AO4407 30V P-Channel MOSFET General Description Product Summary V DS I D (at V GS =-20V) -12A R DS(ON) (at V GS =-20V) < 13mΩ R DS(ON) (at V GS =-10V) < 14mΩ R DS(ON) (at V GS =-5V) < 30mΩ 100% UIS Tested 100% R g Tested Symbol V DS The AO4407 combines advanced trench MOSFET technology with a low resistance package to provide extremely low R DS(ON) . This device is ideal for load switch and battery protection applications. V Maximum Units Parameter Absolute Maximum Ratings T A =25°C unless otherwise noted -30V Drain-Source Voltage -30 SOIC-8 Top View Bottom View D D D D S S S G G D S V DS V GS I DM I AS , I AR E AS , E AR T J , T STG Symbol t ≤ 10s Steady-State Steady-State R θJL Maximum Junction-to-Lead °C/W °C/W Maximum Junction-to-Ambient A D 16 75 24 T A =25°C T A =70°C Power Dissipation B P D Avalanche energy L=0.3mH C Pulsed Drain Current C Continuous Drain Current T A =25°C mJ Avalanche Current C 101 A 26 A I D -12 -10 -60 V V ±25 Gate-Source Voltage Drain-Source Voltage -30 Units Parameter Typ Max °C/W R θJA 31 59 40 Maximum Junction-to-Ambient A 2 T A =70°C Junction and Storage Temperature Range -55 to 150 °C Thermal Characteristics W 3.1 SOIC-8 Top View Bottom View D D D D S S S G G D S Rev 13: July 2010 www.aosmd.com Page 1 of 5
The AO4407 combines advanced trench MOSFETtechnology with a low resistance package to provideextremely low RDS(ON). This device is ideal for load switchand battery protection applications.
VMaximum UnitsParameter
Absolute Maximum Ratings T A=25°C unless otherwise noted
-30V
Drain-Source Voltage -30
SOIC-8
Top View Bottom View
DD
DD
SS
SG
G
D
S
VDS
VGS
IDM
IAS, IAR
EAS, EAR
TJ, TSTG
Symbolt ≤ 10s
Steady-State
Steady-State RθJLMaximum Junction-to-Lead °C/W°C/WMaximum Junction-to-Ambient A D
167524
TA=25°C
TA=70°C
Power Dissipation BPD
Avalanche energy L=0.3mH C
Pulsed Drain Current C
Continuous DrainCurrent
TA=25°C
mJ
Avalanche Current C
101
A26
AID
-12
-10
-60
V
V±25Gate-Source Voltage
Drain-Source Voltage -30
UnitsParameter Typ Max°C/WRθJA
3159
40Maximum Junction-to-Ambient A
2TA=70°C
Junction and Storage Temperature Range -55 to 150 °C
THIS PRODUCT HAS BEEN DESIGNED AND QUALIFIED FOR THE CONSUMER MARKET. APPLICATIONS OR USES AS CRITICAL
COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS ARE NOT AUTHORIZED. AOS DOES NOT ASSUME ANY LIABILITY ARISING
OUT OF SUCH APPLICATIONS OR USES OF ITS PRODUCTS. AOS RESERVES THE RIGHT TO IMPROVE PRODUCT DESIGN,
FUNCTIONS AND RELIABILITY WITHOUT NOTICE.
Body Diode Reverse Recovery Time IF=-12A, dI/dt=100A/µs
Turn-On Rise Time VGS=-10V, VDS=-15V,
RL=1.25Ω, RGEN=3Ω
Turn-Off Fall Time
Body Diode Reverse Recovery Charge IF=-12A, dI/dt=100A/µs
Turn-Off DelayTime
A. The value of RθJA is measured with the device mounted on 1in2 FR-4 board with 2oz. Copper, in a still air environment with TA =25°C. The value in any given application depends on the user's specific board design.B. The power dissipation PD is based on TJ(MAX)=150°C, using ≤ 10s junction-to-ambient thermal resistance.C. Repetitive rating, pulse width limited by junction temperature TJ(MAX)=150°C. Ratings are based on low frequency and duty cycles to keep initialTJ=25°C.D. The RθJA is the sum of the thermal impedence from junction to lead RθJL and lead to ambient.E. The static characteristics in Figures 1 to 6 are obtained using <300µs pulses, duty cycle 0.5% max.F. These curves are based on the junction-to-ambient thermal impedence which is measured with the device mounted on 1in2 FR-4 board with 2oz. Copper, assuming a maximum junction temperature of TJ(MAX)=150°C. The SOA curve provides a single pulse rating.
Rev 13: July 2010 www.aosmd.com Page 2 of 5
AO4407
TYPICAL ELECTRICAL AND THERMAL CHARACTERISTICS
1752
10
018
0
20
40
60
80
1 2 3 4 5 6
-ID(A
)
VGS(Volts)Figure 2: Transfer Characteristics (Note E)
0
5
10
15
20
25
30
0 5 10 15 20
RD
S(O
N)(m
ΩΩ ΩΩ)
-ID (A)Figure 3: On-Resistance vs. Drain Current and Gate
Voltage (Note E)
0.8
1
1.2
1.4
1.6
0 25 50 75 100 125 150 175
Nor
mal
ized
On-
Res
ista
nce
Temperature (°C)Figure 4: On-Resistance vs. Junction Temperature
