Advanced Packaging MATERIALS CHALLENGES & OPPORTUNITIES

Dr. ASHAY DANIDirector of MATERIALS Technology Development

ASSEMBLY TECHNOLOGY DEVELOPMENT, Intel Corporation

drivers• The World Is Becoming More And More Dependent On Data

• Transforming to a DATA-CENTRIC Infrastructure

• Move FASTER + Store MORE + Process EVERYTHING

• Advances In Systems Performance Require

• Small, Thin, Compact , High Bandwidth & Low Power architecture only available with

“Heterogeneous Integration” on Advanced Packaging

1. Scaling Packaging features to keep up with Moore’s law

2. Enable Heterogeneous integration to deliver higher functionality

with High Manufacturability, Quality & Reliability, optimal cost

Multi-Chip Packaging challenges

Improved Thermal Interface Materials (TIMs) and Interface

Control Needed for MCPs

Efficient ThermalsMCP Size Reduction

Improved materials for flow in tight spaces, tight KOZ, high reliability and

compatibility

SKL-Y20x16.5x0.91mm

…N

ext

g

en

Next gen

Room Temperature Reflow Temperature

Improved Solutions to maintain flat packages for Robust Manufacturing

Yields With High Reliability

Warpage occurs due to C.T.E.

Mismatch between Different Packaging

Materials

Material Handling &

Manufacturing

Die to substrate

Interconnect

Package to PCBInterconnect

Package Warpage

MATERIALS for HETEROGENEOUS PACKAGEMATERIALS Solution Space DRIVEN BY architecture, geometry and market segments

• Small & Thin Form Factor

• Interconnect annular space, KOZ

• Warpage control

• Enhanced Thermals

• Improved SMT

• Enable choice of packaging architectures

• High Manufacturability, quality & reliability

Drivers

• Focus areas: New Materials which Enable Scaling & Heterogeneous Packaging manufacturability & reliability

Materials

First Level Interconnect

Thermals

Ball Grid array

Second Level Interconnect

PACKAGE APPLicATION CHALLENGES MATERIALS SOLUTIONS• Improved Spray/Dip flux rheology, activity,

cleanability for fine pitch• Fine solder powder for tight solder paste print• NCF/NCP for manufacturability and reliability

• Solder paste jetting & Pin Dipping paste materials to meet scaling and KIZ/KOZ targets

• Solder paste powder size and loading critical to deliver rheology, activity and robust manufacturability & reliability

Warpage induced:

* Solder bump bridging (SBB)

* Non Contact Open (NCO)

* Non Wet Open (NWO)

• Low Temperature solders (LTS) BGA• Joint Reinforced Paste (JRP)/BLUF materials• Cu core solder ball controlled collapse• Improved SMT solder Paste for manufacturability

and reliability.

• Improved Solder Thermal Interface Materials• Improved STIM flux materials rheology, activity

for high manufacturability & reliability• Improved & compatible Polymer Thermal

Interface Materials for MCPDie1 Die2 Die3 Die4

Substrate

Z-Height

Variation

IHS

RTIM = (BLT0 + Z-height variat ion) / Keffect iveRTIM = BLT0 / Keffect ive

TIM

Key Challenge: Managing All The Attributes Involved in the Surface Mount Process to Achieve Acceptable Yields

Typical SLI Failure Modes

Leaded solderPeak Temp Range

Lead free solderPeak Temp Range

25C 150C 200C 260C

Pa

cka

ge

Wa

rpa

ge

Reflow Temperature

+

-Difficulties Compounded By Higher

Melting Temp Pb-Free Solders

Pa

cka

ge

Wa

rpa

ge

Silicon Thickness

Reducing Package Core Thickness

Package Warpage Worsens as Package Thickness is Reduced

Silicon

Package Core

Second Level Interconnect

Package Build Up

Solder Bridge Defect due to compression

Non-Contact/Non-Wet/Head-on-Pillow Defects due to

expansion

Universal Adoption of LTS can enable thin and light BGA designs

So

lde

r B

rid

ge

Ris

k

BGA Pitch

0

0.2

0.4

0.6

0.8

1

1.2

1.4

Op

en

Ris

k

Platform Z-height (PCB+BGA)

255 C255 C

190 C190 C

LOW TEMPERATURE SOLDERS

•Heterogeneous On-Package Integration is a Critical Enabler for the “Age of Data”…Challenges remain to enable small, thin, high density MCP interconnects, 3D stacking, and high bandwidth

• New Materials Technology Innovations based on structure-property fundamentals are needed that would address small & thin MCP warpage, improved MCP Thermals, improved SMT, high manufacturability and improved reliability

–Creative risk taking is needed to accelerate assembly materials and equipment supplier collaborations to develop out-of-box materials and process innovations