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Heat Transfer Simula0ons with COMSOL Mul0physics
© 2012 COMSOL. COMSOL and COMSOL Multiphysics are registered trademarks of COMSOL AB. Capture the Concept, COMSOL Desktop, and LiveLink are trademarks of COMSOL AB. Other product or brand names are trademarks or registered trademarks of their respective holders.
Dr Edmund Dickinson COMSOL Ltd
Agenda • Why do we model heat transfer?
• Modeling heat transfer with COMSOL Mul0physics® – conduc0on, conduc0on and radia0on – Mul0physics: electrical hea0ng – Mul0physics: cooling flow
• Video demo – Heat transfer in a light bulb.
• How to: – Try COMSOL Mul0physics – Contact us
• Q&A session
Why Do We Model?
• Concep0on and understanding.
• Design and op0miza0on.
• Tes0ng and verifica0on.
Conjugate heat transfer simulation of an aluminum heat sink.
What is mul0physics?
Mul0physics: mul0ple interac0ng phenomena
Could be simple:
• Heat transfer by convec0on in a fluid flow.
Could be complex:
• Reac0ng flow evolving heat, with temperature-‐dependent reac0on rates.
Advantages of COMSOL Mul0physics
• Mul,physics – Everything can link to everything. • Flexible – You can model just about anything.
• Usable – You can keep your sanity doing it.
• Extensible – If it’s not specifically there… add it!
Thermal Stress: A stator blade in the turbine stage of a jet engine is heated
by combustion gases, where the resulting temperature gradients introduce significant stresses. To prevent the stator from melting, air is passed through a cooling duct in the blade. Shown is the temperature distribution throughout the blade and in the flow stream.
All-‐Inclusive Interac0ve Modeling Environment
Model Builder
Provides instant access to any part of the model seZngs.
• CAD/Geometry • Materials • Physics • Mesh • Solve • Results
Graphics
Ultrafast graphic presenta0on, stunning visualiza0on, and mul0ple plots.
COMSOL Desktop™
Straigh_orward to use: it gives full insight into and control over the modeling process.
Product Suite
Thermal Analysis
Conduc0on Heat transfer of moving solids
Convec0on in fluids Radia0on
Thermal modeling can include many
different effects.
It can be solved for both steady state and
0me-‐dependent problems.
Thermal Analysis: Mul0physics
• Many applica0ons combine heat transfer with another physics type.
• Forced / natural convec0on: -‐ fluid flow.
• Joule hea0ng: -‐ electrical analysis.
• Thermal stress: -‐ structural analysis.
Heat Exchanger – Forced Convec0on
Flow and Heat • Model of a heat exchanger:
– Heat conduc0on in solid – Heat convec0on in air flow
• 60 °C hot stream exchanges heat with 30 °C cold stream.
• Isotherms show temperature distribu0on through the steel block.
Natural Convec0on
• Dynamic heat convec0on caused by temperature gradients.
• Occurs when density depends on temperature.
• Control complexity: compare empirical models with a complete fluid flow model.
Electronic Component Cooling
• Heat sinks. • Circuit board components. • Can include modeling of the cooling flow.
Natural convec0ve cooling of a vacuum flask Coffee Temperature vs. Time
Temperature and velocity profile around a vacuum flask cooled by natural convection using low k-ε turbulence model
Light Bulb – All Forms of Heat Transfer in One Model • 60 W filament heats rapidly over the first seconds. • Induces a flow driven by natural convec0on. • Radia0on is significant to both internal and external heat transfer.
t = 0.1 s t = 60 s
Temperature Velocity
t = 0.1 s t = 60 s
Laser Hea0ng of a Spinning Disc
• Gaussian heat pulse for laser hea0ng of a rota0ng disc.
• Flexible heat transfer condi0ons: – choose site and intensity of
hea0ng. – directly incorporate physical
complexity such as a rota0ng solid.
Laser Hea0ng – with depth penetra0on
Revolving Laser with Depth Penetration
• Crea0ng heat from other physics. • Influence of temperature change on physical phenomena.
Heat Transfer: Mul0physics
Joule Hea0ng
• Electrical resistance causes power losses as heat.
• Resis0ve hea0ng is propor0onal to current density.
• Joule hea0ng causes thermal expansion: – Deforma0on and stress
from a mul0physics model.
Heat-‐Induced Deforma0ons
• Thermal expansion in a coil changes its dimensions. • The effect of deforma0on on the inductance can be
determined using a mul0physics model.
Temperature
Deformation
Chemical Reac0on Modeling
• Thermal decomposi0on of a gas-‐phase species in a flow. • High ac0va0on barrier.
– increased temperature accelerates the reac0on.
Flow Velocity
Temperature
Concentra,on
Thermally Induced Creep
• Internally pressurized sphere. • Temperature is held at ~ 40% of
mel0ng point. • Mo0on starts aler 1000 hrs (42
days). von Mises Stress
Stress at 3 points
Focused Ultrasound Hea0ng
• High-‐Intensity Focused Ultrasound (HIFU) uses sonic energy to heat damaged or diseased 0ssue.
Sound Intensity (dB) Isotherms near focus after 1 second
Tissue
Water
Biohea0ng – Hepa0c Tumor Abla0on
• Low frequency Joule hea0ng using a catheter inside an artery.
• Used to kill cancerous cells in a tumor.
• Isotherms allow iden0fica0on of “damage” region where cancer cell necrosis occurs.
Temperature
Voltage
RF Hea0ng – Microwave Oven
• Microwave radia0on in a box heats the potato.
• Center temperature rises quickly.
Hea0ng by Internal Fric0on
• Fluid-‐structure interac0on (FSI) in the cast and mold for an aluminum extrusion process.
• Internal fric0on acts as a heat source.
Viscosity changes in the non-Newtonian flow of
molten aluminum Isotherms and Flow Direction
von Mises Stress
Mold Cooling – Mix 3D Thermal Modelling with 1D Pipe Flow
Mold cooling process in the automo0ve industry
Pipe Flow Module • Fluid flow in pipe networks. • Heat and mass transfer. • Couple to a three-‐
dimensional heat conduc0on model.
Cooling of a plastic mold of a steering wheel – including pipe flow in cooling channels.
EXAMPLE: Light Bulb – Heat and Flow
• Modeling heat transfer in a 60 W glass bulb with a tungsten filament and inert argon atmosphere.
• All forms of heat transfer!
– conduc0on in the glass – internal natural convec0on – convec0ve cooling to the exterior – internal surface-‐to-‐surface radia0on – surface-‐to-‐ambient radia0ve loss
Dr John Dunec will demonstrate how to build the light bulb model in COMSOL Mul0physics.
John Dunec, Ph.D. COMSOL, Inc.
Upcoming Workshops North America
• Los Angeles, CA • Arlington, VA • Houston, TX • Ouawa, ON • Pasadena, CA • Irvine, CA
Europe
• Oxford, UK • Grenoble, France • Paris, France • Amsterdam, Netherlands • Cardiff, UK • London, UK • GöZngen, Germany • Stuugart, Germany • Zürich, Switzerland • Lund, Sweden
Register to our free hands-on workshops at:
www.comsol.com/events
Contact Us
• www.comsol.com – User Stories – Videos – Model Gallery – Discussion Forum – Blog – Product News
• [email protected] – General inquiries
• [email protected] – Technical support
Q&A Session
Any ques0ons not answered will be followed up by email
Product Suite
www.comsol.com