Simultaneously enhancing the strength, ductility and conductivity of copper matrix composites with graphene nanoribbons
Ming Yang1, Lin Weng1, Hanxing Zhu2, Tongxiang Fan1*, Di Zhang1
1State Key Laboratory of Metal Matrix Composites, Shanghai Jiao Tong University, 800 Dongchuan Road, Shanghai 200240, P. R. China
2School of Engineering, Cardiff University, Cardiff CF24 3AA, UK
*Corresponding author. Tel: +86-21-54747779. E-mail: [email protected] (Tongxiang Fan)
Fig. S1. (a) High-resolution SEM and (b) TEM images of raw MWCNTs.
Fig. S2. Images demonstrating the fabrication process of bulk Cu/GNR composites: (a) GNR dispersions. (b) Cu slurry dispersed in ethanol solutions. (c) The sendiment of Cu/GNR mixtures after co-blending, the upper supernatant is pure ethanol. (d) Dried Cu/GNR mixture powders. (e) As-SPSed Cu/GNR disks with a diameter of 28mm. (f) As-rolled plates of Cu/GNR composites.
Table S1. The amount of chemicals for preparation of Cu/GNR composite powders.
GNR Volume fraction (%)
GNR dispersion
Cu powder dispersion
GNR (g)
Ethanol (mL)
Cu powder (g)
Ethanol (mL)
0.5
0.024
240
20
2000
1.0
0.048
480
20
2000
3.0
0.144
1440
20
2000
Note: The density of GNR is 2.0 g cm-3 and the density of Cu is 8.96 g cm-3.
Fig. S3. (a-b) TEM images and (c) the corresponding SAED pattern of an individual GNR. (c) HRTEM image of the edge of a single-layered GNR.
Fig. S4. FTIR spectra of GNRs and raw MWCNTs. Chemical oxidation imparts a large number of epoxide, hydroxyl and carbonxyl groups to GNR surfaces, as designated.
Fig. S5. (a) SEM image of Cu/GNR composites. Arrows indicate the embedded GNRs. (b-c) the corresponding EDS elemental mapping of copper and carbon, repstively.
Fig. S6. Bending load-displacement curves of neat Cu and Cu/GNRs.
Table S2. Change in yield strength (σs) and failure strain (εb), and electrical conductance (κ) for different copper-matrix composites, with comparison to those of the matrix.
Reinforcement
Fraction
Change in σs
Change in εb
κ [IACS%]
Reference
GNRs
0 vol.%
--
--
90.2%
This Work
0.5 vol.%
32.3%
3.3%
93.9%
1.0 vol.%
55.4%
30.4%
94.6%
3.0 vol.%
126.9%
-13.1%
92.6%
um-SiC
10 vol.%
27.2%
-18%
82.63%
Mater. Lett. 2003, 57, 4583-4591
nano-SiC
4 vol.%
35%
--
--
Mater. Design 2013, 52, 881-887
TiB2
3.5 wt.%
54.8%
-71.9%
64.3%
Mater. Lett. 2002, 52, 448-452
TiC
5 vol.%
100.6%
-79%
78.6%
Mater. Design 2016, 92, 58-63
Al2O3
5 vol.%
88%
-77.5
80%
J. Alloys Compd. 2016, 682, 590-593
Si3N4
whisker
5 vol.%
10.7%
--
--
Mater. Sci. Eng. A 2014, 607, 287-293
10 vol.%
23.9%
--
--
15 vol.%
9.4%
--
--
Ternary carbides
5 vol.%
94.8%
--
86.9%
Scr. Mater. 2009, 60, 976-979
10 vol.%
83.8%
--
76.1%
20 vol.%
60.6%
--
50.7%
SiC fiber
13 wt.%
116.3%
-42.6%
85%
Mater. Sci. Eng. A 2007, 449-451, 778-781
SWCNTs
5 vol.%
30.4%
-25%
83.6%
Mater. Sci. Eng. A 2016, 675, 82-91
DWCNTs
0.5 vol%
10%
12.7%
93-97%
Carbon 2016, 96, 212-215
MWCNTs
5 vol.%
83.3%
-47%
80.5%
Mater. Sci. Eng. A 2009, 513-514, 247-253
10 vol.%
167.5%
-87%
72.6%
15 vol.%
185%
-93.7%
71.8%
Fig. S7. Orientation distribution function sections depicting the component of textures: (a) unreinfored Cu with strong copper type , Brass type and weak S-type textures, and (b) Cu/1%GNRs with Brass type and S-type textures.
2