IMPACT-IAAC 2013 Plenary Speech Special Session IAAC Packaging Session PCB Session Poster Session Day 1－October 22 (Tuesday) 13:30-17:30 IAAC 2013 Opening & Meeng ROOM R 503 Day 2－October 23 (Wednesday) ROOM R 504 a+b+c 10:00-10:20 Opening of IMPACT 2013 10:20-11:10 Ricky Shi-Wei Lee, President of the IEEE-CPMT Society Topic: From MOOREficaon to LEDificaon 11:10-12:00 Dyi Chung Hu, Senior Vice President of Unimicron Topic: The Challenges of IC Substrate in 3D Era 12:00-13:30 Lunch & ALC Commiee Meeng 13:30-15:30 Panel Discussion- Sustainable Manufacture Topic: Designing Electronic Products for Sustainable Manufacture Chair: Dr. Charles E. Bauer & Dr. Shen-Li Fu 15:30-15:45 Poster Session (PCB) / Coffee Break ROOM ROOM 504 a ROOM 504 b+c ROOM 503 ROOM 501 ROOM 502 15:45-18:00 【1】Advanced Packaging (SPIL) 【2】IAAC- Global Business Council 【3】Advanced Packaging I 【4】Advanced and Emerging Technology 【5】IP Session 18:00-20:00 TPCA Show & IMPACT-IAAC 2013 Joint Recepon & Award Ceremony (3F) Day 3－October 24 (Thursday) ROOM R 504 b+c 09:30-10:20 Yasumitsu Orii, Senior Manager of IBM Japan Topic: Next Generaon Computer System for the Era of Big Data ROOM ROOM 504 b+c ROOM 504 a ROOM 503 ROOM 501 ROOM 502 10:30-12:30 【6】ICEP Japan Session 【7】3D Integraon I 【8】Thermal Management I 【9】Modeling, Simulaon & Design I 【10】Green Materials & Process 12:30-13:30 Lunch ROOM R 504 b+c 13:30-14:20 Kyong Wook Paik, Professor of Materials Sci. & Eng., KAIST Topic: Recent Advances in Anisotropic Conducve Technology: Materials & Processing ROOM ROOM 504 b+c ROOM 504 a ROOM 503 ROOM 501 ROOM 502 14:30-17:30 【11】3D IC Forum 【12】Advanced Packaging II 【13】Interconnecons & Nanotechnology 【14】Modeling, Simulaon & Design II 【15】Test & Quality 15:45-16:00 Poster Session (Packaging) / Coffee Break Day 4－October 25 (Friday) ROOM R 504 b+c 09:30-10:20 Islam Salama, Sr. Manager of Intel Topic: Enabling Connuum Compung Thru Innovaon in Packaging Substrate & Assembly ROOM ROOM 504 b+c ROOM 504 a ROOM 503 ROOM 501 ROOM 502 10:30-12:15 【16】iNEMI Reliability Session 【17】3D Integraon II 【18】LED & Thermal Management 【19】Modeling, Simulaon & Design III 【20】HDI & Embedded 12:30-18:30 Plant Visit & Culture Tour (Only for Overseas Aendees)
Transcript
IMPACT-IAAC 2013
Plenary Speech Special Session IAACPackaging Session PCB Session Poster Session
Day 1－October 22 (Tuesday)13:30-17:30 IAAC 2013 Opening & Meeting
ROOM R 503
Day 2－October 23 (Wednesday)ROOM R 504 a+b+c
10:00-10:20 Opening of IMPACT 2013
10:20-11:10 Ricky Shi-Wei Lee, President of the IEEE-CPMT Society Topic: From MOOREfication to LEDification
11:10-12:00 Dyi Chung Hu, Senior Vice President of Unimicron Topic: The Challenges of IC Substrate in 3D Era
Welcome Message from Wun-Yan Chen, Conference Chair
Wun-Yan ChenChairman, IMAPS-Taiwan
It gives me great pleasure to represent the Organizing Committee to welcome you participating in the IMPACT-IAAC 2013 joint conference . Over the past years, IMPACT conference continually pays attention to the latest trends of global micro-system, packaging and circuit technology, and encouraging the development and research of new materials, processes and designs in realizing the versatile system demands for advanced consumer, communication, mobile computing, medical and automobile applications . Due to the efforts, IMPACT conference has been successfully established as an international platform for information exchange and experience shared by experts from all over the world .
Recently, we witnessed a significant increase of concern among the peoples of the world with the rational utilization of renewable natural resources, and also there is a greater consciousness today of the links with the research which leads to a better understanding and knowledge of environmental issues . This year, catering to the eco-technology trends, the IMPACT-IAAC 2013 joint conference highlights “Green & Cloud: Creating Value and Toward ECO Life”, and elaborately arranges the panel sessions, invited talks, industrial sessions and outstanding paper presentations, with a view to pushing the research and development of ICT products to gain further effective improvements in system performance and integration, and innovating to alleviate environmental damages .
We hope this Conference to be successful and to become an important and valuable resource under your contribution and participation . The challenges in front of us are significant, but I am confident that we will succeed in your zealously dedication. I wish you have a very pleasant stay here, and have a productive and successful meeting . Finally, I would like to thank to the working team members and the organizing committee members, and also express my particular appreciations to the collaboration with ICEP (International Conference on Electronic Packaging), iNEMI (The International Electronics Manufacturing Initiative), and IAAC (IMAPS All Asia Conference) .
Wun-Yan ChenChair, Organizing Committee
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Welcome Message from Shen-Li Fu, Conference Co- Chair
As the Co-Chair of the Organizing Committee, IMPACT-IAAC2013, I take it a great pleasure to welcome friends, colleagues, and participants from all over the world attending this wonderful event .
IMPACT-IAAC2013 is the eighth conference jointly organized by IEEE-CPMT Taipei Chapter, IMAPS Taiwan Chapter, ITRI (Industrial Technology Research Institute), I-Shou University and TPCA (Taiwan Printed Circuit Association) . It is one of the most important events of this kind in the world, and is acknowledged for its intensive connections between industries and academia .
Several unique arrangements of IMPACT-IAAC 2013 are as the follows . First, the conference will be a joint event of IMPACT and IAAC this year . Second, follows the footsteps of the previous conferences, there will still be Industrial Forums this year: Advanced Packaging-SPIL and 3D IC Forum . There will also be several special forums: ICEP (Japan Packaging Session), iNEMI (iNEMI Session) and a Panel Discussion (Chaired by Dr . Charles E . Bauer) .
Thanks again for your participation . I hope, and I am sure, you will have fruitful discussion and expand cooperation . Wish you all have a pleasant and enjoyable stay in Taiwan and looking forward to seeing you in person .
Welcome Message from Dr. CT Liu, Conference Co-Chair
Dr. CT LiuVice President & General Director, ITRI
On behalf of the Organizing Committee, it is my great pleasure to welcome you to “IMPACT 2013”, the 2013 International Microsystems, Packaging, Assembly and Circuits Technology Conference .
The theme of 2013 IMPACT is “Green & Cloud: Creating Value and Toward Eco-Life” . All participants will enjoy many well organized technical events by our Technical Program Committee and Organizers, including IEEE, CPMT-Taipei, IMPAS-Taiwan, ISU University, TPCA, and ITRI .
In this 3-day conference, you will have the chance to attend the IMPACT speeches and meet renowned Plenary Speakers who will share their visions on technology trends . In addition, there will be 4 Special Sessions and 1 Special Forum presented by experts in advanced packaging technologies moving toward system scaling and integration .
Your involvement brings together the world’s leading researchers, engineers, and industrial experts . I would also like to express my sincere appreciation to everyone who has helped in organizing this conference, in particular, the Local Organizing Committee and the Technical Program Committee, and sincere gratitude to all of our sponsors and partners as well .
Again, welcome to IMPACT 2013 –“Green & Cloud: Creating Value and Toward Eco-Life”!Wish you all have a pleasant and enjoyable conference and stay in Taiwan .
CT Liu, Ph.D.Vice President &General Director, ITRI
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Welcome Message from Rick Wu, Conference Co-Chair
Rick WuChairman, Taiwan Printed Circuit Association (TPCA)
As a Co-Chair of IMAPCT Conference, it is my pleasure and privilege in welcoming you to join IMPACT-IAAC 2013 . This year, the 2nd IAAC (IMAPS All Asia Conference) is combined to IMPACT organized by IEEE CPM-Taipei, iMAPS-Taiwan, ITRI and TPCA will be held in conjunction with TPCA Show 2013 on 22nd -25th at Taipei Nangang Exhibition Center . As we know IMPACT is the largest Electronic Packaging and PCB Conference which has become the benchmark event in the world .
This year, IMPACT arranges two thematic Industrial Forums-SPIL-Advanced Packaging and 3D IC Forum . In addition, there are many special sessions such as IAAC GBC session, Japan Packaging session, iNEMI session, Panel Discussion and IP Session . Furthermore, TPCA offers rich scholarship for the Outstanding Paper Award winner from PCB and Packaging and supports them traveling to join ECWC 13 conference in Germany next year . I believe it must attract many experts and elites from world-wide to participate .
Moreover, as a host of TPCA Show, I would like to invite you to visit TPCA Show 2013 taking place on the fourth floor of Nangang Exhibition Center. Base on the full support from TPCA members, TPCA Show 2013 has 1,320 booths consisted by 350 exhibitors which increased 11% compared to last year . Finally, I wish TPCA show 2013 and IMPACT Conference to make a big success and to become a valuable resource under your contribution and participation .
Sincerely Yours,
Ricky WuChairman, Taiwan Printed Circuit Association (TPCA)
Conference Co-ChairShen-Li Fu IEEE-TaiwanCT Liu ITRIRick Wu TPCA
Conference Executive Co-ChairBo-Bin Tsai AVC Co ., Ltd .Dyi Chung Hu UnimicronHeinz Ru Tong Hsing ElectronicMike Ma SPIL Shin-Puu Jeng TSMC
Technical Program Committee
Chair Yu-Hua Chen IMAPS-Taiwan/ITRI
Co-Chair Hsiang-Chen Hsu I-SHOU University
Co-Chair Hsien-Chie Cheng Feng Chia University
Co-Chair Rolf Aschenbrenner Fraunhofer IZM
Co-Chair Yasumitsu Orii IBM Japan
SubCommittee Chair Wei-Chung Lo ITRI
SubCommittee Chair Frank Bai TPCA
SubCommittee Chair Jen-Dong Hwang TTMA
China Haley Fu iNEMI
Germany Andreas Ostmann Fraunhofer IZM
Singapore(Malaysian) Chuan-Seng Tan Nanyang Technology University
Taiwan Ben-Je Lwo National Defense University
Taiwan C . Robert Kao National Taiwan University
Taiwan Chang-Chun Lee Chung Yuan Christian University
Taiwan Chao, Shin Hua ASE
Taiwan Charlie Lu Altera
Taiwan Chen, Kuan-Neng National Chiao Tung University
Taiwan Chi-Chuan Wang National Chiao Tung University
Taiwan Chih Chen National Chiao Tung University
Taiwan Cho-Liang Chung I-SHOU University
Taiwan D . S . Liu National Chung Cheng University
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Taiwan Dennis Lin TPCA
Taiwan Jeffrey Lee IST
Taiwan Jenn-Ming Song National Chung Hsing University
Taiwan John Liu BoardTek Electronics Corporation
Taiwan K . M . Chen UMC
Taiwan Kuan-Jung Chung National Changhua University of Education
Taiwan Kun-Nan Chen Tungnan University
Taiwan L . S . Chen SMTA
Taiwan M . Y . Tsai Chang Gung University
Taiwan Mei-Ling Wu National Sun Yat-Sen University
Taiwan Shih-Kang Lin National Cheng Kung University
Taiwan Shung-Wen Kang Tamkang University
Taiwan Tz-Cheng Chiu National Cheng Kung University
Taiwan Yi-Shao Lai ASE
Taiwan Yu-Po Wang SPIL
USA John Xie Altera
USA Yung-Yu Hsu MC10 Inc .
Domestic Advisory Board
Albert Lan 藍章益 SPIL
David Wang 王 偉 ChipMOS
George Yang 楊志海 Atotech Taiwan Limited
James Ho 何信芳 Nan Ya Printed Circuit Board Corp .
Jao-Hwa Kuang 光灼華 National Sun Yat Sen University
Maurice Lee 李長明 Unimicron Technology Corp .
S . J . Hwang 黃聖杰 National Cheng Kung University
Stephen Wang 王仙壽 ETERNAL CHEMICAL CO .,LTD
International Advisory Board
Chair Shi-Wei Ricky Lee Hong Kong University of Science and TechnologyIEEE CPMT Society
Co Chair Kwang-Lung Lin Materials Science & Engineering, National Cheng Kung University (NCKU) Finland Paul Collander PoltronicHong Kong Enboa Wu ASTRIJapan Masahiro Aoyagi National Institute of Advanced Industrial Science and TechnologyJapan Masaru Ishizuka Toyama Prefectural UniversityJapan Masayoshi Esashi Tohoku UniversityJapan Noriyuki Miyazaki Department of Mechanical Engineering and Science, Kyoto UniversityJapan Toshio Tomimura Kumamoto UniversityJapan Yutake Tsukada The president of JIEP (Japan Institute of Electronic Packaging) .
Both IMAPS-Japan and CPMT-Japan
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Committee
Malaysia Mohd Zulkifly Abdullah Univeristy Sains Malaysia (USM)Malaysia Wong Shaw Fong Intel Coorporation Singapore Andrew Tay National University of SingaporeTaiwan Wen-Hwa Chen National Applied Research Laboratories (NARL)UK Chris Bailey University of GreenwichUSA Charles Bauer TechLead Corp .USA Jay Dasai MFLEXUSA Jie Xue Cisco Systems, Inc .USA Michael Pecht Center for Advanced Life Cycle Engineering/University of MarylandUSA Ning-Cheng Lee Indium Corp .USA Robert C . Pfahl International Electronics Manufacturing Initiative (iNEMI)USA Sung Yi Portland State UniversityUSA Voya Markovich IMAPS
Local Organizing Committee
Chair Long-Shien Lin (IMAPS-Taiwan/ITRI)
Local Committee Co-Chair Yu-Jung Huang (ISU)
Subcommittee-Chair R . S . Lee (ITRI) Hung-Yin Tsai (NTHU) Chi-Shiung Hsi (NUU) David Lai (TPCA) Michelle Hung (TPCA)
Secretariat Jun-Man Lin (ITRI) Sophia Huang (TPCA) Sylvia Yang (TPCA) Erik Yu (TPCA)
Registration Jessie Chiu (TPCA)
Public Relations Jessie Chiu (TPCA)
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IMPACT- IAAC Conference 2013The 8th International Microsystems, Packaging, Assembly and Circuits Technology Conference
In order to avoid dangerous climate change, provide sustainable green energy and better life for global population, the ICT products and services need to gain further effective improvements in system performance and integration, and innovate to reduce environmental impact . Over the past years, IMPACT conference, a remarkable platform, continually pay attention to the latest trends of global micro-system, packaging and circuit technology, and encourage the development and research of new materials, processes and designs in realizing the versatile system demands for advanced consumer, communication, cloud & mobile computing, medical and automobile applications .
IMPACT sincerely welcomes you to IMPACT-IAAC 2013 Joint Conference which will be held in conjunction with TPCA Show 2013 on 22nd -25th at Taipei Nangang Exhibition Hall . This year, the 2nd IAAC (IMAPS All Asia Conference) is rotated in Taiwan, and a joint international conference of IMPACT and IAAC is organized by IEEE CPMT-Taipei, iMAPS-Taiwan, ITRI and TPCA . To cater for the technology trends, the theme of IMPACT-IAAC 2013 highlights “Green & Cloud: Creating Value and Toward Eco-Life” and will arrange Panel Sessions, invited talks, industrial sessions and outstanding paper presentations . Furthermore, IMPACT keeps collaborating with International organizations such as ICEP from Japan and iNEMI from U .S .A . We hope this Conference to be successful and to become an important and valuable resource under your contribution and participation
General Information■ Date: October 22(Tue) - October 25 (Fri), 2013■ Venue: Taipei Nangang Exhibition Hall, Taipei, Taiwan■ Conference: IMPACT-IAAC Conference■ Exhibition : TPCA Show 2013■ Theme: Green & Cloud: Creating Value and Toward Eco-Life
Hotel Information
To enjoy the discount for IMPACT conference attendees, please book your hotel right away and make further follow-up confirmation with the hotel.
TPCA Show & IMPACT Joint Reception (Taiwanese Cuisine Buffet)
Date: Oct . 23, 2013 (18:00-20:00)Venue: 3F (Canton悅), Taipei Nangang Exhibition Center
International Welcome Dinner
Date: Oct . 24, 2013 (18:30-20:00)Venue: 4F (Formosa 寶島廳, Caesar Park Taipei) (Add : 38, Chung Hsiao W . Rd ., Sec . 1, Taipei, 100, Taiwan, R .O .C .)Invited Guest: Plenary Speakers, Invited speakers, Overseas authors, VIP and Committee members
Lunch Provided
Organizer will arrange lunch box for every attendee .Date: Oct .23-24, 2013Time: 12:30-13:30Venue: 504
Identification
Badges are required for admittance to all sessions, lunch and TPCA Show & IMPACT Joint Reception . Please bring it with you all the times .
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Information
Registration Desk
Reception desk is located on 5th floor of Taipei Nangang Exhibition Center. Please check in and get proceedings in reception desk from 8:30AM to 17:00PM .
Organizer Office
Room 521 is organizer’s office on the 5th floor of Taipei Nangang Exhibition Center.
Speaker Preview Room
The preview room for all speakers is located in the Room 521 on the 5th floor of Taipei Nangang Exhibition Center. All speakers are advised to provide your update presentation slides or check your file in advance there.Open Hour: 9:00am - 5:30pm, October 22-25
Conference Venue
Conference rooms will be located on the5th floor of Taipei Nangang Exhibition Center.
Poster Session
Poster session will be located on 5th floor of Taipei Nangang Exhibition Center.
Internet Access
Wireless internet is provided on 5th floor of Taipei Nangang Exhibition Center for free.
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Social ProgramPlant & Culture TourOnly for Oversea Attendees and Student • Schedule on Oct. 25rd afternoon *Note: The Organizer reserves the right to amend the schedule .
Time Schedule Location
12:30-12:40 Gathering at 5F (in front of Impact Register Counter) Nangang Exhibition
12:40-14:00 Shuttle to Taiwan DuPont Innovation Center
14:00-15:00 Plant tour DuPont Innovation Center
15:00-15:30 Shuttle to Hsinchu Glass Museum
15:30-17:00 Glass Museum visit & Guided tour Glass Museum
17:00-18:30 Shuttle to Caesar Park Taipei Hotel
• Plant tour: DuPont Innovation Center DuPont has been bringing world-class science and engineering to the global marketplace in the form of innovative products, materials, and services since 1802 . The Innovation Centers bring to life the problem-solving power of private/public alliances, serve as a catalyst for growth, and serve to uncover unmet needs that will improve the lives of people everywhere .Address: No .2, Li-Hsin 4th Rd ., Hsinchu Science ParkWebsite: www .innovationcenter .dupont .comNote: the plant tour has minimum of 10 and maximum of 25 people.
• Culture tour: Glass MuseumSituated at the north western of Hsinchu Park, the museum was officially opened on December 18th, 1999 . The mission of the museum is to link resources of culture and tourism, assist the upgrading of Hsinchu glass industry, and introduce glass industry to the people and dealers of its development and application .Address: No .2, Sec . 1, Dongda Rd ., East Dist ., Hsinchu City 300, Taiwan (R .O .C .)Website: http://glassmuseum .moc .gov .tw/index .htm
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Information
City Tour
Taiwan Tour Bus-ScheduleTaiwan Tour Bus schedules provide many kinds of trips which include the major scenic spots in Taiwan . It will lead you to experience Taiwan’s city life, Taiwanese’s passion and hospitality, the ecology in farms, the spectacular scenery, hot springs and delicious food, shopping and Chinese holiday activities and to rediscover the charming characteristics of “Formosa .” IMAPCT organizer arranges 7 tours in Northern Taiwan, if you are interested in, you could contact South East Travel Service .
TOUR NO. Pick upTOUR FARE
NOTEADULT/person
(1) Taipei City tour Morning and afternoon NTD 855 Half day
(2) Taipei Night Tour Every day NTD 1235 3 1/2 hours
(3) Folk Arts Tour Afternoon NTD 1045 Half day
(4) Yangmingshan National Park Afternoon NTD 1235 Half day
(5) Chiufen Village & Northeast Coast Afternoon NTD 1045 Half day
(6) Northern Coast Tour Morning NTD 950 Half day
(7) Taroko Gorge Tour Morning NTD 4655 One day
If you need any further information,please contact South East Travel Service Phone:(886) 2-25713001 Fax :(886) 2-25236981
About Taiwan
I. VisaVisa-Exempt Entry
Countries eligible for Visa-exempt entry
1 . The nationals of the following countries are eligible for the visa exemption program, which permits a duration of stay up to 90 days: Austria, Belgium, Bulgaria, Canada, Croatia, Cyprus, Czech Republic, Denmark, Estonia, Finland, France, Germany, Greece, Hungary, Iceland, Ireland, Israel, Italy, Japan, Republic of Korea, Latvia, Liechtenstein, Lithuania, Luxembourg, Malta, Monaco, the Netherlands, New Zealand, Norway, Poland, Portugal, Romania, Slovakia, Slovenia, Spain, Sweden, Switzerland, U .K ., U .S .A . and Vatican City State .The nationals of the following countries are eligible for the visa exemption program, which permits a duration of stay up to 30 days: Australia, Malaysia, Singapore .
2 . The nationals of India, Thailand, Vietnam, Philippines and Indonesia, who also possess a valid visa or permanent resident certificate issued by U .S .A ., Canada, Japan, U .K ., Schengen Convention countries, Australia or New Zealand, are eligible for the visa exemption program, which permits a duration of stay up to 30 days. Those who meet the above qualification and have never been employed in Taiwan as blue-collar workers have to apply to the “Advance Online Registration System for the Visitors of Nationals from Five Southeast Asian Countries to Taiwan” of the R .O .C . National Immigration Agency (website: https://nas .immigration .gov .tw/nase) for an "Authorization Certificate" before coming to Taiwan. After completion, the printed-out Certificate can be used by the foreign visitor for boarding the airplane and the immigration inspection . During the immigration inspection, foreign visitors who can not show a valid visa or permanent resident certificate issued by one of the aforementioned countries will not be admitted into the R.O.C. (In case a single-entry visa issued by any of the said countries has already been used, it is invalid .)
Requirements 1 . a passport with validity of at least six months upon entry . ‧ visa-exempt entry only applies to foreign visitors holding formal passports (i .e .
ordinary, official/service and diplomatic passports), not including those holding emergency, temporary, other informal passports or travel documents . ‧ Japanese passport holders with their passports valid for more than 3 months are
eligible for visa-exempt entry . ‧ US passport( including emergency passport) holders with their passports valid for the
period of intended stay are eligible for visa-exempt entry .2 . a confirmed return air/sea ticket or an air/sea ticket and a visa for the next destination,
and a confirmed seat reservation for departure. 3 . non-criminal record and not prohibited by the local authorities to enter the R .O .C .
Duration of stay 1 . The duration of stay starts from the next day of arrival and is not extendable . Foreign visitors must depart by the end of the said duration . Please click here for " Penalty for overstay" .
2 . Visa-exempt entry cannot be converted to other types of visas, unless the following exceptions:A . Foreign visitors entering the R .O .C . through visa-exemption may only apply for
converting to visitor visas within their legal stay at the Bureau of Consular Affairs or branch offices of MOFA in case of: severe acute diseases, natural disasters or other force majeure reasons, which hold them back from leaving the R .O .C . In addition, white-collar professionals who have obtained the work permits within their legal stay may apply for work visas, together with their spouse and minors (under age 20) entering the R .O .C . at the same time .
B . For U .K . and Canadian passport holders, please refer to "Notice for British & Canadian Passport Holders Who Enter Taiwan Visa-Free and Apply for an Extension of Stay" .(doc)
Ports of entry Taiwan Taoyuan International Airport, Taipei Songshan Airport, Keelung Harbor, Taichung Airport, Taichung Harbor, Kaohsiung International Airport, Kaohsiung Harbor, Magong Airport, Taitung Airport, Hualien Airport, Hualien Harbor, Kinmen Airport, Shuitou Harbor and Fuao Harbor .
Landing VisaCountries eligible for Visa-exempt entry
1 . Nationals of Hungary , Poland and Slovak .2 . Holders of emergency or temporary passports with validity more than six months for
nationals of those countries eligible for visa-exempt and landing-visa entry .3 . Holders of USA passport with validity less than six months .
Requirements 1 . a passport valid for at least six months2 . a confirmed return air ticket or an air ticket and a visa for the next destination, and a
confirmed seat reservation for departure3 . fill out an application form with one photo4 . visa fee of NT$ 1,600 (citizens of countries with reciprocal agreements shall be issued
visas gratis) plus a handling fee of NT$ 800; For U .S . citizens: see remarks 25 . no criminal record
Duration of stay 1 . Bruneian passport holders: The 14-day duration of stay starts from the next day of arrival and is not extendable .
2 . Other eligible passengers: The 30-day duration of stay starts from the next day of arrival and is not extendable .
3 . The above-said landing visa cannot be converted to visitor or resident visa under normal circumstances .
Ports of entry Taiwan Taoyuan International Airport, Kaohsiung International Airport .More information please refer to : http://www.boca.gov.tw/mp?mp=2
II. TransportationBusesBuses from the Taoyuan International Airport to Taipei are available . Please indicate your needs at ticket counters which are located in the Arrival Passenger Reception Areas of both Terminals . Please visit more Information at http://www .taoyuanairport .gov .tw
Airport TaxiTaxi queues are outside the Arrival Halls of both terminals . To ensure the safety of passengers, only the taxis approved by the Aviation Police Bureau are permitted to operate in Taoyuan International Airport . Airport taxis charge according to the meter in addition to a 50% surcharge (highway tolls not included) and provide transport to anywhere in Taiwan . (A typical taxi fare to Taipei is approx NT$1,100 .)
Taiwan High Speed Rail (THSR)The Ubus and taxis to Taiwan High Speed Railway Station standby at Access Station charge according to regulation of local government without increment, passengers are welcomed to take the ride . Please visit more information at http://www .taoyuanairport .gov .tw
III. Helpful TipsClimateOctober is one of the most pleasant months in Taiwan . The climate in October is generally mild withtemperatures of 22-27℃ in Taipei .
CurrencyThe New Taiwan Dollar (NT$) is the national currency . Paper currency comes in $2,000, $1,000, $500, $200, and $100 denominations, while coins come in $50, $10, $5, and $1 denominations . The currency exchange rate at Sep . 2013 is around NT$ 29 .536 to US$1 . Foreign currencies can be exchanged at the Taiwan Taoyuan International Airport, government-designated banks and hotels . Please visit the Currency converter at http://www.xe.net . Major credit cards are accepted in major hotels and stores and travelers checks may be cashed at foreign-exchange banks, some tourist-oriented businesses and most international tourist hotels .
Electricity110 Volts/ 60Hz A .C .
LanguagesMandarin Chinese is the official language in Taiwan, but English is familiar to the younger generation, especially students, and those engaged in export trading, tourism, and hotel industries . Most taxi drivers do not speak English .
Time ZoneTaiwan is 8 hours ahead of Greenwich Mean Time (GMT + 0800)
TippingA 10% service charge is automatically added to room rates and meals . Other tipping is not expected .
Telecommunication ServicesThe local rate for public pay phones is NT$1 for two minutes . Most public phones provide international call services . English and Japanese speaking switchboard operators are employed at most hotels . Please dial the area code (02) for Taipei first if you are calling from the Taiwan Taoyuan International Airport.
Useful Phone NumbersTaiwan Taoyuan International Airport Tourist Service Centerhttp://www .taoyuanairport .gov .twTel: +886-3-3983728
Requests for information about the Conference should be directed to:Ms . Sophia HuangIMPACT 2013 SecretariatNo . 147, Sec . 2, Gaotie N . Rd ., Dayuan, Taoyuan 33743, TaiwanTel: +886-3-3815659 Ext . 404Fax: +886-3-3815150Mobile: +886-961-160-202E-mail: service@impact .org .twWebsite: www .impact .org .tw
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Information
PLENARY SPEECHWednesday, October 23, 10:20-11:10
Ricky Shi-Wei Lee
President IEEE-CPMT SocietyTopic: From MOOREfication to LEDificationTime: 10:20-11:10
Light-emitting diode (LED) is a semiconductor device with a p-n junction which can emit photons under forward bias . That’s why LED is called a solid-state lighting (SSL) source . Although the electroluminescence effect was discovered in early 20th century, LED did not become industrialized until 1960s . Before the turn of the millennium, LED was mainly used for signaling and display applications . That was because LED had not completed its full color spectrum and the luminous flux of LED was still low at that time. Similar to integrated circuits (IC), the evolution of LED in the past two decades is indeed more than impressive . With the substantial progress of blue LED, phosphor materials, and power wattage in 1990s, white light illumination by blue LED together with yellow phosphor for general lighting applications became possible at the dawn of the 21st century . In the Strategies in Light 2000 conference, Dr . Roland Haitz of Agilent Technologies presented his observation and prediction on LED: “for a given wavelength, the amount of light generated per LED package increases by a factor of 20 every decade and, at the same time, the cost per lumen falls by a factor of 10 .” The previous statement has been known as Haitz’s Law since then and is also considered the LED counterpart to Moore's Law for IC . In recent years, commercial SSL products started to appear in the consumer markets around the world . Despite the increasingly innovative applications of LED, the propagation of SSL is not always that smooth . The main difficulty in bringing LED lighting into households is the rather high start-up cost . Nevertheless, most major countries in the world are developing and/or implementing policies to ban the production and installation of incandescent light bulbs due to their poor efficiency. With the impetus from government policies for energy saving and proper promotion of the concept of “cost of ownership”, people should be more willing to embrace SSL starting from 2015 . It is my true belief that there exists a huge SSL market potential ahead of us .
Room 504
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Wednesday, October 23, 11:10-12:00
Dyi Chung Hu
Senior Vice President Unimicron, TaiwanTopic: The Challenges of IC Substrate in 3D Era.Time: 11:10-12:00
Semiconductor technology is moving rapidly from 28nm to 20nm and even 16nm node . Traditional laminate substrate is been challenged to meet the fine line and performance requirement of the IC. For future high performance products, fine line such as 5/5 and 3/3 even 2/2 um are required . To meet the challenges, laminate materials with low CTE, low loss and fine line capabilities are being developing in an ever increasing speed . New substrate requirement such as embedding passive and active components into the substrate is also emerging . Innovative substrate approach such as 2 .5D silicon/glass interposer is an alternative solution to meet the fine line and fine via requirement.
In this talk, the laminate substrate industry efforts to meet the challenges will be reviewed and new approaches to the fine line IC substrate will be discussed.
Room 504
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Plenary Speeches
Thursday, October 24, 09:30-10:20
Yasumitsu Orii
Senior Manager IBM Japan, Ltd. ,JPTopic: Next Generation Computer System for the Era of Big DataTime: 09:30-10:20
The last several years in particular has been a time when the amount of data used in the general public has been increasing dramatically . Processing speed accordingly plays a crucial role, and the packaging technology to support the system will be mentioned .
Room 504 b+c
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20
Thursday, October 24, 13:30-14:20
Kyong Wook Paik
Professor of Materials Sci. & Eng.KAIST, KRTopic: Recent Advances in Anisotropic Conductive Technology:
Materials & ProcessingTime: 13:30-14:20
Anisotropic Conductive Films (ACFs) have been widely used as excellent interconnection materials in semiconductor and display applications for chip-on-glass (COG), flex-on-glass (FOG), flex-on-board (FOB), chip-on-flex (COF), chip-on-board (COB) interconnections due to their fine-pitch capability, simple process, and cost effectiveness . There have been many technical innovations in terms of materials and processing technologies. In this presentation, solder ACFs, nanofiber ACFs, photo-activated ACFs and also 3D-TSV NCF materials will be presented as recent ACF materials innovation, and novel vertical ultrasonic bonding technique and wafer level ACF processing methods will be presented as recent ACF processing innovation .
For nanofiber ACFs, about 500 nm diameter polymer nanofibers with coupled conductive particles are fabricated using an electro-spinning method. This novel nanofiber ACF shows excellent electrical bump contact resistance, and fine pitch handling capability . Nanofiber ACF can completely solve the electrical shortage problems at 7 μm bump-to-bump gap and 20 micron ultra fine bump pitch of COG(Chip On Glass) and COF(Chip On Flex) electronic packaging applications .
In addition, new solder ACFs containing micron size Sn-Bi and SAC solder particles combined with the later described Ultrasonic(U/S) Bonding method overcome the limit of conventional ACFs in terms of current handling capability and reliability, because solder ACFs form many tiny solder alloy metallurgical joints rather than several physical contact based joints of conventional ACFs .
As very high impact innovation in ACF bonding process, room temperature operating Ultrasonic (U/S) bonding method was successfully invented as an alternative of conventional thermo-compression (T/C) bonding method . Solder ACF with US bonding can be successfully used for FOB(Flex On Board) and FOF(Flex On Flex) applications to eliminate socket connectors in mobile applications .
Wafer level packages using pre-applied ACFs were also invented . After ACF pre-lamination on a bumped wafer, and subsequent singulation, and singulated chips were assembled on various substrates using a thermo-compression bonding method . The new wafer level packages using pre-applied ACFs can be widely used for many non-solder flip chip assembly applications such as COB (Chip-on-Board), COF (Chip-on-Flex), COG (Chip-on-Glass), and 3D-TSV . Excellent SnAg bump joints were successfully formed with stable electrical interconnection by the added flux function at 40 um pitch 3D-TSV bump pitch.
Room 504 b+c
21 ▲
Plenary Speeches
Friday, October 25, 09:30-10:20
Islam Salama
Sr. ManagerSubstrate and packaging technology developmentIntel, USATopic: Enabling Continuum Computing Thru Innovation in Packaging
Substrate & AssemblyTime: 09:30-10:20
In today’s world, computing is becoming more pervasive . We have more devices per user and more functionality in each device . This is shaping a uniquely personalized computing experience and driving an explosive growth with new markets, devices and applications . It is also increasing the demands on data centers, cloud computing and giving rise to the era of “Big Data” .The economics of Moore’s law is fueling all this . At Intel we are committed to Moore’s law scaling . We are investing in several key materials, processes and equipment technologies that are critical to integrated circuit manufacturing throughout the coming decade . In this talk, we highlight the critical role high-density interconnect packaging, substrate and assembly technologies play in Moore’s law scaling . We provide our take on the current state of the industry and call for action to increase industry focus on standardization, HDI substarte scaling and structural cost reduction .
13:40-14:20 Materials and Interconnections to meet demands of future computing systems
Voya Markovich iMAPS-USA
14:20-14:50 Advanced Packaging Development in Taiwan —Challenges and Opportunities
Wun-Yan Chen iMAPS-Taiwan
14:50-15:20 History and Activity of Korean Semiconductor Packaging Industry
Gu-Sung Kim Kangnam University
15:20-15:30 Coffee Break
15:30-16:00 JIEP Activities and Trend of Low Temperature Bonding Technology for Packaging
Tadatomo Suga JIEP
16:00-16:30 The Role of IEEE-CPMT in the Evolution of Microelectronics Packaging Technologies
Ricky Shi-Wei Lee IEEE-CPMT Society
16:30-17:00 Panel Discussion
Voya Markovich Wun-Yan Chen Gu-Sung Kim Tadatomo Suga Ricky Shi-Wei Lee
IAAC Opening & Meeting
23 ▲
IAAC
Time: 13:30-15:30, Wednesday, October 23Topic: Designing Electronic Products for Sustainable ManufactureChair: Charles E . Bauer (TechLead Corp .)Co-Chair: Shen-Li Fu (IEEE CPMT-Taipei / ISU)
Remark: Special SessionRoom: 504 a+b+c
Time Topic Chairs and Panelist Affiliation
13:30-13:40 Opening Remarks Charles E . Bauer TechLead Corp .
Shen-Li Fu IEEE CPMT-Taipei / ISU
13:40-14:40 Topic: Designing Electronic Products for Sustainable Manufacture
processes)(3) Smart power & energy conservation(4) Process efficiency and waste management(5) The role of organic materials in packaging,
interconnection & assembly(6) Design efficiencies(7) Eco infrastructure in support of manufacturing operations(8) Supply chain management for conservation and efficiency(9) Components, partitioning & system architecture
Hajime Tomokage Fukuoka University
Kyong Wook Paik Korea AdvancedInstitute of Science andTechnology(KAIST)
Ricky Shi-Wei Lee IEEE-CPMT Society
Klaus-Dieter Lang Fraunhofer IZM
Ning Cheng Lee Indium Corporation
Joseph Fjelstad Verdant Electronics
14:40-15:30 Panel Discussion
Charles E . Bauer Shen-Li Fu
Hajime Tomokage Kyong Wook Paik Ricky Shi-Wei Lee Klaus-Dieter Lang Ning Cheng Lee Joseph Fjelstad
Panel Discussion
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24
Panel Discussion
ORAL PRESENTATIONSESSION 1: Advanced Packaging (SPIL)Time: 15:45-17:25, Wednesday, October 23Chair: Max Lu
Remark: Industrial SessionRoom: 504 a
Time Topic Lead Author
15:45-16:05 Advanced Package / Technology Integration of Interconnection – From OSAT Perspective
Albert Lan16:05-16:25 [Ag Wire] Interconnection Challenge in Wire Bonding - Ag alloy wire
Jensen Tsai 16:25-16:45 [SIP] SIP Techology of IOT and Wearable Application
Ja-Yang Chen16:45-17:05 [New Gen POP] Alternative PoP with Routable Substrate Interposer for stacking solution
Steven Lin17:05-17:25 [3D IC] The Innovative Integration of Advanced Package Technology
Max Lu
SESSION INTRODUCTION
IMPACT OPENINGTime: 10:00 am-10:20 am, Wednesday, October 23, 2013Room: R 504, 5F, Taipei Nangang Exhibition Center, Taipei, TaiwanSymposium Chair: Wun-Yan Chen (iMAPS-Taiwan)
25 ▲
Sessions
SESSION 2: IAAC- Global Business CouncilTime: 15:45-17:30, Wednesday, October 23Topic: More SiP or 3D ICChair: Wun-Yan Chen & Voya Markovich
Remark: IAACRoom: 504 b+c
Time Topic Chairs and Panelists Affiliation
15:45-15:55
~Welcome Remarks~
Wun-Yan Chen iMAPS-Taiwan
Voya Markovich iMAPS-USA
15:55-16:05
More SiP or 3D IC
Charles E . Bauer TechLead Corp .
16:05-16:15 Gu-Sung Kim Kangnam University
16:15-16:25 Y . H . Chen Unimicron
16:25-16:35 K . M . Chen UMC
16:35-16:45 Yasumitsu Orii IBM Japan Ltd .
16:45-17:30 Panel Discussion
Wun-Yan Chen Voya Markovich
Charles E . Bauer Gu-Sung Kim Y . H . Chen K . M . Chen Yasumitsu Orii
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26
SESSION 3: Advanced Packaging ITime: 15:45-17:45, Wednesday, October 23Chair: Shih-kang Lin (National Cheng Kung University)Co-Chair: Cheng-En Ho (Yuan Ze University )
Room: 503
TimePaperCode
Topic Lead Author Affiliation
15:45-16:15 INVITEDEU153-1
A New Generation of Power Packaging Using Embedding of Active Chip
Andreas Ostmann
Fraunhofer IZM
16:15-16:30 EU083-1 Non-Etching Adhesion Promoter for Dry Film for Semi-additive Manufacturing – Advanced Dry Film Pre-treatment
Rami Haidar Atotech Deutschland GmbH
16:30-16:45 TW034-1 Heat-Resistance Study of Thermal Release Tape
Chieh-Yuan Chi SPIL
16:45-17:00 TW064-3 A Miniature Crystal Package of Using DPC Technology
Vincent Wei Tong Hsing Electronic Industries
17:00-17:15 TW086-1☆
Electroplating of <111>-oriented nickel using <111>-orientated nano-twinned copper
Yi-Cheng Chu Materials Science and Engineering . National Chiao Tung University
17:15-17:30 TW124-1 Phase Evolution and Nanomechanical Properties of Intermetallic Compounds in Solid-Liquid Interdiffusion Bonding
Tsung-Yun Pai National Chung Hsing University
17:30-17:45 TW120-1 Fabrication of nearly void-free Cu3Sn microbumps for 3D IC packaging
Wei-Lan Chiu National Chiao Tung University
☆ Outstanding Paper Award Winner
27 ▲
Sessions
SESSION 4: Advanced and Emerging TechnologyTime: 15:45-18:00, Wednesday, October 23Chair: T .M . Lee (ITRI)Co-Chair: Jenn-Ming Song (National Chung Hsing University)
Room: 501
TimePaperCode
Topic Lead Author Affiliation
15:45-16:15 INVITEDUS123-1
FPC deformation and its implications for the high frequency applications
Qiang Gao
MFLEX
16:15-16:30 TW085-1☆
On the Mechanical Behaviors of ACF-typed Ultra-Thin-Chip-On-Flex Interconnect Technology Under Bonding Process and Bending Test
Chien-Hao Ma Feng Chia University
16:30-16:45 AS052-1 A Novel and Green Electroless Copper Andy Chow The Dow Chemical Company
16:45-17:00 TW145-1 Study of Interfacial Reactions between Cu Substrate and Lead-Free Solder with Low Solder Volume for 3D IC Integration Technology
Ting-Li Yang National Taiwan University
17:00-17:15 AS050-1 The Evolution of organic solderability preservative process in printed circuit board application
Kti Ho Tong Interconnect Technologies, Dow Electronic Materials
17:15-17:30 TW087-1 A Novel Through-Hole Filling Technology for Next Generation Organic Interposer Applications
Tao-Chi Liu Enthone
17:30-17:45 TW041-1☆
Cu Electroless Deposition by using Cu Nanoparticles as Catalysts for a Printed Circuit Board Metallization
Yi-Chun Chung National Chung Hsing University
17:45-18:00 TW122-1☆
Reactive Wetting of Molten Ga solder on Poly-crystalline, Single-crystalline and Pt-coated Cu Substrates
Yi-kai Kuo National Cheng Kung University
☆ Outstanding Paper Award Winner▲
28
SESSION 5: IP SessionTime: 15:45-18:00, Wednesday, October 23Theme: What Makes Good Innovations into Great IPs?Chair: Kwang-Lung Lin & Kuo-Ning Chiang
Remark: Special SessionRoom: 502
Time Topic Chairs and Panelist
15:45-15:50 Introduction Kwang-Lung Lin Kuo-Ning Chiang
15:50-16:10 U .S . patent system overview: (i) Unique US patent features in patent procurement and enforcement(ii) Trends of patent enforcement in US
Bing AiJohn Schnurer
16:10-16:30 Patent litigation before US federal courts: litigation procedures and case study John Schnurer
16:30-16:55 Patent litigation before US International Trade Commission (Section 337 investigation):ITC procedures and case study
John Schnurer
16:55-17:10 US post-grant proceedings as part of litigation defense strategy Bing Ai
17:10-17:20 Break17:20-18:00 Panel discussion and Q&A from the floor Bing Ai
John SchnurerBenjamin Wang
No Chairs & Panelists of IP Session Photo
Chair Kwang-Lung LinProfessor of Materials Science & Engineering, National Cheng Kung University (NCKU)Co-Chair of IAC (IMPACT)
Chair Kuo-Ning ChiangChair Professor of National Tsing Hua UniversityHonorary Chair of IMPACT Conference
1 Mr. John Schnurer is a patent litigation partner of Perkins Coie LLP and co-chair of the firm's Section 337 investigations practice. He litigates and tries cases in courts throughout the country, including Section 337 investigations before the United States International Trade Commission (ITC) including eight jury trials and eighteen bench trials, five of which were patent trials U.S. ITC. He is recognized as a premiere intellectual property strategist, particularly with respect to the development and execution of global patent litigation strategies . John also prepares provides strategic intellectual property counseling including advice on patent infringement, validity, re-examinations, and large portfolio due diligence studies, whether for acquisitions, licensing, or pre-suit purposes . He achieves optimum results by partnering with his clients to devise and execute customized legal strategies that are consistent with his clients' tactical and strategic business objectives . John represents Taiwanese companies in patent litigation before U .S . ITC and federal courts, including HTC, ASUS, Largan Precision, ATEN and Pegatron .
2 Dr. Bing Ai is a partner in the patent group at Perkins Coie LLPand is the co-chair of the firm's patent post-grant proceeding practice. Bing was a physicist before entering law practice . His practice emphasizes patent prosecution, patent counseling and strategy, patent portfolio management, freedom to operate analyses, patent validity and infringement issues, patent re-examinations and inter partes review (IPR) proceedings, patent due diligence and support for patent litigation, and patent due diligence for corporate financing, mergers and acquisitions. Bing practices in a wide range of technology fields, including electronics, semiconductors, wireless technologies, telecommunications, computer hardware, software, Internet-based technologies, medical devices, batteries and fuel cells, lasers and optics, and nanotechnology . Bing represents Taiwanese companies including HTC and Largan Precisionin post-grant proceedings in connection with patent litigation .
3 Benjamin Wang has been the general director of Technology Transfer Centre at Industrial Technology Research Institute since 2007 . Before that, he was the deputy general director at the centre from 2000 to 2007 . He has also acted as the director of the business programme, computer and communication laboratories at ITRI .
Mr . Wang holds a PhD in management of technology from National Chiao Tung University, Taiwan (2007), an MS in IP rights law from the Franklin Pierce Law Centre in the United States (1992) and an MBA from National Taiwan University Taiwan (1981) .
Mr . Wang has make contributions not only in advancing IP rights but also in managing business and marketing for more than 30 years . Mr . Wang was awarded “Innovative Model Promoter Award”, Award for National Industrial Innovation, Ministry of Economic Affairs (MOEA), Taiwan (2011), “Best Marketing Manager”, National Management Excellence Award, Chinese Professional Management Association, Taiwan (2008) and “Value-created Pioneer Award”, Ministry of Economic Affairs (MOEA), Taiwan (2006) .
29 ▲
Sessions
SESSION 6: ICEP Japan SessionTime: 10:30-12:20, Thursday, October 24Chair: Yasumitsu Orii
Remark: Special SessionRoom: 504 b+c
TimePaperCode
Topic Lead Author Affiliation
10:30-11:50 INVITEDAS168-1
Technical Review of ICEP 2013
Shintaro Yamamichi
Renesas Electronics Corporation
10:50-11:10 INVITEDAS163-1
Study on Surface Treatment Process Using VUV/O3 Treatment for Reduction of Au-Au Bonding Temperature
Jun Mizuno
Waseda University
11:10-11:30 INVITEDAS171-1
Advanced Micro Soldering Technology with Semiconductor device
Derek Daily
Senju Metal Industry Co ., Ltd
11:30-11:50 INVITEDAS167-1
A New Embedded Package Structure and Technology for Next Generation of WLP
Akio Katsumata
J-DEVICES CORPORATION
11:50-12:10 INVITEDAS169-1
Advanced Build-up Electrical Insulation Material for IC Packages
Koichi Shibayama
Sekisui Chemical Co . ltd .
12:10-12:20 Q&A
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30
SESSION 7: 3D Integration ITime: 10:30-12:30, Thursday, October 24Chair: Shin Hua Chao (ASE)Co-Chair: Tao-Chih Chang (ITRI)
Room: 504 a
TimePaperCode
Topic Lead Author Affiliation
10:30-11:00 INVITEDAS166-1
TSV Technology Solution for Advanced Packaging
Koukou Suu
ULVAC,Inc .,Japan
11:00-11:15 AS081-1☆
300 mm Wafer 3D Integration Technology using Hybrid Wafer Bonding Kazuyuki Hozawa Central Research
Laboratory, Hitachi, Ltd .
11:15-11:30 TW028-1☆
Effects of Overlaying Dielectric Layer and Its Local Geometry on TSV-Induced KOZ in 3D IC
PuShan Huang Chang Gung University
11:30-11:45 EU001-1 Thin Wafer Handling and Chip to Wafer Stacking Technologies
Pauzenberger GuumlFnter
EV Group EVG
11:45-12:00 TW030-1 Determination of the Equivalent Thermal Conductivities of a Through Glass Via TGV Structure Used for 3D IC Integration
Heng Chieh Chien Industrial Technology and Research Institute
12:00-12:15 TW105-1 Intermetallic Compound Growth Behavior during Multiple Reflows of Ni/SnAg/Ni and Cu/SnAg/Ni Microbumps in Three-Dimensional Integrated Circuits
Yuan-wei Chang Dept . of Materials Sci . & Eng ., National Chiao Tung Univ .
12:15-12:30 TW049-1 The 3-D Parallel Processor applied to Matrix Inversion
Karl Cheng Innotest Inc .
☆ Outstanding Paper Award Winner
31 ▲
Sessions
SESSION 8: Thermal Management ITime: 10:30-12:00, Thursday, October 24Chair: Chien-Yuh Yang (National Central University)Co-Chair: Shung-Wen Kang (Tamkang University)
Room: 503
TimePaperCode
Topic Lead Author Affiliation
10:30-11:00 INVITEDAS150-1
A THERMAL DESIGN APPROACH FOR NATURAL AIR COOLED ELECTRONIC EQUIPMENT CASINGS
Masaru Ishizuka
Toyama Prefectural University
11:00-11:15 AS093-1 Thermal Design Method of Printed Circuit Board with Measured Effective Thermal Conductivity
Daiji KondoToyama Prefectural University
11:15-11:30 TW099-1 Thermal Radiation Material for Electronic Devices Applications
Sha Yi-An Polytronics Technology Corp .
11:30-11:45 TW074-1☆
Interfacial Reactions in the Cu/In/Ni Sandwich Couples at 280°C
Yu-Hsiang Wang National Cheng Kung University Department of materials science and engineering
11:45-12:00 TW022-1 A Case Study of Thermoelectric Generator Application on Rotary Cement Furnace
Hsu Cheng-Ting Industrial Technology Research Institute
☆ Outstanding Paper Award Winner
▲
32
SESSION 9: Modeling, Simulation & Design ITime: 10:30-12:30, Thursday, October 24Chair: M . Y . Tsai (Chang Gung University)Co-Chair: Yu-Po Wang (SPIL)
Room: 501
TimePaperCode
Topic Lead Author Affiliation
10:30-11:00 INVITEDUS114-1
Power and Ground Co-referencing for High Speed 10-28Gbps Transceivers in FPGA and ASIC Devices
Hong Shi
Xilinx
11:00-11:15 TW146-1 Signaling Enabler in High-speed System Design by Using Hybrid Stack-up Printed Circuit Board
Thonas Su Intel Corporation
11:15-11:30 TW135-1 Analysis of LED Wire Bonding Process Using Arbitrary Lagrangian-Eulerian and Explicit Time Integration Methods
Kuo-Ning Chiang National Tsing Hua University
11:30-11:45 TW133-1 Analytical Description of the Out-of-Plane Equivalent Mechanical Properties of Through-Silicon Via Interposers
Sheng-Tsai Wu ITRI
11:45-12:00 TW038-1 A Novel Decoupling Capacitor for Power Integrity Application in High-Speed 3D-IC Package System
Robert Sung Siliconware Precision Industries Co ., Ltd .
12:00-12:15 TW053-1 A New Detection Method for the Onset of PCB Pad Cratering
Graver Chang Integrated Service Technology
12:15-12:30 TW137-1 Transition Behavior in Large Deflection of Elastically-Bossed Unsymmetrically Layered Plate under Initial Tension
Chun-Fu Chen Chung-Hua University
33 ▲
Sessions
SESSION 10: Green Materials & ProcessTime: 10:30-12:15, Thursday, October 24Chair: Jay Desai (MFLEX)Co-Chair: LC Chen (DuPont Taiwan Co ., Ltd)
Room: 502
TimePaperCode
Topic Lead Author Affiliation
10:30-11:00 INVITEDAS161-1
Why TBBPA in FR-4 Laminates is a Green Solution for Printed Circuit Boards?
Grace Han
Chemtura
11:00-11:15 TW023-1☆
Reliability Evaluation on ENEPIG, Ultrathin NiP, and EPIG Surface Finishes in Soldering Applications
Shih-Ju Wang Yuan Ze University
11:15-11:30 TW072-1☆
Effective retardation of Sn-58Bi/Cu interfacial reactions with minor Ga addition
Trong Lan Nguyen National Cheng Kung University
11:30-11:45 TW142-1 High Frequency Substrate Materials with Highly Thermal Resistance and Low Dielectric Properties
Feng-Po Tseng Industrial Technology Research Institute
11:45-12:00 TW098-1 A SIMPLE PRINTABLE ETCHANT FORMULATION FOR ETCHING OXIDIC,TRANSPARENT AND CONDUCTIVE LAYERS
Shin-Shin Wang Industrial Technology Research Institute, Material and Chemical Research Lab .
12:00-12:15 US154-1 A High Reliability, Stress-Free Electroless Copper Process for FPC, Polyimide and Rigid-Flex
William Bowerman OMG Electronic Chemicals, Inc .
☆ Outstanding Paper Award Winner
▲
34
SESSION 11: 3D IC ForumTime: 14:30-17:30, Thursday, October 24Chair: Shin-Puu Jeng (TSMC)
Remark: Speical SessionRoom: 504 b+c
Time Topic Chair and Panelists Affiliation
14:30-14:35 Opening Remarks Shin-Puu Jeng TSMC
14:35-14:55 Advanced 3D Waferlevel System in Package Technologies Klaus-Dieter Lang Fraunhofer IZM
14:55-15:15 3D IC Integration: A Foundry Perspective Vic, J .C . Lin TSMC
15:15-15:35 Technologies for Multi-chip Integration: Equipment perspective
16:00-16:15 TW060-1 IC-Package Co-design by Computational Thermographics
Jui-Hung Chien National Tsing Hua University
16:15-16:30 TW080-1 Design optimization for wafer level package reliability by using artificial neural network
Po Chen Lai National Cheng Kung University
16:30-16:45 TW018-1 Thermal and Thermo-Mechanical Simulations on High Power Diode Packaging for a Typical Power Adapter
Ben-Je Lwo National defense University
16:45-17:00 TW088-1 A New Edge Strength Evaluation Method and Apparatus for Flexible Brittle Material
Chih-Ming Shen ITRI/EOL
▲
38
SESSION 15: Test & QualityTime: 14:30-17:00, Thursday, October 24Chair: Jeffrey Lee (IST-Integrated Service Technology Inc .)Co-Chair: Jerry Huang (Tripod Technology Co .)
Room: 502
TimePaperCode
Topic Lead Author Affiliation
14:30-15:00 INVITEDUS172-1
Quality: Value and Cost
Herbert J . Neuhaus
Scimaxx Solution
15:00-15:15 TW025-1☆
Unusual IMC Growth in 3D-IC Solder Joints Cheng-En Ho Yuan Ze University
15:15-15:30 TW091-1☆
Temperature-dependent failure mechanism of SnAg solder joints with Cu under-bump-metallization after electromigration: experimentation and analysis
Chung Kuang Lin National Chiao Tung University
15:30-15:45 AS070-1 Remotely-Controlled Tensile Test of Copper-Cored Lead-Free Solder Joint in Liquid Using Permanent Magnet
11:20-11:45 TW165-1 Improving UL Certification of Laminates and PCBs
Carl Wang
UL
11:45-12:10 US155-1 Striking the Balance – Driving Increased Density and Cost Reduction in Printed Circuit Board Designs
Tim Swettlen
Intel
▲
40
SESSION 17: 3D Integration IITime: 10:30-12:15, Friday, October 25Chair: R . S . LEE (ITRI)Co-Chair: Chang-Chun Lee (Chung Yuan Christian University)
Room: 504 a
TimePaperCode
Topic Lead Author Affiliation
10:30-11:00 INVITEDTW064-1☆
Through-Ceramic Vias TCVs Interposer of Using Direct Plated Copper Technology for 2 .5DIC Packaging
Vincent Wei
Tong Hsing Electronic Industries
11:00-11:15 EU094-1 FABRICATION, ELECTRICAL CHARACTERIZATION AND RELIABILITY STUDY OF PARTIALLY ELECTROPLATED TAPERED COPPER THROUGH-SILICON VIAS
PRADEEP DIXIT VTT TECHNICAL RESEARCH CENTER OF FINLAND
11:15-11:30 TW139-1 Investigation of the process for Glass interposer
Ching-Kuan Lee Industrial Technology Research Institute
11:30-11:45 TW090-1 Wafer Bonding Type Selection for 3D IC Designs
Shih-Hsu Huang Chung Yuan Christian University
11:45-12:00 TW028-2 Strength Evaluation of Thin 3D-TSV Memory Chips by Pin-on-Elastic-Foundation Test
PuShan Huang Chang Gung University
12:00-12:15 TW090-2 Temperature Rise Minimization through Simultaneous Layer Assignment and Thermal Through-Silicon-Via Planning
Shih-Hsu Huang Chung Yuan Christian University
☆ Outstanding Paper Award Winner
41 ▲
Sessions
SESSION 18: LED & Thermal ManagementTime: 10:30-12:15, Friday, October 25Chair: Jen-Dong Hwang (TTMA) Co-Chair: Chien-Yuh Yang (National Central University)
Room: 503
TimePaperCode
Topic Lead Author Affiliation
10:30-11:00 INVITEDTW160-1
Application of Heat Transfer Enhanced Fins in Electronic Devices Cooling Systems
Chien-Yuh Yang
National Central University
11:00-11:15 EU156-1 Electro-Optical PCBs for Optical Interconnects in Data Centers
Marika Immonen TTM Technologies
11:15-11:30 AS101-1☆
Analysis of Hot Spot Temperature in Power Si MOSFET with Electro- thermal Analysis
Risako Kibushi Toyama Prefectural University
11:30-11:45 TW004-1 The Analysis of the Thermal Resistance Structure of LEDs by Measuring Its Transient Temperature Variation
Wei-Keng Lin Enginnering System Science Dept ., National Tsing-Hua Univ .
11:45-12:00 TW065-1 Implement of a Silicon-based LED Packaging Module with Temperature Sensor
Chingfu Tsou Department of Automatic Control Engineering, Feng Chia University
12:00-12:15 TW132-1 Thermal Design for High Power Arrayed LED Heat-Dissipating System
11:00-11:15 TW003-1 Simulations and Characterizations for Stress Reduction Designs in Wafer Level Chip Scale Packages
Ming-Che Hsieh STATS ChipPAC Taiwan
11:15-11:30 AS131-1 Fatigue strength around through hole in printed circuit board
Takahiro Kinoshita Toyama Prefectural University
11:30-11:45 TW149-1☆
On the Non-Polarity Effects of the Bi/Ni Interfaces under Current Stressing
Liu Yu-chen NCKU
11:45-12:00 TW048-1 Three Dimensional Compression Molding Simulation for Wafer Level Packaging
Chih-Chung Hsu National Tsing-Hua University
☆ Outstanding Paper Award Winner
43 ▲
Sessions
SESSION 20: HDI & EmbeddedTime: 10:30-12:00, Friday, October 25Chair: Eric Hsu (Nan Ya PCB Corp)Co-Chair: Anderson Cheng (ITEQ)
Room: 502
TimePaperCode
Topic Lead Author Affiliation
10:30-11:00 INVITEDUS113-1
Multi-island platform for realization of wearable electronics
Yung-Yu Hsu
MC10 Inc .
11:00-11:15 US046-1 Integrated Metallization System for High Density Interconnects and Modified Semi Additive processing
Kesheng Feng MacDermid
11:15-11:30 TW033-1☆
A Novel Cu Plating Formula for Filling Through Holes of a PCB
Jhih-Jyun Yan National Chung Hsing University
11:30-11:45 TW024-1 Investigation of Through Hole Filling by Electrolytic Cu Deposition Using Electron Backscatter Diffraction
Chia-Wei Fan Yuan Ze University
11:45-12:00 TW157-1 Advanced Thin Copper Electroplating Process for HDI Microvia Filling Application
Ming-Yao Yen The Dow Chemical Company
☆ Outstanding Paper Award Winner
▲
44
POSTER (PCB)
Time: 15:30-15:45, Wednesday, October 23Venue: 5F, Taipei Nangang Exhibition Center, Taipei, Taiwan
PaperCode
Topic Lead Author Affiliation
AS020-1☆
An efficient rough vacuum chlorinated separation method for recovery of indium from waste liquid crystal display panels
En Ma Shanghai Jiao Tong University
AS117-1 Design and Reliability Analysis of Voltage Reference Circuit in 180 nm CMOS Process
Yasuhiro Takahashi Gifu University
EU112-1 Advanced Via Filling for improved Within-Unit Distribution
Henning Hübner Atotech Deutschland GmbH
TW005-1 OPTICALLY-INDUCED DIELECTROPHORETIC TECHNOLOGY FOR PARTICLES MANIPULATION AND SEPARATION
Chen Hsiu-Hsiang Industrial Technology Research Institute
TW027-1 The Failure Investigation of The Polymer Ball Interconnect Under Board Level Bending Stress
Cheng-Chih Chen IST-Integrated Service Technology, Inc .
TW056-1 The Methodology to Monitor Gaseous Contamination in Data Centers
Dem Lee IST-Integrated Service Technology
TW059-1 Anisotropic grain growth and crack propagation in eutectic microstructure under cyclic temperature annealing in flip-chip SnPb composite solder joints
Yu-Chun Liang NCTU
TW063-1 When “Signal” meets “Temperature” Albert Chen Elite Material Co ., Ltd .
TW096-1 Investigation of Interfacial Reactions in the Sn/Fe-xNi Couple
Yi- Shan Li National Taiwan University of Science and Technology
TW100-1 Power density effect on the microstructures and thermoelectric properties of p-type Bi-Sb-Te nanocrystalline thin films deposited by RF sputtering
Chen Tai-Sheng ITRI
TW103-1☆
PROCESS FEASIBILITY OF A NOVEL DIELECTRIC MATERIAL IN A CHIP EMBEDDED, CORELESS AND ASYMMETRICALLY BUILT-UP STRUCTURE
Yu-wei Huang Industrial Technology Research Institute
TW111-1 The Investigation of the Inkjet Printing Metallization Technology on Flexible Substrate
Yan-Yu Nian National Defense University
TW116-1 The Inkjet Printing of Catalyst Pd Ink for Selective Metallization Apply to Product Antenna on PC/ABS Substrate
Po-Chiang Wang National Defense University
TW128-1 Surface Clean of Readily Oxidized Metals for Interconnections with Organic Acid Vapor
Shang-Kun Huang National Chung Hsing University
TW140-1 Electroless Nickel deposition on the hybrid polyimide Yi-Ling Lo Industrial Technology Research Institute
☆ Outstanding Paper Award Winner
45 ▲
Posters
POSTER (PACKAGING)
Time: 15:45-16:00, Thursday, October 24Venue: 5F, Taipei Nangang Exhibition Center, Taipei, Taiwan
PaperCode
Topic Lead Author Affiliation
AS051-1 Characterization and performance study of packaged micropump for drug delivery
Vinaya kumar K .B Indian institute of science
AS073-1 Packaging of Polyvinylidene fluoride nasal sensor for biomedical applications
Roopa Manjunatha Indian institute of science
EU156-2 Optical Backplane Demonstrator with 10Gbps Video Transmission Link on Printed Circuit Board Using Optical Waveguides
Qian Xia Shanghai University
TW006-1 Thermal Stability of Hydrogen Annealed Aluminum Doped Zinc Oxide Films Investigated by Thermal Desorption Spectroscopy
Shang-Chou Chang Kun Shan University
TW007-1 Parameters Optimization of Electroporation Chip for Gene Transfection
Yung-Chiang Chung Ming Chi University of Technology
TW009-1 Nugget Shape Control in Resistance Spot Welding P . S . Wei Department of Mechanical and Electro-Mechanical Engineering, National Sun Yat-Sen University
TW011-1 WiFi SiP Module Using IPD Rx Balun Applications Hin-Han Chuang Siliconware Precision Industries Co ., Ltd
TW031-1 Novel Assembly Framework of Bi-Layered Molding Materials for 3D-ICs Packaging
Lee Chang-Chun Department of Mechanical Engineering, Chung Yuan Christian University
TW035-1 Thermomigration of Ag in Pb-free SnAg solder joints Mulaine Shih National Tsing Hua University
TW042-1 Electrical Model Analysis and Measurement of TSV to TSV Coupling Capacitance
Yang Shiuan-hau Siliconware Precision Industries Co ., Ltd .
TW061-1 CU WIRE HAST FAIL MECHANISM INVESTIGATION FOR BGA PACKAGE
Chih Hung Chang NXP Semiconductors Taiwan
TW062-1 Cu wire Development for Thin QFN Package using Die Attach Film (DAF)
Ho-Chin Hsieh NXP
TW066-1☆
Interfacial reacions between pure tin and electroplated copper substrates fabricated using different formulas
Wu Je-Yi National Chung Hsing University
TW069-1 Film Over Wire (FOW) Selection for Copper Wire Application
Ming-Wei Lee NXP Semiconductors Taiwan
TW075-1 Formation of alternating interfacial layers in the Au-12Ge/Ni joints
Ming-yueh Tsai National Cheng Kung University
☆ Outstanding Paper Award Winner
▲
46
PaperCode
Topic Lead Author Affiliation
TW077-1 Interfacial reaction in Cu/Pb-free solders/Co couples during reflowing process
Shen Chang Lee Department of Engineering and System Science, National Tsing Hua University
TW078-1 Molded Underfill for Flip Chip Package Chen Yu-Kai National Cheng Kung University Department Of Mechanical Engineering
TW079-1 Study on thermal conductive BN/VGCF/polyimide resin composites
Chin Si-Yi Industrial Technology Research Institute
TW084-1 Cu Pillar Bump-on-Trace BoT Design for Ultra Low-K Packaging
Harold Wu United Microelectronics Corporation
TW084-2 Bill of Material and Geometry of FCBGA Impacts on Packaging Warpage
Harold Wu United Microelectronics Corporation
TW092-1 An Efficient and Effective Simulation Approach for Solder Joint Reliability Prediction of Through-Silicon-Via TSV 3D Integration
Lin Sheng-Chuen National Tsing Hua University
TW095-1 Effects of Annealing on Sn Whisker Formation: Role of Cu Alloy Seed Layer
Wahyu Diyatmika National Taiwan University of Science and Technology
TW097-1 TSV-less BSI-CIS Wafer-Level Package and Stacked CIS Module
Zhi-Cheng Hsiao Industrial Technology Research Institute
TW102-1 Reflow Heat Source Impact on IMC Formation of Micro Bump Interconnection for 3D Package
Yi-Chian Liao Siliconware Precision Industries Co ., Ltd .
TW106-1 Interfacial reactions in microbumps of Ni/SnAg/Cu with different SnAg thicknesses
Yi Sa Huang NCTU
TW107-1 UNDERFILL ADHESION ENHANCEMENT VIA OPTIMIZATION OF PLASMA TREATMENT FOR 3DIC
Chi Tung Yeh Siliconware Precision Industries Co ., Ltd .
TW110-1 The investigation of dielectric properties measurement method of packaging materials
Meng-Sheng Chen ITRI
TW115-1 Fabrication of Robust Polyaniline Thin Film Electrodes on the Surface of Elastomeric Polydimethylsiloxane for Polymeric MEMS Applications
Kuan-Hsun Li National Tsing Hua University
TW115-2 Investigating the Influence of Various Organosilanized Substrates and Dopant Species on the Properties of Transparent Polypyrrole Thin Films Deposited on Glass Surfaces
Kuan-Hsun Li National Tsing Hua University
Venue: 5F, Taipei Nangang Exhibition Center, Taipei, Taiwan
47 ▲
Posters
PaperCode
Topic Lead Author Affiliation
TW143-1 Warpage study of power module Wei Li Industrial Technology Research Institute
TW144-1 High Thermal Conductivity Underfill study for fine pitch Cu pillar bump
Huang Huei-Nuan SPIL
TW158-1 The Improvement of Thermoelectric Element and People’s Livelihood Applications
Kuen-Shan Jaw Taipei Chengshih University of Science and Technology
Venue: 5F, Taipei Nangang Exhibition Center, Taipei, Taiwan
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48
9th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT 2014)16th International Conference on Electronics Materials and Packaging (EMAP 2014)
Save your dates for Oct 22-24, 2014Taipei, Taiwan
Save your dates for Oct 22-24, 2014Taipei, Taiwan
IMPACT-EMAP 2014
1 6 t h I n t e r n a t i o n a l C o n f e r e n c e o nE l e c t r o n i c M a t e r i a l s a n d p a c k a g i n g
