetic
Good
Better
Best
Packaging Technology is a Differentiator
Overmolded MLF® Cavity MLF®
Sep-14 9
Materials Help Manage Die Stress
From material datasheets From simulation results
0
500
1000
1500
2000
2500
Epoxy - C Film Epoxy - NC Silicone1 Silicone2
Mo
du
lus -
MP
a
Die Attach Adhesives
0
0.001
0.002
0.003
0.004
0.005
0.006
0.007
FR5 Ceramic FR5-1 FR5-2
S1 P
rin
cip
al S
tress -
MP
a
Substrate Thickness/Material
Thin
Thick
Sep-14 10
Focusing on Cavity Package
Standard on the outside,
custom on the inside
Sensor fusion ready, multiple
MEMS/sensor dice
Multiple stimuli opening/ports
Low stress bill of materials
Applicable to leadframes and
laminates
Sep-14 11
MEMS Package Evolution
Overmolded Exposed Die Surface Cavity Package
SOIC
MLF®/QFN
ChipArray®
LGA/BGA
Sep-14 12
MEMS Package – Next Generation
Cavity Package Hybrid Cavity Package
MLF®/QFN
ChipArray®
BGA
Sep-14 13
Packaging
Inter-connection
MEMS Capping/Interconnect Trend
MEMS Wafer Capping
TBD
Through Silicon Vias Overmolded CSP
ME
MS
De
vic
e
*TSV, TGV is at foundry level.
3D Functional Cap Through Glass Vias
Chip on Chip
Thin Film Capping (RnD Stage)
Pre-Mold/Cavity
Overmolded CSP/MLF®
Cavity Packaging
Glass Cap
Silicon Cap
Hermetic Packaging Bare Die
WLCSP
Cavity CSP
Sep-14 14
Packaging
Inter-connection
Sensor Fusion Trend
MEMS Wafer Capping
Overmolded CSP
Through Silicon Vias
WLCSP ME
MS
Se
ns
ors
*TSV, TGV is at foundry level.
3D Functional Cap
Chip on Chip
Capped, Uncapped Sensors
Flip Chip, Stacked
Wirebond, Side by Side, Stacked Cavity Packaging
Overmolded CSP
Cavity CSP
Sep-14 15
MEMS and Sensor Standard Platforms
*Not compatible
Accelerometers Gyroscopes
Magnetometers
Overmolded Packaging ChipArray® BGA MLF® Dual
Cavity Packaging Hermetic/Ceramic Cavity Laminate/LF Cavity
Wafer Level Package
Microphone Pressure Sensors
Overmolded Packaging ChipArray® BGA MLF® Dual
Cavity Packaging Ceramic Cavity Laminate Cavity
Wafer Level Package
Temperature & Humidity Sensors
Overmolded Packaging ChipArray® BGA MLF® Dual
Cavity Packaging Ceramic Cavity Laminate Cavity Exposed Die Surface
Wafer Level Package
Bio-metric Bio-medical
Overmolded Packaging ChipArray® BGA MLF®
Dual
Cavity Packaging Laminate or LF Cavity Ceramic Cavity Exposed Die Surface
Wafer Level Package
Microbolometers Displays
Overmolded Packaging ChipArray® BGA MLF® Dual
Cavity Packaging Laminate or LF Cavity Ceramic Cavity Exposed Die Surface
Wafer Level Package
RF Switch Oscillators
Overmolded Packaging ChipArray® BGA MLF® Dual
Cavity Packaging Ceramic Cavity Laminate/LF Cavity
Wafer Level Package
Sep-14 16
In Summary
MEMS Sensor Market is Growing…
– Wide array of consumer applications driven by “smart devices”
– The automotive MEMS sensor market continues to grow with worldwide mandates on
safety, efficiency and driver assistance
Standard Platforms = Faster Development
– Faster introduction of new products
– Lower development cost
Amkor Experience
– Dedicated MEMS Team
– Constantly updating the MEMS Toolbox with investments on new equipment and
materials and leveraging other core technologies like TSV, Cu Pillar
Sep-14 17
Contact Amkor For Further Information
Amkor Corporate Amkor Euroservices
1900 South Price Road Immeuble Alliance
Chandler, AZ 85286 Batiment C
USA Archamps, Archamps 74160
Phone: 1.480.821.5000 France
Phone: 33.4.50.31.88.00