An Overview of Soft-Lithographies for Materials Patterning and Device
Fabrication
Will Childs, Keon Lee, Svetlana Mitrovski, Lindsay Elliott, John Rogers, and Ralph Nuzzo
University of Illinois at Urbana-ChampaignFrederick Seitz Materials Research Laboratory
Department of ChemistryDepartment of Materials Science and Engineering
http://www-306.ibm.com/chips/gallery/www.just2good.co.uk/ cpuSilicon.htm
The “Si Standard” for Materials Patterning: Photolithography
WaferWith Photoresist
Pattern Copied
Lens
Photomask
Light
p M O S n a n o - t r a n s i s t o rp M O S n a n o - t r a n s i s t o r
Intel: 30 nm
Nanoelectronics: Materials and Manufacturing Challenges
Bell past and future(?)
Photolithography: It always wins!
Immersion Lithography: 65 nm using 193 nm ArF(limit ~35 nm)
{Resolution ~ (Wavelength/NA); NA = n x sinθ}
Photoresists: As Good as Organic Chemistry Gets!There are so many choices (some of my favorites).
Amplified Resists SU-8: the Monster of MEMS(many variants)
Nanofabrication: Molecular Imprints
Step and Flash
Soft Lithography: Materials Patterning via Physical Contact/Mass Transfer
-[Si(CH3)2-O]-n
The Core Material of Soft Lithography
Near Field Phase-shift Photolithography
Rogers, J. A.; Paul, K. E.; Jackman, R. J., Whitesides, G. M. Appl. Phys. Lett. 1997, 70, 2658.
head group
carbon chainsulfur
2-3
nm
The “Au Standard” for Materials Assembly: Self-Assembled Monolayers (SAMs)
1 cm
Image of Gold Surface Patterned withHydrophobic and Hydrophilic SAMs
XX X
X
xx
xx
SSS
SS
S
S
S
STM Image of a SAM
1 cm
Image of Gold Surface Patterned withHydrophobic and Hydrophilic SAMs
1 cm1 cm
Image of Gold Surface Patterned withHydrophobic and Hydrophilic SAMs
Self-Assembled Monolayers (SAMs): Organic Materials Surface Chemistry
Self-Assembling Monolayers (SAMs)
Laibinis, Paul E.; Whitesides,G. M.; et al. J. Am. Chem. Soc. 1991, 113, 152.
Self-Assembled Monolayers (SAMs): an Ink
Xia, Y.; Whitesides, G. M. Angew. Chem., Int. Ed. 1998, 37, 550. Michel, B.; Bernard, A., et al. IBM J. Res. & Dev. 2001, 45, 697.
Soft Lithography: Masters
Patterning TechniquesE-Beam FIB (Focused Ion Beam)
Photolithography Micromachining
Holography SPM lithography
Master
Cast/MoldPDMS
Stamp
Pattern
Transparent
Low Thermal Expansion
Chemically Inert
Reusable for patterning
Best Resolution: 2-10 nm
Poly(dimethylsiloxane)
Environmentally Safe
Silanized
Rapid Prototyping
Microcontact Printing
a-c: Silver; e: Gold; f: copper
a+b: rolling stamp
g+h: metal as etch mask for silicon
Xia, Y.; Whitesides, G. M. Ann. Rev. Mater. Sci 1998, 28, 153.
Microcontact Printing: Patterned SAMs are Used to Define Fabrication Level in Au via Wet Etching
Rogers, J. A. et. al. Proc. Nat. Acad. Sci. USA 2001, 98, 4835-4840.
Dodabalapur, A.et.al. Appl. Phys. Lett. 1998, 73, 142-144.
Electronic Paper
20µm
spherical curvature
PZT Fresnel Lens Patterned using Microcontact Printing, a Soft-Lithographic Patterning Method
PDMS Stamp
Patterned OTS SAM on Quartz: Lift-off Patterning on Si and Glass
• Sol-gel Ceramics•Evaporated Metals
(poor as an etch resist)
Microcontact Printing
a: polyurethane (PU)b: CuSO4c: Cu CVD on Sid: LiNbO3 CVDon Si/SiO2
Xia, Y.; Whitesides, G. M. Ann. Rev. Mater. Sci 1998, 28, 153.
≤ 50 nm Resolutionof Etched Gold
Michel, B.; Bernard, A., et al. IBM J. Res. & Dev. 2001, 45, 697.
MicroMolding in Capillaries (MiMIC)
a: PU on Sib: polyanilinec: ZrO2
d; polystryene colloidse+f: free standing PU
Xia, Y.; Whitesides, G. M. Ann. Rev. Mater. Sci 1998, 28, 153.
Jeon, N. L.; Hu, J.; Whitesides, G.M.; Erhardt, M.K.; Nuzzo, R.G. Adv. Mater. 1998, 10, 1466.
200 µm
Challenges: Registration, Resists
Ex: MOSFETs
Vd
-16 -14 -12 -10 -8 -6 -4 -2 0
Id
-0.0008
-0.0007
-0.0006
-0.0005
-0.0004
-0.0003
-0.0002
-0.0001
Vg= -4 VoltsVg= -5 VoltsVg= -6 VoltsVg= -7 Volts
Solvent Assisted MicroMolding (SAMiM)
photoresist ona: SiO2b: polystrenec: ABS
Xia, Y.; Whitesides, G. M. Ann. Rev. Mater. Sci 1998, 28, 153.
Duffy, D. C.; Jackman, R. J., et al. Adv. Mater. 1999, 11, 546.
Continuous MembranePattern
Add or Remove Layer
Dry Lift-Off
Spin-Cast PDMS Membrane
Jackman, et al.; Langmuir 1999, 15, 2973.
Elastic Membrane Patterning
electroluminescent materials
plasma etch resist
Replica Molding (ReM)
PDMS master
PU mold
Xia, Y.; Whitesides, G. M. Ann. Rev. Mater. Sci 1998, 28, 153.
Cohesive Transfer Lithography
PDMS molding
UVO treatment
Heat or UV curing (Closed)
Physical removal (Open)
• UVO bonded PDMS features can be torn from stamp• Works best for small feature sizes ( < 5 µm)• PDMS resists transferred from a non-composite stamp are thin ( < 100 nM)• Effective RIE/Liftoff resists—aSi, metals, etc.• Limit: composite stamps embedding a release level are exceptionally hard to master for feature sizes below 1 µm—segments detach from transfer pad during molding process.
MicroTransfer Molding (µTM)
a+b: PU c+d: epoxy e+f: solgelXia, Y.; Whitesides, G. M. Ann. Rev. Mater. Sci 1998, 28, 153.
Quake, S.R., et al. Science 2002, 298, 580.
Integrated Microfludics
Integrated Microfluidcs
Loading Separation
Mixing Purging
BR
AW
BWAR
High Voltage A
High Voltage B
1. 100 W Hg Arc Lamp2. Aperture Stop3. Field Stop4. Dichroic Cube Assembly5. PDMS Device6. 80:20 Beam Splitter7. Tube Camera8. R-376 PMT
S-20
(R-3
76)
Olympus AX-70
1
23
4
5
67
8
Fabrication and Detection using PDMS
place desired pattern onphotoresist & irradiatewith UV light (365nm)
spin coat STR 1075photoresist on Si wafer
wash off exposed resistwith basic developer
cure PDMS elastomer onSi/photoresist master
peel off PDMS
seal with second PDMSplanar substrate
Typical dimensions from channel intersection to reservoir are (BR) 8 mm, (AR) 8 mm, (AW) 8 mm, (BW) 60 mm. Channel cross sections ~15 µm (height) x 90 µm (width).
Schematic representation of experimental setup
30 40 50 60 70 80 90 100 110 120
-3.8
-3.6
-3.4
-3.2
Migration Time (sec)
PMT
Sign
al (A
.U.)
0.0008 0.0006 0.0004
Mobility (cm2 / V sec)
S G F
System peak
Sugar Separation in PDMS Device at pH = 12.3
System peak
30 40 50 60 70 80 90 100 110 120
pH = 12.6
pH = 12.3
pH = 12.0
pH = 11.5
PMT
Sign
al (A
.U.)
Migration Time (sec)
0.0008 0.0006 0.0004
Mobility (cm2 / V sec)
S G F
G
S/G/F
S/G/F
SPS F
Effect of pH on Carbohydrate Separations
SP
SP
SP
Self Referencing Chip Design-EOF Instability
• Capillary Electrophoresis Microchips– From J. Monahan thesis:
• High pH stability• Electroosmotic flow in native PDMS
channels• Retention times have poor
reproducibility• Dye/EOF marker partitioning
• Design chip geometry to account for drift due to changes in EOF, PDMS surface, pH, temp.
• Split analyte plug down two paths of differing lengths
• Recombine for detectionBuffer Waste
Analyte ReservoirAnalyte Waste
Buffer reservoir
Pat
h 1
Pat
h 2
Detection Area
100 150 200 250 300 350
1.0 V
Time /sec
PM
T S
igna
l /V
FITC1 FITC2
FL1 FL2
-50 0 50 100 150 200Adj. Time /sec
(a) (b)
Drifting Migration Times in Split Channel
Aligned to 1st peakFL-FITC separations
4 sequential runs
Split Channel for CE Standardization
• Split analyte plug down two paths of differing lengths
• Recombine for detection
Buffer Waste
Analyte ReservoirAnalyte Waste
Buffer reservoir
Path
1
Path
2
Detection Area
Standardizationj
obsy
obsystd
obsxj
obsx
obsxjx )()()()( 12112
"' µµµµµµ −−+−=FITC2
jobsx
obsxstd
obszj
obsz
obszjz )()()()( 12112
"' µµµµµµ −−+−=FA2
jobsx
obsxstd
obsyj
obsy
obsyjy )()()()( 12112
"' µµµµµµ −−+−=FL2
jobsy
obsystd
obsxj
obsx
obsxjx )()()()( 12112
"' µµµµµµ −−+−=FITC2 jobsy
obsystd
obsxj
obsx
obsxjx )()()()( 12112
"' µµµµµµ −−+−=FITC2
jobsx
obsxstd
obszj
obsz
obszjz )()()()( 12112
"' µµµµµµ −−+−=FA2 jobsx
obsxstd
obszj
obsz
obszjz )()()()( 12112
"' µµµµµµ −−+−=FA2
jobsx
obsxstd
obsyj
obsy
obsyjy )()()()( 12112
"' µµµµµµ −−+−=FL2 jobsx
obsxstd
obsyj
obsy
obsyjy )()()()( 12112
"' µµµµµµ −−+−=FL2
Adjusted µa
Observed µa2 Path 2
Set µa1 of Path 1 as reference
Standardize µa1of all devices
Compensate for EOF
within runs
FITC1 FL1 FA1 FITC2 FL2 FA2 FA2Average 96.2 105.7 135.4 179.7 197.4 254.2
Migration Time STD DEV 13.8 15.6 21.9 26.7 30.2 42.4%RSD 14.4 14.8 16.1 14.9 15.3 16.7Average 2.64E-04 2.41E-04 1.88E-04 2.05E-04 1.87E-04 1.46E-04
Mobility STD DEV 1.4E-05 1.4E-05 1.4E-05 1.1E-05 1.2E-05 1.1E-05%RSD 5.3 5.8 7.4 5.7 6.4 7.5Average 2.69E-04 2.56E-04 2.14E-04 2.09E-04
Adjusted Mobility STD DEV 9.8E-07 9.8E-07 2.4E-06 1.8E-06%RSD 0.4 0.5 1.1 0.9
( )j
eofy )12( −∆µ ( )
j
eofy )12( −∆µ( )
j
eofx )12( −∆µ ( )
j
eofx )12( −∆µ
50 100 150 200
Time /sec
PMT
Sign
al /a
.u.
0.4 V
FITC1
FITC2
FL2
FA2
FA1
FL1
Summary data for 15 separations
3 component separations
FL=fluoresceinFITC=fluorescein-isothiocyanateFA=fluorescein-amine
Monolithic Valves and Pumps
• Multilayer structures are constructed by binding layers of PDMS
• Useful for fluidic manipulation for lab-on-a-chip
Unger, M., et.al., Science 2000, 288, 113.
3D Microfluidics
Patterns of Cells and Proteins
Whitesides, G. M., et al., Proc. Nat. Acad. Sci. USA 2000, 97, 2409.
Laminar
Takayama, S., et al. Proc. Natl. Acad. Sci. U.S.A. 1999, 96, 5545.
Laminar Flow Patterning
Depletion Gradients
Fosser, K. A.; Nuzzo, R. G. Anal. Chem. 2003, 75, 5779.
Charge Patterning
Whitesides, G. M. MRS Bull. 2002, 27, 56-65.
Exposed Area
Exposed Area
Catalytic Patterning
Michel, B.; Bernard, A., et al. IBM J. Res. & Dev. 2001, 45, 697.
Catalytic Amplification
Harada, Y.; Girolami, G. S.; Nuzzo, R. G. Langmuir 2003, 19, 5114.
Phase-Shift Lithography
Schmid, H., et al. J. Vac. Sci. Technol. B. 1998, 16, 3422. Michel, B.; Bernard, A., et al. IBM J. Res. & Dev. 2001, 45, 697-717.
patterned gold lines
Microlens Patterning
Wu, M.; Whitesides, G. M.; J. Micromech. Microeng. 2002, 12, 747-758.
NanoTransfer Printing (nTP)
Zaumseil, J., et al. Nano Lett. 2003, 3, 1223.
Decal Transfer Lithography
Master and PDMS
UVO TreatmentOf PDMS
Heat or UV exposure
Adhesive PatternTransfer
10 µm
2 µm
Layer-By-Layer Printing (LBL)
Park, J.; Hammond, P. T. Adv. Mater. 2004, 16, 520.
Rogers et al., Proc. Nat. Acad. Sci. USA 2001, 98, 4837.
Flexible and Non-Planar Substrates
Whitesides, G. M., et al. Adv. Mater. 1999, 11, 7.
Problem and Solution?
d≥20h(h/l) range is 2.0-0.2
d (.2-20 µm); h (.5-200 µm); l (0.5-200 µm)
Sylgard 184
h-PDMSMichel, B.; Bernard, A., et al. IBM J. Res. & Dev. 2001, 45, 697. Xia, Y.; Whitesides, G. M. Ann. Rev. Mater. Sci 1998, 28, 153.
Improved Materials
Odom, T. W., et al. Langmuir 2002, 18, 5314.
Lat
eral
Hybrid Stamps
Michel, B.; Bernard, A., et al. IBM J. Res. & Dev. 2001, 45, 697.
2 layer stamp w/ glass backing
trilayer 2 layer w/ polymer backing
Fabrication of High Performance Ceramic Microgear
• Free-standing mm-sized gear of borosilicon carbonitride (SiBNC)
• Can withstand harsh thermal and oxidative environments
Yang, H., et.al., Adv. Mater. 2001, 13, 54.
Metal-oxide-semiconductor field effect transistor (MOSFET)
Jeon, H., et.al., Adv. Mater. 1998, 10, 1466.
Half-Wave Rectifier
Deng, T., et.al., Sens. and Act. 1999, 75, 60.
Magnetic Microfiltration
• Magnetic filtration allows for removal of paramagnetic and ferri(o)magneticparticles from diamagnetic fluids
• Arrays of micron-scale nickel posts were fabricated by soft lithography and electrodepostion
• Magnetic filters integrated into microfluidic systems reduces the size of the system
Deng, T., et.al., Appl. Phys. Lett., 2002,80, 461.
Light-emitting Diodes
• Soft contact lamination provides a means for establishing electrical contacts at room temperature in ambient conditions
• Applications: – Conformable light sources – Nanoscale optoelectronics
Lee, T., et.al.,PNAS 2004, 101, 429.
Patterning Spherical Surfaces
• Uses in optical and sensing devices with wide fields of view (>60º)
• Limits of lithography– Depth of focus limits
topography to ±λ/2– Planar mask only comes
into contact a single point – only a small area will be in
focus
Paul, K., et.al., Adv. Funct. Mater. 2003, 13(4), 259.
Thin-Film Transistors
• TFTs are used to address pixels in flat panel displays
• Eye focuses images on a spherically curved retina
Erhardt, M., et.al.,Chem. Mater. 2000, 12, 3306.
Microcontact Printing DNA
S.A. Lange, V. Benes, D.P. Kern, J.K.H. Horber, A. Bernard, Anal. Chem. 2004, 76, 1641.
Microcontact Printing Proteins
H. Wolf et al. IBM Journal of Research & Development. 2001, 45, 697.
Affinity Contact Printing of Proteins
J.P. Renault, A. Bernard, D. Juncker, B. Michel, H.R. Bosshard, E. Delamarche, Angew. Chem. Int.Ed. 2002, 41, 2320.
Separation of Biomolecules
Tryptic digest of FITC-BSA
S. Sia, G.M. Whitesides, Electrophoresis. 2003, 24, 3563.
Immunoassays
A. Bernard, B. Michel, E. Delamarche, Anal. Chem. 2001, 73, 8.