Midwest Express Center, Milwaukee, June 23-26 .- T_JlUFIN 2663, the &m&al-conference and exhi- square feet of state-of-the-art exhibit space. The bition of the American Electroplaters and- SUR/FIN Exhibit will be held in Halls C and D. Surface Finishers Society, will take place this Skywalks link the Midwest Express Center to the 1~e~~~~~-~~~~~~.~~~~~~~; c-&g-,. $/g@&&, Ju’ ri& 23 Hi&&i and Hyatt hotels, :~ to 26. There’will be an extensive conference program The Metal Finishing Suppliers. Association ..^. __.__ .Lw. .y...- _.* “‘> fd~,“_..~ and an exhibition with &%‘ I% organizations dis- (MFSAj will be --hosting their -‘annual party playing equipment, materials, and services for the Wednesday night, June 25, 7 to 10 p.m., at the metal finishing industry. There will also be a number- Milwaukee Public Museum. of courses offered and a full program of social events. The spouse/guest program (June 24-26) offers The Midwest Express Center is located in the interesting tours to the Milwaukee Art Museum, heart of downtown Milwaukee and has 188,695 Kohler Village, and Boerner’s Botanical Gardens.
Transcript
Midwest Express Center, Milwaukee, June 23-26
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T_JlUFIN 2663, the &m&al-conference and exhi- square feet of state-of-the-art exhibit space. The bition of the American Electroplaters and- SUR/FIN Exhibit will be held in Halls C and D. Surface Finishers Society, will take place this Skywalks link the Midwest Express Center to the
1 ~e~~~~~-~~~~~~.~~~~~~~; c-&g-,. $/g@&&, Ju’ri& 23 Hi&&i and Hyatt hotels, :~ to 26. There’will be an extensive conference program The Metal Finishing Suppliers. Association ..^. __._ _ .Lw. .y...- _.* “‘> fd~,“_ ..~ and an exhibition with &%‘I% organizations dis- (MFSAj will be --hosting their -‘annual party playing equipment, materials, and services for the Wednesday night, June 25, 7 to 10 p.m., at the metal finishing industry. There will also be a number- Milwaukee Public Museum. of courses offered and a full program of social events. The spouse/guest program (June 24-26) offers
The Midwest Express Center is located in the interesting tours to the Milwaukee Art Museum, heart of downtown Milwaukee and has 188,695 Kohler Village, and Boerner’s Botanical Gardens.
and microbubble agitation. Sulfuric, oxalic, and malonic acids are used as electrolytes. We want to experiment and study how the new electrolytes can replace the sulphuric, phosphoric, and chromic electrolytes. This implies researching on the new electrolytes for application on the food, precision mechanics, and aerospace industries. This work is done under the auspices of the CSIC (Spanish High Centre of Scientific Research), Centre of Study and New Technologies of the Polytechnic University of Barcelona, and Centre for the Enterprises and Environment-CEMA. The work will have a duration of approximately three years.
2 p.m.-Analog Circuit Simulator as a ~~e~~~~ Tool for AC Anodizing of Al Prof: Dr. Toshihiko Sato, Shibaura Technical University, Department of Material Engineering Tokyo Equivalent circuits of AC electrolysis and analog circuit simulators are introduced in general. Distorted wave- forms of alternating current during AC anodizing of Al
work in the commercial aircraft/aerospace and mili: tary areas over the past 43 years.
JIM. Runge, C.Y. Han, and H.H. Wang, Argonne National Laboratory, Argonne, Ill.; and A.J Pomis, The University of Illinois at Chicago, Chicago Commerial use of anodized aluminum oxide finishes is approaching 80 years in industry, It is a sturdy fixture in the minds of several industries as a means to impart corrosion and wear resistance, as well as decoration to the surface of aluminum components. Over this period of time, scientific research and analysis have shown us the anodizing process yields a finish with a predictable microstructure. Engineering process and formulation development has focused on finishing and finish per- formancechallenges of pretreatment, finish hardness, corrosion resistance, and coloring. Little innovation
are analyzed using the analog circuit simulator.
ie CQ~~~ of
Leonid M. &ml; Sanford Process According to the recommendations of Association, the preferred aluminum
step coloring are AAIXXX, AA3xxX, AA6m. Results of the followi sented: (I) To find whether th power supply used as the first step p
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Fred Dyer and Catherine W. Dyer, Industrial Instruments, Newport News, Vu. The Stressometer, first introduced by Joseph B. Kushner in 1954, measures the stress of a deposit plated onto a thin metal disk. Stress in the deposit results in a bending of the disk with the resulting displacement of the center of the disk directly pro- portional to the magnitude of the stress. Displacement was originally measured by using a liquid-filled chamber in contact with the disk and a vertical capillary tube. Modern sensors and elec- tronics have allowed disk bending caused by stress to be measured more accurately and easily. Data will be presented from an instrument modified to use an LVDT linear displacement transducer in place of the liquid-filled capillary.
Organizer & Session Chairman: Dr. Jude Runge, Argonne National Laboratory, Argonne, Ill.
~~~br~n~~- ~n~sc~le UXWS
Catherine Y. Han, Z.L. Xiao, H.H. Wang, G.A. -. Willing, U Geiser, U. Welp, W K. Kwok, S.D. Bader, and G.W. Crabtree, Materials Science Division, Argonne National Laboratory, Argonne, Ill. Porous anodic aluminum oxide (AAO) membranes have attracted significant interest during recent years because of the fact that AA0 can be made con- veniently and inexpensively, yet they are extremely useful in nanoscience studies. Pore diameter (5-300 nm), and pore-pore distance (25-500 nm) can be eas-
s ily controlled by varying the anodizing conditions. Adam Dynapower I Rapid Power Corp., Highly ordered, straight nanopores in hexagonally South Burlington, Vt. close-packed arrays with domain sizes of approxi- The presentation will detail the recent advances in mately 2.8 x 2.5 pm2 and aspect ratios as high as power supply control systems from improvements l,~O(?,~~a~ ‘be achieved. The nanopores within the on operator interfaces to the next generation of; f;:: &A~,$&nbranes are used as templates for fabricat-
layer with three areas. The closest to aluminum area has composition Alz+qO, with higher con- centration of aluminum ions. Above it there is pure dielectric: Al, Os-area. Area Al,O,+P close to electrolyte has higher concentration of oxygen ions. A weak (for example, boric) acid does not dissolve barrier layer. A strong (for example, sul- furic) acid finds a spot and dissolves barrier layer until the lowest area Al,+q03 surrounding the spot is reached and flooded with oxygen ions. These ions transform Al,+qO, into Al 20, that builds up a wall around the spot, forming a pore. Each spot is complemented equidistantly with six spots, building hexagonal cells with a pore in the center of each cell.
Yar-Ming Wang, Hong-Hsiang (Harry) Kuo, and Sheila Kia, Materials & Process Laboratory, GM R&D Center, Warren, Mich. The effects of alloying elements, microstructures, and coating thickness on the surface gloss of anodized aluminum panels were investigated. Three automotive aluminum alloys (AA5083, AA5657, and AA6111) were tested. The oxide
Significant -enhancement’ of the critical field in supercondu&ing- Pbnanowires and an abnormal magnetoresistance m-Ni magnetic: antidot arrays a.@ bhici. in the,& samples, The preparation, char- Aaron Pomis and Michael McNallan, Durham, N.C.
, _a&eriiation; ‘and~application of .AAO’ and various Surface and interfacial studies of as-cast, finish- nanowires, nanotubes, and nanoscale antidots will machined and anodized A380 die castings have been be- presented; Work at ANL is supported by the US performed in an effort to understand the effects of .DOEmES Materials Science under contra& W-31- various types of surface treatment. Comparative 109~tiNG-$B,...: ,- ‘. : metallurgical analyses of surfaces processed with .,
C+AC pro&ss can -7 VDC that creates a
forming a barrier
common and modified pretreatments identified ele- ments and phases preferentially attacked in the die- cast alloy. Comparison of conventional and modified anodic finishes was also performed. Combined results of these studies enabled recommendations to optimize the -finishing process for aluminum die castings.
% ,. .
Chairman: Dr. Sudarshan Lal, CEF, FCI Electronics, Etters, Pa.
Kivotaka Tsuii, Research and Development
on health and the environment. For example, the European Union has enacted a phase-out and com- esston Chairman: Fred Clay, P.E., plete ban on lead in electronic products by mid- CEF-4, AESF Fellow, Lee’s Summit, MO.
_ _, 2006. In view of this, the semiconductor industry is ~~~~g&tly~&$,$&~d t;o &$r &&&teri& &J rep&&
lead in its products including solder plating materi- als for integrated circuit packages. This paper presents the findings of a series of experiments by Jack MeCaskie and- N~colus iifessin, Shipley LLC,
-‘-. a’ maj~~-~-g~obal integrated-~ &vice manufa&,urep -to?:, fiiqortj- 2\/7, Jz&- :.: --’ “; i,-..F4zi_ <.+-_ :-- + _,,+ I , >. :- :.. .# ._ ,.,/ I/ evaluate various commercial lead-free plating The possibility of plating mineral-reinforced nylon alternatives including tin, tin-copper and tin-bis- for applications in automotive and plumbing ware <- ‘-muah ;pWod;cts-; Three ‘different- IC _packagelty&?; indust_iies.h& bee* -explored previously but..$ithout
(T8OP 48j-,PLCC32$ and -SOIC44) were used in enduring success or-wide market use..Mineral-filled both off line and in a production environment to nylon’s attractive physical properties of impact eva\luate -.sofde~~bility aspects _incl;aing. .pl&ing-- ‘i-‘- ~e&&_$,-- &$_& and &s@j. &&&& to drs+
I.. thickness, ionic impurityi morphology grade, solder process specialists*.to develop new, and. reliable,: whisker growth, solderability, (tests under steam- process sequences to promote metallization of this @e and. bake~~conditioiis), and lead pull tests”‘;of substrate-; Th7s.‘ipapV”+r deskriEe&.x $ .3G.& ‘.Gl~~titig“
mounted packages. Because no lead-free plating process for mineral-reinforced nylon substrates-that _ standards of quality were available at the time of contains no chromic acid salts in the etch step and
has a simple and- relitible sequence for producing high and stable adhesion values of metal films on the part surface. The cosmetic characteristics of the
the study, normal solder plating standards were used as a reference. Initial experiments revealed solderability issues (especially poor morphology grades and whiskering with both tin-bismuth and tin-copper materials). Tin plating looked the most promising material. Tin and tin-bismuth plating were further investigated in production processes to attempt to eliminate the initial quality issues, and to develop, fine-tune, and optimize the plating process. The extensive experiments of this study of lead-free plating have yielded a great amount of information pertaining to the different chemistries of the different plating types, have identified a number of production concerns, and suggest process parameters for tin and tin-bismuth plating types that make these materials viable replace- ments for tin-lead plating.
plated finish are acceptable for many applications, but some optimization of filler loading, distribution, and molding techniques are required for the widest range of market applications.
9:30 a.m.-Synergistic Effects of Copper Plating Additives & Filter Types for Coil Plating in Write Heads Dr: Saud Doss, Satinder Singh, Thomas E. Dinan, and Leonora Balbuena, Read-Rite Corp., Fremont, Calif The coils in write heads for disk drives are made of electroplated copper. These can be plated from acid copper baths with proprietary additives. Recently, plating studies done for damascene copper intercon- nects have shed light on specific chemicals used in copper plating additives. A Hull cell study of three copper additives has been done to assess their appli- cability for plating copper coils. The three additives studied were polyethylene glycol, Janus Green B, and 3:mercapto-propane-sulfonic acid. These coils
3.0 a. .-Nip - A Pb-free Lead Finish Donald Abbott, Doug Romm, and Mike Mitchell Nickel-palladium (NiPd) has been used as a semiconductor component lead finish since 1989. More than 50 billion devices are in the
supplanted NiPd a finish for peripher This paper will disc advantages-and disad lead finish relative to to NiPd.
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Dr: fiideytiki K anematsu, Suzuka National College of Technology2 Suzuka, Japan; Nobumitsu Hirai and Toshihiro Tan-aka, Osaka, University? Osaka, Japan; a& TaFz;eo- Oki; Fagtiyti. Uniuersity, Nagoy~a; Japan Pulse plating has been well known for homo- geneous,’ dense, and fine precipitation. In this study;we observed the-precipitation process for pulse plating topographically, by using Atomic Force microscopy (AFM) as well as SEM, Even though AFM is not always recog- nized-as- a suitable measure for the precipita- tion phenomenon- in aqueo-us solution, we applied:AFM to the qualitative observation. Different potential sequences for pulse plating were applied. to sulfate solution for tin plating. In situ precipitation behavior was observed as we’ll as the static one by AFM, and the results were compared with those by SEM.
scale. With the rise in temperature, an increase of internal crack of the electroplated Zn-Ni alloy coating was observed, and its corrosion resist- ante was deteriorated by the salt spray test.
atrman: Ralph Dixon, MacDermid, Inc., East Berlin, Pa.
:
When we survey the decorative electroplating industry in the U.S. today, we find a much different picture than that of 10 years ago. Through design engineering, environmental restrictions, or offshore competition, 50% of our market has disappeared, The major decorative plating market has narrowed to motorcycles, motorcycle components, plated plas- tic automotive trim, aluminum wheels, and pick-up truck bumpers.
S. S. Kruglikov Consultants, Moscow The composition of Zn-Ni coatings may be nonuni- form on a microscale. With the average Ni content of 12 to 14%, its total value may vary in the alloy deposited on a microrough surface from 4% on micro- peaks up to more than 20% in microrecesses. These variations result in appreciably decreased protective action of the coating. Bath composition and plating conditions are recommended that minimize local variations in the composition of the coatings and allow the improvement of their protective values.
Jae-Ryung Lee and Sang-Keol Noh, POSCO, Technical Research Laboratory, Jenman, Korea Zn-Ni alloy electroplated steel sheet has been
The good news is that, barring some unforeseen catastrophic event, plating in these industries should remain strong for the next 8 to 10 years. The quality required is higher than it ever was in the past. Custom plating is being produced on a high-production basis. Platers in both the U.S.. and Canada are meeting these demands.
Our program consists of suppliers to the indus- try (ranging from suppliers of automatic equip- ment to process troubleshooting) and the platers who are meeting these challenges. Our goal is that when we adjourn, everyone will have a bet- ter understanding of what the plating industry is facing, and a better knowledge of the help that is available, and an idea of how to achieve success in the future.
Within the last 10 years, Harley-Davidson Motor Company’s design philosophy has focused
__:
in the PCB industry is generallyyacknowledged. The technique is now also diffusing into different fields
Jorge Hidalgo, York Vehicle Operations, Harley-. of electrochemical application such as electroplat- Davidson Motor Co., York, Pa. ing, electroforming, or electrochemical machining
[the general metal finishing industry (GMF)]. This _. :-._ -- paper briefly describes the history of pulse and pulse reverse technology, focusing on the reasons for
1lnvestment .._ _-I -. the eminent success of PR technology in the PCB .- Lucien-.Dallai%, ‘Nap&, &~mi~gttin, ~Cbnn, .-~ :I ; ~. industry. The challenges are discussed regarding the 1 The finished produet demanded by the automotive introduction of the technique in the extremely diver-
and- motorcycle industries are driven by many faC- -~ sified GMF industry; particularly as related to tars such as quality in appearance and function, equipment %nd processes. Successful implementa- part traceabilityi and costs. The complexity of tion requires a thorough understanding of the appli-
.- today’s manufacturing operations coupled with the cation invoIved and the realization that PR process- strong enviromental requirements make the design es are not simple plug-and-play DC replacements. of a plating facility a coordination of many talents- This is illustrated by examples. sometimes handled by a complex alliance of multi- . ple suppliers. ~~~~~~~ ~~~~~~ JUNE 24 i
G-LTGM”l’ MiETALS ~~~~~~~~~ 111 10:30 a&.-Rack Design & ~a~~te~~~ee for Organizer: Dr. Jude Runge, Argonne~ National Decorative Automotive Ap Laboratory, Argonne, Ill. Donald Bauer, Associated Rack Corp., Vero Beach, Session Chairman: Drew Nosti; N>TFC, Fla. Bensalem, Pa. In the automobile and motorcycle industries, appearance sells. The most obvious attraction to a 1:30 p.m.-Updating Anodizing Equipment vehicle is the amount of chrome accessories that Drew Nosti, N>TEC, Bensalem, Pa. adorn the exteriors. This paper will cover design The parameters and criteria for purchasing equip-. engineering, materials, auxiliary anodes, mainte- ment for successful anodizing will be presented; nance, and selecting a supplier. The proper design keeping in mind the trends in this industry toward and maintenance of plating racks is “the right start cost savings, quality control improvements, and to a perfect finish.” waste minimization concerns. From chillers and rec-
tifiers to tank configuration and cathodes, well- I 8. ~l~~~t~~~ ~a~~~y tin designed equipment can add dollars of savings to
Jason Davey, Mefiag Division, Harleysville, Pa. parts produced through energy conservation, lower Platers for the automotive industry are required to reject rates, and process time cost reductions. adhere to higher quality standards than ever before. Critical process areas and correct equipment selec- Platers look to filter manufacturers to provide tion will be emphasized to assure a modern, smooth- equipment that allows them to meet quality stan- running, quality anodizing line. dards with a minimum of rejects. Filter manufac- turers have developed equipment that not only Sterility of l~~~~o~~e~i~al achieve better quality plating, but also minimize Aluminium A~~l~~d with operating costs associated with maintenance, ener- Diff~~~~~ ~~~t~e~trn~~ts gy consumption, and hazardous material disposal. Werner Pessenhofer, Bernhard Gollas and JO. The successful plater utilizes higher quality, highly : Bes&hti~d, ECHEM Center of Competence for efficient filtration to achieve bette Higher quality filtration serves to while a highly efficient filter pro savings in operating costs.
~~:3~ a.m.- eriodic ~~ve~~~ Op the General Metal ~~i~~~~~ Ind John Kelly, American Plating Power, Fla. The SUCCeSS of pulse reverse (PR)
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strengths of more than 50 N+m2can be achieved. In ing line. In manufacturing operations, several fac- addition, the long-time stability at elevated temper- tors, such as substrate, its surface preparation, atures was determined. After heat treatment at dif- micro-stresses in the deposits, nature of chemistry, ferent temperatures in the range of 350” C to 400” and postplating conditions, were examined and C, the formation of NiAl alloys was detected by X- their impact on whisker formation was evaluated. ray_ diffraction, The growth constants of the NiAi Applications in press-fit, plated-thru-holes (PTH), alloy was calculated for different temperatures from and solder to board are also discussed in this paper. SEM and EDX measurements.
2 p.riGAn ~~v~~t~g~~~~~ into M~t~~~~ for ~~~~~ ~~~~~i~i~g Tin ~igk~r Growth
s Fi ~~~~ Keith Whitlaw and Jeff Crosby, Shipley Europe Ltd., Ira J: Donovan, CEF-4, Mark J: Safarik, dnd Angela Derbyshire, England M_ Vawter, CEF-2, Burns & McDonnell, Kansas City, Previous work has shown that pure-tin and tin alloy MO, plating processes do not produce coatings with the Industrial and occupational hygiene and safety prac- same resistance to whiskering as tin/lead alloy elec- tices recommended for the light metals finishing trodeposits. In the earlier study, nickel barrier lay- industry are useful in achieving improved loss control,. em, deposit annealing; and thick coatings were- all reduced down time, and avoidance of negative public- shown to be beneficial~in~reducing whiskering. Pure ity, but also greater efficiency and compliance with tin deposits that possess X-ray diffraction patterns: regulatory requirements as well. This paper explores (i.e., the absence of small angles between adjacent some potential safety and health hazards encountered crystal planes) have also been shown to have mini- in a light metals finishing facility and the control mum whisker formation tendencies. This paper measures for prevention of injury and illness. An overview of industry consensus standards and regula- tory guidelines is provided, including a discussion of the “standard of care” to which the professional may be obligated. Furthermore, work practices and control measures utilized in state-of-the-art operations shall be presented.
presents the results of further laboratory trials examining the effect of deposit thickness of a new tin deposit on whiskering. The influence of the pre- treatment (etch depth, etch ratio, and etch type), posttreatment (time/temperature), and the use of undercoats (nickel and copper) will be reported. A recommendation for minimizing whisker formation will be presented.
William Copping, Precious Plate, Inc., Niagara Falls, N.Y;
carry out local (selective) plating even after storage of nickel-plated parts (as long as for 10 days) with- out any additional pretreatment. Nickel coating can be applied as an underlayer for gold and silver plat- ing for electronic components, such as a substrate tional chrome passivation technique. A mathematical for integrated circuits, contactors, and switches model will be presented that explains the processes at treated in reel-to-reel lines. Any corrosion in the the interface and estimates the thickness of the coat- pores of a local coating (if there are such pores) is ing as a function of pH and concentration of electroac- completely excluded. Also, there is no transfer of cor- tive species. The talk will also showcase the develop- rosion products of an underlayer onto the contacting ment of composite materials that are applicable in the surface (the local coating). Because of the combina- next generation of batteries, super capacitors, and fuel tion of high ductility and sufficient hardness, the Ni cell assemblies. With increasing miniaturization of coating can withstand deformation (bending, com- electronic devices, current focus is on developing pression, etc.). portable energy sources that can power these devices.
To this purpose, several nanostructured composites 3:30 based on transition metals (Co/Ni/Cu) and noble met-
als (Pt/Pd/Ru) loaded on powders were developed using electroless and pulse plating techniques. The
chievement talk will demonstrate that electrodeposition is an Award Recipient & William Blum Lecturer attractive method for controlling composite Organizer & Chairman: Dr. E. Jennings Taylor, microstructure and morphology, thus yielding superi- Faraday Technology, Inc., Clayton, Ohio or electrocatalytic properties.
,_~:.~~~~~~
_,;cY.& a&i . :.: ‘.::T{:, .
’ #g-j _, ,_ ,: ir
Professor B. N. Popov, Center of Electrochen$~~~ ZyIp: -: _: y: %&&&I&&, RE., CEFj Dr. E.J Taylor, and
Engineering, Department of Chemical Engineeczn&, $&&&&T~chno1ogy, Inc., Clayton, Ohio University of South Carolina, Columbia3 $j’.(J’,:“Y I?:::.~z::
.i~.._. ..A_ r
Tremendous potential exists for the’growth4 , .,. .~‘L metal finishing industry in this century th$$jj development of processes that are eithe~~~~~~~~~~~
It”~~~~.~:~,~i-~~~~~~~~~~~~~, mentally friendly or are applicable a~~~~~~~~~~~~ scale. This talk will discuss some of the$h&r
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parameters, and will report on the progress toward scale-up to a pilot-scale electroplating line for shock absorber rods and pump augers. Results may include bench-scale rotating rod electrode studies, and a controlled “Alpha” test of the Faradaic process in a pilot-scale manufactur- ing cell, using shock rods provided by a tier I automotive supplier. The project is being funded by the U.S. EPA and a commercial partner.
Dr. Patrick Benaben, J Popakul, and R. Goutte, Ecole Nationale Superieure des Mines de Saint-Etienne, Surface Treatment Laboratory, Saint-Etienne, France A new chemical method used to purify and recycle hexavalent chromium slutions (electro- plating and etching solutions) was described during AESF SUR/FIN in Chicago (Session R - June 26-29, 2000). This method allows extrac- tion of the almost metallic cations’after pre-
for high-quality decorative chrome plating on plastics is an on-going challenge. Suppliers today must provide quality to satisfy a wide variety of markets and customers. This can only be accom- plished with proper equipment and process con- trol. Characteristics, such as visual appearance., part performance standards, part design, material selection, processing parameters, equipment limi- tations, and cost, all attribute to the customer’s expectation and ultimate satisfaction. Can a sup- plier today meet these stringent requirements and still be profitable?
Michael Crary, MacDermid, Inc., Santa Ana, Calif: Plating of aluminum wheels for the automotive industry today requires that two to four layers of nickel bedeposited to achieve the corrosion protec-
(France) for the performance of a
of this technology. process is technically and
We will describe the AESF Project #106.
June 2003
lenges to the laboratory personnel who need to solve these problems. Discussions will center on the following: Defining the problem; identi- fying the problem on the parts; identifying the problem in the plating solutions; controlIing the problem; eliminating the problem; and pre- vention of the problem. Discussion will include the types -,of analysis, instrumentation used, and plating tests used to discover the source of the problems.
Co-orgunizers: Prof. Pie&o Cavallotti, Dip. Chimica Fisica Applicata, Politecnico de Milano, Milano, Italy , and Dr. Baumgartner, Forschungsinstitut fur Edelmetalle und Metallchemie, Schwabisch Gmiind, Germany Session Chairman: Prof. Cavallotti
a
Jim Wenske, AS&-C&E, Kohler Co., KohEer, Wis. With_ increasing customer demands for higher quality and lower cost, the need to obtain bet- ter control of production processes, through implementation of IS0 9001, is evident for U.S. companies to maintain competitive advan-
and J, Deconinck, Vrije Universiteit Brussel, Department of Electrical Engineering TWIETEC, Brussels, Belgium Mass transfer effects can drastically influence the behavior of plating reactors. In this paper, a simu- lation tool is presented to analyze the fluid flow in arbitrary shaped electrochemical reactors. Using
tage. This presentation will follow the journey to IS0 9001 certification in the Plating Department at the Kohler Company, a leading manufacturer of plumbing products.
this flow field, the local mass transfer at high Schmidt numbers, including effects of electrode
ire nd
reactions, will be calculated. Some examples t shown to illustrate the effects of the laminar a
Pure Tin, Lead Free, Tin Lead Alloys, Plating Processes Specialists
BATHS: ??Sulfonic Baths-Methane Sulfonic Acid Base ??Sulfuric Baths-Sulfuric Acid Base ??Fluoboric Baths-Fluoboric Acid Base
APPLICATIONS: ??Excellent for All Types of Reel-to-Reel Applications Including Plating of Preformed or Bandoliered Contacts, High Speed Wire and Strip Material
The incorporation of nanoparti- cles into a deposited metal layer can change the surface properties dramatically. In this work, small diamond particles were deposited with copper onto brass and gold substrates. As a method of depo- sition, pulse plating was used in order to obtain a nanocrystalline copper matrix. Several organic inhibitors were tested to decrease the average copper grain size. The influence of the diamond con- tent and the diamond particle size on the microhardness, the surface topography, and the con- ductivity of the resulting layer were investigated.
se ~~~~~~ Dr: Maria Ruiz Martinez, Ernst Pircher; Selma Hansal and Wolfgang E.G. Hansal, ECHEM Dr: S. Hansal, M. P6lzer, J Cuenin, and WE.G. Hansal, Kompetenzzentrum fiir Angewandte Elektroehemie ECHEM Kompetenzzentrum fiir Angewandte GmbH, Wiener Neustadt, Austria Elektroc’hemie GmbH, Wiener Neustadt, Austria Electropolishing for smoothing and polishing metal sur- Zino alloys’.as nickel-free, corrosion-inhibiting coat- faces is usually carried out using direct current. In this : .ings~~~?e~plated out of complete organic additive- work, the influence of pulsating current on the elec;A.’ -,~-~~~~~~eilij;at~ng~pulse, pulse reversed, and superim- tropolishing process of copper and copper alloy surfaceS.~,~.I’~~~~~~~~d~~~~~~~~~,.~~~ting techniques. The influence of L c,, _i;r2:.: ..?, ._. . FL ‘- 2. ‘_“_., ,, ; . ST. in an aqueous solution of phosphoric acid as electroIy&, ~,-~,~~~~th~~dlf%erent platmg parameters on the structure has been investigated. The rate of anodic leve~~~~~~~.~~~~~~~~~~~~~~.~~~~~_:~~~position of the deposits were evaluated in dependence on the average currentdensr~+;. .,~,~:s~vared~~~,~t~~~~,:iSlating techniques were com- i li il . _- ‘r: *_* :-: ‘:++.-. -.%*F. ..*;,___. >b.. -*- >..&..~_ li,~~~~~~,~~,~_.,=_ *“_ ~~_,_ .I;&*, .- -_.,_; _&! <. i .:, / i ,,, ty, the lengths of the anodic on-times and off-tirnes;$m-&‘j ~~:_~~~~~~~~~~~~~~~~~c~~.~~~~~~ bath composition inves- the electrolyte temperature. me characteriza~~~~.c,.~.,: ‘~~~~~~~~~~i; layer surfaces were charac_
,;. :.:‘i._.: _... ; _, polished surfaces was performed using envirorrnrental scanning electron microscopy (ESEM) and atomic force
,~ and the corro&& behavior &as tested using electro- Dr. U. Fastner; H. Pavetits, S. Hansal, and WE.G. ch&icil experiments and’ salt spray chamber tests. Hansal, ECHEM Kompetenzzentrum fiir Angewandte
Elektrochemie GmbH, Wiener Neustadt, Austria Silver- alloy layers are reported in literature as an improvement to pure silver layers concerning corro- sion, In this work, silver and silver tin alloys layers
-.- . . ..‘.~@CjYEM .Kompet&zzentrum fiir Angewandte were deposited on copper platelets using direct cur- !&, Wiener Neustadt, Austria. rent, pulse, and pulse reverse plating. The resulting
Pulse tid puls+r&erSe techniques have been used layers were characterized and compared to each
.~ : i taZode@%it inlert’ particles into-a nickel %a+ fro& other with. a special focus on microhardness and
ia W&&&h. The_itiflu~nce of bath’t&mper&ture and wear v v PI-I;. particle con+&ration in the electrolyte, agita: alloy composition were determined in dependence Iti:?,_, and pulse, plating pa&meters on. the total’ con- &I tlie plating parameters (such as pulse sequence, t&t- bf Yn&% partrcles witliin the -resuilting r&&l ba%h~c~~position). layer sind the surface properties have been investi-.
: ga&d_ $$ .pulse and pulse-reverse plating- tech- i- lU niquesr & comparison to results obtained using DC Orguni~er & Session Chairman: Dr. Joe Abys, has been made. The morphology of the layer surface Enthone Iyc./Cookson Electronics, Jersey City, N.J. and the particle content have been studied by an environmental scanning electron microscope (ESEM) combined with an EDX detector, AFM, and
resistance. The average arain size and the
low-angle X-ray analysis.
~1:3~ a.xm.-$iilver Using Pulse BeveJr
Steve Burling and Diane Markey, Metalor Xechnologies (UK) Ltd., and Giorgio Bolli, Meta2or Technologies, Italy; and Hirohiko Shiokawa, NECC, Japan Despite a sometimes bad press, sulfite gold systems
to get the results you want:
?? Filtration ?? Waste fluid recycling
?? Oil removal ?? Programmable controllers
0 Automated material handling
?? Multiple frequency ultrasonics
?? Analyze your application ACKSTONE (FREE application testing in our lab)
?? Specify an optimal cleaning process
?? Identify effective chemistry
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ification of the specification allow the dramatic reduc- terns are able to meet this requirement only at 16wk tion of the thickness of the precious metal deposits current densities. A new electrolytic NiP process- ha, without sacrifice of performance, while achieving con- been developed that allows operation at cur&W densi siderable cost saving. Additional cost saving can even ties of up to 35 ASD with a cathode effi&ncy of 60% be achieved by plating palladium alloys to replace The deposit was shown to have a high phosphorous con palladium. In this study, ultra-thin surface finishes of tent of > 11% over a wide CD range.
r acid concentrations. Reduce chemical adds. Eliminate bath bailouts. Reduce waste treatment. _““.*II._ .
process control. Steady tin and acid concentration. Reduced cost of operation.
Precision Process Equipment will be phased to demonstrate the economic advantages of TinSolve . . .
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istics of “stabilized” vs. “nonstabilized” systems will also be taken into consideration. We will also present perti- nent data detailing comparative studies on solderabili-
grain size as a function of ele&ically mediate leveling parameters, are presented for feature sizes in the range of 0.25 to 1 pm.-
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3 other precision parts, EDAX analyzers feature:
leasurements
to remove material, Faradaic etch- ing is based on electrical media- tion of the etching process. The proposed Faradaic etching process will allow etching of lines and spaces to below 10 pm in width and will etch anisotropically. Initial results will be discussed.
NMlENTAL CONCERNS
r & Session Chairman : Phil Platcow, C.I.H., SECOR International, Inc., Chestnut Hill, Mass.
~.m.-~~~~e & Sludge ~i~irni~a~io~ from Surface ~e~trn~~ts & Waste Recovery
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Research & I I
Dr. Xavier Albert Ventura, ‘- Laboratory of Etectrochemical Development, Integral Centre, Barcelona, Spain This work reviews zinc plating pr ~. ~. which alkalines and high-cyanide-content. bal being eliminated. Complete elimina expected in a three-year time or blue, yellow or dichromate, and zinc passi processes will be substituted with triv The total elimination of hexavaIent .c accomplished in five years, maxim&($ Copper and cyanide silver baths will be sub$ with noncyanide baths. Physical-chemic&;
n+ime material. Anodizing sludge, for example, is rsed~~$c#;~cement manufacturing. Acid zinc sludge ~ith?&$rexavalent chrome is used to make building ; :<*,<_;.>& ;*:*<< iii .,
tor’s sludge from surface treatment pro@ <; .**;+e alreadv used bv different industries as bv&%
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Co-organizers: Melissa Klingenberg, Concurrent 10 a.m.-Spill Response Martha S. Martin, CEF-4, Delta Chemicals & Equipment Inc., Indianapolis Spills happen all too often in industry. Responses
Technologies Corp., Johnstown, Pa., and Francisco Gonzalez, Integran Technologies Inc., Toronto, Session Chairman: Melissa Klingenberg
that are manageable by the worker who uses a 9 a.m.-Nanotechnology Opportunities for particular chemical will be addressed in this Electroplating Industries paper. A simple cross reference table can be G. Palumbo, I? Gonzalez, and K. Tomantschger, developed to aid in spill response. Commonly Integran Technologies Inc., Toronto, and U Erb & used industry chemicals are included in an exam- K.T. Au&, Department of Materials Science and ple table. The table will show requirements for Engineering, University of Toronto, Toronto PPE, the hazardous byproducts that result from Nanotechnology is an exciting new field that combining incompatible chemicals and proper deals with the design of extremely small struc- disposal of the spilled material. In addition, an tures having critical length dimensions on the overview of the regulations driving spill response order of a few manometers. Because of the broad will be briefly discussed. field of potential applications, ranging from tiny
lo:30 a.m.-R&cling Used rinse Water Usin,p Reverse OsmLsis & Stal ndard (Iron-phos
The powder coating industry demanc ~~~~spr~~~~~.coverage in the media, in particular i216’~~n.~;-thi-~~e~ent announcements of substan- 2:::::; ~.,<! s J
&u@ent-sponsored nanotechnology ini- $~c&ntries around the world. This &&&.: advances in the field of ,:I i~~~~~~~alsyproduced by electrod-&_;
robots and computers to tissue engineering and completely new materials, this technology has not. only captured the attention of researchers
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Simultaneously, there is also a need to redu total volume of wastewater from the n facility. As companies begin to find oui their waters can be reused int them and then repurifying the ing that the process involved is so sir
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South Carolina Columbia, S.C. In the current work, a new Zn-Ni plating process was developed that offers a unique way of controlling the Zn-Ni ratio. Nanostructured Zn-Ni alloys are electrodeposited by direct and pulse current from alkaline sulfate electrolytes in the presence of additives and complet- ing agents. The ratio of the zinc and nickel was effectively con- trolled by varying the concentra- tion of the electroactive species and operating parameters. The new electrodeposited Zn-Ni alloy has an increased content of nickel as compared to the conventional Zn-Ni alloy, The increase in the nickel content accounts for the
Nifec 9000 - Plates at a fast 0.8-1.2 mls/hour,
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Exceptional hardnesses as plated, with mid to low
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tre presented in this work. The capabilities of the elec- trolytic plasma to polish and modify the surface of tita- nium alloys are demonstrated. The EPP method is based on the chemical and physical processes occurring at the electrode surface immersed in a low-concentra- tion nonacid electrolyte, during applying the direct cur- rent voltage in the range of 100 to 600 V. Chemical solu-
Basker Veeraragtian, Swaminathal? Kumaraguru, Bala Haran, and Branko Popov, Center for Electrochemical Engineering, Department of Chemical Engineering University of South Carolina, Columbia, S.C. The most promising alternative to Cd coating for corrosion protection of steel is Zn and its alloys, Zn-
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Ni; in particular. However, deposition of these alloys is anomalous and hence they exhibit high rate of dissolution in corrosive media. A novel nanostruc- tur’ed Ni-Zn-P alloy with increased Ni content was d&eloped by electroless process as a possible &pIatiement for Cd coatings. The operating parame- tei+s, such as the concentration of the electroactive species, the pH, temperature, and the concentration
-of the reducing agent, were optimized. Corrosion studies revealed a four-times increase in corrosion rtisisttince’of the deposit as compared to cadmium, while- providing- sacrificial protection to steel. Also, th& mechanical properties of the developed coating were seen to be comparable to that of Cd, thus making it a suitable alternative to Cd coatings.
Session organizer: European Academy of Surface Technology Co-organizers: Prof. Pietro Cavallotti, Dip. Chimica Fisica Applicata, Politecnico de M&no, M&no, Italy, and Dr. Baumgktner, Forschungsinstitut fiir Edelmetalle und Metallchemie, Schwgbisch Gmiind, Germany
Session Chairman: Dr. Wolfgang Paatsch, Bundesanstalt fiir Materiaforschung und-priifung (BAM), Berlin
S. Frc~nz. Profesor I? L. Cavallotti, and M. Bestetti, :a, Materiali, Ingegneria Chimica “Giulio
klilano, Italv, and K Sirtori and
with strong hcp [OO.ll P. 0. show perpendicular magnetic anisotropy; those with mixed orientation __ _ _ .__ __
P.O. have parallel magnetic anisotropy. The effect cobalt and platinum interraction on the ferroma,
are magnetically isotropic; and those with Ill.01 of g-
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neti; behavior of the electrodeposited alloys was investigated by means of X-ray photoelectron spec- troscopy.
of corrosion testing is to simulate and Thebasicidea _~ _. ~.~ u accelerate the corrosion performance of a component in service by enhancing the corrosion test parameters. By this way the corrosion mechanism may change and fur- ther on the test itself may not be suitable for the system under test. This is partly valid for the neutral salt spray test, widely used in practice, but which always takes too much time. The stratem to overcome this dilemma will -------a -- -
no longer be to simulate and accelerate natural corro- sion processes but to switch over to other, especially combined, electrochemical techniques where the parameters and, therefore, the corrosion reaction itself can be fixed easily. For long-term corrosion assessment, however, the correlation between the electrochemical data and the actual corrosion behavior in service has to be evaluated in a first step by help of the artificial cor- rosion climate tests. This can be possible by combining the salt spray test with optical and electrical tech- niques, reducing the test duration, and increasing its reproducibility and accuracy
?rofessor Per Mollel; S. Martin Lin,dherg and S. Peter Paulsen, Department of Manufacturing Engineering and Management (Materials Technology), The Technical University of Denmark, Lyngby Denmark Potentiostatic experiments have been made in ternary plating baths at varying temperatures and pH values with the purpose of electrodepositing the solar cell material, CuInSez, The influence on the deposit of sev- eral complexing agents has been investigated. Heat treatment in Ar atmosphere at 400°C was applied and XRD measurements were carried out to verify the for- mation of the chalcopyrite structure of CuInSes, Galvanostatic experiments were performed from bina- ry baths to form Cus-xSe and In,Se,, which can be used as precursors in the formation of CuInSe2. The plating systems were studied.
Nanocrystallization and strain recovery of ACD Ni- P during microindentation creep tests under con- stant load are investigated. Stress-strain curves with dwell times between q and 60 set are obtained and loads in the range of 1 to 1OOmN are applied for 60 set during creep tests. Under constant load, ACD Ni-P is characterized by the recovery of the pene- tration depth with time. The transition with heat treatment from amorphous to crystalline Ni-P is related to the dcrease of the penetration depth. An evolution and reorganization of the local microstruc- ture are suggested to explain the starin recovery under constant load. Ni-P films are characterized by XPS angle resolved technique before and after sput- tering. The energy of the Ni maximum peak in the valence band of Ni90-PlO corresponds to that of metallic nickel, with binding energy 0.75 eV. No detectable difference was found between the binding energy of nickel in the metallic state and the Ni-P coating, showing a similar chemical state for nickel in both conditions.
Dr. Andreas Zielonka, Forschungsinstitut fur Edel;;_,etaile and Metallche,mie, Schwtibisc?~ Gmiind (FEM), Schwabisch Gmiind, Gemany, and Ivan Krastev, Institute of Physical Chemistry, Bulgarian Academy of Sciences, Sofia, Buigartw Silver and silver alioys are an important maieriai for electronic compon~& especially for con_ni‘:&or upplica tions. The influence of the electrodeposition conditions onto the formation of the composiiionally modulated silver-antimony-alloys and their properties, such as internal stress, microhardness, roughness, riectricwi contact resistance, wear resistance, and the plug-in force, was investigated. By the application of current pulses with different ampitude and duration, a change of the thickness of the deposited sublayers and the properties of the layer system can be achieved. This presentation gives an introduction into the principles of the deposition of multilayer systems and describes the
chloride barrel plating baths. Barrel platers can realize significant productivity gains by modifying the parameters of a zinc chloride plating solution. This new chemistry also produces positive improve- ments to the properties of the zinc deposit. This paper will explore several real-world examples of this new chemistry in action. Necessary line modifi- cations will be defined and the economic benefits of running this type of chemistry will be presented.
Dr. Eric Vignola and Richard Menini, Industrial Materials Institute, NRC, Boucherville, Quebec, Canada; and George Petrescu and Lucian Gurban, Ultraspee Finishing, Inc., Ville St-Laurent, Quebec, Canada Due to hazards associated with chemicals used in cad- mium and cyanide processes, replacement of cadmium coatings by Zn-Ni alloys for corrosion resistance has led to numerous studies. Optimal corrosion resistance has been reported for Zn alloys containing 5 to 15% in Ni, depending on the process. Even though the benefits of zinc-nickel electroplates are well documented, influence of solution contamination has not been addressed. This
materials. This paper focuses on several commercial or near-commercial zinc alloy and zinc-containing coatings that may provide a satisfactory alternative that meets the three performance criteria listed above. Emphasis is placed on coatings that will not cause hydrogen embrittlement of high-strength steel substrates. The results of thickness, adhesion, lubricity, corrosion resistance, and hydrogen embrit- tlement screening tests are presented and compared to cadmium as a control and ion-vapor-deposited aluminum, one of the other possible alternatives, as a benchmark.
Hideyuki Kanematsu, Tatsumasa Kobayashi, and Noriyuki Wada, Suzuka National College of Technology? Suzuka, Japan; and Takeo Oki, Nagoya
paper reports artificial aging of an alkaline Zn-Ni plat- .‘-’ Un<v~q@y, Nagoya, Japan
ing bath with Pb, Cr. and Cu and its detrimental effects S+~j $#y .film has been investigated as a substi- We for, chromium plating. Any process relating to it
~s$_&&zed onI& aIlov electrodeposition, however, ”
onadhesion, throwmg power, and, to a 1 corrosion resistance.
38
&$&? v&‘very hard to find the best depo: &&& @&the other hand, we have devel-
scale production; and a fully automatic system for the control and delivery of zinc concentrate, alkalin- ity as well as additives, with the full parameters’ documentation. The total concept, used usccessfully at various installations, provides applicators with constant quality, s ;upported by documented data.
Co-orgunizers:, Melissa Klingenberg, Concurrent Technologies Corp., Johnstown, Pa., and Francisco Gonzalez, Integran Technologies Inc., Toronto Session Chairman: Francisco Gonzalez
corrosion test was done by cyclic voltammetry, main- iy, The results for Sn-Ni alloy films were compared with other conventional plating films (such as chromium plating, etc.).
Dr: Pat?icia Preikschat, SurTec GmbH, iwingenberg, Germany ~.- Alkaline cyanide-free zinc continues to gain in pop- ularity because of its superior metal distribution. Problems typically associated with the process, how- ever, include blistering, anode passivation, and dis- colored chromate layers. These problems demand careful control of several parameters, often interre- lated variables. This paper discusses an integrated concept that controls the factors affecting bath per- form&e and finishing quality through newly ion- ceived critical process elements: True inert anode design to prevent metallic contamination, improve current distribution, and reduce consumption of organic additives; small-size zinc generators designed with catalytically coated baskets for accel- erated dissolution of zinc for uninterupted large-
Johnstown, &a..; and Dx E. Brooman and ‘1 A. Nagus Air Force Research Laboratory CMLSC)), W&h&Patterson Air Force Base, Ohio As part of an effort to evaluate alternatives to elec-
ng ‘ed IO-
troplated hexavalent chromium coatings, screeni tests were performed on numerous nanostructur coatings or amorphous coatings containing nar
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which included adhesion, thickness analysis, hard- ness, and abrasive wear resistance. The results suggested that all of the ENi-P, ENi-Co-P, and ECo-P processes with occluded diamond particles have the potential to impart the required adhe- sion, hardness, and tribological properties, while
_ -_ _---- _ wear resistance. Other factors, such as ductility and the ratio of surface hardness to elastic properties, also play important roles. A comparison between wear data obtained on numerous nanocrystalline coatings for two different abrading wheels (CS- I 0 and CS- 17) is also presented.
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nitrate solution in a flat was optimized in the range of 8 to under such electrochemical condition trodeposited template was characterized by s ning electron microscopy (SEM) and energy persive spectroscopy (EDS). X-ray photoelec._ _~_ spectroscopy (XPS) study confirmed that the deposited nanoparticles were of metallic palladi- urn. High-resolution transmission electron microscopy (HRTEM) investigation revealed that Pd-nano-particles consisted of nanocrystallitesin the size range of 5 to 10 nm.
Organizer & Session Chairman: David Ku,
ss fluids prior to repair. In order to minimize downtime and address accessibility issues, a proprietary electrodepo- sition process has been developed that applies an OD reinforcement to degraded sections of pipe. A fully bonded nanocrystalline microal- loy is produced, such as previously utilized in the sleeve repair of the ID of nuclear steam gen- erator tubing. This nano-material provides supe- rior mechanical properties and thus allows for design/operating load conditions to be accommo- dated with significantly less material build-up than would normally be required if using a con- ventional material. In this presentation an overview of the OD niping repair technology will be presented and discussed. -
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information to advance the practice of electropol- workpiece by conversion of the metal to its ions ishing among its members. This paper is intended resulting from the flow of an electric current. This to review the state of the art as last reported and is one of the applications of electrochemistry dis- to recommend a direction for continued study of covered by Michael Faraday in the early 1800s. the process. The paper will focus on modern issues The principle of electrochemical decomposition related to electropolishing of stainless steels and was not employed as a manufacturing process
tintil the mid-1900s. The most notable early appli- cation was machining of advanced aerospace materials. Since then, there have been many new applications and process innovations that have lead to broad implementation of the technology. Intrinsic process benefits, such as very fast removal rates, stress-free results, complex geome- try machining, and nonconsumed tooling have added to the popularity of electrolytic machining. This paper will include four aspects of this tech- nology: selective burr removal and edge machin- ing, surface finishing improvement, volumetric machining, and electrolytic rifling.
3: Waltace, Faraday Technology. Inc., Clayton, Ohio; and I: Lievestro, Sermatech Mfg. Group, Cincinnati This paper will present an electrically mediated edge and surface finishing process for industrial parts. Electrical mediation controls the electro- chemical surface finishing process through adjustment of parameters such as on-time and peak current or voltage of the electric field. The advantages of this approach over conventional chemically mediated electrochemical finishing include higher efficiency, the use of environmen- tally benign electrolytes, and control of oxide film formation. Results will be presented for edge and surface finishing of passive alloys such as titani- um. Parts that will be discussed may include medical parts (including staples) as well as spe- cialized finishing of golf club heads.
Rich Taufer, Vectron, Elyria, Ohio Deburring is an ever increasing and important consideration relating to metal cutting and metal removal operations. The electro-chemical debur- ring process has proven to be an excellent process in accomplishing reliable and consistent burr removal on a wide variety of applications. Electrochemical deburring can be used on all :: electrically conductive engineering materials;;.:., : The process can easily be adapted to +eburringl:-:=‘; simple,as well as complex and: delicate clos~~t&$&~ erance pa&?. Described are practicaf and &&$f&<&$ applications of the electrochemical deb~~~~&$~~-~~~ process including tooling considerations;~~-~~~~~~~~~ and limitations. .:- _._ ;.:‘. .: :..._ I_ ,~. ,_ i a,. _--,.; ;
