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7/27/2019 5W Emitter Led Datasheet
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ProLight PG1N-5LXE5W Power LED
Technical Datasheet
Version: 1.0
Features? High Flux per LED
? Very long operating life(up to 100k hours)
? Available in White, Warm White, Green, Blue, Amber, Red-Orangeand Red
? Lambertian or Collimated Radiation Pattern
? More Energy Efficient than Incandescent and most Halogen lamps
? Low Voltage DC operated
? Cool beam, safe to the touch
? Instant light (less than 100ns)
? No UV
? Superior ESD protection
? Soldering methods: IR reflow soldering and Hand soldering
Typical Applications? Reading lights (car, bus, aircraft)
? Portable (flashlight, bicycle)
? Decorative
? Appliance
? Sign and Channel Letter
? Architectural Detail
? Cove Lighting
? Automotive Exterior (Stop-Tail-Turn, CHMSL, Mirror Side Repeat)
? LCD backlight
1
10 Melfort Avenue | Clydebank, G81 2HX | Tel. 0141 5625627 | Fax 0870 7621832 | www.led-bulbs.com
rolight 5W Emitter
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Mechanical Dimensions
2
Notes:
1. The cathode side of the device is denoted by a
hole in the lead frame.
2. Electrical insulation between the case and the
board is required-slug of device is not electrically
neutral. Do not electrically connect either the
anode or cathode to the slug.
3. Drawing not to scale.4. All dimensions are in millimeters.
5 .All dimendions without tolerances are for
reference only.
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Part Number Matrix
Color Emitter STAR Beam Pattern
White PG1N-5LWE PG1N-5LWS
Lambertian
Warm White PG1N-5LVE PG1N-5LVS
Green PG1N-5LGE PG1N-5LGS
Blue PG1N-5LBE PG1N-5LBS
Amber PG1N-5LAE PG1N-5LAS
Red-Orange PG1N-5LHE PG1N-5LHS
Red PG1N-5LRE PG1N-5LRS
Flux Characteristics at 700mA, Junction Temperature, Tj=25Color Minimum Luminous Flux (lm) Typical Luminous Flux (lm) Beam Pattern
White 67.2 116
Lambertian
Warm White 67.2 108
Green 67.2 120
Blue 18.1 40
Amber - 120
Red-Orange - 144
Red - 120
Optical Characteristics at 700mA, Junction Temperature, Tj=25Dominant Wavelength D Temperature
Peak Wavelength p Spectral Coefficient or
Color Temperature(CCT) Half-width (nm) Dominant Wavelength
Color Min. Typ. Max. 1/2 D/Tj (nm/)
White 4500K 5500K 10000K - -
Warm White 2850K 3300K 3800K - -
Green 520nm 530nm 550nm 35 0.04
Blue 460nm 470nm 490nm 25 0.04Amber 584.5nm 590nm 597nm 20 0.05
Red-Orange 610nm 617nm 620.5nm 20 0.05
Red 620.5nm 625nm 645nm 20 0.05
3
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Optical Characteristics at 700mA, Junction Temperature, Tj=25( Continued)
Total Included Angle Viewing Angle Typical Candela
Color Beam Pattern 0.9v (degree) 21/2 (degree) on Axis (cd)
White
Lambertian
160 140
Warm White 160 140
Green 160 140
Blue 160 140
Amber 160 140
Red-Orange 160 140
Red 160 140
Electr ical Characteristics at 700mA, Junction Temperature, Tj=25Temperature Thermal
Coefficient of Resistance
Forward Voltage Vf(V) Dynamic Vf(mV/) Junction to
Color Min. Typ. Max. Resistance() Vf/Tj Board(/W)
White 5.43 7.10 7.98 1.0 -4 8
Warm White 5.43 7.10 7.98 1.0 -4 8
Green 5.43 7.10 7.98 1.0 -4 8
Blue 5.43 7.10 7.98 1.0 -4 8Amber 3.75 4.40 6.20 2.4 -4 8
Red-Orange 3.75 4.40 6.20 2.4 -4 8
Red 3.75 4.40 6.20 2.4 -4 8
4
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Absolute Maximum RatingsParameter White/Warm White/Green/Blue Amber/Red-Orange/Red
DC Forward Current (mA) 700 770
Peak Pulsed Forward Current (mA) 1000 1100
Average Forward Current (mA) 700 700
ESD Sensitivity 16000V HBM
LED Junction Temperature () 135 120
Aluminum-core PCB Temperature() 105 105
Storage & Operating Temperature() -40 to +105 -40 to +105
Soldering Temperature() 260 for 5 seconds Max.
Photometric Luminous Flux Bin StructureBin Code Minimum Photometric Flux (lm) Maximum Photometric Flux (lm)
L 10.7 13.9
M 13.9 18.1
N 18.1 23.5P 23.5 30.6
Q 30.6 39.8
R 39.8 51.7
S 51.7 67.2
T 67.2 87.4
U 87.4 113.6
V 113.6 147.7
W 147.7 192.0
Tolerance on each Luminous Flux bin is 15%
Color Bins for AmberBin Code Minimum Dominant Wavelength (nm) Maximum Dominant Wavelength (nm)
1 584.5 587.0
2 587.0 589.5
4 589.5 592.0
6 592.0 594.5
7 594.5 597.0
Tolerance on each Color bin is 1nm
Color Bins for Red-OrangeBin Code Minimum Dominant Wavelength (nm) Maximum Dominant Wavelength (nm)
1 610.0 613.5
2 613.5 620.5
Tolerance on each Color bin is 1nm
5
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Color Bins for Red
Bin Code Minimum Dominant Wavelength (nm) Maximum Dominant Wavelength (nm)
2 613.5 620.5
4 620.5 631.0
5 631.0 645.0
Tolerance on each Color bin is 1nm
Color Bins for Blue
Bin Code Minimum Dominant Wavelength (nm) Maximum Dominant Wavelength (nm)
1 460 465
2 465 470
3 470 475
4 475 480
5 480 485
6 485 490
Tolerance on each Color bin is 1nm
Color Bins for Green
Bin Code Minimum Dominant Wavelength (nm) Maximum Dominant Wavelength (nm)
1 520 525
2 525 530
3 530 535
4 535 540
5 540 545
6 545 550
Tolerance on each Color bin is 1nm
Color Bins for White
Bin Code X YTyp. CCT
(K)Bin Code X Y
Typ. CCT
(K)
V0
0.346 0.359
5350 X0
0.316 0.333
67000.344 0.344 0.317 0.32
0.329 0.331 0.308 0.311
0.329 0.345 0.305 0.322
V1
0.367 0.4
5500 X1
0.329 0.369
63000.362 0.372 0.329 0.345
0.329 0.345 0.305 0.322
0.329 0.369 0.301 0.342
W0
0.329 0.345
6050 YA
0.308 0.311
80000.329 0.331 0.311 0.293
0.317 0.32 0.29 0.27
0.316 0.333 0.283 0.284
WA
0.329 0.331
6300 Y0
0.303 0.333
80000.33 0.31 0.308 0.311
0.311 0.293 0.283 0.284
0.308 0.311 0.274 0.301
Tolerance on each Color bin (x , y) is 0.01
6
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Color Bins for White
Color Bins for Warm White
Bin Code X YTyp. CCT
(K)Bin Code X Y
Typ. CCT
(K)
N0
0.438 0.412
2950 Q0
0.409 0.4
3370
0.429 0.394 0.402 0.382
0.444 0.399 0.416 0.3890.453 0.416 0.424 0.406
0.438 0.412 0.409 0.4
N1
0.454 0.446
2950 R0
0.392 0.391
3640
0.438 0.412 0.387 0.374
0.453 0.416 0.402 0.382
0.471 0.451 0.409 0.4
0.454 0.446 0.392 0.391
P0
0.424 0.406
3150 R1
0.402 0.423
3500
0.416 0.389 0.392 0.391
0.429 0.394 0.424 0.406
0.438 0.412 0.438 0.44
0.424 0.406 0.402 0.423
P1
0.438 0.44
3150 RA
0.387 0.374
3500
0.424 0.406 0.383 0.36
0.438 0.412 0.41 0.374
0.454 0.446 0.416 0.389
0.438 0.44 0.387 0.374
Tolerance on each Color bin (x , y) is 0.01
7
0.25
0.27
0.29
0.31
0.33
0.35
0.37
0.39
0.41
0.25 0.3 0.35 0.4
X
Y
Y0
V1
V0
YA
WA
X1
X0
W0
CCT 4500KCCT 5000KCCT 5500K
CCT 6000K
CCT 7000K
CCT 8000K
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Color Bins for Warm White
8
0.34
0.36
0.38
0.4
0.42
0.44
0.46
0.36 0.4 0.44 0.48
X
Y
R1
CCT 3250KCCT 3490K
CCT 3800K
CCT 3050K CCT 2850K
R0
N1
N0
RA
P1
Q0P0
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Wavelength Characterist ics, Tj=25
White Color Spectrum
Warm White Color Spectrum
9
0.0
0.2
0.4
0.6
0.8
1.0
400 450 500 550 600 650 700
Wavelength(nm)
RelativeSpectralPowe
rDistribution
Blue RedGreen
0
0.2
0.4
0.6
0.8
1
350 400 450 500 550 600 650 700 750 800 850
Wavelength(nm)
RelativeSpectralPower
Distribution
Figure 1a. Relative Intensity vs. Wavelength
Figure 1b. White Color Spectrum of Typical 5500K Part.
Red-
Orange
0
0.2
0.4
0.6
0.8
1
350 400 450 500 550 600 650 700 750 800 850
Wavelength(nm)
RelativeSpectral
Power
Distribution
Figure 1c. Warm White Color Spectrum of Typical 3300K
Part.
Amber
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Light Output Characteristics
10
50
60
70
80
90
100
110120
130
140
150
1 2 3 4 5 6 7 8
Junction Temperature ( )
RelativeLightOutp
ut(%)
.
Green Photometric
White Photometric
Blue Photometric
Figure 2a. Relative Light Output vs. Junction
Temperature
0
20
40
60
80
100
120140
160
180
200
1 2 3 4 5 6 7 8
Junction Temperature()
RelativeLightoutput(%
)
.
Red Photometric
Red-Orange Photometric
Figure 2b. Relative Light Output vs. Junction Temperature
-20 0 20 40 60 80 100 120
-20 0 20 40 60 80 100 120
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Forward Current Characterist ics, Tj=25
11
0
100
200
300
400500
600
700
800
0 0.5 1 1.5 2 2.5 3 3.5 4
VF-Forward Voltage(V)
IF-AverageForwardC
urrent(mA)
0
100
200
300
400500
600
700
800
0 0.5 1 1.5 2 2.5 3 3.5 4
VF-Forward Voltage(V)
IF-AverageForwardC
urrent(mA)
Fig 3a. Forward Current vs.
Forward Voltage for White, Warm
White, Blue and Green.
Fig 3b. Forward Current vs.
Forward Voltage for Amber, Red-
Orange and Red.
0
0.2
0.4
0.6
0.8
1
1.2
0 200 400 600 800
IF-Average Forward Current(mA)
Normalize
dRelativeLuminous
Flux
.
0
0.2
0.4
0.6
0.8
1
1.2
0 200 400 600 800
IF-Average Forward Current(mA)
NormalizedRelativeLuminous
Flux
.
Fig 4a. Relative Luminous Flux vs.
Forward Current for White, Warm
White, Blue and Green at Tj=25
maintained.
Fig 4b. Relative Luminous Flux
vs. Forward Current for Amber,
Red-Orange, Red at Tj=25
maintained.
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Current Derating Curves
12
0
100
200
300
400
500
600
700
800
0 25 50 75 100 125 150
Ta-Ambient Temperature ( )
IF-ForwardCurre
nt(mA)
0
100
200
300
400
500
600
700
800
0 25 50 75 100 125 150
Ta-Ambient Temperature ( )
IF-ForwardCu
rrent(mA)
Fig 5a. Maximum Forward Current vs.
Ambient Temperature. Derating based on
TjMAX=135 for White, Warm White, Blue
and Green.
RJ-A=20/W
RJ-A=20/W
RJ-A=15/W
RJ-A=10/W
RJ-A=10/W
RJ-A=15/W
Fig 5b. Maximum Forward Current vs. Ambient
Temperature. Derating based on TjMAX=120
forAmber, Red-Orange and Red.
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Typical Representative Spatial Radiation PatternLambertian Radiation Pattern
Recommended Soldering Pads
13
0
10
20
30
40
50
6070
80
90
100
-100 -80 -60 -40 -20 0 20 40 60 80 100
Angular Displacement(Degree)
RelativeIntensity(%)
Fig 6. Typical Representative Spatial Radiation Pattern for
White, Warm White, Blue, Green, Amber, Red-Orange andRed.
Fig 7. Recommended Solder pads dimension. Solder mask
is
also recommended to advoid short circuit while
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n
Recommend IR Reflow Condition
Reflow Soldering
Lead Solder Lead-free Solder
Pre-heat 120~150 180~200
Pre-heat time 120 sec. Max. 120 sec. Max.
Peak temperature 240 Max. 260 Max.Soldering time 10 sec. Max. 10 sec. Max.
Conditionrefer to temperature-
profile (A)
refer to temperature-
profile (B) (N2 reflow is
recommended.)
After reflow soldering rapid cooling should be avoided.
Temperature-prof ile ( Surface of MCPCB)
Occasionally there is a brightness decrease caused by the influence of heat or ambient
during air reflow. It is recommended that the User use the nitrogen reflow method.
Repairing should not be done after the LEDs have been soldered. When repairing is
double-head soldering iron should be used. It should be confirmed beforehand whether the
characteristics of the LEDs will or will not be damaged by repairing.
Reflow soldering should not be done more than two times.
When soldering, do not put stress on the LEDs during heating.
After soldering, do not warp the circuit board.
Manual Hand Soldering
For Prototype builds or small series production runs it possible to place and solder the emitters
It is recommended to hand solder the leads and slug with a solder tip temperature of 230'C for l
10 seconds. This profile maintains a junction temperature below the maximum of 120'C, avoidi
to the emitter or to the MCPCB dielectric layer. Damage to the epoxy layer can cause a short ci
the array.
14
2.5~5/sec.
2.5~5/sec.
Pre-heating
120~150
120sec.Max
60sec.Max.
Above 200
240Max.
10sec.Max.
60sec.Max.
Above 220
1~5/sec.
1~5/sec.
Pre-heating
180~200
120sec.Max.
260Max.
10sec.Max.
Figure 8a. Lead Solder Temperature Profile
Figure 8b. Lead-free Solder Temperature Profile
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Emitter Reel Packaging
15
Notes:
1. The emitters should be picked up by the body
(not the lens) during placement. The inner diameterof the pick-up collet should be greater than or
equal to 6.5 mm.
2. Drawing not to scale.
3. All dimensions are in millimeters.
4 .All dimendions without tolerances are for
reference only.