2008 ITRS Public Conference San Francisco, USA 1 DRAFT – DO NOT PUBLISH DRAFT – DO NOT PUBLISH ITRS Factory Integration Shige Kobayashi, Tom Jefferson July 2008 San Francisco, USA Global Co-Chairs: Europe: Arieh Greenberg Japan: Shige Kobayashi, Michio Honma Korea: S. H. Park Taiwan: Thomas Chen US: Tom Jefferson 2008 Contributors: Terry Francis, Gopal Rao, Al Chasey, Les Marshall, Todd Lasater, Brad van Eck, Kenjiro Nawa, Daniel Babbs, Dave Eggleston, Mutaz Haddadin, Gavin Rider, Andreas Neuber, Eric Englhardt, Peter Csatary, Adrian Pyke, Mikio Otani, Bill Fosnight, Richard Oeschner Junji Iwasaki, Mazafumi Fukushima, Tomoyuki Masui
Transcript
2008 ITRS Public Conference San Francisco, USA 1DRAFT – DO NOT PUBLISHDRAFT – DO NOT PUBLISH
ITRS Factory IntegrationShige Kobayashi, Tom Jefferson
July 2008
San Francisco, USA
Global Co-Chairs:Europe: Arieh GreenbergJapan: Shige Kobayashi, Michio HonmaKorea: S. H. ParkTaiwan: Thomas ChenUS: Tom Jefferson
2008 Contributors: Terry Francis, Gopal Rao, Al Chasey, Les Marshall, Todd Lasater, Brad van Eck, Kenjiro
Nawa, Daniel Babbs, Dave Eggleston, Mutaz Haddadin, Gavin Rider, Andreas Neuber, Eric Englhardt, Peter Csatary, Adrian Pyke, Mikio Otani, Bill Fosnight, Richard Oeschner
Junji Iwasaki, Mazafumi Fukushima, Tomoyuki Masui
2008 ITRS Public Conference San Francisco, USA 2DRAFT – DO NOT PUBLISHDRAFT – DO NOT PUBLISH
Factory Integration Scope and Drivers
WaferMfg
ChipMfg
ProductMfg
Dis
trib
uti
on
• FEOL• BEOL
• Probe/Test• Singulation
• Packaging• Test
Si SubstrateMfg
ReticleMfg
Increasing cost &Cycle time implications
Factory is driven by Cost, Quality, Productivity, Speed, and FlexibilityReduce factory capital and operating costs per functionFaster delivery of new and volume products to the end customerEfficient/Effective volume/mix production, high reliability, & high equipment reuseEnable rapid process technology shrinks and wafer size changes
FactoryOperations
ProductionEquipment AMHS Factory Information
& Control Systems Facilities
UI
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Key Technologies that will Impact Factory Design 2008 and future years are targeted to meet productivity and capture technology
requirements Key process & device technology intercepts that will impact the factory design are
Extreme Ultraviolet Litho (EUVL), new materials, 450mm conversion, significant productivity improvements, and waste (inefficiencies) reduction
Economic and business challenges are equal to our manufacturing and process technology challenges in scope and breadth to attain efficiency and effectiveness
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FI 2008 FocusEnable the Transition to NGF / 450mm for cost, cycle time & productivity improvement
2008 Topics Result
1 Incorporate waste (inefficiency) reduction as part of FI roadmap
-Defined initial factory integration high level metrics for creation of a waste reduction roadmap
-Equipment Output Waste-Wait Time Waste
-Completed initial draft of package to communicate waste reduction roadmap approach
2 Improve data quality, & time to information
- Defined strategy for integrating time synchronization and data handling requirements between production equipment and factory information and control systems.
3 Develop Facilities modeling methodology
- Initial development of a modeling methodology for evaluating factory size and cost relationship
OperatorsIssue: Comprehensive data collection of factory resource activitiesAddition of related factory resource activity data(; equipment, AMHS, operators, facility)
Standardization of data definition
Data collection automation
by Lotby Wafer
W/R :Waste ReductionWTW :Wait Time WasteEOW :Eqp Output Waste
W/R
Plan
Do
Check
KPIStructuredInformation
Action
EOWEOW
ReferenceReferenceOEE
Metrics
Waste Reduction Cycle
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Applying Waste Reduction to Drive The Industry in the Proper Direction
Wait Time Waste Baseline = time to process a single wafer in an un-loaded tool = CTmin Actual performance = cycle time of wafer when processed in production
with large lot Waste = (actual CT-CTmin)/CTmin
Equipment Output Waste Baseline = designed equipment output capability (wph) Actual performance = actual good production wafer output of the
equipment in production Waste = (capacity-actual good wfrs)/capacity * 100
2008 ITRS Public Conference San Francisco, USA 12DRAFT – DO NOT PUBLISHDRAFT – DO NOT PUBLISHFactory Integration - AMHS Sub-team June 18, 2008 12
Data Collection Roadmap
FICS PE
Tool
Sensor
HostSoftware
EDA
E148
(NTPv3)
FactoryTime Server
Data Frequency
Time Synchronization
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Process Mask LayersMetal LayersProcess Steps
Process Mask LayersMetal LayersProcess Steps
Process Tools
Physical Characteristics
(LxWxH, Weight, etc)
Process Materials
(New Technology Impact)
Facility (SF,M2)Clean space, Admin
Space, Non-clean space
Construction ImpactDesign/Build
TimeSchedule
Methodology for Methodology for Future Facility ModelingFuture Facility Modeling
High Level ApproachHigh Level Approach
HIGH LEVELFirst DraftAverage Tool Size Tool Scaling FactorAdmin Scaling FactorSupport Space Scaling FactorCost per square foot
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