W. Wichelhaus et al., assignors to Henkel, Duesseldorf; Germany

A process for phosphating and af- ter-rinsing surfaces of at least one metal selected from the group consisting of steel, galvanized steel, aluminum, and alloys of which at least 50% by weight con- sist of iron, zinc, or aluminum comprising phosphating the sur- faces by contacting them with a nitrite- and nickel-free water- based phosphating solution, which has a pH value of 2.7 to 3.6 and comprises 0.3 to 3 g/L of Zn(II); 5 to 40 g/L of phosphate ions; and at least one accelerator; and, after phosphating, with or without intermediate rinsing with water, rinsing the surface with an aqueous solution with a

pH value of 3 to 7, which contains 0.01 to 0.1 g/L of copper ions; and from 100 to 500 mg/L of hexafluo- rotitanate ions, hexafluorozir- conate ions, or both; or from 0.01 to 1 g/L of cerium (III) ions, ce- rium (IV) ions, or both; or from 0.01 to 1.0 g/L of aluminum (III).

ELECTRODEPOSITION METHOD

U.S. Patent 6,090,253. July 18, 2000 K. Shima et al., assignors to Nissan Motor Co., Ltd., Kanagawa-ken, Japan

An electrodeposition method com- prising dipping a work into electro- deposition paint; heating at a tem- perature equal to or higher than 40 and lower than lOO”C, and spray- ing, at least once, water having a temperature equal to or higher

than 40 and lower than 100°C to the work; spraying air having a tem- perature equal to or higher than 40 and equal or lower than 150°C to the work; and baking the work.

APPARATUS FOR CONTROLLING PLATING

U.S. Patent 6,090,261. July 18, 2000 G.L. Mathieu, assignor to FormFactor Inc., Livermore, Calif

A method of plating on a sub- strate including exposing a first face of the substrate to a plating solution; directing the plating so- lution onto a first region of the first face of the substrate, the plating solution flowing over the first region, from where the plat- ing solution flows over a second region of the first face, wherein

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74 Metal Finishing

the direction of flow of the plating solution over the first face of the substrate in the second region is changed with respect to the direc- tion of flow of the plating solution over the first face of the substrate in the first region; and plating on the substrate utilizing a tech- nique selected from the group con- sisting of electroplating and elec- troless plating.

CONFORMABLE NICKEL COATING

U.S. Patent 6,090,263. July 18, 2000

J. Anthony et al., assignors to Lucent Technologies Inc., Murray Hill, NJ.

A method for electroplating a layer of conformable nickel on a metal substrate comprising plac-

ing a metal substrate made of a material selected from the group consisting of copper, copper al- loys, and nickel alloys in a nickel bath consisting essentially of 75 to 130 g/L of nickel as a nickel

complex; 3 g/L of a nickel salt; 30 to 45 g/L of a buffer; and 5 to 20 m/L of a fluorochemical wetting agent; and maintaining the pH of the bath in the range of 2 to 2.5

while applying a current density of 5 to 50 Ndm2 for a period of time sufficient to plate a layer of nickel of the desired thickness onto the substrate, wherein the nickel complex is nickel sulfa-

mate and the nickel salt is nickel chloride.

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WET SCRUBBER FOR A PAINT

SPBAYBOOTH

U.S. Patent 6,093,250. July 25, 2000 A.J. Salazar et al., assignors to University of Kentucky Research Foundation, Lexington, and Toyota Motor Manufacturing, Erlanger, both of Ky.

A system for controlling the scrubbing of particulates from an airflow comprising at least one wet scrubber to which liquid and airflow is applied for scrubbing particles from the airflow; a first sensor for detecting particles in the airflow at the input of the wet scrubber; a second sensor for de- tecting particles at the output of the wet scrubber; a controller for receiving the outputs of the first

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July 2001 75

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